CN113380690A - Protection method for wet cap opening of plastic package device - Google Patents
Protection method for wet cap opening of plastic package device Download PDFInfo
- Publication number
- CN113380690A CN113380690A CN202110649668.9A CN202110649668A CN113380690A CN 113380690 A CN113380690 A CN 113380690A CN 202110649668 A CN202110649668 A CN 202110649668A CN 113380690 A CN113380690 A CN 113380690A
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- plastic package
- package device
- frame
- wet
- cap opening
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a protection method for wet cap opening of a plastic package device, and belongs to the field of semiconductor packaging. The support is designed and manufactured according to the size of the plastic packaging device, the plastic packaging device to be uncapped is embedded in the support, then the support is fixed and protected by adopting an acid-base resistant adhesive tape, and an anticorrosive peelable adhesive is coated on a non-uncapped area to form a tight protective layer, so that the corrosion of acid liquid to the non-uncapped area in the uncapping process is avoided, the protective layer is convenient to remove after the uncapping, the device guide legs are not damaged, and the cap opening yield is improved. The method can accurately control the position of the cap opening area according to requirements, and simultaneously protect the plastic package body and the device guide leg in the non-cap opening area, so that the plastic package body and the device guide leg are prevented from being damaged in the acid etching process.
Description
Technical Field
The invention belongs to the field of semiconductor packaging, and relates to a wet cap opening protection method for a plastic packaging device.
Background
The chip package is a package for mounting a semiconductor integrated circuit chip, plays a role in placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit. The chip detection requires opening the package, which is called uncapping. The chip is internally provided with a bonding wire, a wafer and a lead, the structure inside the chip is required to be ensured not to be influenced when the chip plastic package shell is removed, the existing wet cap opening process needs to adopt strong acid to corrode the plastic package material in the cap opening area so as to remove the plastic package material for encapsulating the metal chip and the bonding wire, other areas are required to be ensured not to be corroded when the plastic package material in the cap opening area is corroded, and the pins of the device are not damaged. The conventional wet cap opening method is that acid is dripped in an area needing to be opened, then the area is quickly put into water for cleaning, and the steps are repeated until plastic packaging materials of the area needing to be opened are completely removed, but other areas are not protected, the area needing to be opened is not accurate because a regular shape cannot be formed in the acid dripping process, and meanwhile, repeated acid cleaning also corrodes a plating layer on the surface of a device pin, so that the function of the device after being opened is damaged, and the accuracy of a test result is influenced.
Therefore, it is necessary to design a new wet cap opening process for a plastic package device to solve the technical problem.
Disclosure of Invention
In order to overcome the defects that a cap opening area is inaccurate and the function of a device is damaged after the cap is opened due to a wet cap opening method of a plastic package device in the prior art, the invention aims to provide a wet cap opening protection method of the plastic package device.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
a protection method for wet cap opening of a plastic package device comprises the following steps:
step 1) obtaining the size of a plastic package device, and designing a support based on the size of the plastic package device;
the plastic package device comprises a device body and guide legs led out from two sides of the device body;
the bracket comprises a base and a frame arranged on the base, wherein the center of the frame is provided with a through groove for embedding and fixing the device body;
step 2) mounting the device body in the through groove;
step 3) performing ultrasonic scanning on the plastic package device to be uncapped to obtain an uncapped area and a non-uncapped area;
and 4) winding acid and alkali resistant adhesive tapes on the parts outside the cap opening area of the plastic package device.
Preferably, the acid and alkali resistant adhesive tape is coated with the corrosion-resistant peelable glue after being wound with the acid and alkali resistant adhesive tape.
Preferably, when the anti-corrosion peelable glue is coated, the anti-corrosion peelable glue is coated at the junction of the acid-base resistant adhesive tape and the cap opening area, and the junction extends 1-1.5 mm to the center of the cap opening area.
