CN113370362B - Ceramic green body processing method, ceramic part manufacturing method and ceramic part - Google Patents
Ceramic green body processing method, ceramic part manufacturing method and ceramic part Download PDFInfo
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- CN113370362B CN113370362B CN202110557274.0A CN202110557274A CN113370362B CN 113370362 B CN113370362 B CN 113370362B CN 202110557274 A CN202110557274 A CN 202110557274A CN 113370362 B CN113370362 B CN 113370362B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/08—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/08—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
- B28B11/0818—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads for roughening, profiling, corrugating
- B28B11/0836—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads for roughening, profiling, corrugating for pottery articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/04—Exhausting or laying dust
Abstract
The invention provides a processing method of a ceramic green body, a manufacturing method of a ceramic part and the ceramic part, which comprises the following steps: s1, carrying out surface processing on the surface to be processed of the ceramic green body by adopting a first cutter so as to enable the surface to be processed to reach a first surface roughness; s2, adopting a second cutter to carry out surface processing on the surface to be processed so as to enable the surface to be processed to reach second surface roughness; wherein the second surface roughness is lower than the first surface roughness; the second tool has a lower strength than the first tool. The processing method of the ceramic green body, the manufacturing method of the ceramic part and the ceramic part provided by the invention can reduce the damage defect formed on the surface of the ceramic green body, so that the slag particles and crack pits on the surface of the ceramic part formed by subsequent sintering are reduced, the problem that surface particles fall off in practical application is prevented, and the pollution to wafers to be processed in practical application environment is avoided.
Description
Technical Field
The invention relates to the field of semiconductor manufacturing, in particular to a processing method of a ceramic green body, a ceramic part manufacturing method and a ceramic part.
Background
The existing ceramic molding process flow comprises the following steps: granulating, forming a green body, processing the green body, sintering, sandblasting and cleaning. Among them, it is common to turn, mill and grind it using machining centers or the like to facilitate the subsequent sintering step.
A typical knife in green processing has: YT14 tool, YG6 tool, YW1 tool, PCD tool, CBN tool, etc. The YT14 cutter, the YG6 cutter and the YW1 cutter are three hard alloy cutters, and have the advantages of high hardness, low manufacturing cost and the like; the PCD cutter is a diamond cutter, has the advantages of high hardness, high compressive strength, good thermal conductivity, good wear resistance and the like, and can obtain high machining precision and machining efficiency in high-speed cutting; CBN cutters are artificial cubic boron nitride cutters that retain the advantage of high hardness under high temperature conditions. However, in the actual processing process of the ceramic green body, the microscopic morphology of the surface of the ceramic green body processed by the plurality of cutters can be seen, and the surface processed by the hard alloy cutter can leave a plurality of scale-shaped or wafer-shaped pits which are large in area and densely distributed; the number and the area of pits on the surface processed by the diamond cutter and the cubic boron nitride cutter are relatively small, but the defect of obvious damage exists. In the sintering step, the pits and the damage defects can cause the formation of slag particles and crack pits on the surface of the ceramic part, so that the ceramic part is easy to fall off surface particles and pollute a wafer to be processed in practical application, such as plasma etching equipment.
Disclosure of Invention
The embodiment of the invention aims at solving at least one of the technical problems in the prior art, and provides a ceramic green body processing method, a ceramic part manufacturing method and a ceramic part, which can reduce damage defects formed on the surface of the ceramic green body, so that slag particles and crack pits on the surface of the ceramic part formed by subsequent sintering are reduced, the problem that surface particles fall off in practical application is avoided, and pollution to wafers to be processed in practical application environments is avoided.
In order to achieve the object of the invention, a method for processing a ceramic green body is provided, which comprises the following steps:
s1, carrying out surface processing on the surface to be processed of a ceramic green body by adopting a first cutter so as to enable the surface to be processed to reach a first surface roughness;
s2, adopting a second cutter to carry out surface processing on the surface to be processed so as to enable the surface to be processed to reach a second surface roughness;
wherein the second surface roughness is lower than the first surface roughness; the second tool has a lower strength than the first tool.
