CN113369721A - Double-laser processing system and method - Google Patents

Double-laser processing system and method Download PDF

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Publication number
CN113369721A
CN113369721A CN202110768986.7A CN202110768986A CN113369721A CN 113369721 A CN113369721 A CN 113369721A CN 202110768986 A CN202110768986 A CN 202110768986A CN 113369721 A CN113369721 A CN 113369721A
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CN
China
Prior art keywords
laser
pulse
pulse laser
mirror
reflector
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Pending
Application number
CN202110768986.7A
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Chinese (zh)
Inventor
钱代数
陆家钿
曾超峰
刘志峰
赵朋
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Guangdong Original Point Intelligent Technology Co Ltd
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Guangdong Original Point Intelligent Technology Co Ltd
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Priority to CN202110768986.7A priority Critical patent/CN113369721A/en
Publication of CN113369721A publication Critical patent/CN113369721A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Abstract

The invention discloses a double-laser processing system and a method, wherein the processing system comprises: the device comprises a first laser, a second laser and a beam combining module; the first laser is used for generating first pulse laser; the second laser is used for generating second pulse laser; the beam combination module is used for receiving the first pulse laser and the second pulse laser and combining the first pulse laser and the second pulse laser into a third laser beam. The invention can combine two laser beams into one laser beam and accurately process the product with high efficiency.

