CN113376180A - Detection method and detection equipment - Google Patents

Detection method and detection equipment Download PDF

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Publication number
CN113376180A
CN113376180A CN202110644261.7A CN202110644261A CN113376180A CN 113376180 A CN113376180 A CN 113376180A CN 202110644261 A CN202110644261 A CN 202110644261A CN 113376180 A CN113376180 A CN 113376180A
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image
mark
imaging device
view
workpiece
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Chinese (zh)
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陈鲁
王天民
张嵩
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Skyverse Ltd
Shenzhen Zhongke Feice Technology Co Ltd
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Shenzhen Zhongke Feice Technology Co Ltd
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Priority to CN202110644261.7A priority Critical patent/CN113376180A/en
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01Arrangements or apparatus for facilitating the optical investigation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The application discloses a detection method. The detection method is used for detecting the position deviation of a workpiece, the workpiece is provided with a first mark and a second mark, and the detection method comprises the following steps: aligning the target physical position of the first mark by using an imaging device, and acquiring an image comprising the first mark as a first image; driving at least one of the imaging device and the workpiece to move so that the imaging device is aligned with the target physical position of the second mark; acquiring an image including a second marker as a second image by using an imaging device; and detecting the position deviation of the workpiece according to the first image and the second image. The application also discloses a detection device. No matter how the first mark and the second mark of the workpiece are distributed, the image can be acquired through the imaging device, and then the position deviation of the workpiece can be detected, so that the detection equipment applying the detection method can be suitable for the detection requirements of various elements.

Description

Detection method and detection equipment
Technical Field
The present disclosure relates to the field of industrial detection technologies, and in particular, to a detection method and a detection apparatus.
Background
At present, in Automatic Optical Inspection (AOI) equipment for elements such as panels and wafers, before defect detection is performed on the elements, the placement positions of the elements need to be corrected to ensure normal performance of subsequent defect detection. Before the placing position of the element is corrected, the current position deviation of the element needs to be determined, for the elements in the same batch, the positions and the number of the marks are usually fixed, and the position deviation can be obtained by photographing the marks through a fixed camera and then analyzing the marks. However, the components to be inspected have different types or different batches, the distribution of marks between the components has large differences, and one AOI apparatus can only detect the position deviation of the components with one distribution of marks, and cannot meet the inspection requirements of multiple components.
Disclosure of Invention
The embodiment of the application provides a detection method and detection equipment.
A detection method according to an embodiment of the present application is a detection method for detecting a positional deviation of a workpiece on which a first mark and a second mark are formed, the detection method including:
aligning the target physical position of the first mark by using an imaging device, and acquiring an image comprising the first mark as a first image;
driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the second mark;
acquiring an image including the second marker as a second image using the imaging device; and
and detecting the position deviation of the workpiece according to the first image and the second image.
In some embodiments, said aligning with an imaging device a target physical location of said first marker, acquiring an image including said first marker as a first image, comprises:
aligning the target physical position of the first mark by using the imaging device, and taking a first field-of-view acquisition image as a first initial image;
if the first initial image comprises the image of the first mark, taking the first initial image as the first image; and
if the first initial image does not include the image of the first mark, the imaging device is utilized to align the target physical position of the first mark, and a second field of view is used for acquiring an image as the first image, wherein the second field of view is larger than the first field of view.
In some embodiments, said acquiring an image including said second marker with said imaging device as a second image comprises:
and acquiring an image by using the imaging device with an initial view field as a second initial image, wherein the initial view field is the view field of the imaging device when the first image is acquired.
In some embodiments, said acquiring an image including said second marker with said imaging device as a second image comprises: if the initial field of view is the first field of view and the second initial image does not include the image of the second marker, acquiring an image with the second field of view as the second image by using the imaging device;
after the acquiring, by the imaging device, the image including the second mark is a second image, the detection method further includes:
driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the first mark; and
acquiring an image with the second field of view as an updated first image with the imaging device.
In some embodiments, said driving at least one of said imaging device and said workpiece to move said imaging device to align said imaging device with a target physical location of said second mark comprises:
driving the workpiece to move along a first direction, and/or driving the imaging device to move along a second direction; wherein the first direction is different from the second direction.
In some embodiments, the detecting a positional deviation of the workpiece from the first image and the second image includes:
identifying a first on-map location of the first marker in the first image and a second on-map location of the second marker in the second image;
calculating a first physical distance between the current physical position of the first mark and the target physical position according to the first on-graph position and the target on-graph position of the first mark;
calculating a second physical distance between the current physical position of the second mark and the target physical position according to the position on the second graph and the position on the target graph of the second mark;
calculating the current physical distance between the first mark and the second mark according to the position on the first graph, the position on the second graph and the physical positions of the imaging device when the imaging device shoots the first image and the second image; and
and calculating the position deviation of the workpiece according to the first physical distance, the second physical distance, the current physical distance and the standard physical distance between the first mark and the second mark.