Optionally, the second cutter comprises a mixed material of polyetheretherketone and diamond.
Optionally, the step S2 includes:
s21, milling the surface to be treated of the ceramic green body by adopting the second cutter;
s22, cleaning and blowing the surface to be treated to remove scraps on the surface to be treated;
and (3) cyclically and alternately executing the step S21 and the step S22 at least twice until the surface to be treated reaches the second surface roughness.
Optionally, the milling amount of the second tool decreases with an increase in the number of cycles of the step S21 and the step S22.
Optionally, the step S1 includes:
s11, turning the surface to be treated of the ceramic green body by adopting the first cutter so that the surface to be treated reaches the first surface roughness;
s12, sweeping the surface to be treated by adopting sweeping airflow so as to remove chips on the surface to be treated.
Optionally, a first preset included angle is formed between the direction of the purge gas flow and the surface to be treated, and the first preset included angle is smaller than or equal to 45 °.
Optionally, after the step S2, the method further includes:
s3, grinding the surface to be treated;
s4, cleaning the ceramic green body by adopting cleaning liquid to remove scraps on the surface to be treated;
s5, detecting the surface roughness of the surface to be treated, judging whether the surface roughness is smaller than or equal to the third surface roughness, and if not, returning to the step S3; if yes, ending the flow; the third surface roughness is less than the second surface roughness.
Optionally, in the step S3, the surface to be treated is ground by using a brush made of a polyetheretherketone material.
Optionally, the step S4 includes:
s41, cleaning the surface to be treated by adopting an alkaline solution;
s42, cleaning the surface to be treated by adopting deionized water to remove the alkaline solution remained on the surface to be treated;
s43, cleaning the surface to be treated by adopting an acidic solution;
s44, cleaning the surface to be treated by adopting deionized water to remove the residual acid solution on the surface to be treated.
Optionally, after the step S44, the step S4 further includes:
s45, immersing the ceramic green body in deionized water, and carrying out ultrasonic cleaning on the ceramic green body;
s46, flushing the surface to be treated by deionized water;
s47, placing the ceramic green body into a drying box for drying.
As another technical solution, an embodiment of the present invention further provides a method for manufacturing a ceramic piece, including:
processing the ceramic green body;
sintering the processed ceramic green body to obtain a ceramic piece;
wherein the step of processing the ceramic green body comprises performing the processing method of any one of the embodiments described above.
As another technical scheme, the embodiment of the invention also provides a ceramic piece, which is manufactured by the manufacturing method of the embodiment.
The embodiment of the invention has the following beneficial effects:
according to the processing method of the ceramic green body, firstly, the surface to be processed of the ceramic green body is processed by adopting the first cutter, so that the surface to be processed reaches higher first surface roughness, namely, the surface to be processed of the ceramic green body is processed by adopting the first cutter; then adopting a second cutter to carry out surface processing on the surface to be processed of the ceramic green body again, so that the surface to be processed can reach a lower second surface roughness, namely adopting the second cutter to carry out finish processing on the surface to be processed of the ceramic green body, thereby reducing pits and damage defects left by the surface processing of the first cutter and reducing the surface roughness of the surface to be processed; moreover, the second cutter has lower strength, so that the damage defect on the surface to be treated is not easy to be caused, and the increase of the damage defect on the surface to be treated can be avoided.
As another technical solution, in the method for manufacturing a ceramic piece provided by the embodiment of the present invention, before sintering a ceramic green body, the processing method provided in the foregoing embodiment is adopted to process the ceramic green body, so as to reduce the surface damage defect of the ceramic green body used for sintering, thereby reducing the surface damage defect of the ceramic piece, and further avoiding the occurrence of surface particle shedding of the ceramic piece in practical application, so as to avoid pollution to a wafer to be processed.
As another technical scheme, the ceramic piece provided by the embodiment of the invention is manufactured by adopting the manufacturing method provided by the embodiment, the surface of the ceramic piece has lower surface roughness, and the damage defect of the surface of the ceramic piece is very few, so that the falling of surface particles in practical application can be avoided, and the pollution to the wafer to be processed is avoided.