Preferably, the outer dimensions of the base are the same as the outer dimensions of the frame.
Preferably, the side edge of the frame is provided with a first positioning hole, the side edge of the base is provided with a second positioning hole at a position corresponding to the first positioning hole, and the base and the frame are aligned and fixed through the positioning pin by the first positioning hole and the second positioning hole.
Further preferably, at least 4 first positioning holes are provided;
the diameters of the first positioning hole and the second positioning hole are the same.
Preferably, the position where the frame contacts the base is coated with a two-component quick-drying adhesive.
Preferably, the bracket is prepared from an FR-4 epoxy substrate.
Preferably, the thickness of the frame is the same as that of the plastic package device.
Compared with the prior art, the invention has the following beneficial effects:
the invention discloses a protection method for wet uncapping of a plastic package device, which is characterized in that a support is designed according to the size of the plastic package device, the plastic package device to be uncapped is embedded in the support, then an acid-base resistant adhesive tape is adopted for fixing and protecting, and an anticorrosive peelable adhesive is coated on a non-uncapped area to form a tight protective layer, so that the corrosion of acid liquid to the non-uncapped area in the uncapping process is avoided, the protective layer is convenient to remove after uncapping, no damage is caused to device leading legs, and the uncapping yield is improved. The method can accurately control the position of the cap opening area according to requirements, and simultaneously protect the plastic package body and the device guide leg in the non-cap opening area, so that the plastic package body and the device guide leg are prevented from being damaged in the acid etching process.
Furthermore, an FR-4 epoxy resin board is adopted to manufacture a support, the support comprises a base and a frame, and the bottom, the periphery and the guide legs of the plastic package device are protected in a fully-enclosed mode.
Furthermore, the acid and alkali resistant adhesive tape is adopted to wind and wrap the non-uncapped area, and meanwhile, the corrosion resistant peelable adhesive is adopted to paint and protect the non-uncapped area, so that the non-uncapped area can be prevented from being corroded, the position of a plastic package device is fixed, and the device leg is prevented from being damaged in the operation process.
Drawings
FIG. 1 is a schematic size diagram of a plastic packaged device to be uncapped according to the present invention; wherein, (a) is a top view of the plastic packaging device to be uncapped; (b) is a left view of the plastic packaged device to be uncapped; (c) is a front view of the plastic packaged device to be uncapped;
FIG. 2 is a schematic size view of a pedestal of the stand of the present invention; (a) a top view of the bracket base; (b) is a left view of the bracket base; (c) is a front view of the bracket base;
FIG. 3 is a dimensional schematic of a stent frame of the present invention; (a) is a top view of the bracket frame; (b) is a left view of the bracket frame; (c) is a front view of the bracket frame;
FIG. 4 is a schematic view of the assembly process of the base and the frame according to the present invention; (a) a positioning diagram is combined for the base and the frame; (b) the assembly of the base and the frame is completed;
FIG. 5 is a schematic structural view of the plastic package device of the present invention after being placed in a protective holder;
FIG. 6 is a schematic illustration of the protection of the uncapped area of the present invention;
wherein: 1-a device body; 2-leg leading; 3-a first locating hole; 4-a second positioning hole; 5-through groove; 6-positioning pins; 7-plastic packaging the device; 8-uncapped region; 9-acid and alkali resistant adhesive tape winding area; 10-smearing the extending area with the anti-corrosion peelable glue; 11-a base; 12-frame.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the accompanying drawings:
example 1
A protection method for wet cap opening of a plastic package device comprises the following steps:
step 1) obtaining the size of a plastic package device, and designing a support based on the size of the plastic package device;
the plastic package device comprises a device body 1 and guide legs 2 led out from two sides of the device body, and the structural size is shown in figure 1; the bracket comprises a base 11 and a frame 12 arranged on the base 11, wherein the center of the frame 12 is provided with a through groove 5 for embedding and fixing a device body, and the structural size is shown in fig. 2 and 3;
step 2) mounting the device body 1 in the through groove 5;
step 3) performing ultrasonic scanning on the plastic package device to be uncapped to obtain an uncapped area 8 and a non-uncapped area;
and 4) winding a layer of acid and alkali resistant adhesive tape on the part outside the cap opening area of the plastic package device. After winding the acid and alkali resistant adhesive tape, coating the acid and alkali resistant adhesive tape with the corrosion-resistant peelable glue.
