CN113380540A - Method for preparing electrode of inductance device - Google Patents
Method for preparing electrode of inductance device Download PDFInfo
- Publication number
- CN113380540A CN113380540A CN202110634243.0A CN202110634243A CN113380540A CN 113380540 A CN113380540 A CN 113380540A CN 202110634243 A CN202110634243 A CN 202110634243A CN 113380540 A CN113380540 A CN 113380540A
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- electrode
- preparing
- groove
- inductor
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000007731 hot pressing Methods 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 238000004804 winding Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims description 12
- 239000006247 magnetic powder Substances 0.000 claims description 9
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 239000003973 paint Substances 0.000 abstract description 9
- 238000002360 preparation method Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 12
- 210000001161 mammalian embryo Anatomy 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000001939 inductive effect Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The invention relates to the field of inductor device preparation, in particular to a method for preparing an electrode of an inductor device. The method comprises the following steps: step S1, winding the coil on the blank, and respectively arranging the electrode leads at the two ends of the coil on the two leaf pendulums of the blank; step S2, forming two electrode surfaces on the two leaf pendulums by hot pressing, and forming a groove-shaped bridge on the central column between the two leaf pendulums by hot pressing; step S3 of coating resin on all surfaces of the inductance element formed in step S2; and step S4, removing the resin on the electrode surface and the enameled wire of the electrode lead in the inductance element to prepare the electrode of the inductance device. The technical scheme of the invention has the beneficial effects that: the method for preparing the electrode of the inductance device has the advantages that in the process of preparing the electrode, the bridge can be formed through hot pressing to protect the electrode, the size of the thin paint can be controlled, short circuit risk during soldering is reduced, and the yield of products is improved.
Description
Technical Field
The invention relates to the field of inductor device preparation, in particular to a method for preparing an electrode of an inductor device.
Background
The traditional integrally formed inductor adopts a cold pressing or hot pressing mode to press a coil to form an electrode. However, after the electrode is formed by pressing, the subsequent welding is prone to misoperation, which causes defects such as short circuit between electrodes and between adjacent different products due to too close intervals.
Disclosure of Invention
In view of the above problems in the prior art, there is provided a method for preparing an electrode of an inductor device, including:
step S1, winding a coil on a blank, and respectively arranging electrode leads at two ends of the coil on two leaf pendulums of the blank;
step S2, placing the coil and the green blank into a mold cavity together, filling hot-pressing magnetic powder into the mold cavity, carrying out hot pressing to form two electrode surfaces on the two leaf pendulums, and forming a groove-shaped bridge on a center pillar between the two leaf pendulums;
a step S3 of coating resin on all surfaces of the inductance element formed in the step S2;
and step S4, removing the resin on the electrode surface and the enameled wire of the electrode lead in the inductance element to prepare the electrode of the inductance device.
Preferably, a groove is arranged on the surface of the central column in advance; the step S2, forming the corresponding bridge by hot pressing according to the groove;
or the like, or, alternatively,
the surface of the central column is horizontal and smooth; and step S2, performing heat pressing on the surface of the center pillar to form the bridge according to preset groove parameters.
Preferably, the green embryo is a T-shaped green embryo or an I-shaped green embryo.
Preferably, the groove has a chamfer.
Preferably, the chamfer is 30 to 60 °
Preferably, the chamfer angle is 45 °.
Preferably, the thickness of the groove is 0.01 mm-0.1 mm.
Preferably, the thickness of the groove is 0.03 mm.
Preferably, the distance between the electrode and the edge of the electrical element is 0.04 mm-0.16 mm.
Preferably, the method further comprises the following steps:
and step S5, cleaning the inductance element and electroplating.
The technical scheme of the invention has the beneficial effects that: the method for preparing the electrode of the inductance device has the advantages that in the process of preparing the electrode, the bridge can be formed through hot pressing to protect the electrode, the size of the thin paint can be controlled, short circuit risk during soldering is reduced, and the yield of products is improved.
