CN113372847A - Packaging material, packaging adhesive film, manufacturing method of packaging adhesive film and photovoltaic module - Google Patents
Packaging material, packaging adhesive film, manufacturing method of packaging adhesive film and photovoltaic module Download PDFInfo
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- CN113372847A CN113372847A CN202110540926.XA CN202110540926A CN113372847A CN 113372847 A CN113372847 A CN 113372847A CN 202110540926 A CN202110540926 A CN 202110540926A CN 113372847 A CN113372847 A CN 113372847A
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- Prior art keywords
- mass
- polyethylene
- acetate copolymer
- polyvinyl acetate
- packaging
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- Pending
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 74
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 73
- 239000005022 packaging material Substances 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 229920002689 polyvinyl acetate Polymers 0.000 claims abstract description 135
- 239000011118 polyvinyl acetate Substances 0.000 claims abstract description 135
- 229910052809 inorganic oxide Inorganic materials 0.000 claims abstract description 89
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 50
- 239000007822 coupling agent Substances 0.000 claims abstract description 30
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 23
- 239000011256 inorganic filler Substances 0.000 claims abstract description 14
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 14
- 150000002500 ions Chemical class 0.000 claims description 38
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 28
- -1 octyl epichlorohydrin Chemical compound 0.000 claims description 25
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 18
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 150000003505 terpenes Chemical class 0.000 claims description 14
- 235000007586 terpenes Nutrition 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 239000004971 Cross linker Substances 0.000 claims description 12
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 12
- 239000003963 antioxidant agent Substances 0.000 claims description 12
- 230000003078 antioxidant effect Effects 0.000 claims description 12
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 12
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 11
- 235000010354 butylated hydroxytoluene Nutrition 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 11
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 claims description 11
- 239000004014 plasticizer Substances 0.000 claims description 11
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 9
- 239000012760 heat stabilizer Substances 0.000 claims description 9
- 239000004611 light stabiliser Substances 0.000 claims description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 8
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 7
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 7
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 7
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 7
- AKKLAJYCGVIWBS-UHFFFAOYSA-N O=[N].CC1(C)CCCC(C)(C)N1 Chemical compound O=[N].CC1(C)CCCC(C)(C)N1 AKKLAJYCGVIWBS-UHFFFAOYSA-N 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000000395 magnesium oxide Substances 0.000 claims description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 6
- 230000005012 migration Effects 0.000 claims description 6
- 238000013508 migration Methods 0.000 claims description 6
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 5
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 claims description 5
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 5
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 claims description 5
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 5
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 claims description 5
- 239000011787 zinc oxide Substances 0.000 claims description 5
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 claims description 4
- 239000002671 adjuvant Substances 0.000 claims description 4
- AIPOPAMHLCTKSM-UHFFFAOYSA-N benzoic acid;2,2,6,6-tetramethylpiperidine Chemical compound OC(=O)C1=CC=CC=C1.CC1(C)CCCC(C)(C)N1 AIPOPAMHLCTKSM-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000306 component Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- 229920006280 packaging film Polymers 0.000 claims description 2
- 239000012785 packaging film Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 15
- 239000005038 ethylene vinyl acetate Substances 0.000 description 14
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 14
- 238000012360 testing method Methods 0.000 description 13
- 239000004408 titanium dioxide Substances 0.000 description 11
- 230000004069 differentiation Effects 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 230000010354 integration Effects 0.000 description 7
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 238000006460 hydrolysis reaction Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 3
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-Tetramethylpiperidine Substances CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229960003753 nitric oxide Drugs 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 229910001414 potassium ion Inorganic materials 0.000 description 3
- 229910001415 sodium ion Inorganic materials 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 230000004224 protection Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- LGXAANYJEHLUEM-UHFFFAOYSA-N 1,2,3-tri(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC(C(C)C)=C1C(C)C LGXAANYJEHLUEM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 239000002135 nanosheet Substances 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 125000000864 peroxy group Chemical group O(O*)* 0.000 description 1
- 125000005498 phthalate group Chemical group 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000012812 sealant material Substances 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a packaging material, a packaging adhesive film, a manufacturing method of the packaging adhesive film and a photovoltaic module, and relates to the technical field of photovoltaics, so that the packaging material is guaranteed to have good PID resistance and low production cost. The packaging material is used for packaging a photovoltaic module and comprises: the polyethylene-polyvinyl acetate copolymer, the nanometer inorganic filler, the cross-linking agent component, the coupling agent and the auxiliary agent component, wherein the nanometer inorganic filler is nanometer inorganic oxide which can be negatively charged. The packaging adhesive film comprises the packaging material provided by the technical scheme. The packaging material provided by the invention is used for a photovoltaic module.
Description
Technical Field
The invention relates to the technical field of photovoltaics, in particular to a packaging material, a packaging adhesive film, a manufacturing method of the packaging adhesive film and a photovoltaic module.
Background
Ethylene-vinyl acetate copolymer (EVA) is a thermosetting adhesive film and can be placed between laminated glasses. EVA has been increasingly widely used in current devices and various optical products due to its significant advantages in adhesion, durability, optical properties, etc.
In the related technology, the solar cell sheet can be packaged by using the EVA adhesive film with high transparency, excellent ultraviolet resistance and aging resistance, good adhesion and elasticity, and the EVA adhesive film is bonded with an upper layer protective material (such as glass) and a lower layer protective material (such as a back plate or glass) to jointly form a photovoltaic module. In practical application, the double-glass assembly utilizes the packaging adhesive film to package the battery unit, and utilizes the packaging adhesive film to bond the glass cover plate and the battery unit together. The glass cover plate is mostly silicate glass, and the main components thereof are inorganic oxides such as silica, potassium oxide, sodium oxide, magnesium oxide, and the like, and in a moist heat state, these alkali positive charge ions and alkaline earth positive charge ions are easily precipitated from the glass cover plate and may migrate to the solar battery cell. When positive charge ions such as alkali positive charge ions and alkaline earth positive charge ions migrate to the surface of the solar cell unit, the power of the solar cell decreases when high voltage flows through the solar cell unit, which is called potential Induced degradation (pid) phenomenon, resulting in the decrease of the power of the module.
