CN113376966A

CN113376966A - Glue spraying equipment for semiconductor photoetching

Info

Publication number: CN113376966A
Application number: CN202110680133.8A
Authority: CN
Inventors: 罗兵甲
Original assignee: Shenzhen En'bide Electronic Technology Co ltd
Current assignee: Shenzhen En'bide Electronic Technology Co ltd
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2021-09-10

Abstract

The invention discloses glue spraying equipment for semiconductor photoetching processing, which comprises a glue inlet and a nozzle pipe fixedly arranged at the bottom of the glue inlet, wherein the bottom of the nozzle pipe is provided with a plurality of glue spraying openings, and an anti-blocking sealing piece for adjusting the number of the glue spraying openings is arranged in the nozzle pipe; a limiting piece is arranged above the end part of the anti-blocking sealing piece, and an auxiliary device is connected below the anti-blocking sealing piece through a connecting piece; the side of auxiliary device is equipped with the discharge device who handles the unnecessary glue that spouts in the wafer outside, discharge device's below is equipped with the device that gathers materials, and this semiconductor lithography processing is with spouting gluey equipment, can adjust the quantity that spouts the mouth of glue on the nozzle pipe through preventing stifled sealing member and auxiliary device, adjusts according to wafer external diameter size, and the location scraper on the auxiliary device can also remove the unnecessary glue that spouts in the wafer outside when the location, has not only improved the gluey efficiency of spouting on the surface of wafer, can also avoid the wafer edge exposure to appear in follow-up process, the finished product efficiency of effectual improvement wafer.

Description

Glue spraying equipment for semiconductor photoetching

Technical Field

The invention relates to the technical field of semiconductors, in particular to glue spraying equipment for photoetching processing of semiconductors.

Background

Photolithography is one of the important process methods in semiconductor manufacturing processes, and generally includes the following steps: forming a photoresist layer on a semiconductor wafer; selectively exposing the photoresist layer, and further forming a photoresist pattern on the exposed photoresist layer through a developing step, which is also called as patterning of the photoresist layer; etching the semiconductor wafer by taking the patterned photoresist layer as a mask; and after the etching is finished, ashing the photoresist layer to remove the photoresist layer, wherein the photoresist layer can be formed by spraying or spin coating.

However, in the spin coating process of the existing glue spraying equipment, only a single concentrated nozzle sprays glue, and the wafer is driven to rotate, so that the glue can be uniformly coated on the wafer under the action of centrifugal force. Therefore, the glue spraying equipment for the semiconductor photoetching processing is provided.

Disclosure of Invention

The invention aims to provide glue spraying equipment for semiconductor photoetching processing, which aims to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a glue spraying device for semiconductor photoetching processing comprises a glue inlet and a nozzle pipe fixedly arranged at the bottom of the glue inlet, wherein the bottom of the nozzle pipe is provided with a plurality of glue spraying openings, and an anti-blocking sealing piece for adjusting the number of the glue spraying openings is arranged in the nozzle pipe; a limiting piece is arranged above the end part of the anti-blocking sealing piece, and an auxiliary device for positioning the spin coating of wafers with different sizes is connected below the anti-blocking sealing piece through a connecting piece; and a discharging device for treating redundant glue spraying outside the wafer is arranged on the side surface of the auxiliary device, and a material collecting device is arranged below the discharging device.

Preferably, the calibers of the glue spraying openings are sequentially reduced, so that the centrifugal force generated by the rotation of the wafer drives the glue spraying openings to cover more uniformly.

Preferably, prevent stifled sealing member including setting up the removal sprue in the inside top of nozzle pipe, the bottom surface width that removes the sprue is greater than the biggest spout and glues mouthful bore, the side fixed mounting that removes the sprue has the removal screw rod, the outside spiro union that removes the screw rod has the removal loop bar, the afterbody that removes the loop bar runs through nozzle pipe and fixedly connected with removes the knob, is convenient for to the quantity of spouting gluey mouth to the wafer regulation without external diameter size.

Preferably, the limiting part comprises a limiting ring fixedly mounted on the outer side of the movable sleeve rod, a limiting hole is formed in one side of the upper portion of the nozzle pipe, a limiting screw is arranged in the limiting hole, and the top of the limiting ring is arranged in the limiting screw so as to limit the auxiliary device after adjustment.

Preferably, the connecting piece is including setting up the mounting groove in nozzle pipe one side, the top of mounting groove is equipped with the one-level gear, one-level gear fixed mounting is at removal loop bar tip, and its bottom meshing has the cooperation gear, the bottom meshing of cooperation gear has the secondary gear, secondary gear fixed mounting is at the afterbody of location loop bar, is convenient for connect and prevents stifled sealing member and auxiliary device for connect and prevent stifled sealing member and auxiliary device and keep synchronous motion.