The detection apparatus of an embodiment of the present application is for detecting a positional deviation of a workpiece formed with a first mark and a second mark, the detection apparatus including:
the imaging device is used for aligning the target physical position of the first mark and acquiring an image comprising the first mark as a first image; and
a drive device for driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the second mark;
the imaging device is further used for acquiring an image comprising the second mark as a second image;
the detection apparatus further comprises a processing device for detecting a positional deviation of the workpiece from the first image and the second image.
In some embodiments, the imaging device is further configured to:
aligning the target physical position of the first mark, and taking a first field-of-view collected image as a first initial image;
if the first initial image comprises the image of the first mark, taking the first initial image as the first image; and
and if the first initial image does not comprise the image of the first mark, aligning the target physical position of the first mark, and acquiring an image as the first image by using a second field of view, wherein the second field of view is larger than the first field of view.
In some embodiments, the imaging device is further configured to: and taking an initial field-of-view collected image as a second initial image, wherein the initial field of view is the field of view of the imaging device when the first image is obtained.
In some embodiments, the imaging device is further configured to: if the initial field of view is the first field of view and the second initial image does not include the image of the second marker, acquiring an image with the second field of view as the second image;
the drive device is further configured to: driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the first mark;
the imaging device is further configured to: acquiring an image with the second field of view as an updated first image.
In some embodiments, the drive device comprises:
the first driving sub-device is used for driving the workpiece to move along a first direction; and/or
A second driving sub-device for driving the imaging device to move in a second direction; wherein the first direction is different from the second direction.
In certain embodiments, the processing device is configured to:
identifying a first on-map location of the first marker in the first image and a second on-map location of the second marker in the second image;
calculating a first physical distance between the current physical position of the first mark and the target physical position according to the first on-graph position and the target on-graph position of the first mark;
calculating a second physical distance between the current physical position of the second mark and the target physical position according to the position on the second graph and the position on the target graph of the second mark; and
calculating a positional deviation of the workpiece based on the first physical distance, the second physical distance, and a standard physical distance between the first mark and the second mark.
In the detection method and the detection apparatus according to the embodiment of the application, after the imaging device captures the first image of the image including the first mark, at least one of the imaging device and the workpiece moves, so that the imaging device captures the second image of the image including the second mark, and then the position deviation of the workpiece is detected through the first image and the second image.
Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic perspective view of a detection apparatus according to certain embodiments of the present disclosure;
FIG. 2 is a schematic plan view of a detection apparatus according to certain embodiments of the present disclosure;
FIG. 3 is a schematic illustration of a workpiece according to certain embodiments of the present application;
FIG. 4 is a schematic flow chart of a detection method according to some embodiments of the present disclosure;
FIG. 5 is a schematic plan view of a detection apparatus according to certain embodiments of the present application;
FIG. 6 is a schematic plan view of a detection apparatus according to certain embodiments of the present application;
FIG. 7 is a schematic flow chart of a detection method according to some embodiments of the present disclosure;
FIG. 8 is a schematic diagram of the principle of the detection method according to certain embodiments of the present application;
FIG. 9 is a schematic flow chart of a detection method according to some embodiments of the present disclosure;
FIG. 10 is a schematic flow chart of a detection method according to some embodiments of the present disclosure;
FIG. 11 is a schematic diagram of the principle of the detection method according to certain embodiments of the present application;
FIGS. 12 and 13 are schematic plan views of a detection apparatus according to some embodiments of the present disclosure;
FIG. 14 is a schematic flow chart of a detection method according to some embodiments of the present disclosure;
FIGS. 15 and 16 are schematic illustrations of a detection method according to certain embodiments of the present disclosure.
Description of the main elements and symbols:
the detection device 100, the imaging device 10, the driving device 20, the processing device 30, the scanning device 40, the first support 50, the second support 60, the third support 70, the fourth support 80, the imaging device 90, the workpiece 200, the first mark 201, and the second mark 202.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic perspective view illustrating a detecting apparatus 100 according to some embodiments of the present disclosure, and fig. 2 is a schematic plan view illustrating the detecting apparatus 100 according to some embodiments of the present disclosure, where the detecting apparatus 100 according to the embodiments of the present disclosure may be used to detect a position deviation of a workpiece 200. The detection apparatus 100 includes an imaging device 10, a driving device 20, and a processing device 30.
Specifically, the inspection apparatus 100 may be an inspection machine, a part of a manufacturing machine, or an apparatus independent of the manufacturing machine. The workpiece 200 may be any element requiring position detection, for example, the workpiece 200 may be a display panel, a substrate, a wafer, a chip, a film, a cover plate, and the like, and is not limited herein, and the workpiece 200 is exemplified as a panel in the drawings of the present application. After the workpiece 200 is subjected to the position deviation detection by the detection device 100, any subsequent processes such as position correction, manufacturing, processing, defect detection and the like can be performed, and in order to ensure that the subsequent processes can be correctly performed on the workpiece 200, it is first required to ensure that the position deviation of the workpiece 200 can be accurately and quickly detected.