Drawings
FIG. 1 is a schematic flow chart of a method for manufacturing an electrode of an inductive device according to a preferred embodiment of the present invention;
FIG. 2 is an elevational cross-sectional view of an inductive device in accordance with a preferred embodiment of the present invention;
FIG. 3 is a top cross-sectional view of an inductive device in accordance with a preferred embodiment of the present invention;
fig. 4 is a schematic flow chart of step S5 in the preferred embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The invention provides a method for preparing an electrode of an inductance device, which comprises the following steps of:
step S1, winding the coil on the blank, and respectively arranging the electrode leads at the two ends of the coil on the two leaf pendulums of the blank;
step S2, placing the coil and the green blank into a mold cavity, filling hot-pressing magnetic powder into the mold cavity, carrying out hot pressing to form two electrode surfaces on the two leaf pendulums, and forming a groove-shaped bridge on the middle column between the two leaf pendulums;
step S3 of coating resin on all surfaces of the inductance element formed in step S2;
and step S4, removing the resin on the electrode surface and the enameled wire of the electrode lead in the inductance element to prepare the electrode of the inductance device.
Specifically, as shown in fig. 2, step S1 is first performed to wind the coil 2 around the center pillar of the blank 3, around the back of the two leaf pendulums 31 of the blank 3, and electrode leads at both ends of the coil 2 are respectively disposed on the front surfaces of the two leaf pendulums 31 of the green body 3, and then step S2 is performed to place the coil 2 and the green body 3 together in a mold cavity, and to fill the hot-pressed magnetic powder 1 for hot-pressing, the front surfaces of the two leaf pendulums 31 are hot-pressed to form electrode surfaces, the front surfaces of the central columns 32 are hot-pressed to form the electric bridges 6 which are concave inwards and are in groove shapes, then, step S3 is performed, all surfaces of the inductance element formed in step S2 are coated with resin, namely, the surface of the hot-pressed magnetic powder 1, the electrode face, and the front surface of the center pillar including the bridge 6 are coated with resin, and finally, step S4 is performed to remove the resin of the electrode face and the enamel wire of the electrode lead to prepare the electrode 5 of the inductor.
It should be noted that, in the coil winding process, the electrode leads at the two ends are respectively led out to the front of the leaf pendulum 31, when powder is filled in the hot pressing process, the electrode leads at the two ends are exposed and are not covered by hot pressing magnetic powder, so that the leakage of the electrode is ensured, in step S3, the surface of the whole inductance element is coated with resin, at this time, the electrode surface is also wrapped by insulating resin, and in step S4, the resin layer of the electrode surface and the enameled wire on the surface of the copper wire of the lead can be removed by laser, so that the electrode surface is formed.
In a preferred embodiment of the present invention, a groove is provided in the center pillar in advance;
and step S2, forming a corresponding bridge according to the groove by hot pressing.
Specifically, set up a recess on the center pillar of green body is positive in advance, lead to the leaf pendulum respectively with the both ends lead wire of this coil and openly, put into the mould die cavity afterwards to fill into hot pressing magnetic powder and carry out the hot pressing in the mould die cavity, at the hot pressing in-process, because be equipped with the recess on the center pillar openly, consequently corresponding formation is inside sunken in the hot pressing in-process, becomes the electrical bridge of groove form.
In another preferred embodiment of the present invention, the center pillar is horizontally smooth;
and step S2, according to the preset groove parameters, hot pressing the center pillar to form the bridge.
Specifically, a groove parameter is preset, namely the shape parameter of the electric bridge, the front surface of the middle column of the green blank is horizontal and smooth, leads at two ends of the coil to the front surface of the blade pendulum respectively, then the die cavity is placed in, hot pressing magnetic powder is filled into the die cavity for hot pressing, and in the hot pressing process, the groove is formed by hot pressing the front surface of the middle column according to the groove parameter in advance, namely the electric bridge between two electrodes is correspondingly formed.
That is, the inward concave groove and the bridge in the shape of the groove in the invention can be formed by corresponding hot pressing according to the groove preset on the front surface of the center pillar, and can also be formed directly in the hot pressing process.
In a preferred embodiment of the present invention, the green embryo is a T-shaped green embryo or an i-shaped green embryo.
In a preferred embodiment of the invention, the recess has a chamfer.
Specifically, the groove is arranged in advance on the front face of the center pillar of the green body, and the chamfer is arranged on the groove under the condition that the bridge is formed in the subsequent step S2, so that powder is not easy to lack in the process of forming the green body, the preparation operation of the green body is facilitated, the bridge can be conveniently generated in the step S2, and the equipment operation is facilitated. For the situation that the front surface of the center pillar of the green body is not provided with the groove in advance, and the bridge is formed only in the step S2 by direct hot pressing, the separation of the preparation tool and the inductance element is convenient after the electrode and the bridge are generated, and the operation of workers is convenient. In the preferred embodiment of the invention, the value range of the chamfer is usually 30-60 degrees, wherein the chamfer is usually 45 degrees in consideration of the advantages and disadvantages of the technical realization effect and the convenience of the process equipment flow.
