CN113377176A - Heat dissipation device and case with same - Google Patents

Heat dissipation device and case with same Download PDF

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Publication number
CN113377176A
CN113377176A CN202010116379.8A CN202010116379A CN113377176A CN 113377176 A CN113377176 A CN 113377176A CN 202010116379 A CN202010116379 A CN 202010116379A CN 113377176 A CN113377176 A CN 113377176A
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China
Prior art keywords
heat
pipe
heat dissipation
hard disk
base
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Pending
Application number
CN202010116379.8A
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Chinese (zh)
Inventor
徐仲恺
洪忠仁
陈钦洲
陈进铭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Priority to CN202010116379.8A priority Critical patent/CN113377176A/en
Publication of CN113377176A publication Critical patent/CN113377176A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/181Enclosures
    • G06F1/182Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/187Mounting of fixed and removable disk drives

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides a heat abstractor for an at least hard disk heat dissipation, heat abstractor includes base, heat pipe, first radiating part and installed part, the middle-end of heat pipe with the base is connected, the both ends of heat pipe are to keeping away from the base direction extends, a plurality of first radiating part range upon range of setting and alternate in proper order the both ends of heat pipe, the installed part is vertical to be installed the both sides of first radiating part, the hard disk is fixed to be installed on the installed part. The application also discloses a case. This application is through being in hard disk perpendicular setting the mode of first radiating piece both sides both improves the radiating effect of hard disk has saved again the space of machine case.