Drawings
FIG. 1 is a flow chart of a method of processing a ceramic green body provided by an embodiment of the invention;
FIG. 2 is a flow chart of processing a ceramic green body for making a ceramic dielectric window according to an embodiment of the present invention;
FIG. 3A is a surface topography of a ceramic green body made by a prior art ceramic green body processing method;
FIG. 3B is a surface topography of a ceramic green body made by the ceramic green body processing method provided by the embodiments of the present invention;
FIG. 4A is a surface scratch pattern of a ceramic green body made by a prior art ceramic green body processing method;
FIG. 4B is a surface scratch pattern of a ceramic green body made by the ceramic green body processing method provided by the embodiment of the invention;
FIG. 5A is a graph of surface damage of a ceramic green body made by a prior art ceramic green body processing method;
fig. 5B is a graph showing surface damage of a ceramic green body produced by the method for processing a ceramic green body according to an embodiment of the present invention.
Detailed Description
In order to enable those skilled in the art to better understand the technical scheme of the invention, the processing method of the ceramic green body, the manufacturing method of the ceramic part and the ceramic part provided by the invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, the embodiment provides a method for processing a ceramic green body, which includes the following steps:
step S1: carrying out surface processing on the surface to be processed of the ceramic green body by adopting a first cutter so as to enable the surface to be processed to reach a first surface roughness;
step S2: adopting a second cutter to carry out surface processing on the surface to be processed so as to enable the surface to be processed to reach a second surface roughness;
wherein the second surface roughness is lower than the first surface roughness; the second tool has a lower strength than the first tool.
Specifically, the step S1 of performing surface processing on the surface to be processed for the first time is to properly increase the surface roughness of the surface to be processed, so that the subsequent surface processing is facilitated and the subsequent surface processing times can be saved, that is, rough processing is performed on the surface to be processed, and accordingly, the preset value of the first surface roughness does not need to be too low; because the strength of the first cutter is higher, after the step S1 is completed, the surface to be treated of the ceramic green body has more obvious damage defects such as tiny pits or cracks. On this basis, in the step S2, the surface to be treated is processed so as to achieve a lower second surface roughness of the surface to be treated, that is, the surface to be treated is finished, so that the surface roughness of the surface to be treated can be reduced, and damage defects of the surface to be treated can be reduced. Moreover, as the strength of the second cutter is lower, the second cutter is adopted to carry out surface processing on the surface to be processed, and the defect of damage on the surface to be processed again can be avoided; therefore, the ceramic green body processed by the processing method has few defects such as surface slag particles, crack pits and the like after being sintered into a ceramic piece, so that when the ceramic piece is applied to plasma etching process equipment, the ceramic piece is not easy to fall off surface particles, and further, wafers in a process chamber can be prevented from being polluted, and the quality of the wafers is improved.
In some embodiments, the first tool may be a diamond tool, because in the course of rough machining of the surface to be treated, a large machining allowance is required to reduce the number of machining times and improve the machining efficiency, so that a tool having high impact resistance is required. However, the present embodiment is not limited thereto, and the first tool may be a cemented carbide tool or an artificial cubic boron nitride tool.
In some embodiments, the aforementioned second tool comprises a mixed material of polyetheretherketone and diamond. Wherein, polyether ether ketone (PEEK) is a linear aromatic polymer compound containing chain links in a molecular main chain, and has the advantages of semicrystalline, thermoplastic, high mechanical strength and the like; diamond (PCD) is a simple substance material with the advantages of high hardness and high wear resistance; the mixed material containing the polyether-ether-ketone and the diamond has the advantages of high wear resistance and high heat resistance, and has lower strength compared with the artificial cubic boron nitride cutter and the diamond cutter which are commonly used in the prior art, and better grinding performance compared with the polyether-ether-ketone cutter, so that ceramic green bodies can be cut, damage defects caused on the surface to be treated due to overlarge cutter strength can be avoided when the ceramic green bodies are cut, and tiny pits and cracks on the surface to be treated can be removed; and because the mixed material has good wear resistance and toughness, when the tool tip of the second tool made of the mixed material is contacted with the surface to be treated, certain elastic deformation can occur, so that pits or scratches on the surface to be treated caused by rigid collision with the surface to be treated can be avoided.