Description

Double-laser processing system and method
Technical Field
The invention relates to the field of laser processing, in particular to a double-laser processing system and a double-laser processing method.
Background
Generally, a laser with a wider pulse width can achieve higher single pulse energy and higher material processing efficiency, while a laser with a narrower pulse width has small pulse energy and relatively lower processing efficiency, but can achieve higher-fineness material processing and higher processing quality.
The range of pulse widths used by the laser may include pulse widths of varying magnitude from microseconds to femtoseconds. In order to achieve both high processing efficiency and high processing quality, a method of performing high-efficiency rough processing by using a laser having a wider pulse width and performing finish processing by using a laser having a narrower pulse width is generally used to improve the processing quality.
However, in this method, it is necessary to successively and individually perform the machining by using the pulse lasers having different pulse widths, and this machining method has at least the following problems. Need frequently switch between different light paths or different stations, the process is loaded down with trivial details, and can not guarantee the high contact ratio of processing position in thick, the finish machining process, and the machining precision can not guarantee, and in addition, after the rough machining was accomplished, the damage that causes the material is great, is difficult to restore in the finish machining process, often can not obtain anticipated processingquality.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: at least one technical problem addressed above is solved.
The solution of the invention for solving the technical problem is as follows:
a dual laser machining system comprising: the device comprises a first laser, a second laser and a beam combining module; the first laser is used for generating first pulse laser; the second laser is used for generating second pulse laser; the beam combination module is used for receiving the first pulse laser and the second pulse laser and combining the first pulse laser and the second pulse laser into a third laser beam.
As a further improvement of the above technical solution, the polarization directions of the first pulse laser and the second pulse laser are different, and the beam combining module is a PBS polarizing beam splitter.
As a further improvement of the above technical solution, the beam combining module is a dichroic mirror, and the wavelengths of the first pulse laser and the second pulse laser are different.
As a further improvement of the above technical solution, a first adjusting module is further disposed between the first laser and the beam combining module, and the first adjusting module is configured to adjust an emitting position and a direction of the first pulse laser.
As a further improvement of the above technical solution, a second adjusting module is further disposed between the second laser and the beam combining module, and the second adjusting module is configured to adjust an emitting position and a direction of the second pulse laser.
As a further improvement of the above technical solution, the first adjusting module includes a first reflector and a second reflector, the first reflector is disposed on the upstream of the optical path of the second reflector, the second reflector is configured to receive the light beam from the first reflector and reflect the light beam to the beam combining module, and the first reflector and the second reflector can respectively adjust the inclination angle along the orthogonal direction in the plane where the reflecting surface of each reflector is located.
As a further improvement of the above technical solution, the second adjusting module includes a third reflector and a fourth reflector, the third reflector is disposed on the upstream of the optical path of the fourth reflector, the fourth reflector is configured to receive the light beam of the third reflector and reflect the light beam to the beam combining module, and the third reflector and the fourth reflector can respectively adjust the inclination angle along the orthogonal direction of the plane where the respective reflecting surface is located.
As a further improvement of the above technical solution, the dual laser processing system further includes a detector, and the detector is configured to detect the coaxiality of the first pulse laser and the second pulse laser in the third laser beam.
The invention also provides a double-laser processing method, which comprises the steps of setting parameters of first pulse laser and second pulse laser respectively generated by the first laser and the second laser; and generating the first pulse laser and the second pulse laser so that the first pulse laser and the second pulse laser are coaxially arranged.
As a further improvement of the above technical solution, the parameters specifically include that the light emission starting time of the first pulse laser is t1, the pulse energy is e1, the pulse width is τ 1, and the frequency is f 1; the light emission starting time of the second pulse laser is t2, the pulse energy is e2, the pulse width is tau 2, and the frequency is f 2; e1 is greater than e2, t2 is no earlier than t1, and τ 1 is greater than τ 2.
The multi-laser processing system has the advantages that in the multi-laser processing system, the first laser can be used for generating first pulse laser, the second laser can be used for generating second pulse laser, the first pulse laser and the second pulse laser have difference, for example, the wavelengths of the first pulse laser and the second pulse laser are different, or the polarization directions of the first pulse laser and the second pulse laser are different, so that the beam combining module can enable one laser beam to be transmitted and the other laser beam to be reflected, when the multi-laser processing system is used, the first laser and the second laser beam can enter the beam combining module from different angles, one laser beam is transmitted through the beam combining module, the other laser beam is reflected by a certain angle, the two laser beams are combined, and then the workpiece can be processed by the two different laser beams at the same time.
According to the double-laser processing method, the first pulse laser and the second pulse laser are used in a matched mode, and the first pulse laser and the second pulse laser are coaxially arranged, so that the processing efficiency is effectively improved, and the processing precision is guaranteed.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures are only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from them without inventive effort.
FIG. 1 is a system diagram of one embodiment of a laser system of the present invention;
FIG. 2 is a system diagram of one embodiment of a laser system of the present invention;
FIG. 3 is a system diagram of one embodiment of a laser system of the present invention;
FIG. 4 is a schematic diagram of a first conditioning module in one embodiment of a laser system of the present invention;