In view of the fact that the PID phenomenon causes the function of the photovoltaic module to be reduced to different degrees, in order to reduce the influence of PID, ethylene-octene copolymer (POE) adhesive films are frequently selected in the industry as the packaging material of the dual-glass photovoltaic module. However, the POE adhesive film has the disadvantages of high cost, long laminating time and the like.
Disclosure of Invention
The invention aims to provide a packaging material, a packaging adhesive film, a manufacturing method of the packaging adhesive film and a photovoltaic module, so as to ensure that the packaging material not only has good PID (proportion integration differentiation) resistance, but also has lower production cost.
In a first aspect, the present invention provides an encapsulant for encapsulating a photovoltaic module, the encapsulant comprising: polyethylene-polyvinyl acetate copolymer, nano inorganic filler, cross-linking agent component, coupling agent and auxiliary agent component. The nanoscale inorganic filler is a nanoscale inorganic oxide capable of carrying negative charges, and the nanoscale inorganic oxide is used for blocking migration of positive charge ions in the photovoltaic module.
Under the condition of adopting the technical scheme, each component selected by the packaging material is easy to purchase and has low cost, and under the action of the cross-linking agent component and the coupling agent, the polyethylene-polyvinyl acetate copolymer can react with the auxiliary agent component to form a three-dimensional network, so that the nano-scale inorganic filler is surrounded by the three-dimensional network in a uniformly dispersed manner. Meanwhile, under the small-size effect, the nanoscale inorganic oxide has good light transmittance, so that the light utilization rate of the photovoltaic module is not influenced when the packaging material containing the nanoscale inorganic oxide is used for the photovoltaic module; moreover, the packaging material has negative charges in a damp and hot environment, so that when the packaging material is used for packaging the battery unit, in the process that migratable positive charge ions generated by the photovoltaic module in the damp and hot environment penetrate through the packaging adhesive film and migrate to the battery module, the nano inorganic oxide surrounded by the three-dimensional network can electrostatically adsorb the positive charge ions, and the PID phenomenon generated when the positive charge ions migrate to the surface of the battery module is reduced. Moreover, since the nanoscale inorganic oxide is uniformly dispersed and surrounded by the three-dimensional network, when the nanoscale inorganic oxide electrostatically adsorbs positive charge ions, the three-dimensional network can lock the positive charge ions adsorbed on the nanoscale inorganic oxide and prevent the positive charge ions from being separated from the nanoscale inorganic oxide. Therefore, when the packaging material provided by the invention is used for packaging a photovoltaic module, positive charge ions in the photovoltaic module are blocked from migrating to the surface of a battery module through the mutual matching of all components contained in the packaging material, so that the influence of a PID (proportion integration differentiation) phenomenon on the photovoltaic module is reduced, and the power of the photovoltaic module in a damp and hot environment is improved. Proved by verification, the power attenuation rate of the packaging material provided by the invention used for the photovoltaic module can be reduced by at least 29.7%.
Therefore, the packaging material provided by the invention not only has good PID resistance, but also has lower production cost.
In an alternative form, the nanoscale inorganic oxide includes silicon oxide and/or an oxide of a fourth subgroup element. When the nano-scale inorganic oxide is silicon oxide or fourth subgroup element oxide, the nano-scale inorganic oxide ensures that the probability of blocking light by the packaging material is reduced when the packaging material is used for packaging a photovoltaic module. Meanwhile, the nanoscale inorganic oxide can carry negative charges and adsorb positive charge ions in a damp and hot environment, so that the influence of a PID (proportion integration differentiation) phenomenon on the photovoltaic module is reduced.
In one possible implementation, the fourth subgroup oxide includes titania and/or zirconia.
In one possible implementation, the structure of the nanoscale inorganic oxide includes at least a particle structure, a rod structure, or a sheet structure.
In one possible implementation, the particle size of the nanoscale inorganic oxide is less than 100 nm.
In one possible implementation mode, the mass of the nanoscale inorganic oxide is 0.01-5% of the mass of the polyethylene-polyvinyl acetate copolymer. At the moment, the ion migration blocking function of the nano-scale inorganic oxide can be fully exerted by controlling the adding amount of the nano-scale inorganic oxide, the performance influence of the nano-scale inorganic oxide on the packaging material can be reduced, and the packaging adhesive film made of the packaging material is ensured to play the role of protecting the original packaging adhesive film.
In one possible implementation, the polyethylene-polyvinyl acetate copolymer contains a vinyl acetate content of 23% to 35% by mass. When the packaging material is in a damp and hot condition, the polyethylene-polyvinyl acetate copolymer contained in the packaging material has a low hydrolysis rate, and the manufactured packaging adhesive film can be ensured to have a three-dimensional network structure as complete as possible. Based on this, when the photovoltaic module that contains the encapsulation glued membrane is in the damp and hot condition, the three-dimensional network structure that encapsulation glued membrane has is difficult to be destroyed by steam to guarantee that three-dimensional network structure locks the positive charge ion ability of adsorbing at nanometer inorganic oxide better, in order to further improve packaging material's anti PID performance.
In one possible implementation, the crosslinker component includes a primary crosslinker and a secondary crosslinker; wherein, the mass of the main crosslinking agent is 0.3-2% of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the auxiliary crosslinking agent is 0.1-0.5% of the mass of the polyethylene-polyvinyl acetate copolymer.
In one possible implementation, the primary crosslinking agent includes at least diphenyl carbonate, benzoyl peroxide, triallyl cyanurate, or a ketone peroxide crosslinking agent.