Example 2
The contents are the same as those of example 1 except for the following.
As shown in fig. 4, a first positioning hole 3 is formed in a side edge of the frame 12, a second positioning hole 4 is formed in a position of the side edge of the base 11 corresponding to the first positioning hole 3, and the base 11 and the frame 12 are aligned and fixed by the first positioning hole 3 and the second positioning hole 4 through the positioning pin 6.
The position where the frame 12 contacts the base 11 is coated with a two-component quick-drying adhesive.
The base 11 is used for supporting and protecting the bottom of the plastic package device, the center of the frame 12 is provided with a through groove 5 which is used for embedding and fixing the plastic package device and protecting the leading legs 2 led out from the two sides of the device. The thickness of the frame 12 is the same as that of the plastic package device.
Example 3
The contents are the same as those of example 1 except for the following.
When the anti-corrosion peelable glue is coated, the anti-corrosion peelable glue is coated at the junction of the acid-base-resistant adhesive tape and the cap opening area, and the junction extends 1-1.5 mm to the center of the cap opening area. Completely covers the acid and alkali resistant adhesive tape winding area 9 and the corrosion resistant peelable glue smearing extension area 10. The external dimension of the base 11 is the same as that of the frame 12, and both are cuboid structures. As shown in fig. 4, a first positioning hole 3 is formed in a side edge of the frame 12, a second positioning hole 4 is formed in a position of the side edge of the base 11 corresponding to the first positioning hole 3, and the base 11 and the frame 12 are aligned and fixed by the first positioning hole 3 and the second positioning hole 4 through the positioning pin 6. 4 first positioning holes 3 are arranged; the first positioning hole 3 and the second positioning hole 4 have the same diameter. The position of frame 12 and 11 contact coating of base has AB glue, can accomplish preliminary solidification within 5min for the quick assembly of frame and base is fixed.
Example 4
A protection method for wet cap opening of a plastic package device,
taking the plastic package device in fig. 1 as an example, a tool is designed:
step 1) the overall size of the plastic package device in fig. 1 is 20.0mm × 12.4mm × 1.2mm, the size of the through groove 5 in the frame 12 is designed according to the size, the corresponding length and width are 20.4mm × 12.6mm respectively, the periphery is designed to be symmetrical in size, a first positioning hole 3 of 1.0mm is reserved, and the structure of the frame 12 is as shown in fig. 3;
and 2) designing a base 11 with the same external dimension according to the external dimension of the frame 12, and designing a second positioning hole 4 with the diameter of 1.0mm at the corresponding position, wherein the base is structurally shown in FIG. 2.
Step 3), selecting a 0.6mmFR-4 epoxy resin substrate, and processing and molding according to the figure 2;
step 4), selecting an epoxy resin substrate (the thickness of the plastic packaging device in the figure 1 is 1.2mm) with the same height as that of the plastic packaging device, and processing and molding according to the figure 3;
step 5) fixing the positioning holes at the corresponding positions of the frame 12 and the base 11 by using the positioning pins 6 with the diameter of 1.0mm, and meanwhile, smearing double-component quick-drying glue at the contact position of the frame 12 and the base 11 to combine the frame 12 and the base 11 into a whole, as shown in figure 4;
step 6), placing the plastic package device 7 to be uncapped in the through groove 5 in the frame 12, as shown in fig. 5;
step 7), performing ultrasonic scanning to obtain an uncapped area 8, and protecting the uncapped area by using an acid and alkali resistant adhesive tape, as shown in fig. 6, to obtain an acid and alkali resistant adhesive tape winding area 9;
and 8) smearing the adhesive tape wrapping area with the corrosion-resistant peelable glue, and extending the junction of the adhesive tape and the cap opening area to the center by 1mm to obtain a corrosion-resistant peelable glue smearing extension area 10, as shown in FIG. 6.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.