FIG. 5 is a schematic diagram of a second conditioning module in an embodiment of the laser system of the present invention;
FIG. 6 is a schematic diagram of the first conditioning module or the second conditioning module in one embodiment of the laser system of the present invention;
fig. 7 is a schematic parameter diagram of a first pulse laser, a second pulse laser, and a combination of the first pulse laser and the second pulse laser in the laser method of the present invention.
In the drawings: 1-a first laser, 2-a second laser, 3-a beam combination module, 4-a first adjustment module, 41-a first reflector, 42-a second reflector, 5-a second adjustment module, 51-a third reflector, 52-a fourth reflector, and 6-a deflection reflector.
Detailed Description
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention. In addition, all the coupling/connection relationships mentioned herein do not mean that the components are directly connected, but mean that a better coupling structure can be formed by adding or reducing coupling accessories according to specific implementation conditions. All technical characteristics in the invention can be interactively combined on the premise of not conflicting with each other.
Referring to fig. 1 to 6, a dual laser processing system includes: a first laser 1, a second laser 2 and a beam combining module 3; the first laser 1 is used for generating first pulse laser; the second laser 2 is used for generating second pulse laser; the beam combination module is used for receiving the first pulse laser and the second pulse laser and combining the first pulse laser and the second pulse laser into a third laser beam.
As described above, the first laser 1 may be configured to generate a first pulse laser, the second laser 2 may be configured to generate a second pulse laser, and the first pulse laser and the second pulse laser have a difference, for example, the wavelengths of the first pulse laser and the second pulse laser are different, or the polarization directions of the first pulse laser and the second pulse laser are different, so that the beam combining module 3 can transmit one of the laser beams and reflect the other laser beam, when in use, the first laser and the second laser may enter the beam combining module from different angles, and transmit one of the laser beams through the beam combining module 3, and reflect the other laser beam at a certain angle, so that the two laser beams are combined, and further, the two different laser beams may be used to process a workpiece simultaneously.
The invention can also comprise a control unit, for example, a singlechip or a programmable controller and the like. The pulse frequency, the trigger time, the number of pulses, etc. of the first laser 1 can be controlled by the control unit. Similarly, the pulse frequency, the trigger time, the number of pulses, and the like of the laser light generated by the second laser 2 may be controlled by the control unit. The user can utilize two control units to respectively control the first laser 1 and the second laser 2, and also can simultaneously control the first laser 1 and the second laser 2 through one control unit, so that the use is very convenient.
In some embodiments, the polarization directions of the first pulse laser and the second pulse laser are different, and the beam combining module 3 is a PBS polarizing beam splitter. Preferably, the polarization directions of the first pulse laser and the second pulse laser are perpendicular to each other. For example, the polarization direction of the first pulse laser light is in the left-right direction, and the polarization direction of the second pulse laser light is in the front-back direction. In the present embodiment, the first laser 1 and the second laser 2 generate the first pulse laser and the second pulse laser, respectively, having different polarization directions.
Preferably, the first pulse laser light is reflected by the PBS polarizing beam splitter so that the angle of incidence to the PBS polarizing beam splitter is 45 degrees. The beams of the first pulse laser and the second pulse laser which are incident to the PBS beam splitter are vertical to each other.
As another implementation manner, in some embodiments, the beam combining module 3 is a dichroic mirror, and the wavelength of the first pulse laser is different from that of the second pulse laser. The wavelength of first pulse laser and second pulse laser is different to the dichroic mirror passes the dichroic mirror to the most transmission of one of them laser, and another laser is then most by the dichroic mirror reflection, thereby reaches to close a bundle effect to light, and in this embodiment, the user can adjust the angle that sets up of dichroic mirror, thereby makes first pulse laser and second pulse laser can merge into a bundle of laser.
In some embodiments, a first adjusting module 4 is further disposed between the first laser 1 and the beam combining module 3, and the first adjusting module 4 is configured to adjust an emitting position and a direction of the first pulse laser.
In some embodiments, a second adjusting module 5 is further disposed between the first laser 1 and the beam combining module 3, and the second adjusting module 5 is configured to adjust an emitting position and a direction of the second pulse laser.
Optionally, the first adjusting module 4 and the second adjusting module 5 may exist at the same time, or only the first adjusting module 4 or the second adjusting module 5 may exist.
When the first adjusting module 4 and the second adjusting module 5 exist at the same time, the first adjusting module 4 can adjust the flight direction and the emitting position of the first pulse laser, and the second adjusting module 5 can adjust the flight direction and the emitting position of the second pulse laser, which are very flexible to adjust, for example, a user can coaxially set the first pulse laser and the second pulse laser emitted by the beam combining module 3 by adjusting the first adjusting module 4 and the second adjusting module 5.
When only the first adjusting module 4 or the second adjusting module 5 is present, the user may adjust only the first adjusting module 4 or the second adjusting module 5 accordingly. For example, when only the first adjustment module 4 is present, the user can adjust the flight direction of the first pulse laser and the position of the first pulse laser emitted from the first adjustment module 4 through the first adjustment module 4, thereby adjusting the direction and the position of the first pulse laser incident on the beam combining module 3, and coaxially arranging the first pulse laser and the second pulse laser emitted from the beam combining module 3.
In some embodiments, the first adjusting module 4 includes a first mirror 41 and a second mirror 42, the first mirror 41 is disposed upstream of the second mirror 42 in the optical path, the second mirror is configured to receive the light beam from the first mirror and reflect the light beam to the beam combining module, and the first mirror and the second mirror are respectively capable of adjusting the tilt angle along the orthogonal direction in the plane of the respective reflecting surfaces. The first pulse laser may be translated or the flying direction of the first pulse laser may be adjusted by adjusting the positions of the first mirror 41 and the second mirror 42.