In one possible implementation, the above-mentioned co-crosslinking agent includes at least zinc oxide, magnesium oxide, triallyl cyanurate, triallyl triisocyanate or trimethylolpropane trimethacrylate.
In a possible implementation, the mass of the coupling agent is 0.3% to 1% of the mass of the polyethylene-polyvinyl acetate copolymer.
In one possible implementation, the coupling agent comprises at least vinyltriethoxysilane, vinyltrimethoxysilane or vinyltris (β -methoxyethoxy) silane.
In one possible implementation, the aforementioned adjuvant component comprises at least an antioxidant. The mass of the antioxidant is 0.1-1% of the mass of the polyethylene-polyvinyl acetate copolymer. The antioxidant at least comprises 2, 6-di-tert-butyl-4-methylphenol, trisnonylphenyl phosphite, triphenyl phosphate or di (dodecyl) -3,3' -thiodipropionate.
In one possible embodiment, the abovementioned auxiliary components comprise at least light stabilizers. The mass of the light stabilizer is 0.1-1% of that of the polyethylene-polyvinyl acetate copolymer, and the light stabilizer at least comprises 2,2,6, 6-tetramethyl piperidine benzoate or 2,2,6, 6-tetramethyl piperidine-nitrogen-oxide.
In one possible implementation, the aforementioned auxiliary component comprises at least a heat stabilizer. The mass of the heat stabilizer is 1 to 5 percent of that of the polyethylene-polyvinyl acetate copolymer. The heat stabilizer at least comprises stearate, octyl epichlorohydrin, trialkyl phosphite, triaryl phosphite or pentaerythritol.
In one possible implementation, the adjuvant component comprises at least a tackifier. The mass of the tackifier is 0.2-0.8% of that of the polyethylene-polyvinyl acetate copolymer, and the tackifier at least comprises terpene resin, rosin tackifier or pentaerythritol ester.
In one possible implementation, the aforementioned adjuvant component comprises at least a plasticizer. The mass of the plasticizer is 1-3% of the mass of the polyethylene-polyvinyl acetate copolymer, and the plasticizer at least comprises dioctyl phthalate, dibutyl phthalate or phthalate.
In a second aspect, the present invention provides a packaging adhesive film, including the packaging material described in the first aspect or any one of the possible implementation manners of the first aspect.
The beneficial effect of the packaging adhesive film provided by the second aspect is the same as that of the packaging material described in the first aspect or any possible implementation manner of the first aspect, and is not repeated here.
In a third aspect, the present invention provides a method for manufacturing an encapsulation film, where the encapsulation material described in the first aspect or any one of the possible implementation manners of the first aspect is applied, and the method for manufacturing the encapsulation material includes:
heating and melting inorganic filler, a cross-linking agent, a coupling agent, an auxiliary agent component and a polyethylene-polyvinyl acetate copolymer to obtain a molten liquid;
and manufacturing a packaging adhesive film by using the molten liquid.
The beneficial effects of the manufacturing method of the packaging adhesive film provided by the third aspect are the same as those of the packaging material described in the first aspect or any possible implementation manner of the first aspect, and are not described herein again.
In a fourth aspect, the present invention provides a photovoltaic module, including the encapsulant described in the first aspect or any one of the possible implementations of the first aspect, or the encapsulant film described in the second aspect or any one of the possible implementations of the second aspect.
The beneficial effects of the manufacturing method of the encapsulation adhesive film provided by the fourth aspect are the same as the beneficial effects of the encapsulation material described in the first aspect or any possible implementation manner of the first aspect, and are not described herein again.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more apparent, the present invention is further described in detail below with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on the illustrated embodiments, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The embodiment of the invention provides a photovoltaic module, wherein the contained packaging material can exist in the forms of adhesive films, packaging blocks and the like, and has good PID (proportion integration differentiation) resistance and production cost. The packaging material provided by the embodiment of the invention can be used for packaging a photovoltaic module, and not only can be used for bonding a cover plate and a battery module in a packaging adhesive film manner, but also can be used for bonding a frame and the battery module. When the packaging material exists in the form of an adhesive film, the embodiment of the invention also protects the packaging adhesive film which comprises the packaging material and still has good PID resistance and production cost.
The packaging material used by the packaging adhesive film provided by the embodiment of the invention comprises: polyethylene-polyvinyl acetate copolymer, nano inorganic filler, cross-linking agent component, coupling agent and auxiliary agent component. The nanoscale inorganic filler is a nanoscale inorganic oxide that can be negatively charged. Nanoscale inorganic oxides are used to block migration of positively charged ions within the photovoltaic module. The positive charge ions herein may be metal ions such as sodium ions and potassium ions, but cations in the possible forms such as organic cations are not excluded.
The polyethylene-polyvinyl acetate copolymer and the host component can react under the action of the cross-linking agent component and the coupling agent to form a three-dimensional network, so that the nano inorganic oxide is surrounded by the three-dimensional network in a uniformly dispersed manner. The inventor finds that: under the small-size effect, the nanoscale inorganic oxide has good light transmittance, so that the light utilization rate of the photovoltaic module is not influenced when the packaging material containing the nanoscale inorganic oxide is used for the photovoltaic module. When the transparent material is in a damp and hot environment, the nano inorganic oxide has negative charges and can adsorb ions with positive charges. Based on this, when the packaging material is used for packaging the battery unit, when migratable positive charge ions generated by the photovoltaic module in a damp and hot environment pass through the packaging adhesive film and migrate to the surface of the battery module, the nano inorganic oxide surrounded by the three-dimensional network can electrostatically adsorb the positive charge ions, so that the PID phenomenon generated by migration of the positive charge ions to the surface of the battery module is reduced. Moreover, since the nanoscale inorganic oxide is uniformly dispersed and surrounded by the three-dimensional network, when the nanoscale inorganic oxide electrostatically adsorbs positive charge ions, the three-dimensional network can lock the positive charge ions adsorbed on the nanoscale inorganic oxide and prevent the positive charge ions from being separated from the nanoscale inorganic oxide. Therefore, when the packaging material provided by the embodiment of the invention is used for packaging a photovoltaic module, positive charge ions in the photovoltaic module are blocked from migrating to the surface of a battery module through the mutual matching of all components contained in the packaging material, so that the influence of a PID (proportion integration differentiation) phenomenon on the photovoltaic module is reduced, and the power of the photovoltaic module in a damp and hot environment is improved. Proved by verification, the power attenuation rate of the packaging material provided by the invention used for the photovoltaic module can be reduced by at least 29.7%.