Referring to fig. 2 and fig. 3, wherein fig. 3 is a schematic structural diagram of a workpiece 200 according to some embodiments of the present disclosure, marks may be formed on the workpiece 200, and the marks may be formed on a plurality of positions of the workpiece 200, and may be used to indicate a current posture and a current position of the workpiece 200. In the example shown in fig. 3, the workpiece 200 is formed with a first mark 201 and a second mark 202 near the corner, each of which can be used to indicate the position and posture of the workpiece 200, the marks being shaped like a "+". Of course, the embodiment shown in fig. 3 is only an example, in other embodiments, the number of the marks may be one or another (for example, three, four, five, etc.), the shape of the mark may be any shape, and the position of the mark in the workpiece 200 may also be set according to the specific situation of the workpiece 200, which is not limited herein. For example, the first mark 201 and the second mark 202 are provided on diagonal lines of the workpiece 200; for example, the edge or corner of the workpiece 200 itself may be used as a mark without additionally designing a special mark pattern. In the example shown in fig. 1 and 2, the inspection apparatus 100 further includes a first frame 50, and the workpiece 200 may be transferred to the first frame 50 by a robot or the like, so as to perform position inspection and subsequent processes on the workpiece 200.
The imaging device 10 may be a camera, for example, a zoom camera or a fixed focus camera, and is not limited herein. In the example shown in fig. 1 and 2, the imaging device 10 may be driven to move relative to the workpiece 200 so that the imaging device 10 may capture images of a scene at different locations. Specifically, the detecting apparatus 100 further includes a second frame 60, at least a portion of the second frame 60 can straddle over the first frame 50, the imaging device 10 can be movably mounted on the second frame 60, and the driving device 20 can drive the imaging device 10 to move on the second frame 60, so that the alignment position of the imaging device 10 can be changed.
The driving device 20 may be used to drive the imaging device 10 and the workpiece 200 to move relative to each other. In one example, the driving device 20 can be used to drive the workpiece 200 to move in a first direction (e.g., the X direction shown in fig. 2), in another example, the driving device 20 can be used to drive the imaging device 10 to move in a second direction (e.g., the Y direction shown in fig. 2), and in yet another example, the driving device 20 can be used to drive the workpiece 200 to move in the first direction and can also be used to drive the imaging device 10 to move in the second direction. Wherein the first direction is different from the second direction.
The processing device 30 may be a processing unit in the detection apparatus 100, the processing device 30 may be configured to send control instructions to the imaging device 10 and the driving device 20, and the processing device 30 may also be configured to process images captured by the imaging device 10.
In the example shown in fig. 1 and 2, the inspection apparatus 100 further includes a scanning device 40, a third carriage 70, a fourth carriage 80, and an imaging device 90. The third bracket 70 and the fourth bracket 80 may be disposed side by side with the second bracket 60. The scanning device 40 may be movably mounted on the third support 70, or the scanning device 40 may be fixedly mounted on the third support 70. The scanning device 40 may comprise a plurality of scanning cameras, which may be line scanning cameras. The imaging device 90 may have the same configuration as the imaging device 10, and the imaging device 90 may be movably mounted on the fourth stand 80.
After detecting the positional deviation of the workpiece 200 and correcting the position of the workpiece 200, defect detection may be performed on the workpiece 200. The processes for performing defect detection are, for example: the driving device 20 drives the workpiece 200 to move along the first direction, and during the movement of the workpiece 200 along the first direction, the scanning device 40 scans the image on the surface of the workpiece 200, determines whether a defect exists on the surface of the workpiece 200, and locates the position where the defect exists. After the location of the defect is located, the driving device 20 may drive the workpiece 200 to move along the first direction, and drive the imaging device 10 (or the imaging device 90) to move along the second direction, so as to perform a recheck on the location with the defect by using the imaging device 10. As will be described below, the imaging device 10 of the embodiment of the present invention can also be used to detect the position deviation of the workpiece 200, so that the imaging device 10 can be used to detect the position deviation and to perform defect review, and compared to the existing methods of separately setting a positioning camera to detect the position deviation and setting a review camera to perform defect review, the number of the imaging devices 10 that need to be equipped in the inspection apparatus 100 of the embodiment of the present invention is smaller, so that the structure of the inspection apparatus 100 is simple and the cost is lower.
The following description will focus on a detection method for detecting the positional deviation of the workpiece 200 using the detection apparatus 100.
Referring to fig. 4, fig. 4 is a schematic flow chart of a detection method according to some embodiments of the present disclosure, the detection method including the steps of:
01: aligning a target physical position of the first mark 201 by using the imaging device 10, and acquiring an image including the first mark 201 as a first image;
02: driving at least one of the imaging device 10 and the workpiece 200 to move to align the imaging device 10 with the target physical location of the second mark 202;
03: acquiring an image including the second marker 202 as a second image using the imaging device 10; and
04: the positional deviation of the workpiece 200 is detected based on the first image and the second image.