In some embodiments, the second adjusting module 5 includes a third mirror 51 and a fourth mirror 52, the third mirror 51 is disposed on the upstream of the fourth mirror 52 in the optical path, the fourth mirror 52 is configured to receive the light beam from the third mirror 51 and reflect the light beam to the beam combining module, and the third mirror 51 and the fourth mirror 52 can respectively adjust the tilt angle along the orthogonal direction in the plane of the respective reflecting surface. When the laser combiner is used, the third reflector 51 receives the second pulse laser, after the second pulse laser enters the third reflector 51, the third reflector 51 reflects the second pulse laser to the fourth reflector 52, and then the fourth reflector 52 reflects the second pulse laser to the beam combining module 3. Similarly, the position adjustment of the third mirror 51 and the fourth mirror 52 can translate the second pulse laser or adjust the flight direction of the second pulse laser.
In some embodiments, the first mirror 41 of the first adjustment module 4 can be disposed on a two-dimensional adjustable frame, and similarly, the second mirror 42 can be disposed on another two-dimensional adjustable frame, and the user can adjust the light beam exiting directions of the first mirror 41 and the second mirror 42 by manually adjusting the two-dimensional adjustable frame. Similarly, the third reflector 51 and the fourth reflector 52 in the second adjusting module 5 may also be arranged with reference to the first reflector 41 and the second reflector 42 in a one-to-one correspondence, that is, the third reflector 51 and the fourth reflector 52 are also correspondingly provided with a two-dimensional adjusting mirror frame matched with the third reflector 51 and the fourth reflector 52, so that the third reflector 51 and the fourth reflector 52 can be independently adjusted. In addition, the first adjusting module 4 and the second adjusting module 5 may also adopt other embodiments. The first and second conditioning modules 4, 5 may each adopt the same or different embodiments. Hereinafter, the first adjustment module 4 is exemplified, and the second adjustment module 5 may be implemented by any one or a combination of a plurality of the following.
For example, the first adjusting module 4 conveys two deflection mirrors 6 arranged in sequence from top to bottom along the optical path, the upstream deflection mirror 6 is used for transmitting the light beam to the downstream deflection mirror 6, the upstream deflection mirror 6 can be used for receiving the first pulse laser, the downstream deflection mirror 6 can be used for transmitting the laser to the beam combining module, and the deflection mirror 6 can realize the change of the transmission direction of the light beam by being driven by voltage.
For another example, in the above embodiment, the first adjusting module 4 includes the first reflecting mirror 41 and the second reflecting mirror 42, the first reflecting mirror 41 can move along the left-right direction and swing along the left-right direction, and the second reflecting mirror 42 can move along the front-back direction and swing along the front-back direction, so that the first adjusting module 4 achieves the same effect of adjusting the emitting position and the emitting direction of the first pulse laser.
In some embodiments, a beam expander and a wave plate are further included between the first pulsed laser 1 and the first conditioning module 4, and between the second pulsed laser 2 and the second conditioning module 5, for changing the beam diameter and the polarization state, respectively. The relative upstream or downstream positions of both the beam expander and the wave plate are interchanged.
In some embodiments, the dual laser processing system further comprises a detector for detecting the coaxiality of the first pulsed laser and the second pulsed laser in the third laser beam.
A double-laser beam combining method comprises the double-laser processing system combined by any technical scheme, and further comprises the following steps: generating a first pulse laser and a second pulse laser; adjusting the flight paths of the first pulse laser and the second pulse laser; and step three, combining the first pulse laser and the second pulse laser into a laser beam.
Since the above description has been made in relation to a dual laser machining system, it should be understood by those skilled in the art in view of the accompanying drawings, and therefore, the description thereof will not be repeated.
In some embodiments, the second step is to adjust the flight angle and the incidence position of the first pulse laser; and adjusting the flight angle and the incidence position of the second laser.
As shown in fig. 7, the present invention further provides a dual laser processing method, in which parameters of a first pulse laser and a second pulse laser generated by a first laser and a second laser are set; and generating the first pulse laser and the second pulse laser so that the first pulse laser and the second pulse laser are coaxially arranged.
Further, the parameters specifically include that the light emission starting time of the first pulse laser is t1, the pulse energy is e1, the pulse width is τ 1, and the frequency is f 1; the light emission starting time of the second pulse laser is t2, the pulse energy is e2, the pulse width is tau 2, and the frequency is f 2; the e1 is greater than e2, the t2 is not less than t1, the τ 1 is greater than τ 2; the first pulse laser and the second pulse laser can be synchronously or alternatively processed by the combined arrangement of t1, t2, f1 and f 2.
In practical use, the focusing spot of the second pulse laser can be adjusted to be larger than or equal to that of the first laser, and the focusing spot of the second pulse laser is preferably slightly larger than that of the first pulse laser. Adjusting the frequency of the first pulse laser and the second pulse laser to make the frequency of the second pulse laser not equal to the frequency of the first pulse laser, preferably, the frequency of the second pulse laser is greater than the frequency of the first pulse laser, so that the first pulse laser and the second pulse laser can be synchronously emitted at a certain time point, or one or more pulses of the second pulse laser are inserted between two adjacent pulses of the first pulse laser, which can improve the processing quality, for example, the second pulse laser inserted between the first pulse lasers can refine the processing effect of the first pulse laser, and remove the damaged layer generated on the surface of the material.
For example, when the method is used for drilling, a recast layer is formed on the inner wall of the hole by drilling with the first pulse laser, the recast layer can be removed by the second pulse laser, and one or more times of second pulse laser are possibly needed for removing the recast layer.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that the present invention is not limited to the details of the embodiments shown and described, but is capable of numerous equivalents and substitutions without departing from the spirit of the invention as set forth in the claims appended hereto.