In a preferred embodiment of the invention, the thickness of the groove is 0.01mm to 0.1 mm.
Specifically, considering that if the thickness of the groove is too small, i.e., the thickness of the bridge between the two electrodes is too small, the groove cannot sufficiently protect the electrode, and if the thickness is too large, the thickness of the electrode and thus the performance of the inductance element are affected,
in the invention, the thickness of the groove ranges from 0.01mm to 0.1mm, if the thickness is less than 0.01mm, the welding short circuit condition cannot be effectively prevented, and if the thickness is more than 0.1mm, the green strength of the product is reduced, the processing procedure and yield are influenced, and the magnetic powder quantity is reduced, and the product performance is influenced.
Further, as a result of test analysis, the performance is optimized when the thickness of the groove is 0.03mm, and therefore, in the present invention, the thickness of the groove is often set to 0.03 mm.
As shown in fig. 3, in the control process of forming the size of the electrode, the distance between the electrode and the edge, and the like, the high definition camera lens is used for photographing, the relative position and the size are positioned, then the laser path is controlled through laser control software, the accurate size C and the position after paint stripping are ensured, in the control process, the distance D1 between the long side of the electrode and the long side of the electrical element and the distance D2 between the short side of the electrode and the short side of the electrical element are not related, the paint stripping of the electrode surface is mainly controlled, the overall size of the distance from the edge is insulated, under the condition that the paint stripping area, namely the size C of the finally formed electrode is ensured, the size of the distance from the electrode to the edge is controlled at the same time, and the phenomenon that the side is easy to leak tin during final welding due to the too close distance from the long side edge D1 or the too close to the short side edge D2 is avoided, and further short circuit is caused.
In a preferred embodiment of the present invention, the distance between the electrode and the edge of the electrical component is 0.04mm to 0.16 mm.
Specifically, the edge distance between the electrode and the electrical element, namely the distance D1 between the long edge of the electrode and the long edge of the electrical element, and the distance D2 between the short edge of the electrode and the short edge of the electrical element are controlled within 0.1 +/-0.06 mm, because the value range of the edge distance can influence the appearance of the final product after electroplating and the short circuit failure and other problems of the welding of a client machine, if the value is too small, namely less than 0.04mm, the product is easy to be plated to the side of the product after electroplating, which causes the thickness increase and the appearance failure of the product, and meanwhile, the side surface plating also easily causes the short circuit with other products during welding of the product; if the value is large, that is, greater than 0.16mm, paint and the like in the bridge are peeled off, and thus defects such as short circuit during welding are likely to occur.
The paint, the coil insulating layer and the self-adhesive layer can be completely removed according to the size specification by a laser and preset stripping parameters, for example, the focal range parameter of ultraviolet laser is 10-40 cm, the processing number parameter is 1-4 times, the speed parameter is 1000-2500 mm/s, the frequency parameter is 20 KHz-50 KHz, the Q pulse width is 4-20 mus, the line spacing is 0.009-0.011 mm, the current is 1-10A, and the blue light source is adopted as the laser camera light source verified by multiple parties, so that wrong materials and materials with reverse product placement can be effectively identified, the laser stripping cannot be carried out on the materials, the materials are sorted by a sorting camera in the later process, and the product scrapping is avoided.
In a preferred embodiment of the present invention, as shown in fig. 4, the present invention further includes: and step S5, cleaning the inductance element and electroplating.
Specifically, the method comprises the steps of removing powder scraps and residual lead powder generated by stripping paint on the surface of the inductance element by ultrasonic waves and corresponding solutions in advance, and then further cleaning and activating an electrode of the inductance element by using a weak acid solvent, so that the electroplating quality of the inductance element is ensured, and the thickness of the electroplating element can be 3-10 mu m in an electroplating copper mode during electroplating; electroplating nickel with a thickness of 2-7 μm; and (3) electroplating tin with the thickness of 3-10 mu m, and cleaning and drying the inductor after electroplating to finish the manufacture of the inductor.