Referring to fig. 2, in some embodiments, the imaging device 10 may be configured to perform step 01, that is, the imaging device 10 may be configured to align the target physical position of the first mark 201 with the imaging device 10, and acquire an image including the first mark 201 as a first image. The driving device 20 may be used to implement step 02, i.e., the driving device 20 may be used to drive at least one of the imaging device 10 and the workpiece 200 to move so that the imaging device 10 is aligned with the target physical position of the second mark 202. After step 02 is performed, the imaging device 10 may be further configured to perform step 03, that is, the imaging device 10 is further configured to acquire the image including the second mark 202 as a second image. The processing device 30 may be configured to perform step 04, that is, the processing device 30 may be configured to detect the position deviation of the workpiece 200 according to the first image and the second image.
Specifically, in step 01, the imaging device 10 aligns the target physical position of the first mark 201, and acquires an image including the first mark 201 as a first image. After the workpiece 200 is loaded on the first support 50, the imaging device 10 and the workpiece 200 may be driven by the driving device 20 to move, so that the imaging device 10 is aligned with the target physical position of the first mark 201, that is, the detection apparatus 100 is in the state shown in fig. 5, wherein fig. 5 is a schematic plan view of the detection apparatus 100 according to some embodiments of the present disclosure. The imaging device 10 is aligned with the target physical location of a mark so that the mark can be captured by the imaging device 10 whenever the mark is at or near the target physical location, it can be understood that when the mark is at the target physical location, it indicates that the workpiece 200 may have been placed at the correct location, and when the mark is not at the target physical location, it indicates that the workpiece 200 has not been placed at the correct location, and that the location of the workpiece 200 needs to be corrected. The imaging device 10 acquires a first image in which an image of the first mark 201 needs to be included in order to subsequently process the first image to calculate the positional deviation of the workpiece 200.
In step 02, at least one of the imaging device 10 and the workpiece 200 is driven to move so as to align the imaging device 10 with the target physical position of the second mark 202, that is, the inspection apparatus 100 is in the state shown in fig. 6, wherein fig. 6 is a schematic plan state diagram of the inspection apparatus 100 according to some embodiments of the present application. After the imaging device 10 captures the first image, the imaging device 10 needs to capture the second image of the second mark 202, and first, the imaging device 10 needs to be aligned with the target physical position of the second mark 202 to capture the second image. It can be understood that, in the embodiment shown in the drawings of the present application, since the imaging device 10 can be driven to move in the second direction and the workpiece 200 can be driven to move in the first direction, the imaging device 10 can be aligned to capture an image of any position on the workpiece 200, so that the imaging device 10 can capture an image of a mark no matter how the mark of the currently detected workpiece 200 is distributed, so that the detection apparatus 100 can meet the detection requirements of all kinds of workpieces 200. In one embodiment, the driving device 20 may drive the workpiece 200 to move in a first direction, and/or the driving device 20 may drive the imaging device 10 to move in a second direction, and the driving device 20 may include a first driving sub-device (not shown) and a second driving sub-device (not shown), where the first driving sub-device is used to drive the workpiece 200 to move in the first direction, and the second driving sub-device is used to drive the imaging device 10 to move in the second direction.
In step 03, the imaging device 10 acquires the image including the second mark 202 as a second image, and the second image needs to include the second mark 202 in order to process the second image subsequently to calculate the position deviation of the workpiece 200. It should be noted that the image including the second mark 202 in the second image may refer to an area of the second mark 202 captured in the second image, which is sufficient for calculating the position deviation of the workpiece 200 according to the second image, and if the position deviation of the workpiece 200 is not sufficiently calculated according to the pixels because only a few pixels capture the image of the second mark 202, it is still considered that the image including the second mark 202 in the second image is not included, and the above-mentioned case of including the image of the first mark 201 in the first image is similar, and is not repeated here.
In step 04, a positional deviation of the workpiece 200 is detected based on the first image and the second image. Since the first image includes the image of the first mark 201 and the second image includes the image of the second mark 202, by analyzing the first image and the second image, the positional deviation of the workpiece 200 can be calculated from the positions of the first mark 201 and the second mark 202. Compared with the mode of determining the position deviation only through the position of a certain mark in one image, the step of calculating the position deviation through the relative positions of the two marks in the two images respectively can be applied to the marks with any shapes, and the application range of the detection device 100 and the detection method of the embodiment of the application is further expanded.
Therefore, in the detection method and the detection apparatus 100 according to the embodiment of the present application, after the imaging device 10 captures the first image including the image of the first mark 201, at least one of the imaging device 10 and the workpiece 200 is moved so as to capture the second image including the image of the second mark 202 by using the imaging device 10, and then the positional deviation of the workpiece 200 is detected by using the first image and the second image, so that the image can be captured by using the imaging device 10 and then the positional deviation of the workpiece 200 can be detected regardless of the distribution of the first mark 201 and the second mark 202 of the workpiece 200, so that the detection apparatus 100 using the detection method can meet the detection requirements of various elements.
Referring to fig. 7, fig. 7 is a schematic flow chart of a detection method according to some embodiments of the present disclosure, in some embodiments, step 01: aligning the target physical position of the first mark 201 with the imaging device 10, and acquiring an image including the first mark 201 as a first image, including the steps of:
011: aligning the target physical position of the first mark 201 by using the imaging device 10, and taking the first field-of-view collected image as a first initial image;
012: if the first initial image includes the image of the first mark 201, the first initial image is taken as the first image; and
013: if the first initial image does not include the image of the first mark 201, the imaging device 10 is used to align the target physical position of the first mark 201, and an image is acquired as the first image in a second field of view, where the second field of view is larger than the first field of view.