Therefore, the packaging material provided by the embodiment of the invention has good PID resistance and lower production cost.
As a possible implementation manner, in order to ensure the light transmission performance of the nanoscale inorganic oxide, the particle size of the nanoscale inorganic oxide can be limited to be smaller than 100nm, the visible light wavelength is 400 nm-800 nm, and the difference between the particle size of the nanoscale inorganic oxide and the visible light wavelength is more than 4 times, so that the nanoscale inorganic oxide has good light transmission performance. The structure of the nanoscale inorganic oxide includes at least a particle structure, a rod structure or a sheet structure. The nanoscale inorganic oxide may be a single structure or a mixture of at least two structures. If the structure of the nanoscale inorganic oxide is a particle structure, the nanoscale inorganic oxide is a nanoparticle. If the structure of the nano-scale inorganic oxide is a rod-shaped structure, the nano-scale inorganic oxide is a nano rod. If the structure of the nanoscale inorganic oxide is a sheet structure, the nanoscale inorganic oxide is a nanosheet.
The nanoscale inorganic oxide may include, but is not limited to, silicon oxide and/or fourth subgroup element oxide. The fourth subgroup element oxide may be titania and/or zirconia, or the like.
When the inorganic oxide is silicon oxide or fourth subgroup element oxide, the inorganic oxide ensures that the probability of blocking light by the packaging material is reduced when the packaging material is used for packaging the photovoltaic module. Meanwhile, the inorganic oxide can carry negative charges and adsorb positive charge ions in a damp and hot environment, so that the influence of a PID (proportion integration differentiation) phenomenon on the photovoltaic module is reduced.
As a possible realization mode, the mass of the nanoscale inorganic oxide is 0.01-5% of the mass of the polyethylene-polyvinyl acetate copolymer. At the moment, the sealing adhesive film formed by the sealing material can not only fully play the ion migration blocking function of the nano-scale inorganic oxide, but also reduce the performance influence of the nano-scale inorganic oxide on the packaging material, and ensure that the packaging adhesive film made of the packaging material can guarantee the characteristics of the original packaging adhesive film.
The polyethylene-polyvinyl acetate copolymer can be hot-melt polyethylene-polyvinyl acetate copolymer. In order to reduce the problem of the performance degradation of the adhesive film caused by hydrolysis in a damp and hot environment, the mass content of vinyl acetate contained in the polyethylene-polyvinyl acetate copolymer is 23-35%, and further 28-33%. The polyethylene-polyvinyl acetate copolymer can be selected from EVA Japan three well 220 (with a mass content of vinyl acetate of 28%), Korea le day EVA900 ethylene-vinyl acetate copolymer (with a mass content of vinyl acetate of 28%), DuPont's EVA 360 (with a mass content of vinyl acetate of 25%), Korea Hua 1533 ethylene-vinyl acetate copolymer (with a mass content of vinyl acetate of 33%), EVA Japan three well 150 (with a mass content of vinyl acetate of 33%), etc.
When the packaging material is in a damp and hot condition, the polyethylene-polyvinyl acetate copolymer contained in the packaging material has a low hydrolysis rate, and the manufactured packaging adhesive film can be ensured to have a three-dimensional network structure as complete as possible. Based on this, when the photovoltaic module that contains the encapsulation glued membrane is in the damp and hot condition, the three-dimensional network structure that encapsulation glued membrane has is difficult to be destroyed by steam to guarantee that three-dimensional network structure locks the positive charge ion ability of adsorbing at nanometer inorganic oxide better, in order to further improve packaging material's anti PID performance.
As one possible implementation, the above-mentioned crosslinker component includes a primary crosslinker and a secondary crosslinker. The mass of the primary crosslinking agent may be greater than the mass of the secondary crosslinking agent. The mass of the main crosslinking agent is 0.3-2% of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the auxiliary crosslinking agent is 0.1-0.5% of the mass of the polyethylene-polyvinyl acetate copolymer. The crosslinking of the polyethylene-polyvinyl acetate copolymer and the host component is realized by adopting a mode of mutually matching the main crosslinking agent and the auxiliary crosslinking agent, and the good crosslinking effect can be ensured.
The main crosslinking agent at least comprises diphenyl carbonate, benzoyl peroxide, triallyl cyanurate or a ketone peroxide crosslinking agent. The peroxy ketal crosslinking agent may be 1, 1-bis (t-butylperoxy) -3,3, 5-trimethylcyclohexane, or the like. The auxiliary crosslinking agent at least comprises one of an inorganic crosslinking agent and an organic crosslinking agent. The inorganic cross-linking agent can be zinc oxide, magnesium oxide, etc. The organic crosslinker can be triallyl cyanurate, triallyl triisocyanate, or trimethylolpropane trimethacrylate. When the auxiliary crosslinking agent is inorganic oxide, the polyethylene-polyvinyl acetate copolymer and the auxiliary agent component can be crosslinked by using the inorganic oxide. Because the reaction energy level of the inorganic oxide as the assistant crosslinking agent is lower, the crosslinking reaction can be carried out at a lower temperature, and the polyethylene-polyvinyl acetate copolymer and the assistant component can react at a lower temperature. The heat generated by the reaction can promote the decomposition of the main crosslinking agent, thereby reducing the decomposition temperature of the main crosslinking agent and enabling the packaging film material to be manufactured more easily.