Description

Heat dissipation device and case with same
Technical Field
The invention relates to a heat dissipation device and a case with the same.
Background
With the development of science and technology, people have more and more large demand on mobile hard disks. However, under the condition that the size of the case is not changed, along with the increase of the number of the hard disks, the case not only occupies a large space of the mainboard, but also has poor heat dissipation effect.
Disclosure of Invention
In view of the above, it is desirable to provide a heat dissipation device with good heat dissipation effect and capable of effectively saving the space of the chassis, and the chassis having the heat dissipation device.
The utility model provides a heat abstractor for an at least hard disk heat dissipation, heat abstractor includes base, heat pipe, first radiating part and installed part, the middle-end of heat pipe with the base is connected, the both ends of heat pipe are to keeping away from the base direction extends, a plurality of first radiating part range upon range of setting and alternate in proper order the both ends of heat pipe, the installed part is vertical to be installed the both sides of first radiating part, the hard disk is fixed to be installed on the installed part.
Preferably, the base comprises a support and a heat transfer plate, the heat transfer plate is connected with the surface of the support, a gap is formed between the heat transfer plate and the support, and the middle end of the heat conduction pipe is inserted in the gap.
Preferably, the heat pipe includes a connection pipe, a first extension pipe and a second extension pipe, the connection pipe is a middle end of the heat pipe, the connection pipe is inserted into the gap between the bracket and the heat transfer plate, two ends of the connection pipe extend to a side away from the base and away from the heat transfer plate to form the first extension pipe and the second extension pipe, the first extension pipe and the second extension pipe are connected to the first heat sink, and the heat pipe is used for dissipating heat from the hard disk or transferring heat generated by the hard disk to the first heat sink.
Preferably, first radiating piece includes first fin and second fin, first fin with first extension corresponds, the second fin with the second extension corresponds, a plurality of first fin range upon range of setting and alternate in proper order on the first extension, a plurality of the second fin range upon range of setting and alternate in proper order on the second extension, first radiating piece is used for receiving the heat that the heat pipe transmitted and dispels the heat.
Preferably, the heat dissipation device further comprises a second heat dissipation member, the heat conduction pipe, the first heat dissipation member and the base together enclose an accommodation space, and the second heat dissipation member is accommodated in the accommodation space.
Preferably, the second heat dissipation member is a fan.
Preferably, the mounting member includes a fixing portion and a fixing portion, the fixing portion is sleeved on the first extension pipe and the second extension pipe, and is disposed on the surface of the first heat sink away from the base, and the fixing portion is connected to two ends of the fixing portion for fixing the hard disk.
Preferably, the fixing portion is provided with a fixing hole, and one end of the hard disk is clamped and fixed on the fixing portion through a fixing member.
The application also discloses a case, the case includes mainboard, hard disk and heat abstractor, the mainboard include with the connector that the mainboard electricity is connected, heat abstractor sets up on the mainboard, the one end of hard disk is fixed on heat abstractor, the other end of hard disk passes through the connector with the mainboard electricity is connected.
Preferably, the support four corners is all to keeping away from the direction of support extends an installation department, the mounting hole has been seted up on the installation department, through passing an installed part in proper order the mounting hole, in order to incite somebody to action support fixed mounting is on a mainboard.
This application is through being in hard disk perpendicular setting the mode of first radiating piece both sides both improves the radiating effect of hard disk has saved again the space of machine case.
Drawings
Fig. 1 is an exploded view of a heat dissipation device according to a preferred embodiment of the invention.
Fig. 2 is a partially assembled view of the heat dissipating device shown in fig. 1.
Fig. 3 is another partially assembled view of the heat dissipating device of fig. 1.
Fig. 4 is a schematic view of fixing a hard disk to the heat sink shown in fig. 3.
Description of the main elements
Figure BDA0002391620900000021
Figure BDA0002391620900000031
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
In the present invention, unless otherwise explicitly specified or limited, the term "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; or may be a mechanical connection; the two elements can be directly connected or connected through an intermediate medium, and the two elements can be communicated with each other. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
Referring to fig. 1, the present invention provides a heat dissipation apparatus 100 for dissipating heat from at least one hard disk 200. The heat dissipation device 100 includes a base 10, a heat pipe 20, a first heat dissipation member 30, a second heat dissipation member 40, and a mounting member 50.
The base 10 includes a support 11 and a heat transfer plate 12. The bracket 11 has a substantially plate-shaped structure, and four corners of the bracket extend to a mounting portion 111 away from the bracket 11. The mounting portion 111 is provided with a mounting hole 1111. The bracket 11 is fixedly mounted on a main plate 300 (see fig. 4) by sequentially passing a mounting member 112 through the mounting holes 1111. The heat transfer plate 12 is connected to the surface of the bracket 11 close to the main plate 300, and a gap is formed between the heat transfer plate 12 and the bracket 11. As can be appreciated. The base 10 also has a supporting function.
It is understood that, in the present embodiment, the heat transfer plate 12 and the bracket 11 may be integrally formed. The heat transfer plate 12 contacts an electronic component to be cooled and receives heat generated by the electronic component, and the heat dissipation device 100 dissipates heat from the electronic component.
The heat conductive pipes 20 are substantially "U" shaped. The heat transfer pipe 20 includes a connection pipe 21, a first extension pipe 22, and a second extension pipe 23. The middle end of the heat conducting pipe 20, i.e. the connecting pipe 21, is inserted and connected to the gap between the bracket 11 and the heat transfer plate 12. The connection pipe 21 may be used to be in sufficient contact with the heat transfer plate 12 and receive heat transferred from the heat transfer plate 12. Two ends of the connecting tube 21 extend to a side away from the base 10 and away from the heat transfer plate 12, respectively, to form the first extending tube 22 and the second extending tube 23.
It is understood that the first extension pipe 22 and the second extension pipe 23 are located at both ends of the connection pipe 21, and substantially form a "U" shape with the connection pipe 21. The heat pipe 20 may be used to receive heat transferred by the heat transfer plate 12. In an embodiment, the heat pipe 20 is used to dissipate heat of the hard disk 200. It is understood that the heat conducting pipe 20 is internally provided with a heat conducting liquid which evaporates upon heat to take away the generated heat. The heat conductive pipe 20 may also transfer heat of the hard disk 200 to the first heat sink 30.
It is understood that, in the present embodiment, the heat dissipating device 100 is provided with three heat conductive pipes 20. Three heat conductive pipes 20 are provided substantially in parallel on the susceptor 10. Of course, in other embodiments, the number of the heat conducting pipes 20 is not limited to three, and may be set according to the requirement, for example, two, four, or six.