Referring to fig. 2, in some embodiments, the imaging device 10 can be configured to perform steps 011, 012 and 013, that is, the imaging device 10 can be configured to align the target physical position of the first mark 201, and acquire an image in the first field of view as a first initial image; if the first initial image includes the image of the first mark 201, the first initial image is taken as the first image; if the first initial image does not include the image of the first mark 201, the target physical position of the first mark 201 is aligned, and the image is collected as the first image by using the second field of view, which is larger than the first field of view.
In step 011, the imaging device 10 aligns with the target physical position of the first mark 201, and the first field-of-view captured image is taken as the first initial image, it can be understood that although the imaging device 10 aligns with the target physical position of the first mark 201, the first initial image captured in the first field-of-view cannot be taken as the first image directly because the first mark 201 may not be at the target physical position in practice, that is, there is a position deviation, and the first initial image also needs to be processed.
In step 012, if the first initial image includes the image of the first mark 201, the first initial image is taken as the first image, please refer to fig. 8, fig. 8 is a schematic diagram of the detection method according to some embodiments of the present application, and if the first initial image P11 includes the image of the first mark 201, it indicates that the first initial image meets the condition as the first image, and the first initial image may be output as the first image and used for calculating the position deviation.
In step 013, if the image of the first mark 201 is not included in the first initial image, the imaging device 10 aligns to the target physical position of the first mark 201, and acquires an image as the first image with a second field of view, wherein the second field of view is larger than the first field of view. In the example shown in fig. 8, when the first initial image P12 does not include the image of the first mark 201, it indicates that the position deviation of the workpiece 200 may be large, the first mark 201 is not located near the target physical position, and the distance between the first mark 201 and the target physical position is larger than the range covered by the first field of view, and in this case, it is necessary to enlarge the shooting range to capture the image of the first mark 201. The field of view of the imaging device 10 is switched to the second field of view and the image P21 is captured, and the captured image P21 is output as the first image, and it can be seen that the same position is captured, and the image P21 captured in the second field of view includes the image of the first mark 201.
The specific way of switching the first field of view and the second field of view of the imaging apparatus 10 may be: the imaging device 10 may include a variable power lens by which switching the field of view of the imaging device 10 between a first field of view and a second field of view may be achieved; alternatively, the imaging device 10 may include an objective lens switcher that may switch any one of the plurality of spare objective lenses into the imaging optical path of the imaging device 10, such that the objective lens switcher may also be used to switch the field of view of the imaging device 10 between the first field of view and the second field of view; alternatively, the imaging device 10 includes both the variable power lens and the objective lens switcher described above, which work together to switch the field of view of the imaging device 10 between the first field of view and the second field of view.
Therefore, by performing steps 011, 012, and 013, on the basis of ensuring that the image of the first mark 201 can be captured, the image captured in the smaller first field of view is preferably selected as the first image, the accuracy of the captured first image is higher, and when the image of the first mark 201 cannot be captured in the first field of view, the second field of view is switched to the larger second field of view to ensure that the first image meeting the requirements can be captured, which can accommodate the situation where the positional deviation of the workpiece 200 is large.
Referring to fig. 9, fig. 9 is a schematic flow chart of a detection method according to some embodiments of the present application, in which step 03: acquiring an image including the second marker 202 as a second image by using the imaging apparatus 10, including the steps 031: and acquiring an image by using the imaging device 10 with an initial field of view as a second initial image, wherein the initial field of view is the field of view of the imaging device 10 when the first image is acquired.
Referring to fig. 2, in some embodiments, the imaging apparatus 10 may be configured to perform step 031, that is, the imaging apparatus 10 may be configured to acquire the image in the initial field of view as the second initial image, and the initial field of view is the field of view of the imaging apparatus 10 when the first image is acquired.
Specifically, since the position deviation needs to be calculated by combining the first image and the second image, it is necessary to ensure that the first image and the second image are images captured under the same magnification, therefore, after the target positions of the imaging device 10 and the second mark 202 are aligned, the imaging device 10 acquires the second initial image in the initial field of view, the second initial image first meets the requirement of the same magnification as the first image, and if the second initial image meets other requirements, the second initial image can be directly used for calculating the position deviation.
Referring to fig. 10, fig. 10 is a schematic flow chart of a detection method according to some embodiments of the present disclosure, in some embodiments, step 03: acquiring an image including the second marker 202 as a second image by using the imaging apparatus 10, further comprising step 032: if the initial field of view is the first field of view and the second initial image does not include the image of the second marker 202, then an image is acquired with the imaging device 10 in the second field of view as the second image.