The mass of the coupling agent is 0.3-1% of that of the polyethylene-polyvinyl acetate copolymer. The coupling agent can be a silane coupling agent, and at least comprises vinyl triethoxysilane, vinyl trimethoxysilane or vinyl tri (beta-methoxyethoxy) silane.
The auxiliary components may include one or more of an antioxidant, a light stabilizer, a heat stabilizer, a tackifier, and a plasticizer, but are not limited thereto.
When the auxiliary agent component at least comprises an antioxidant, the mass of the antioxidant is 0.1-1% of that of the polyethylene-polyvinyl acetate copolymer; the antioxidant at least comprises 2, 6-di-tert-butyl-4-methylphenol, trisnonylphenyl phosphite, triphenyl phosphate or di (dodecyl) -3,3' -thiodipropionate; and/or the presence of a gas in the gas,
the mass of the light stabilizer is 0.1-1% of that of the polyethylene-polyvinyl acetate copolymer, and the light stabilizer at least comprises 2,2,6, 6-tetramethyl piperidine benzoate or 2,2,6, 6-tetramethyl piperidine-nitrogen-oxide.
The mass of the heat stabilizer is 1-5% of that of the polyethylene-polyvinyl acetate copolymer, and the heat stabilizer at least comprises stearate, octyl epichlorohydrin, trialkyl phosphite, triaryl ester or pentaerythritol. The triaryl ester may be triisopropylphenyl phosphate, triphenyl phosphate, or the like.
The mass of the tackifier is 0.2-0.8% of that of the polyethylene-polyvinyl acetate copolymer, and the tackifier at least comprises terpene resin, rosin tackifier or pentaerythritol ester. The terpene resin may be terpene resin T80T 90T100 (Jiangxi Jinlin chemical Co., Ltd., production company), terpene resin T-90 (Henan Shengkun chemical products Co., Ltd., production company), etc. The rosin tackifier can be rosin modified resin (Junlong chemical industry), water rosin tackifying resin WT3179 (Weisda West Tech) and the like.
The mass of the plasticizer is 1-3% of that of the polyethylene-polyvinyl acetate copolymer, and the plasticizer at least comprises dioctyl phthalate, dibutyl phthalate or phthalate.
The embodiment of the invention also provides a manufacturing method of the packaging adhesive film, and the raw material used by the packaging adhesive film is the packaging material in the embodiment. The manufacturing method of the packaging adhesive film can comprise the following steps: heating and melting inorganic filler, a cross-linking agent, a coupling agent, an auxiliary agent component and a polyethylene-polyvinyl acetate copolymer to obtain a molten liquid; and manufacturing a packaging adhesive film by using the molten liquid. For example, the inorganic filler, the crosslinking agent, the coupling agent and the auxiliary agent can be heated and melted first, then the inorganic filler, the crosslinking agent, the coupling agent and the auxiliary agent are mixed with the polyethylene-polyvinyl acetate copolymer and heated and melted, and then the packaging adhesive film is formed by adopting film forming modes such as casting film forming, rolling film forming and the like, or other existing film forming processes can be adopted to manufacture the packaging adhesive film.
The following describes the packaging adhesive film according to an embodiment of the present invention, taking the packaging adhesive film formed by a tape casting process as an example.
Example one
The packaging material contained in the packaging adhesive film provided by the embodiment of the invention comprises polyethylene-polyvinyl acetate copolymer, nano inorganic oxide, a cross-linking agent, a coupling agent and an auxiliary agent component. The polyethylene-polyvinyl acetate copolymer is EVA Japan three well 220, and contains 28% of vinyl acetate by mass. The nano inorganic oxide is granular titanium dioxide with the grain diameter of 3nm to 5nm, the cross-linking agent comprises benzoyl peroxide and triallyl cyanurate, the coupling agent is vinyl triethoxysilane, and the auxiliary components comprise 2, 6-di-tert-butyl-4-methylphenol, benzoic acid 2,2,6, 6-tetramethyl piperidine ester, epichlorohydrin octyl ester and terpene resin T80T 90T 100.
The mass of the granular titanium dioxide is 0.8 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the benzoyl peroxide is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl cyanurate is 0.3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the vinyltriethoxysilane is 0.3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the 2, 6-di-tert-butyl-4-methylphenol is 0.8 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the 2,2,6, 6-tetramethylpiperidine ester is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the octyl epichlorohydrin is 3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the terpene resin T80T 90T100 is 0.6 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the dioctyl phthalate is 2 percent of that of the polyethylene-polyvinyl acetate copolymer.
Example two
The packaging adhesive film provided by the embodiment of the invention contains the packaging material which is different from the first embodiment in that the used nanoscale inorganic oxide is rod-shaped titanium dioxide with the particle size of 10 nm-50 nm. The mass of the rod-shaped titanium dioxide is 0.1 percent of that of the polyethylene-polyvinyl acetate copolymer.
EXAMPLE III
The difference between the packaging material contained in the packaging adhesive film provided by the embodiment of the invention and the first embodiment is that the polyethylene-polyvinyl acetate copolymer is EVA Japan three-well 150, and the mass content of the vinyl acetate contained in the polyethylene-polyvinyl acetate copolymer is 33%. The nano-grade inorganic oxide used is rod-shaped titanium dioxide with the particle size of 10 nm-50 nm. The mass of the rod-shaped titanium dioxide is 0.05 percent of that of the polyethylene-polyvinyl acetate copolymer. The antioxidant is di (dodecyl) -3,3' -thiodipropionate, the mass of the antioxidant is 1% of the mass of the polyethylene-polyvinyl acetate copolymer, and the plasticizer is phthalate, the mass of the plasticizer is 1% of the mass of the polyethylene-polyvinyl acetate copolymer. The mass of the vinyltriethoxysilane is 0.8% of the mass of the polyethylene-polyvinyl acetate copolymer.