Preferably, auxiliary device includes the locating plate of slidable mounting in nozzle tube bottom, the side fixed mounting of locating plate has positioning screw, positioning screw's outside spiro union has the locating loop pole, locating plate top both ends are fixed with the direction slider, be equipped with the direction spout on the inner wall of nozzle tube bottom, direction slider slidable mounting is in the direction spout, the bottom fixedly connected with connecting rod of locating plate, the bottom fixed mounting of connecting rod has the backup pad, one side fixed mounting of backup pad has the location scraper, is convenient for fix a position the wafer external diameter, avoids the wafer outside to cover unnecessary spouting simultaneously and glues.

Preferably, discharge device is including the fixed T type groove that sets up in connecting rod one side, slidable mounting has T type piece in the T type groove, one side fixedly connected with arm-tie of T type piece, its opposite side fixedly connected with slide, the bottom fixedly connected with of slide arranges the material sword, the curved surface of arranging the material sword is laminated with the curved surface of location scraper mutually, is convenient for handle the unnecessary glue that spouts in the location scraper outside.

Preferably, the device that gathers materials includes the bracing piece of fixed mounting in the backup pad bottom, the bottom spiro union of bracing piece has the supporting shoe, the side fixedly connected with of supporting shoe gathers materials the case, gather materials the case and arrange the below of location scraper in, be convenient for collect the unnecessary glue that spouts in location scraper and wafer side to the staff of being convenient for is handled unnecessary glue that spouts.

Compared with the prior art, the invention has the beneficial effects that:

according to the invention, the number of the glue spraying openings on the nozzle pipe can be adjusted through the anti-blocking sealing piece and the auxiliary device, the adjustment is carried out according to the outer diameter of the wafer, and the positioning scraper on the auxiliary device can remove redundant glue spraying outside the wafer while positioning, so that the glue spraying efficiency of the surface of the wafer is improved, the edge exposure of the wafer in the subsequent process can be avoided, and the finished product efficiency of the wafer is effectively improved.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the present invention except for the wafer;

FIG. 3 is a schematic view of the connecting rod and the connecting member thereof according to the present invention;

FIG. 4 is a cross-sectional view of the guide slide of the present invention;

FIG. 5 is an enlarged view of a portion A of FIG. 2 according to the present invention;

FIG. 6 is an enlarged view of a portion B of FIG. 2 according to the present invention;

FIG. 7 is an enlarged view of a portion of portion C of FIG. 2 in accordance with the present invention;

FIG. 8 is an enlarged view of a portion D of FIG. 3 according to the present invention;

FIG. 9 is an enlarged view of a portion E of FIG. 3 according to the present invention.

In the figure: 1-a glue inlet; 2-a nozzle tube; 3-spraying a glue opening; 4-anti-blocking sealing element; 5-a limiting part; 6-connecting piece; 7-an auxiliary device; 8-a wafer; 9-a discharge device; 10-a material collecting device; 11-moving the block; 12-moving the screw; 13-moving the loop bar; 14-moving the knob; 15-a limit ring; 16-a limiting hole; 17-a limit screw; 18-a mounting groove; 19-a primary gear; 20-mating gears; 21-a secondary gear; 22-positioning the loop bar; 23-a positioning plate; 24-a positioning screw; 25-a guide slide block; 26-a guide chute; 27-a connecting rod; 28-a support plate; 29-positioning the scraper; 30-T type groove; 31-T shaped blocks; 32-pulling a plate; 33-a skateboard; 34-a discharging knife; 35-a support bar; 36-a support block; 37-collecting box.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-9, the present invention provides a technical solution: a glue spraying device for semiconductor photoetching comprises a glue inlet 1 and a nozzle pipe 2 fixedly arranged at the bottom of the glue inlet 1, wherein the bottom of the nozzle pipe 2 is provided with a plurality of glue spraying openings 3, and anti-blocking sealing pieces 4 for adjusting the number of the glue spraying openings 3 are arranged inside the nozzle pipe 2; a limiting piece 5 is arranged above the end part of the anti-blocking sealing piece 4, and an auxiliary device 7 for positioning the spin coating of wafers 8 with different sizes is connected below the limiting piece through a connecting piece 6; and a discharging device 9 for processing redundant glue spraying outside the wafer 8 is arranged on the side surface of the auxiliary device 7, and a material collecting device 10 is arranged below the discharging device 9.