After step 032, the detecting method further includes the steps of:
05: driving at least one of the imaging device 10 and the workpiece 200 to move to align the imaging device 10 with a target physical position of the first mark 201; and
06: acquiring an image with the imaging device 10 with the second field of view as an updated first image
Referring to fig. 2, in some embodiments, the imaging device 10 may further be configured to perform step 032, that is, if the initial field of view is the first field of view and the second initial image does not include the image of the second marker 202, the imaging device 10 may further be configured to acquire the image of the second field of view as the second image. After the imaging device 10 performs step 032, the driving device 20 may be further configured to perform step 05, that is, the driving device 20 may be configured to drive at least one of the imaging device 10 and the workpiece 200 to move so as to align the imaging device 10 with the target physical position of the first mark 201. The imaging device 10 may also be used to perform step 06, i.e. the imaging device 10 may be used to acquire an image with the second field of view as the updated first image.
In step 032, if the second initial image does not include the image of the second marker 202, it indicates that the second initial image cannot be used as the second image to calculate the position deviation, and since the initial field of view is the first field of view, it indicates that there is still a possibility of switching to a larger second field of view to reacquire the image of the second marker 202. At this time, since the imaging device 10 is still aligned with the target physical position of the second mark 202, the imaging device 10 can be directly switched to the second field of view, and the image is captured as the second image.
Of course, if the second initial image includes the image of the second mark 202, which indicates that the second initial image can be used to calculate the positional deviation of the workpiece 200, the second initial image may be output as the second image.
After step 032 is performed, the second image is an image acquired by the imaging device 10 in the second view field, and the first image is an image acquired by the imaging device 10 in the first view field, and as mentioned above, when calculating the position deviation, it is necessary to ensure that the first image and the second image are captured at the same magnification, so that the imaging device 10 can acquire the first image again in the second view field by performing steps 05 and 06. Wherein step 05 is performed, the driving device 20 drives at least one of the imaging device 10 and the workpiece 200 to move, so as to align the imaging device 10 with the target physical position of the first mark 201, as shown in the state of fig. 5.
Referring to the example shown in fig. 11, fig. 11 is a schematic diagram illustrating a detection method according to some embodiments of the present application, when the first image P1 captured by the imaging device 10 in the first field of view includes an image of the first mark 201, and the second initial image P2 captured by the imaging device 10 in the first field of view does not include an image of the second mark 202, the imaging device 10 switches to the second field of view captured image P3 as the second image, and the imaging device 10 needs to re-capture the image P4 including the first mark 201 in the second field of view as the updated first image.
In the above description, the imaging device 10 is used to capture the first image and the second image, and it should be noted that the imaging device 90 may be used to capture the first image and the second image, as shown in fig. 12 and 13, fig. 12 and 13 are schematic plane views of the detection apparatus 100 according to some embodiments of the present disclosure, or the imaging device 90 may be used to capture the first image (as shown in fig. 12) at the target physical position of the first mark 201, and the imaging device 90 may be used to capture the second image (as shown in fig. 13) at the target physical position of the second mark 202. The image acquired by the imaging device 10 or the imaging device 90 for detecting the position deviation can be determined according to the actual positions of the first mark 201 and the second mark 202 in the workpiece 200, which is not limited herein.
Referring to fig. 14, fig. 14 is a schematic flow chart of a detection method according to some embodiments of the present disclosure, in some embodiments, step 04: detecting the positional deviation of the workpiece 200 from the first image and the second image, comprising the steps of:
041: identifying a first on-map location of a first marker 201 in a first image and a second on-map location of a second marker 202 in a second image;
042: calculating a first physical distance between the current physical position of the first marker 201 and the target physical position according to the first on-map position and the target on-map position of the first marker 201;
043: calculating a second physical distance between the current physical position of the second marker 202 and the target physical position according to the second on-map position and the target on-map position of the second marker 202; and
044: the positional deviation of the workpiece 200 is calculated based on the first physical distance, the second physical distance, and the standard physical distance between the first mark 201 and the second mark 202.
Referring to FIG. 2, in some embodiments, processing device 30 may be configured to perform steps 041, 042, 043 and 044, that is, processing device 30 may be configured to identify a first on-map location of first marker 201 in the first image and a second on-map location of second marker 202 in the second image; calculating a first physical distance between the current physical position of the first marker 201 and the target physical position according to the first on-map position and the target on-map position of the first marker 201; calculating a second physical distance between the current physical position of the second marker 202 and the target physical position according to the second on-map position and the target on-map position of the second marker 202; and calculating the position deviation of the workpiece 200 according to the first physical distance, the second physical distance and the standard physical distance between the first mark 201 and the second mark 202.
Specifically, referring to fig. 15 and 16, fig. 15 and 16 are schematic diagrams illustrating a detection method according to some embodiments of the present application, in step 041, a first on-map location of the first marker 201 is identified in the first image G1 by an image recognition algorithm, and a second on-map location of the second marker 202 is identified in the second image G2, where the first on-map location may be represented by pixel coordinates of a feature point (e.g., a center point) of the first marker 201 in the first image G1, and the second on-map location may be represented by pixel coordinates of a feature point (e.g., a center point) of the second marker 202 in the second image G2.