Preferably, in some embodiments, the ratio of the polyether-ether-ketone material to the diamond material in the mixed material is 87.8 percent to 12.2 percent; under these conditions, the second tool made of the mixed material is strong enough to cut the ceramic green body and is inexpensive to manufacture.
In some embodiments, the step S2 of performing surface processing on the surface to be processed by using the second tool includes:
step S21: milling the surface to be treated of the ceramic green body by adopting a second cutter;
step S22: cleaning and purging the surface to be treated to remove debris, such as swarf, from the surface to be treated;
and (5) circularly and alternately executing the step S21 and the step S22 at least twice until the surface to be treated reaches the second surface roughness.
Specifically, in step S22, deionized water (DIW) with resistivity greater than 200kΩ·cm may be used to rinse the surface to be treated, where an included angle between the water flow direction and the surface to be treated during rinsing is less than 45 ° to avoid the debris from scratching the surface to be treated; and the surface to be treated is purged by adopting high-purity nitrogen with extremely low activity (the content ratio of the nitrogen is higher than 99.9 percent); in order to facilitate the surface treatment of the surface to be treated in step S21 or subsequent processes, the ceramic green body may be dried after the foregoing cleaning and purging.
In some embodiments, the milling amount of the second tool decreases with increasing cycle times of step S21 and step S22, wherein the milling amount refers to a generic term for each motion parameter of the tool when milling, specifically including milling speed, feed amount and back draft (milling depth). Taking the above cycle for five times as an example, the embodiment also provides a processing parameter for milling the ceramic green body by using the polyether-ether-ketone-diamond mixed material cutter:
in the first cycle, a 90-degree excircle cutter is adopted, the included angle between the front cutter surface and the surface to be treated of the ceramic green body is 90 degrees, and the cutter point is not chamfered during sharpening; the milling speed of the cutter is 500m/min, the back cutter-taking amount is 0.5mm, and the feeding amount is 0.5mm/r;
in the second cycle, an 85-degree excircle cutter is adopted, the included angle between the front cutter surface and the surface to be treated of the ceramic green body is 85 degrees, and the cutter point is not chamfered during sharpening; the milling speed of the cutter is 400m/min, the back cutter-taking amount is 0.4mm, and the feeding amount is 0.5mm/r;
in the third cycle, a 75-degree excircle cutter is adopted, the included angle between the front cutter surface and the surface to be treated of the ceramic green body is 75 degrees, and the cutter point is not chamfered during sharpening; the milling speed of the cutter is 300m/min, the back cutter-taking amount is 0.3mm, and the feeding amount is 0.4mm/r;
in the fourth cycle, a 60-degree excircle cutter is adopted, the included angle between the front cutter surface and the surface to be treated of the ceramic green body is 60 degrees, and the cutter point is not chamfered during sharpening; the milling speed of the cutter is 200m/min, the back cutter-taking amount is 0.2mm, and the feeding amount is 0.4mm/r;
in the fifth cycle, a 55-degree excircle cutter is adopted, the included angle between the front cutter surface and the surface to be treated of the ceramic green body is 55 degrees, and the cutter point is not chamfered during sharpening; the milling speed of the cutter is 100m/min, the back cutter feeding amount is 0.1mm, and the feeding amount is 0.3mm/r.
In some embodiments, the step S1 of surface finishing the surface to be treated of the ceramic green body by using the first tool includes:
step S11: turning the surface to be treated of the ceramic green body by adopting a first cutter so as to enable the surface to be treated to reach a first surface roughness;
step S12: a purge gas stream is used to purge the surface to be treated to remove debris from the surface to be treated. In particular, the aforementioned purge gas flow may employ highly pure nitrogen gas (nitrogen gas content ratio is higher than 99.9%) having extremely low mobility, which does not react with the ceramic green body material at all, so that the influence on the surface roughness of the ceramic green body can be avoided.