In the present embodiment, the first heat sink 30 has a sheet shape. The first heat sink 30 is sleeved on the heat conducting pipe 20. Specifically, the first heat sink 30 includes a first heat sink 31 and a second heat sink 32. The first fin 31 corresponds to the first extension pipe 22. The second fin 32 corresponds to the second extension pipe 23. The plurality of first fins 31 are stacked and sequentially inserted into the first extension pipe 22. The plurality of second fins 32 are stacked and sequentially inserted into the second extension pipe 23. The first heat dissipating member 30 is used for receiving the heat transmitted by the heat conductive pipe 20 and dissipating the heat.
In the present embodiment, the first heat sink 30 may be an aluminum fin heat sink. It will be appreciated that when heat is transferred to the aluminum fin heat sink, the fins spread the heat evenly to dissipate the heat. And the more the radiating fins are, the larger the surface area is, and the better the radiating effect is.
Referring to fig. 2, in the present embodiment, the heat conducting pipe 20, the first heat dissipating member 30 and the base 10 may together form an accommodating space 60.
The second heat sink 40 is accommodated in the accommodating space 60. The second heat dissipation member 40 may be used to dissipate heat of the hard disk 200. In the present embodiment, the second heat dissipation member 40 may be a fan. The fan may be used to assist in heat dissipation of the hard disk 200. It can be understood that, after the heat is transferred to the first heat dissipating member 30, the first heat dissipating member 30 evenly disperses the heat, and the heat is blown away by the second heat dissipating member 40 through the flow of air.
In the present embodiment, the mounting member 50 includes a holding portion 51 and a fixing portion 52. The holding portion 51 is substantially a sheet-like structure. The fixing portion 51 is sleeved on the first extension pipe 22 and the second extension pipe 23, and is disposed on the surface of the first heat sink 30 away from the base 10 to prevent the first heat sink 30 from separating from the heat pipe 20.
In the present embodiment, the fixing portion 52 is connected to the holding portion 51. Specifically, the fixing portion 52 has a substantially rectangular shape. The fixing portion 52 may be connected to both ends of the holding portion 51 for fixing the hard disk 200. Specifically, the fixing portion 52 is vertically disposed at two sides of the first heat sink 30, and one end of the fixing portion 52 is connected to the holding portion 51. In this embodiment, the mounting member 50 may be a metal plate made of metal, such as aluminum.
It can be understood that, in the present embodiment, the fixing portion 52 is opened with a fixing hole 521. Thus, an end of the hard disk 200 can be fixed to the fixing portion 52 by a fixing member 522. In this manner, the hard disk 200 is fixed to the mounting member 50. In this embodiment, the fixing member 522 may be a screw.
It is understood that the fixing portion 52 is vertically disposed, and a surface of the fixing portion 52 is in contact with the first heat sink 30.
It is understood that, in other embodiments, the holding portion 51 and the fixing portion 52 may be integrally formed, for example, the fixing portion 52 is formed by bending and extending two ends of the holding portion 51 toward the base 10.
Referring to fig. 3, when assembling the heat dissipation apparatus 100, the heat pipe 20 is first inserted through the base 10, and the connection pipe 21 of the heat pipe 20 is inserted through the gap between the heat transfer plate 12 and the bracket 11. Then, a plurality of the first fins 31 are stacked and sequentially inserted into the first extension pipes 22. A plurality of the second fins 32 are stacked and sequentially inserted into the second extension pipe 23. And then the second heat dissipating member 40 is fixedly mounted in the receiving space 60. Finally, the fixing portion 51 connected with the fixing portion 52 is sleeved on the first extension pipe 22 and the second extension pipe 23, and is disposed on the surface of the first heat sink 30 away from the base 10. Thus, the heat dissipation device 100 is assembled.
Referring to fig. 4, in the embodiment, after the heat dissipation device 100 is assembled, the mounting members 112 sequentially pass through the mounting holes 1111, so that the heat dissipation device 100 is fixed on the main board 300.
In this embodiment, after the heat sink 100 is disposed on the motherboard 300, the hard disks 200 are fixed to both sides of the first heat sink 30 of the heat sink 100. Specifically, the fixing portion 52 fixes an end of the hard disk 200 to the fixing portion 52 by a fixing member 522, so as to fix the hard disk 200 to the fixing portion 52. Further, the hard disks 200 are vertically installed at both sides of the heat sink 100.
In this embodiment, according to different positions of the fixing hole 521, the heat dissipation device 100 can fix hard disks with different sizes to dissipate heat of the hard disks with different sizes. In this embodiment, the heat dissipation device 100 can dissipate heat of two hard disks at the same time.
It can be understood that, in this embodiment, the hard disk 200 is vertically disposed on the mounting member 50, so that the original horizontally disposed hard disk 200 is vertically disposed, the space of the motherboard 300 can be effectively saved, and the space layout of the motherboard 300 is more facilitated. In addition, because the hard disk 200 is vertically arranged on two sides of the first heat dissipation member 30, the heat dissipation of the hard disk 200 is facilitated, and the heat dissipation effect is better.
It can be understood that, in the present embodiment, a heat dissipation pad (not shown) is further disposed between the hard disk 200 and the fixing portion 52 to prevent the hard disk 200 from directly contacting with the mounting member 50, so as to facilitate heat dissipation of the hard disk 200.
In the embodiment, the second heat sink 40 is disposed in the accommodating space 60, and the heat dissipation of the hard disk 200 can be accelerated by the flow of air.
In this embodiment, the heat dissipation device 100 achieves the purpose of good heat dissipation effect by the arrangement manner of the first heat dissipation member 30 and the installation manner of the second heat dissipation member 40.
In this embodiment, the hard disk 200 is vertically fixed on both sides of the heat sink 100, so that the temperature of the hard disk 200 can be effectively reduced to be kept below 35 ℃. In addition, through simulation, the temperature of the hard disk 200 placed vertically is about 6 to 8 degrees lower than that of the hard disk 200 placed horizontally on the motherboard 300. Meanwhile, the space of the main board 300 can be effectively saved by vertically placing the hard disk 200.
It is understood that, in other embodiments, when the heat dissipation device 100 is assembled on the motherboard 300, the heat dissipation device 100 can also perform auxiliary heat dissipation on components disposed on the motherboard 300, such as a Central Processing Unit (CPU). For example, the CPU contacts the heat transfer plate 12, and the heat sink 100 performs auxiliary heat dissipation on the CPU.
It is appreciated that in other embodiments, the present invention also provides a chassis (not shown). The chassis includes the heat dissipation device 100, the hard disk 200, and the motherboard 300. The motherboard 300 includes a connector 301 electrically connected to the motherboard 300. The heat dissipation device 100 is disposed on the motherboard 300, one end of the hard disk 200 is fixed to the heat dissipation device 100, and the other end of the hard disk 200 is electrically connected to the motherboard 300 through the connector 301.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention. Those skilled in the art can also make other changes and the like in the design of the present invention within the spirit of the present invention as long as they do not depart from the technical effects of the present invention. Such variations are intended to be included within the scope of the invention as claimed.