In step 042, a first physical distance between the current physical position of the first marker 201 and the target physical position is calculated according to the first on-map position and the target on-map position of the first marker 201. Taking fig. 15 as an example, the first marker 201 ' is a virtual first marker 201 ' located at a position on the target map, which does not exist in the actually photographed first image G1 and is only used for illustration, and the position on the target map of the first marker 201 is a position coordinate of a feature point (for example, a center point) of the first marker 201 ' in the first image G1. By calculating the on-map distance between the coordinates of the first on-map position and the on-map position coordinates of the first marker 201', in combination with the scale of the first image G1, the value of the first physical distance D1 can be calculated.
In step 043, a second physical distance between the current physical position of the second marker 202 and the target physical position is calculated according to the second on-map position and the target on-map position of the second marker 202. In the example shown in fig. 15, the second marker 202 ' is a virtual second marker 202 ' located at a position on the target map, which is not present in the actually captured second image G2 and is only used for illustration, and the position on the target map of the second marker 202 is a position coordinate of a feature point (for example, a center point) of the second marker 202 ' in the second image G2. By calculating the on-map distance between the coordinates of the second on-map position and the on-map position coordinates of the second marker 202', in combination with the scale of the second image G2, the value of the second physical distance D2 may be calculated.
In step 044, the position deviation of the workpiece 200 is calculated according to the first physical distance, the second physical distance, and the standard physical distance between the first mark 201 and the second mark 202. The standard physical distance between the first mark 201 and the second mark 202 is a property of the workpiece 200 itself, and is known, for example, as shown by distances D3 and D4 in fig. 15. Thus, referring to fig. 15, the deflection angle θ in the diagram can be calculated according to the first physical distance D1, the second physical distance D2, the standard physical distances D3, D4, and the association theorem of triangle.
Referring to fig. 16, fig. 16 shows a state of the first mark 201 in the first image G1 after the first mark 201 and the second mark 202 in fig. 15 are rotated by an angle θ around the center of the workpiece 200, and a state of the second mark 202 in the second image G2, because the first mark 201 no longer has a deflection angle with respect to the first mark 201 ', the second mark 202 no longer has a deflection angle with respect to the second mark 202', the first mark 201 still has a relative displacement with respect to the first mark 201 ', and the second mark 202 still has a relative displacement with respect to the second mark 202', at this time, an on-graph offset amount and an offset direction between the first mark 201 and the first mark 201 'are calculated, a vector a representing the on-graph offset displacement of the first mark 201 can be obtained, and an on-graph offset amount and an offset direction between the second mark 202 and the second mark 202' are calculated, a vector b can be derived that characterizes the offset displacement on the map of the second mark 202, the direction and mode of the vector a and the vector b being theoretically the same. Therefore, the calculated included angle θ and the vector a or b can be used to characterize the positional deviation of the workpiece 200.
Further, if the first image and the second image for calculating the position deviation are acquired by the imaging device 10 using the second view field, the driving device 20 can adjust the position of the workpiece 200 according to the position deviation, then the imaging device 10 is used to align the first mark 201 and the second mark respectively, the first image and the second image are acquired by using the first view field, and then the position deviation is calculated again according to the first image and the second image acquired by using the first view field. Since the first field of view is smaller than the second field of view, the accuracy of the first image and the second image acquired with the first field of view is higher, and the accuracy of the position deviation obtained by recalculation is also higher, the driving device 20 adjusts the position of the workpiece 200 again according to the position deviation obtained by recalculation, so that the position of the workpiece 200 is closer to the target position.
In summary, in the detection method and the detection apparatus 100 according to the embodiment of the present application, after the imaging device 10 captures the first image including the image of the first mark 201, at least one of the imaging device 10 and the workpiece 200 moves so as to capture the second image including the image of the second mark 202 by using the imaging device 10, and then the position deviation of the workpiece 200 is detected by using the first image and the second image, so that the image can be captured by using the imaging device 10 and then the position deviation of the workpiece 200 can be detected regardless of the distribution of the first mark 201 and the second mark 202 of the workpiece 200, so that the detection apparatus 100 using the detection method can meet the detection requirements of various elements.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present application includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present application.
Although embodiments of the present application have been shown and described above, it is to be understood that the above embodiments are exemplary and not to be construed as limiting the present application, and that changes, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (12)

1. A detection method for detecting a positional deviation of a workpiece having a first mark and a second mark formed thereon, comprising:
aligning the target physical position of the first mark by using an imaging device, and acquiring an image comprising the first mark as a first image;
driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the second mark;
acquiring an image including the second marker as a second image using the imaging device; and
and detecting the position deviation of the workpiece according to the first image and the second image.
2. The detection method according to claim 1, wherein the aligning the target physical location of the first marker with an imaging device, acquiring the image including the first marker as a first image, comprises:
aligning the target physical position of the first mark by using the imaging device, and taking a first field-of-view acquisition image as a first initial image;
if the first initial image comprises the image of the first mark, taking the first initial image as the first image; and
if the first initial image does not include the image of the first mark, the imaging device is utilized to align the target physical position of the first mark, and a second field of view is used for acquiring an image as the first image, wherein the second field of view is larger than the first field of view.