In some embodiments, the direction of the purge flow forms a first predetermined angle with the surface to be treated, and the first predetermined angle is less than or equal to 45 °. This is because after the first tool turns the ceramic green body, some cracks and pits exist on the surface to be treated, if the first preset included angle is larger than 45 degrees, chips (such as cutting chips) generated in the turning process can be blown into the cracks and pits on the surface to be treated, and when the next turning or milling is performed, the chips in the cracks and pits can be pressed by the tool to cause deeper cracks or pits; therefore, the first preset included angle is smaller than or equal to 45 degrees, the problems can be avoided, and meanwhile the effect of blowing all chips away from the surface to be treated can be achieved.
In some embodiments, after step S2 of surface finishing the surface to be treated with the second tool, the machining method further includes:
step S3: grinding the surface to be treated to further reduce the surface roughness of the surface to be treated;
step S4: cleaning the ceramic green body by adopting cleaning liquid to remove scraps on the surface to be treated;
step S5: detecting the surface roughness of the surface to be treated, judging whether the surface roughness is smaller than or equal to the third surface roughness, and if not, returning to the step S3; if yes, ending the flow; wherein the third surface roughness is less than the second surface roughness. In some embodiments, the particle number per unit area can be detected by observing the crystal layer particle state and damage condition of the surface to be treated through an optical display mirror, and the particle number can be used for representing the surface roughness of the surface to be treated; specifically, when the particle count is 80ea or less, the surface roughness of the surface to be treated may be regarded as reaching the aforementioned third surface roughness, and a subsequent sintering process may be performed.
In some embodiments, in step S3, the surface to be treated is ground with a brush made of a polyetheretherketone material. In the prior art, a grinding machine is generally adopted to grind the surface to be treated of the ceramic green body, and the contact mode of a grinding tool attached to the grinding machine and the surface to be treated is surface contact or line contact, which easily causes the grinding tool to scratch the surface to be treated; compared with the prior art, the contact mode of the brush made of the polyether-ether-ketone material and the surface to be treated is point contact, and the polyether-ether-ketone has the characteristics of high toughness and high elasticity, so that the grinding end of the brush can generate certain elastic deformation when in contact with the surface to be treated, thereby effectively preventing the surface to be treated from being scratched, reducing the surface roughness of the surface to be treated and reducing the residue of scraps. Specifically, the brush may be fixed to a driving source by a robot arm, and the center region of the surface to be treated is ground to the edge region; specifically, the grinding feed rate of the hairbrush can be in a value range of 0.1-0.5 mm, the feed speed can be in a value range of 60-200 mm/min, and the rotation speed of the hairbrush can be in a value range of 800-2000 r/min.
In some embodiments, the step S4 of cleaning the ceramic green body with the cleaning liquid includes:
step S41: cleaning the surface to be treated by adopting an alkaline solution to remove organic matters and metal oxide scraps which can be dissolved in the alkaline solution;
step S42: the surface to be treated is cleaned by deionized water so as to remove the residual alkaline solution on the surface to be treated;
step S43: cleaning the surface to be treated with an acidic solution to remove metal and metal oxide scraps which can be dissolved in the acidic solution;
step S44: and (3) cleaning the surface to be treated by adopting deionized water to remove the residual acid solution on the surface to be treated.
In some embodiments, the alkaline solution may be potassium hydroxide (KOH) solution with concentration of 8% -12%, and when the alkaline solution is used for cleaning ceramic green bodies, the temperature of the alkaline solution should be kept in the range of 55 ℃ -65 ℃ and the cleaning time should be controlled in the range of 60 min-65 min; the acidic solution may be selected from 40% hydrofluoric acid (HF) solution and 68% nitric acid (HNO) 3 ) The mixing ratio of the solution to the deionized water is 1:1:1, and when the acid solution is used for cleaning the ceramic green body, the cleaning time is controlled within the range of 5-6 min.