The technical scheme of the invention has the beneficial effects that: the method for preparing the electrode of the inductance device has the advantages that in the process of preparing the electrode, the bridge can be formed through hot pressing to protect the electrode, the size of the thin paint can be controlled, short circuit risk during soldering is reduced, and the yield of products is improved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. A method for preparing an electrode of an inductance device is characterized by comprising the following steps:
step S1, winding a coil on a blank, and respectively arranging electrode leads at two ends of the coil on two leaf pendulums of the blank;
step S2, placing the coil and the green blank into a mold cavity together, filling hot-pressing magnetic powder into the mold cavity, carrying out hot pressing to form two electrode surfaces on the two leaf pendulums, and forming a groove-shaped bridge on a center pillar between the two leaf pendulums;
a step S3 of coating resin on all surfaces of the inductance element formed in the step S2;
and step S4, removing the resin on the electrode surface and the enameled wire of the electrode lead in the inductance element to prepare the electrode of the inductance device.
2. The method for preparing an electrode of an inductor device according to claim 1, wherein a groove is formed on the surface of the center pillar in advance; the step S2, forming the corresponding bridge by hot pressing according to the groove;
or the like, or, alternatively,
the surface of the central column is horizontal and smooth; and step S2, performing heat pressing on the surface of the center pillar to form the bridge according to preset groove parameters.
3. The method for preparing an electrode of an inductor device according to claim 1, wherein the green body is a T-shaped green body or an I-shaped green body.
4. The method for preparing an electrode of an inductor device according to claim 1, wherein the groove has a chamfer.
5. The method for preparing an electrode of an inductor as claimed in claim 4, wherein the chamfer angle is 30 ° to 60 °.
6. The method for preparing an electrode of an inductor as claimed in claim 5, wherein the chamfer angle is 45 °.
7. The method for preparing an electrode of an inductor according to claim 1, wherein the groove has a thickness of 0.01mm to 0.1 mm.
8. The method for preparing an electrode of an inductor as claimed in claim 7, wherein the groove has a thickness of 0.03 mm.
9. The method for preparing an electrode of an inductor according to claim 1, wherein the distance between the electrode and the edge of the electrical component is 0.04mm to 0.16 mm.
10. The method for preparing an electrode of an inductor device according to claim 1, further comprising:
and step S5, cleaning the inductance element and electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110634243.0A CN113380540A (en) | 2021-06-07 | 2021-06-07 | Method for preparing electrode of inductance device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110634243.0A CN113380540A (en) | 2021-06-07 | 2021-06-07 | Method for preparing electrode of inductance device |
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| Publication Number | Publication Date |
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| CN113380540A true CN113380540A (en) | 2021-09-10 |
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| CN202110634243.0A Pending CN113380540A (en) | 2021-06-07 | 2021-06-07 | Method for preparing electrode of inductance device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735426A (en) * | 2017-04-19 | 2018-11-02 | 株式会社村田制作所 | Coil component |
| JP2019140246A (en) * | 2018-02-09 | 2019-08-22 | Tdk株式会社 | Electronic component and electronic circuit module |
| CN111161942A (en) * | 2018-11-08 | 2020-05-15 | 株式会社村田制作所 | Surface mount inductor |
| CN111430126A (en) * | 2019-01-09 | 2020-07-17 | 三星电机株式会社 | Coil component |
| CN111755233A (en) * | 2020-06-24 | 2020-10-09 | 华萃微感电子(江苏)有限公司 | Sectional forming micro-inductor manufacturing process |
-
2021
- 2021-06-07 CN CN202110634243.0A patent/CN113380540A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108735426A (en) * | 2017-04-19 | 2018-11-02 | 株式会社村田制作所 | Coil component |
| JP2019140246A (en) * | 2018-02-09 | 2019-08-22 | Tdk株式会社 | Electronic component and electronic circuit module |
| CN111161942A (en) * | 2018-11-08 | 2020-05-15 | 株式会社村田制作所 | Surface mount inductor |
| CN111430126A (en) * | 2019-01-09 | 2020-07-17 | 三星电机株式会社 | Coil component |
| CN111755233A (en) * | 2020-06-24 | 2020-10-09 | 华萃微感电子(江苏)有限公司 | Sectional forming micro-inductor manufacturing process |
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Effective date of registration: 20211012 Address after: 214100 No. 8, Huaqing Innovation Park, Huishan District, Wuxi City, Jiangsu Province Applicant after: JIANGSU LINEPRINTING MATERIALS Co.,Ltd. Address before: 214000 No. 8, Huaqing Innovation Park, Huishan District, Wuxi City, Jiangsu Province Applicant before: Wuxi lanpei New Material Technology Co.,Ltd. |
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Application publication date: 20210910 |