Claims (10)

1. The utility model provides a heat abstractor for to at least one hard disk heat dissipation, its characterized in that: the heat dissipation device comprises a base, a heat pipe, a first heat dissipation piece and an installation piece, wherein the middle end of the heat pipe is connected with the base, the two ends of the heat pipe extend towards the direction of the base, the first heat dissipation piece is stacked and sequentially inserted into the two ends of the heat pipe, the installation piece is vertically installed on the two sides of the first heat dissipation piece, and the hard disk is fixedly installed on the installation piece.
2. The heat dissipating device of claim 1, wherein: the base comprises a support and a heat transfer plate, the heat transfer plate is connected with the surface of the support, a gap is formed between the heat transfer plate and the support, and the middle end of the heat conduction pipe is inserted in the gap.
3. The heat dissipating device of claim 2, wherein: the heat pipe comprises a connecting pipe, a first extending pipe and a second extending pipe, the connecting pipe is the middle end of the heat pipe, the connecting pipe is connected to the support and the gap between the heat transfer plates in a penetrating mode, two ends of the connecting pipe extend towards one side away from the base and away from the heat transfer plates respectively to form the first extending pipe and the second extending pipe, the first extending pipe and the second extending pipe are connected with the first radiating piece, and the heat pipe is used for radiating heat of the hard disk or transmitting heat generated by the hard disk to the first radiating piece.
4. The heat dissipating device of claim 3, wherein: first radiating part includes first fin and second fin, first fin with first extension corresponds, the second fin with the second extension corresponds, a plurality of first fin range upon range of setting and alternate in proper order on the first extension, a plurality of the second fin range upon range of setting and alternate in proper order on the second extension, first radiating part is used for receiving the heat of heat pipe transmission and dispels the heat.
5. The heat dissipating device of claim 1, wherein: the heat dissipation device further comprises a second heat dissipation member, the heat conduction pipe, the first heat dissipation member and the base together enclose an accommodating space, and the second heat dissipation member is accommodated in the accommodating space.
6. The heat dissipating device of claim 5, wherein: the second heat dissipation member is a fan.
7. The heat dissipating device of claim 4, wherein: the mounting piece comprises a fixing part and fixing parts, the fixing part is sleeved on the first extension pipe and the second extension pipe and is arranged on the surface, far away from the base, of the first heat dissipation part, and the fixing parts are connected to the two ends of the fixing part and used for fixing the hard disk.
8. The heat dissipating device of claim 7, wherein: the fixing part is provided with a fixing hole, and one end of the hard disk is clamped and fixed on the fixing part through a fixing part.
9. The utility model provides a case, case includes mainboard and hard disk, its characterized in that: the case further comprises the heat dissipation device as claimed in any one of claims 1 to 8, wherein the motherboard comprises a connector electrically connected with the motherboard, the heat dissipation device is arranged on the motherboard, one end of the hard disk is fixed on the heat dissipation device, and the other end of the hard disk is electrically connected with the motherboard through the connector.
10. A cabinet according to claim 9, wherein: support four corners is all to keeping away from the direction of support extends an installation department, the mounting hole has been seted up on the installation department, through passing an installed part in proper order the mounting hole, with will support fixed mounting is on a mainboard.
CN202010116379.8A 2020-02-25 2020-02-25 Heat dissipation device and case with same Pending CN113377176A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010116379.8A CN113377176A (en) 2020-02-25 2020-02-25 Heat dissipation device and case with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010116379.8A CN113377176A (en) 2020-02-25 2020-02-25 Heat dissipation device and case with same

Publications (1)

Publication Number Publication Date
CN113377176A true CN113377176A (en) 2021-09-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010116379.8A Pending CN113377176A (en) 2020-02-25 2020-02-25 Heat dissipation device and case with same

Country Status (1)

Country Link
CN (1) CN113377176A (en)

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