In some embodiments, after the aforementioned step S44, step S4 further includes:
step S45: immersing the ceramic green body in deionized water, and carrying out ultrasonic cleaning on the ceramic green body;
specifically, in some embodiments, the intensity of the ultrasonic wave for ultrasonic cleaning is in the range of 20W/inch 2 ～50W/inch 2 The value range of the cleaning time of each surface to be treated is 15-17 min.
Step S46: washing the surface to be treated by deionized water;
specifically, in some embodiments, the resistivity of the deionized water used in the step S46 is greater than 4mΩ·cm, the flow rate of the deionized water is 100L/h to 200L/h, the water temperature is 38 ℃ to 46 ℃, and the cleaning time of each surface to be treated is 15min to 17min.
Step S47: and placing the ceramic green body into a drying box for drying.
In some embodiments, the specifications of the drying box, the drying time, the drying temperature, and other technical parameters should be adjusted according to the characteristics of the ceramic green body and the ceramic part to be manufactured, such as the shape, the size, and the material, for example: when the ceramic green body for manufacturing the ceramic dielectric window is dried, a clean drying box is selected, and the ceramic green body is dried for 60-150 min at the temperature of 115-125 ℃.
Referring to fig. 2, taking a process of manufacturing a ceramic dielectric window as an example, the present embodiment further provides a processing flow of a ceramic green body, which specifically includes:
step S01: turning the surface to be treated of the ceramic green body by adopting a diamond cutter;
step S02: purging the surface to be treated by adopting high-purity nitrogen;
step S03: milling the surface to be treated by adopting a polyether-ether-ketone-diamond mixed material cutter;
step S04: adopting deionized water to clean the surface to be treated;
step S05: purging the surface to be treated by adopting high-purity nitrogen;
step S06: drying the ceramic green body;
the steps S03-S06 are circularly executed, and the circulation times are 5 times;
step S07: grinding the surface to be treated by adopting a polyether-ether-ketone brush;
step S08: cleaning the surface to be treated by adopting an alkaline solution;
step S09: adopting deionized water to clean the surface to be treated;
step S010: cleaning the surface to be treated by adopting an acid solution;
step S011: adopting deionized water to clean the surface to be treated;
step S012: immersing the ceramic green compact in deionized water, and carrying out ultrasonic cleaning on the ceramic green compact;
step S013: washing the surface to be treated by deionized water;
step S014: drying the ceramic green body;
step S015: detecting and judging whether the roughness of the surface to be treated reaches a preset standard, if not, returning to the step S07; if yes, the process is ended.
Referring to fig. 3A, fig. 4A and fig. 5A, the three show the surface morphology, surface scratch and surface damage of a ceramic green body manufactured by the existing ceramic green body processing method, respectively; referring to fig. 3B, fig. 4B and fig. 5B, the three show the surface morphology, surface scratch and surface damage of the ceramic green body manufactured by the processing method of the ceramic green body provided by the above embodiment, respectively; as is apparent from fig. 3B, fig. 4B, and fig. 5B, compared with the prior art, the method for processing a ceramic green body provided in the foregoing embodiments can improve the surface morphology of the ceramic green body, and can effectively reduce the surface scratches and surface damages of the ceramic green body, so that the phenomenon of surface particle falling off can be avoided after the ceramic green body is sintered into a ceramic part.
According to the method for processing the ceramic green body, firstly, a first cutter is used for carrying out surface processing on the surface to be processed of the ceramic green body, so that the surface to be processed reaches a higher first surface roughness, namely, the first cutter is used for carrying out rough processing on the surface to be processed of the ceramic green body; then adopting a second cutter to carry out surface processing on the surface to be processed of the ceramic green body again, so that the surface to be processed can reach a lower second surface roughness, namely adopting the second cutter to carry out finish processing on the surface to be processed of the ceramic green body, thereby reducing pits and damage defects left by the surface processing of the first cutter and reducing the surface roughness of the surface to be processed; moreover, the second cutter has lower strength, so that the damage defect on the surface to be treated is not easy to be caused, and the increase of the damage defect on the surface to be treated can be avoided.