Example four
The packaging material contained in the packaging adhesive film provided by the embodiment of the invention comprises polyethylene-polyvinyl acetate copolymer, nano inorganic oxide, a cross-linking agent, a coupling agent and an auxiliary agent component. The polyethylene-polyvinyl acetate copolymer is EVA 360 from DuPont, and contains 25% by mass of vinyl acetate. The nano inorganic oxide is sheet silicon oxide with the particle size of 60 nm-80 nm, the cross-linking agent comprises diphenyl carbonate, triallyl cyanurate and zinc oxide, the coupling agent is vinyl trimethoxy silane, and the auxiliary agent comprises trisnonylphenyl phosphite, 2,6, 6-tetramethylpiperidine-nitrogen-oxide and trialkyl phosphite.
The mass of the sheet silica is 0.01 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the diphenyl carbonate is 0.1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl cyanurate is 0.2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the zinc oxide is 0.1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the vinyltrimethoxysilane is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the trisnonylphenyl phosphite is 0.08 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the di (dodecyl) -3,3' -thiodipropionate is 0.02 percent of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the 2,2,6, 6-tetramethylpiperidine-nitrogen-oxide is 1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the trialkyl phosphite is 2 percent of the mass of the polyethylene-polyvinyl acetate copolymer.
EXAMPLE five
The packaging material contained in the packaging adhesive film provided by the embodiment of the invention comprises polyethylene-polyvinyl acetate copolymer, nano inorganic oxide, a cross-linking agent, a coupling agent and an auxiliary agent component. The polyethylene-polyvinyl acetate copolymer was korean 1533, and contained 33% by mass of vinyl acetate. The nano-scale inorganic oxide is granular silicon oxide with the grain diameter of 30nm to 90nm, the cross-linking agent comprises 1, 1-bis (tert-butylperoxy) -3,3, 5-trimethylcyclohexane, magnesium oxide and triallyl triisocyanate, the coupling agent is vinyl tri (beta-methoxyethoxy) silane, and the auxiliary agent comprises triphenyl phosphate, 2, 6-di-tert-butyl-4-methylphenol, 2,6, 6-tetramethylpiperidine-nitrogen-oxide, sodium stearate, triisopropylbenzene phosphate, terpene resin T80T 90T100 and dibutyl phthalate.
The mass of the granular silicon oxide is 3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the 1, 1-bis (tert-butylperoxy) -3,3, 5-trimethylcyclohexane is 2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the magnesium oxide is 0.3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl triisocyanate is 0.2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the vinyl tri (beta-methoxyethoxy) silane is 1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triphenyl phosphate is 0.7 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the 2, 6-di-tert-butyl-4-methylphenol is 0.3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the 2,2,6, 6-tetramethylpiperidine-nitrogen-oxide is 0.1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the sodium stearate salt is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triisopropylphenyl phosphate ester is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the terpene resin T80T 90T100 is 0.2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the dibutyl phthalate is 3 percent of the mass of the polyethylene-polyvinyl acetate copolymer.
EXAMPLE six
The packaging material contained in the packaging adhesive film provided by the embodiment of the invention comprises polyethylene-polyvinyl acetate copolymer, nano inorganic oxide, a cross-linking agent, a coupling agent and an auxiliary agent component. The polyethylene-polyvinyl acetate copolymer contained 35% by mass of vinyl acetate. The nanometer inorganic oxide comprises rod-shaped zirconia with the grain diameter of 30 nm-70 nm and sheet-shaped silica with the grain diameter of 10 nm-50 nm, the cross-linking agent comprises triallyl cyanurate and triallyl triisocyanate, the coupling agent comprises vinyltriethoxysilane and vinyltrimethoxysilane, and the auxiliary agent comprises 2, 6-di-tert-butyl-4-methylphenol, 2,6, 6-tetramethylpiperidine benzoate, 2,6, 6-tetramethylpiperidine-nitrogen-oxide, pentaerythritol, aqueous rosin tackifying resin WT3179, dibutyl phthalate and phthalate.
The mass of the rodlike zirconia is 2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the sheet-like silica is 3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl cyanurate is 1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl triisocyanate is 0.4 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the vinyltriethoxysilane is 0.2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the vinyltrimethoxysilane is 0.4 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the 2, 6-di-tert-butyl-4-methylphenol is 0.6 percent of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the 2,2,6, 6-tetramethylpiperidine-nitrogen-oxide is 0.1 percent of the mass of the polyethylene-polyvinyl acetate copolymer The mass of 2,2,6, 6-tetramethyl piperidine benzoate is 0.3% of the mass of polyethylene-polyvinyl acetate copolymer, the mass of pentaerythritol is 0.5% of the mass of polyethylene-polyvinyl acetate copolymer, the mass of water-based rosin tackifying resin WT3179 is 0.8% of the mass of polyethylene-polyvinyl acetate copolymer, the mass of dibutyl phthalate is 3% of the mass of polyethylene-polyvinyl acetate copolymer, and the mass of phthalate is 1% of the mass of polyethylene-polyvinyl acetate copolymer.