3. The detection method according to claim 2, wherein the acquiring the image including the second marker with the imaging device is a second image, including:
and acquiring an image by using the imaging device with an initial view field as a second initial image, wherein the initial view field is the view field of the imaging device when the first image is acquired.
4. The detection method according to claim 3, wherein the acquiring the image including the second marker with the imaging device is a second image, including: if the initial field of view is the first field of view and the second initial image does not include the image of the second marker, acquiring an image with the second field of view as the second image by using the imaging device;
after the acquiring, by the imaging device, the image including the second mark is a second image, the detection method further includes:
driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the first mark; and
acquiring an image with the second field of view as an updated first image with the imaging device.
5. The inspection method of any one of claims 1 to 4, wherein said driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the second mark comprises:
driving the workpiece to move along a first direction, and/or driving the imaging device to move along a second direction; wherein the first direction is different from the second direction.
6. The inspection method according to any one of claims 1 to 4, wherein the inspecting the positional deviation of the workpiece from the first image and the second image includes:
identifying a first on-map location of the first marker in the first image and a second on-map location of the second marker in the second image;
calculating a first physical distance between the current physical position of the first mark and the target physical position according to the first on-graph position and the target on-graph position of the first mark;
calculating a second physical distance between the current physical position of the second mark and the target physical position according to the position on the second graph and the position on the target graph of the second mark; and
calculating a positional deviation of the workpiece based on the first physical distance, the second physical distance, and a standard physical distance between the first mark and the second mark.
7. An inspection apparatus for detecting a positional deviation of a workpiece formed with a first mark and a second mark, comprising:
the imaging device is used for aligning the target physical position of the first mark and acquiring an image comprising the first mark as a first image; and
a drive device for driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the second mark;
the imaging device is further used for acquiring an image comprising the second mark as a second image;
the detection apparatus further comprises a processing device for detecting a positional deviation of the workpiece from the first image and the second image.
8. The inspection apparatus of claim 7, wherein the imaging device is further configured to:
aligning the target physical position of the first mark, and taking a first field-of-view collected image as a first initial image;
if the first initial image comprises the image of the first mark, taking the first initial image as the first image; and
and if the first initial image does not comprise the image of the first mark, aligning the target physical position of the first mark, and acquiring an image as the first image by using a second field of view, wherein the second field of view is larger than the first field of view.
9. The inspection apparatus of claim 8, wherein the imaging device is further configured to: and taking an initial field-of-view collected image as a second initial image, wherein the initial field of view is the field of view of the imaging device when the first image is obtained.
10. The inspection apparatus of claim 9, wherein the imaging device is further configured to: if the initial field of view is the first field of view and the second initial image does not include the image of the second marker, acquiring an image with the second field of view as the second image;
the drive device is further configured to: driving at least one of the imaging device and the workpiece to move to align the imaging device with a target physical location of the first mark;
the imaging device is further configured to: acquiring an image with the second field of view as an updated first image.
11. The detection apparatus according to any one of claims 7 to 9, wherein the driving means comprises:
the first driving sub-device is used for driving the workpiece to move along a first direction; and/or
A second driving sub-device for driving the imaging device to move in a second direction; wherein the first direction is different from the second direction.
12. The detection apparatus according to any one of claims 7 to 9, wherein the processing device is configured to:
identifying a first on-map location of the first marker in the first image and a second on-map location of the second marker in the second image;
calculating a first physical distance between the current physical position of the first mark and the target physical position according to the first on-graph position and the target on-graph position of the first mark;
calculating a second physical distance between the current physical position of the second mark and the target physical position according to the position on the second graph and the position on the target graph of the second mark;
calculating the current physical distance between the first mark and the second mark according to the position on the first graph, the position on the second graph and the physical positions of the imaging device when the imaging device shoots the first image and the second image; and
and calculating the position deviation of the workpiece according to the first physical distance, the second physical distance, the current physical distance and the standard physical distance between the first mark and the second mark.
CN202110644261.7A 2021-06-09 2021-06-09 Detection method and detection equipment Pending CN113376180A (en)

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CN103460028A (en) * 2011-03-23 2013-12-18 丰田自动车株式会社 Apparatus for detecting defect of work
CN111830795A (en) * 2020-07-15 2020-10-27 浙江启尔机电技术有限公司 Tool and method for detecting micro-bubbles in immersion flow field of immersion lithography machine
CN112577970A (en) * 2019-09-30 2021-03-30 深圳中科飞测科技股份有限公司 Detection method, alignment method of detection equipment and detection equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103460028A (en) * 2011-03-23 2013-12-18 丰田自动车株式会社 Apparatus for detecting defect of work
CN112577970A (en) * 2019-09-30 2021-03-30 深圳中科飞测科技股份有限公司 Detection method, alignment method of detection equipment and detection equipment
CN111830795A (en) * 2020-07-15 2020-10-27 浙江启尔机电技术有限公司 Tool and method for detecting micro-bubbles in immersion flow field of immersion lithography machine

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