As another technical solution, the present embodiment further provides a method for manufacturing a ceramic piece, including:
the processing method provided by the plurality of embodiments is adopted to process the ceramic green body;
sintering the processed ceramic green body to obtain a ceramic part.
According to the manufacturing method of the ceramic piece, before the ceramic green body is sintered, the ceramic green body is processed by adopting the processing method provided in the embodiment, so that the surface damage defect of the ceramic green body for sintering is reduced, the surface damage defect of the ceramic piece can be reduced, and further, the falling of surface particles of the ceramic piece in practical application can be avoided, and the pollution to a wafer to be processed is avoided.
As another technical solution, this embodiment also provides a ceramic piece, which is manufactured by the ceramic piece manufacturing method provided in the foregoing embodiment.
The ceramic piece provided by the embodiment is manufactured by adopting the manufacturing method provided by the embodiment, the surface of the ceramic piece has lower surface roughness, and the damage defect of the surface of the ceramic piece is very few, so that surface particle falling can be avoided in practical application, and the wafer to be processed is prevented from being polluted.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (9)
1. A method of processing a ceramic green body comprising the steps of:
s1, carrying out surface processing on the surface to be processed of a ceramic green body by adopting a first cutter so as to enable the surface to be processed to reach a first surface roughness;
s2, adopting a second cutter to carry out surface processing on the surface to be processed so as to enable the surface to be processed to reach a second surface roughness; the step S2 includes:
s21, milling the surface to be treated of the ceramic green body by adopting the second cutter;
s22, cleaning and blowing the surface to be treated to remove scraps on the surface to be treated;
cyclically and alternately executing the step S21 and the step S22 at least twice until the surface to be treated reaches the second surface roughness; the milling amount of the second cutter decreases with the increase of the cycle times of the step S21 and the step S22;
wherein the second surface roughness is lower than the first surface roughness; the strength of the second cutter is lower than that of the first cutter, and the second cutter comprises a mixed material of polyether-ether-ketone and diamond.
2. The method of processing a ceramic green body according to claim 1, wherein the step S1 comprises:
s11, turning the surface to be treated of the ceramic green body by adopting the first cutter so that the surface to be treated reaches the first surface roughness;
s12, sweeping the surface to be treated by adopting sweeping airflow so as to remove chips on the surface to be treated.
3. The method of claim 2, wherein the direction of the purge gas flow is at a first predetermined angle to the surface to be treated, the first predetermined angle being less than or equal to 45 °.
4. The method of processing a ceramic green body according to claim 1, further comprising, after said step S2:
s3, grinding the surface to be treated;
s4, cleaning the ceramic green body by adopting cleaning liquid to remove scraps on the surface to be treated;
s5, detecting the surface roughness of the surface to be treated, judging whether the surface roughness is smaller than or equal to the third surface roughness, and if not, returning to the step S3; if yes, ending the flow; the third surface roughness is less than the second surface roughness.
5. The method according to claim 4, wherein in the step S3, the surface to be treated is ground with a brush made of a polyetheretherketone material.
6. The method of processing a ceramic green body according to claim 4, wherein step S4 comprises:
s41, cleaning the surface to be treated by adopting an alkaline solution;
s42, cleaning the surface to be treated by adopting deionized water to remove the alkaline solution remained on the surface to be treated;
s43, cleaning the surface to be treated by adopting an acidic solution;
s44, cleaning the surface to be treated by adopting deionized water to remove the residual acid solution on the surface to be treated.
7. The method of processing a ceramic green body according to claim 6, wherein after the step S44, the step S4 further comprises:
s45, immersing the ceramic green body in deionized water, and carrying out ultrasonic cleaning on the ceramic green body;
s46, flushing the surface to be treated by deionized water;
s47, placing the ceramic green body into a drying box for drying.
8. A method of making a ceramic article comprising:
processing the ceramic green body;
sintering the processed ceramic green body to obtain a ceramic piece;
wherein the step of processing the ceramic green body comprises performing the processing method of any one of claims 1-7.
9. A ceramic part, characterized in that it is produced by the production method according to claim 8.
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