Claims (9)
1. A protection method for wet cap opening of a plastic package device is characterized by comprising the following steps:
step 1) obtaining the size of a plastic package device, and designing a support based on the size of the plastic package device;
the plastic package device comprises a device body (1) and lead legs (2) led out from two sides of the device body;
the support comprises a base (11) and a frame (12) arranged on the base (11), wherein a through groove (5) used for embedding and fixing the device body is formed in the center of the frame (12);
step 2), mounting the device body (1) in the through groove (5);
step 3) performing ultrasonic scanning on the plastic package device to be uncapped to obtain an uncapped area and a non-uncapped area;
and 4) winding an acid and alkali resistant adhesive tape on the part outside the cap opening area of the plastic package device.
2. The method for protecting the wet uncapping of the plastic package device according to claim 1, wherein the acid and alkali resistant adhesive tape is wound and then coated with the corrosion-resistant peelable glue.
3. The method for protecting the wet uncapping of the plastic package device according to claim 2, wherein the anticorrosive peelable glue is coated at the junction of the acid and alkali resistant adhesive tape and the uncapping area, and the junction extends 1-1.5 mm toward the center of the uncapping area.
4. The method for protecting the wet uncapping of the plastic package device according to claim 1, wherein the external dimension of the base (11) is the same as the external dimension of the frame (12).
5. The method for protecting the wet cap opening of the plastic package device according to claim 1, wherein a first positioning hole (3) is formed in a side edge of the frame (12), a second positioning hole (4) is formed in a position, corresponding to the first positioning hole (3), of the side edge of the base (11), and the base (11) and the frame (12) are aligned and fixed through the positioning pin (6) by the first positioning hole (3) and the second positioning hole (4).
6. The method for protecting the wet cap opening of the plastic package device according to claim 5, wherein at least 4 first positioning holes (3) are provided;
the diameters of the first positioning hole (3) and the second positioning hole (4) are the same.
7. The method for protecting the wet uncapping of the plastic package device according to claim 1, wherein the position where the frame (12) is in contact with the base (11) is coated with a two-component quick-drying adhesive.
8. The method for protecting the wet uncapping of the plastic package device according to claim 1, wherein the bracket is prepared from an FR-4 epoxy resin substrate.
9. The method for protecting the wet uncapping of the plastic package device according to claim 1, wherein the thickness of the frame (12) is the same as the thickness of the plastic package device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110649668.9A CN113380690B (en) | 2021-06-10 | 2021-06-10 | Protection method for wet-process capping of plastic package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110649668.9A CN113380690B (en) | 2021-06-10 | 2021-06-10 | Protection method for wet-process capping of plastic package device |
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| Publication Number | Publication Date |
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| CN113380690A true CN113380690A (en) | 2021-09-10 |
| CN113380690B CN113380690B (en) | 2023-06-16 |
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| CN202110649668.9A Active CN113380690B (en) | 2021-06-10 | 2021-06-10 | Protection method for wet-process capping of plastic package device |
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Cited By (1)
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| CN116422954A (en) * | 2023-06-13 | 2023-07-14 | 苏州猎奇智能设备有限公司 | Cap opening repairing method for electronic product with shell |
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| CN116422954B (en) * | 2023-06-13 | 2023-08-25 | 苏州猎奇智能设备有限公司 | Cap opening repairing method for electronic product with shell |
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| Publication number | Publication date |
|---|---|
| CN113380690B (en) | 2023-06-16 |
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