EXAMPLE seven
The packaging material contained in the packaging adhesive film provided by the embodiment of the invention comprises polyethylene-polyvinyl acetate copolymer, nano inorganic oxide, a cross-linking agent, a coupling agent and an auxiliary agent component. The polyethylene-polyvinyl acetate copolymer contained 23% by mass of vinyl acetate. The nano inorganic oxide is granular zirconia with the grain diameter of 30nm to 50nm, the cross-linking agent comprises triallyl cyanurate, trimethylolpropane trimethacrylate and triallyl cyanurate, the coupling agent comprises vinyl triethoxysilane, and the auxiliary agent comprises triphenyl phosphate, 2,6, 6-tetramethyl piperidine benzoate, triphenyl phosphate, octyl epoxy chloropropane, terpene resin T-90, pentaerythritol ester and dibutyl phthalate.
The mass of the granular zirconium oxide is 2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl cyanurate is 1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the trimethylolpropane trimethyl acrylic acid methyl ester is 0.1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl cyanurate is 0.1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the vinyltriethoxysilane is 0.7 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triphenyl phosphate is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the benzoic acid 2,2,6, 6-tetramethyl piperidine ester and the triphenyl phosphate is 0.2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the triphenyl phosphate is 2 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the epichlorohydrin octyl ester is 1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the terpene resin T-90 is 0.4 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the pentaerythritol ester is 0.1 percent of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the dibutyl phthalate is 1 percent of the mass of the polyethylene-polyvinyl acetate copolymer.
Comparative example
The packaging adhesive film provided by the comparative example contains a packaging material which comprises polyethylene-polyvinyl acetate copolymer, a cross-linking agent, a coupling agent and an auxiliary agent component. The polyethylene-polyvinyl acetate copolymer is EVA Japan three well 220, and contains 28% of vinyl acetate by mass. The cross-linking agent comprises benzoyl peroxide and triallyl cyanurate, the coupling agent is vinyl triethoxysilane, and the auxiliary components comprise 2, 6-di-tert-butyl-4-methylphenol, benzoic acid 2,2,6, 6-tetramethylpiperidine ester, octyl epichlorohydrin and terpene resin T80T 90T 100.
The mass of the benzoyl peroxide is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the triallyl cyanurate is 0.3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the vinyltriethoxysilane is 0.3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the 2, 6-di-tert-butyl-4-methylphenol is 0.8 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the benzoic acid 2,2,6, 6-tetramethylpiperidine ester is 0.5 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the octyl epichlorohydrin is 3 percent of the mass of the polyethylene-polyvinyl acetate copolymer, the mass of the terpene resin T80T 90T100 is 0.6 percent of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the dioctyl phthalate is 2 percent of the mass of the polyethylene-polyvinyl acetate copolymer.
In order to prove the PID resistance effect of the sealant film provided in the embodiment of the present invention, the following comparative example is used as a reference, and the sealant films provided in the first to third representative examples are selected to perform the PID resistance test, and the test results are shown in table 1.
TABLE 1 Power attenuation test results of packaging materials contained in packaging adhesive films
As can be seen from table 1, the packaging adhesive films provided in the first to third embodiments of the present invention have lower power attenuation. Compared with the comparative example, the power attenuation after PID96h is reduced by 43.8-54.8%, and the power attenuation after PID192h is reduced by 29.6-68.4%. According to analysis, the nano-scale inorganic oxide is not added in the comparative example, and the packaging adhesive film has a good PID (proportion integration differentiation) resistant effect by adding the nano-scale inorganic oxide and the synergistic effect of the nano-scale inorganic oxide and other components.
As shown by the PID96h test performed on the packaging adhesive films of the first to third embodiments, the packaging adhesive film with the smallest power attenuation after the PID96h test is the packaging adhesive film of the third embodiment, and the power attenuation thereof can be reduced by 54.8%, and the packaging material in the packaging adhesive film of the third embodiment contains the least nano-inorganic oxide (compared with the first and second embodiments), but the anti-PID effect thereof is the best. This is likely to be the result of a combination of three reasons:
first, the rod-shaped titanium dioxide has a slender shape, and can absorb more positive charge ions, such as metal ions, such as sodium ions, potassium ions, and the like, by utilizing the advantage that the rod-shaped titanium dioxide has a longer dimension in the axial direction.
Secondly, under the action of the main crosslinking agent, the auxiliary crosslinking agent and the coupling agent, the rodlike titanium dioxide is surrounded in the crosslinking process of the polyethylene-polyvinyl acetate copolymer and the auxiliary agent component, so that the nanoscale inorganic oxide is uniformly dispersed in the finally generated three-dimensional network structure. When positive charge ions such as sodium ions and potassium ions pass through the packaging adhesive film, the positive charge ions can be adsorbed by utilizing the rod-shaped titanium dioxide, and can be locked and adsorbed on the nano-scale inorganic oxide by utilizing the three-dimensional network, so that the positive charge ions are prevented from being separated from the nano-scale inorganic oxide.
Thirdly, the polyvinyl acetate mass content of the polyethylene-polyvinyl acetate copolymer is proper, so that the packaging adhesive film meets the requirements of balanced packaging and hydrolysis, the isolation of the packaging adhesive film is better, and positive charge ions are prevented from being separated from the nano inorganic oxide to a certain extent.
In summary, although the nano-inorganic oxide added in the third embodiment is only 0.05%, the power attenuation value is higher than that of the packaging adhesive film disclosed in the first embodiment in which the nano-inorganic oxide is added most, so that the third embodiment has a good PID resistance effect on the basis of a low addition amount of the nano-inorganic oxide.
After performing the PID192h test on the packaging adhesive films of the first to third embodiments, it can be found that the packaging adhesive film with the minimum power attenuation after the PID192h test is the packaging adhesive film of the first embodiment, and the power attenuation of the packaging adhesive film of the first embodiment can be reduced by 68.4%. This may be a result of a combination of two reasons:
first, under the PID192h test condition, the anti-PID effect of the packaging adhesive film of the third example may be better at the beginning of the test, but as the test increases, the adsorption of positive charge ions of the rod-shaped titanium dioxide reaches saturation, so that the packaging adhesive film of the third example cannot further exert the anti-PID effect. At this time, in the adhesive sealant films of the first and second embodiments, the effect of the nano-inorganic oxide addition amount contained in the sealant material is exhibited, so that the adhesive sealant films of the first and second embodiments have a good PID resistance effect.