Claims (10)

1. A dual laser machining system, comprising:
a first laser (1), the first laser (1) being adapted to generate a first pulsed laser light;
a second laser (2), the second laser (2) being adapted to generate a second pulsed laser light;
and the beam combination module (3) is used for receiving the first pulse laser and the second pulse laser and combining the first pulse laser and the second pulse laser into a third laser beam.
2. The dual laser processing system according to claim 1, wherein the first and second pulsed lasers have different polarization directions, and the beam combining module (3) is a PBS polarizing beam splitter.
3. The dual laser processing system according to claim 1, wherein the beam combining module (3) is a dichroic mirror and the wavelengths of the first and second pulsed lasers are different.
4. The dual laser processing system according to claim 1, wherein a first adjusting module (4) is further disposed between the first laser (1) and the beam combining module (3), and the first adjusting module (4) is configured to adjust an emitting position and an emitting direction of the first pulse laser.
5. The dual laser processing system according to claim 1, wherein a second adjusting module (5) is further disposed between the second laser (2) and the beam combining module (3), and the second adjusting module (5) is configured to adjust an emitting position and an emitting direction of the second pulse laser.
6. The twin laser processing system according to claim 4, wherein the first adjustment module (4) comprises a first mirror (41) and a second mirror (42), the first mirror (41) is disposed upstream of the second mirror (42) in the optical path, the second mirror is configured to receive the light beam from the first mirror and reflect the light beam to the beam combining module, and the first mirror (41) and the second mirror (42) are configured to adjust the tilt angle along the orthogonal direction in the plane of the respective reflection surfaces.
7. The dual laser processing system according to claim 5, wherein the second adjusting module (5) comprises a third reflector (51) and a fourth reflector (52), the third reflector (51) is disposed upstream of the optical path of the fourth reflector (52), the fourth reflector is configured to receive the light beam from the third reflector and reflect the light beam to the beam combining module, and the third reflector (51) and the fourth reflector (52) are respectively adjustable in inclination angles along orthogonal directions in a plane where the respective reflecting surfaces are located.
8. The dual laser machining system of claim 1, further comprising a detector for detecting a coaxiality of the first pulsed laser and the second pulsed laser in the third laser beam.
9. A double laser processing method is characterized in that parameters of first pulse laser and second pulse laser generated by a first laser and a second laser respectively are set; and generating the first pulse laser and the second pulse laser so that the first pulse laser and the second pulse laser are coaxially arranged.
10. The twin laser processing method according to claim 9, wherein the parameters are, in particular, the time of starting light emission of the first pulse laser is t1, the pulse energy is e1, the pulse width is τ 1, and the frequency is f 1; the light emission starting time of the second pulse laser is t2, the pulse energy is e2, the pulse width is tau 2, and the frequency is f 2; e1 is greater than or equal to e2, t2 is no earlier than t1, and τ 1 is greater than or equal to τ 2.
CN202110768986.7A 2021-07-07 2021-07-07 Double-laser processing system and method Pending CN113369721A (en)

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CN202110768986.7A CN113369721A (en) 2021-07-07 2021-07-07 Double-laser processing system and method

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Application Number Priority Date Filing Date Title
CN202110768986.7A CN113369721A (en) 2021-07-07 2021-07-07 Double-laser processing system and method

Publications (1)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013208A1 (en) * 1989-04-20 1990-11-01 Douw, Serge Device for selectively influencing the colour and direction of a white-light laser beam
CN103592766A (en) * 2013-10-28 2014-02-19 华中科技大学 Optical module for improving brightness of lasers and high-frequency pulse laser source
CN106964908A (en) * 2017-05-26 2017-07-21 广东工业大学 A kind of laser micropore system of processing
CN107953027A (en) * 2018-01-15 2018-04-24 哈尔滨工业大学 A kind of femtosecond of pulse combined-nanosecond laser system of processing and processing method
CN110412769A (en) * 2019-07-12 2019-11-05 武汉锐科光纤激光技术股份有限公司 A kind of fiber laser combiner

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990013208A1 (en) * 1989-04-20 1990-11-01 Douw, Serge Device for selectively influencing the colour and direction of a white-light laser beam
CN103592766A (en) * 2013-10-28 2014-02-19 华中科技大学 Optical module for improving brightness of lasers and high-frequency pulse laser source
CN106964908A (en) * 2017-05-26 2017-07-21 广东工业大学 A kind of laser micropore system of processing
CN107953027A (en) * 2018-01-15 2018-04-24 哈尔滨工业大学 A kind of femtosecond of pulse combined-nanosecond laser system of processing and processing method
CN110412769A (en) * 2019-07-12 2019-11-05 武汉锐科光纤激光技术股份有限公司 A kind of fiber laser combiner

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