The calibers of the glue spraying openings 3 are sequentially reduced, so that the centrifugal force generated by the rotation of the wafer 8 drives the glue spraying to cover more uniformly.

Prevent stifled sealing member 4 including setting up the removal sprue 11 in the inside top of nozzle pipe 2, the bottom surface width that removes sprue 11 is greater than the 3 bores of the biggest glue gun mouth, the side fixed mounting that removes sprue 11 has removal screw 12, the outside spiro union of removal screw 12 has removal loop bar 13, the afterbody that removes loop bar 13 runs through nozzle pipe 2 and fixedly connected with removes knob 14, rotates and removes knob 14, drives and removes loop bar 13 and the meshing of removal screw 12 to the removal sprue 11 that drives removal screw 12 tip removes, reaches the effect of 3 quantity of regulation glue gun mouth.

The locating part 5 includes the spacing ring 15 of fixed mounting in the removal loop bar 13 outside, top one side of nozzle pipe 2 is equipped with spacing hole 16, be equipped with stop screw 17 in the spacing hole 16, stop screw 17 arranges the 15 tops of spacing ring in, accomplishes the location back, rotates stop screw 17, drives

stop screw

17 and 15 locks of spacing ring.

Connecting piece 6 is including setting up mounting groove 18 in nozzle pipe 2 one side, the top of mounting groove 18 is equipped with one-

level gear

19, 19 fixed mounting of one-level gear have cooperation gear 20 at 13 tip of removal loop bar, and its bottom meshing, the bottom meshing of cooperation gear 20 has secondary gear 21, secondary gear 21 fixed mounting is at the afterbody of location loop bar 22, and the one-level gear 19 that removes 13 tip of loop bar meshes with cooperation gear 20, and cooperation gear 20 drives secondary gear 21 rotatory to it is rotatory to drive location loop bar 22, is convenient for connect prevents stifled sealing member 4 and auxiliary device 7.

Auxiliary device 7 includes locating plate 23 of slidable mounting in nozzle pipe 2 bottom, the side fixed mounting of locating plate 23 has positioning screw 24, positioning screw 24's outside spiro union has positioning

sleeve pole

22, 23 top both ends of locating plate are fixed with direction slider 25, be equipped with direction spout 26 on the inner wall of 2 bottoms of nozzle pipe, direction slider 25 slidable mounting is in direction spout 26, the bottom fixedly connected with connecting rod 27 of locating plate 23, the bottom fixed mounting of connecting rod 27 has backup pad 28, one side fixed mounting of backup pad 28 has location scraper 29, and positioning sleeve pole 22 meshes with positioning screw 24, drives the locating plate 23 removal of 24 sides of positioning screw, and the connecting rod 27 of locating plate 23 bottom drives the location scraper 29 of backup pad 28 below and presses close to the wafer 8 outsides.

Discharge device 9 is including the fixed T type groove 30 that sets up in connecting rod 27 one side, slidable mounting has T type piece 31 in T type groove 30, one side fixedly connected with arm-tie 32 of T type piece 31, its opposite side fixedly connected with slide 33, the bottom fixedly connected with of slide 33 arranges material sword 34, the curved surface of arranging material sword 34 is laminated mutually with the curved surface of location scraper 29, and pulling arm-tie 32 drives T type piece 31 and removes in T type groove 30 to the surface of material sword 34 clearance location scraper 29 is arranged in the drive.

The device 10 that gathers materials includes the bracing piece 35 of fixed mounting in the backup pad 28 bottom, the bottom spiro union of bracing piece 35 has supporting shoe 36, the side fixedly connected with of supporting shoe 36 gathers materials case 37, gather materials case 37 and arrange the below of location scraper 29 in, be convenient for collect the unnecessary glue that spouts in location scraper 29 and 8 sides of wafer to be convenient for the staff handles unnecessary glue that spouts.