Second, under the PID192h test conditions, the decomposition of vinyl acetate contained in the polyethylene-polyvinyl acetate copolymer is not so severe at the beginning of the test that the structure of the three-dimensional network is not collapsed over a large area, and thus the three-dimensional network can still exert the effect of locking the positively charged ions adsorbed on the nano-scale inorganic oxide. However, as the testing time increases, the decomposition of vinyl acetate contained in the polyethylene-polyvinyl acetate copolymer is accelerated, so that the positive charge ions adsorbed on the nano inorganic oxide cannot be effectively locked by the three-dimensional network.
Combining the two reasons, the anti-PID effect of the adhesive film disclosed in the first to third embodiments is closely related to the addition amount of the nanoscale inorganic oxide, so that the anti-PID effect of the adhesive film disclosed in the first to third embodiments is sequentially reduced according to the addition amount of the nanoscale inorganic oxide.
In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (14)
1. An encapsulant for encapsulating a photovoltaic module, the encapsulant comprising: polyethylene-polyvinyl acetate copolymer, nano inorganic filler, cross-linking agent component, coupling agent and auxiliary agent component; wherein the nanoscale inorganic filler is a negatively chargeable nanoscale inorganic oxide for blocking migration of positively charged ions within the photovoltaic module.
2. The encapsulation material of claim 1, wherein the nanoscale inorganic oxide comprises silicon oxide and/or a fourth subgroup oxide.
3. The packaging material of claim 1, wherein the fourth subgroup oxide comprises titania and/or zirconia.
4. The encapsulating material according to claim 1, wherein the structure of the nanoscale inorganic oxide comprises at least a particle structure, a rod structure, or a sheet structure.
5. The encapsulation material of claim 1, wherein the nanoscale inorganic oxide has a particle size of less than 100 nm.
6. The encapsulating material according to claim 1, wherein the nanoscale inorganic oxide is present in an amount of 0.01 to 5% by mass based on the mass of the polyethylene-polyvinyl acetate copolymer.
7. The packaging material of claim 1, wherein the polyethylene-polyvinyl acetate copolymer comprises 23% to 35% by mass of vinyl acetate.
8. The encapsulating material of any of claims 1 to 7, wherein the crosslinker component comprises a primary crosslinker and a secondary crosslinker; wherein,
the mass of the main crosslinking agent is 0.3-2% of the mass of the polyethylene-polyvinyl acetate copolymer, and the mass of the auxiliary crosslinking agent is 0.1-0.5% of the mass of the polyethylene-polyvinyl acetate copolymer.
9. The encapsulant of claim 8, wherein the primary crosslinker comprises at least diphenyl carbonate, benzoyl peroxide, triallyl cyanurate, or a ketal crosslinker; and/or the presence of a gas in the gas,
the auxiliary crosslinking agent at least comprises zinc oxide, magnesium oxide, triallyl cyanurate, triallyl triisocyanate or trimethylolpropane trimethacrylate.
10. The encapsulating material according to claim 8, wherein the mass of the coupling agent is 0.3% to 1% of the mass of the polyethylene-polyvinyl acetate copolymer; and/or the presence of a gas in the gas,
the coupling agent at least comprises vinyltriethoxysilane, vinyltrimethoxysilane or vinyltris (beta-methoxyethoxy) silane.
11. The packaging material of claim 8 wherein the adjuvant component comprises at least an antioxidant; wherein the mass of the antioxidant is 0.1-1% of that of the polyethylene-polyvinyl acetate copolymer; the antioxidant at least comprises 2, 6-di-tert-butyl-4-methylphenol, trisnonylphenyl phosphite, triphenyl phosphate or di (dodecyl) -3,3' -thiodipropionate; and/or the presence of a gas in the gas,
the auxiliary component at least comprises a light stabilizer; wherein the mass of the light stabilizer is 0.1-1% of that of the polyethylene-polyvinyl acetate copolymer, and the light stabilizer at least comprises 2,2,6, 6-tetramethyl piperidine benzoate or 2,2,6, 6-tetramethyl piperidine-nitrogen-oxide; and/or the presence of a gas in the gas,
the auxiliary component at least comprises a heat stabilizer; wherein the mass of the heat stabilizer is 1-5% of that of the polyethylene-polyvinyl acetate copolymer, and the heat stabilizer at least comprises stearate, octyl epichlorohydrin, trialkyl phosphite, triaryl ester or pentaerythritol; and/or the presence of a gas in the gas,
the auxiliary component at least comprises a tackifier; wherein the mass of the tackifier is 0.2-0.8% of that of the polyethylene-polyvinyl acetate copolymer, and the tackifier at least comprises terpene resin, rosin tackifier or pentaerythritol ester; and/or the presence of a gas in the gas,
the auxiliary component at least comprises a plasticizer; wherein the mass of the plasticizer is 1-3% of the mass of the polyethylene-polyvinyl acetate copolymer, and the plasticizer at least comprises dioctyl phthalate, dibutyl phthalate or phthalate.
12. An adhesive packaging film comprising the packaging material according to any one of claims 1 to 11.
13. A method for manufacturing a packaging adhesive film, wherein the packaging material of any one of claims 1 to 11 is applied, and the method for manufacturing the packaging material comprises:
heating and melting inorganic filler, a cross-linking agent, a coupling agent, an auxiliary agent component and a polyethylene-polyvinyl acetate copolymer to obtain a molten liquid;
and manufacturing a packaging adhesive film by using the molten liquid.
14. A photovoltaic module comprising the encapsulant of any one of claims 1 to 11 or the encapsulant film of claim 12.
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