The working principle is as follows: after the wafer 8 is installed on the workbench, the moving knob 14 is rotated to drive the moving loop bar 13 to be meshed with the moving screw 12, so as to drive the moving block 11 at the end part of the moving screw 12 to move, the first-stage gear 19 at the end part of the moving loop bar 13 is meshed with the matching gear 20, the matching gear 20 drives the second-stage gear 21 to rotate, so as to drive the positioning loop bar 22 to rotate, the positioning loop bar 22 is meshed with the positioning screw 24, so as to drive the positioning plate 23 at the side surface of the positioning screw 24 to move, the connecting rod 27 at the bottom of the positioning plate 23 drives the positioning scraper 29 below the supporting plate 28 to be close to the outer side of the wafer 8, after the positioning is completed, the limiting screw 17 is rotated to drive the limiting screw 17 to be locked with the limiting ring 15, a worker puts the photoresist into the nozzle pipe 2 from the photoresist inlet 1 to perform the photoresist spraying work, and the redundant photoresist on the outer side of the wafer 8 is scraped by the positioning scraper 29 to the material collecting box 37 in the rotating process, accomplish the photoetching after-working, can stimulate the arm-tie 32, drive T type piece 31 and remove in T type groove 30, thereby drive the surface of arranging material sword 34 clearance location scraper 29, scrape unnecessary spouting glue to the case 37 that gathers materials, the completion resets slide 33, the elastic block card to the slide 33 back resets the inslot, the staff regularly clear up the case 37 that gathers materials can, when nozzle pipe 2 is out of work, can remove the tip that blocks up 11 and remove to nozzle pipe 2, can avoid unnecessary spouting glue to stop in nozzle pipe 2, block up spout glue mouth 3 after the drying.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor lithography processing is with spouting gluey equipment, advances jiao kou (1) and fixed mounting and advances nozzle pipe (2) of jiao kou (1) bottom including advancing, its characterized in that: the bottom of the nozzle pipe (2) is provided with a plurality of glue spraying openings (3), and anti-blocking sealing pieces (4) for adjusting the number of the glue spraying openings (3) are arranged inside the nozzle pipe (2);

a limiting piece (5) is arranged above the end part of the anti-blocking sealing piece (4), and an auxiliary device (7) for positioning the spin coating of wafers (8) with different sizes is connected below the anti-blocking sealing piece through a connecting piece (6);

the side of the auxiliary device (7) is provided with a discharging device (9) for processing the redundant glue spraying outside the wafer (8), and a material collecting device (10) is arranged below the discharging device (9).

2. The apparatus of claim 1, wherein: the calibers of the plurality of glue spraying openings (3) are sequentially reduced.

3. The apparatus of claim 1, wherein: prevent stifled sealing member (4) including setting up removal sprue (11) in nozzle pipe (2) inside top, the bottom surface width of removing sprue (11) is greater than the biggest spout and glues mouth (3) bore, the side fixed mounting that removes sprue (11) has removal screw rod (12), the outside spiro union of removal screw rod (12) has removal loop bar (13), the afterbody that removes loop bar (13) runs through nozzle pipe (2) and fixedly connected with removes knob (14).

4. The apparatus of claim 1, wherein: the limiting part (5) comprises a limiting ring (15) fixedly mounted on the outer side of the movable sleeve rod (13), a limiting hole (16) is formed in one side of the upper portion of the nozzle pipe (2), a limiting screw (17) is arranged in the limiting hole (16), and the top of the limiting ring (15) is arranged in the limiting screw (17).

5. The apparatus of claim 1, wherein: connecting piece (6) are including setting up mounting groove (18) in nozzle pipe (2) one side, the top of mounting groove (18) is equipped with one-level gear (19), one-level gear (19) fixed mounting is in removal loop bar (13) tip, and its bottom meshing has cooperation gear (20), the bottom meshing of cooperation gear (20) has secondary gear (21), secondary gear (21) fixed mounting is at the afterbody of location loop bar (22).

6. The apparatus of claim 1, wherein: auxiliary device (7) include locating plate (23) of slidable mounting in nozzle pipe (2) bottom, the side fixed mounting of locating plate (23) has positioning screw (24), the outside spiro union of positioning screw (24) has location loop bar (22), locating plate (23) top both ends are fixed with direction slider (25), be equipped with direction spout (26) on nozzle pipe (2) bottom inner wall, direction slider (25) slidable mounting is in direction spout (26), the bottom fixedly connected with connecting rod (27) of locating plate (23), the bottom fixed mounting of connecting rod (27) has backup pad (28), one side fixed mounting of backup pad (28) has location scraper (29).

7. The apparatus of claim 1, wherein: discharge device (9) including fixed T type groove (30) that sets up in connecting rod (27) one side, slidable mounting has T type piece (31) in T type groove (30), one side fixedly connected with arm-tie (32) of T type piece (31), its opposite side fixedly connected with slide (33), the bottom fixedly connected with of slide (33) arranges material sword (34), the curved surface of arranging material sword (34) is laminated with the curved surface of location scraper (29) mutually.

8. The apparatus of claim 1, wherein: the aggregate device (10) comprises a supporting rod (35) fixedly installed at the bottom of a supporting plate (28), a supporting block (36) is screwed at the bottom of the supporting rod (35), a material collecting box (37) is fixedly connected to the side surface of the supporting block (36), and the material collecting box (37) is arranged below the positioning scraper (29).