CN113346793B - Multistage refrigerating system for recycling circuit waste heat - Google Patents

Multistage refrigerating system for recycling circuit waste heat Download PDF

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Publication number
CN113346793B
CN113346793B CN202110611997.4A CN202110611997A CN113346793B CN 113346793 B CN113346793 B CN 113346793B CN 202110611997 A CN202110611997 A CN 202110611997A CN 113346793 B CN113346793 B CN 113346793B
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thermoelectric generation
stage
refrigeration
piece
energy storage
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CN113346793A (en
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蔡烨芸
邓方
赵佳晨
丁宁
王向阳
高峰
石翔
陈杰
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Beijing Institute of Technology BIT
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Beijing Institute of Technology BIT
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H02N11/002Generators
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/32Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from a charging set comprising a non-electric prime mover rotating at constant speed
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B40/00Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

The invention provides a multistage refrigerating system for recycling circuit waste heat, which can avoid the problems of a heat dissipation device and realize effective temperature reduction and high-efficiency waste heat recycling of a circuit. The temperature difference between the cold end and the hot end of the thermoelectric power generation piece is improved due to the introduction of the refrigerating piece, so that the utilization rate of converting waste heat into electric energy is improved. The invention carries out innovative design on the installation structures of the thermoelectric generation pieces and the refrigeration pieces, and the structures of the multistage thermoelectric generation pieces and the refrigeration pieces can carry out multistage recycling on heat generated in electronic equipment, thereby increasing the energy utilization rate compared with one-time utilization.

Description

Multistage refrigerating system for recycling circuit waste heat
Technical Field
The invention relates to the technical field of thermoelectric generation and refrigeration, in particular to a multistage refrigeration system for recycling circuit waste heat.
Background
With the increase of the popularity of electronic equipment, almost one mobile phone and one notebook computer are used at present. In addition, there are various intelligent electronic wearable devices, and various electronic devices such as large servers and desktop computers placed indoors. Electronic devices require a large amount of electrical energy to operate, and more than 40% of the electrical energy is ultimately consumed in the form of heat. When electronic equipment generates heat, the temperature of the equipment rises, the service performance of the equipment is influenced, meanwhile, the resource waste is also caused by the generation of heat, and the effective electric energy which can be really utilized is limited. In order to not affect the service performance of the equipment, the temperature of the equipment needs to be reduced, and some heat dissipation devices, such as fans, water cooling and other additional devices, are usually installed together with the electronic equipment, which is very common in the use of electronic equipment such as desktop computers, notebooks and the like. The use of these additional heat abstractor needs extra electric energy supply to there is certain defect, for example the fan can be because the long-term deposition causes the card stifled, and the noise grow during the rotation even causes can't rotate and burns out equipment, and the water cooling plant dismouting is complicated, and general user hardly accomplishes by oneself, and when seeking professional help the price is higher, and the scheduling problem that leaks appears easily still.
Some existing technologies refer to the technology that a thermoelectric power generation sheet is used for converting system waste heat into electric energy to supply power to a heat dissipation device of equipment. The method can improve the effective utilization rate of the electric energy to a certain extent, but still needs heat dissipation parts such as a fan, water cooling and the like to realize cooling, and the problems of the heat dissipation devices cannot be solved. Meanwhile, the electric energy obtained by the thermoelectric generation piece through waste heat conversion is not as large as the electric energy directly provided for the heat dissipation part by the power supply, and the same heat dissipation effect can not be achieved. The thermoelectric generation piece can only utilize the temperature difference between the cold end and the hot end to convert heat energy into electric energy, can not independently dissipate heat, and can not only help equipment to dissipate heat through the thermoelectric generation piece. After the equipment radiating effect reduces, the temperature difference between the cold end and the hot end of the thermoelectric generation piece can become small, the generating efficiency becomes low, the radiating effect of the radiating device is further influenced, and the vicious circle finally leads to the overhigh temperature of the equipment and can not be normally used. In addition, the prior art only collects waste heat for the core processor (CPU or GPU) of the circuit, but the circuit also has a plurality of heating elements, and the heat is wasted.
Disclosure of Invention
In order to solve the existing problems, the invention provides a multistage refrigeration system for recycling circuit waste heat, which can avoid the problems of a heat dissipation device and simultaneously realize effective temperature reduction and high-efficiency waste heat recycling of a circuit.
In order to achieve the purpose, the multistage refrigeration system for recycling the circuit waste heat comprises an electronic equipment core circuit board, a hot end heat exchanger, a cold end heat exchanger, a temperature difference power generation module, a refrigeration module and an energy storage module, wherein the electronic equipment core circuit board is connected with the hot end heat exchanger and the cold end heat exchanger; the thermoelectric power generation module comprises N stages of thermoelectric power generation pieces, N is an integer and is more than or equal to 2; the refrigeration module comprises refrigeration pieces with the same number as the thermoelectric generation piece;
the electronic equipment core circuit board is stuck and clamped between the hot end heat exchanger and the cold end heat exchanger;
the hot end heat exchanger is attached to the hot end of the first-stage thermoelectric generation piece, the cold end of the first-stage thermoelectric generation piece is attached to the cold end of the second-stage refrigeration piece, the hot end of the second-stage refrigeration piece is attached to the hot end of the third-stage thermoelectric generation piece, the cold end of the third-stage thermoelectric generation piece is attached to the cold end of the fourth-stage refrigeration piece, and the rest is done until the cold end of the N-1-stage thermoelectric generation piece is attached to the cold end of the N-stage refrigeration piece;
a cold end heat exchanger is attached to a cold end of a first-stage refrigerating sheet, a hot end of the first-stage refrigerating sheet is attached to a hot end of a second-stage thermoelectric generation sheet, a cold end of the second-stage thermoelectric generation sheet is attached to a cold end of a third-stage refrigerating sheet, a hot end of the third-stage refrigerating sheet is attached to a hot end of a fourth-stage thermoelectric generation sheet, and the like are carried out until the hot end of an N-1-stage refrigerating sheet is attached to the hot end of the N-stage thermoelectric generation sheet;
The thermoelectric generation pieces with the same grade are respectively connected with the output interfaces of the refrigeration pieces, the thermoelectric generation pieces supply electric energy to the refrigeration pieces, and meanwhile the thermoelectric generation pieces are also connected with the energy storage module;
the energy storage module is used for storing electric energy.
And the electronic equipment core circuit board, the hot end heat exchanger and the cold end heat exchanger are packaged by a packaging box body.
And the direction of the core circuit board of the electronic equipment is taken as reference, the hot end heat exchanger faces upwards, and the cold end heat exchanger faces downwards.
Wherein, the refrigeration piece of highest level is alternately twined with the copper wire.
Wherein, the binding surfaces among all parts are provided with heat-conducting silicone grease.
The energy storage module comprises an energy storage element and a charge-discharge modulation circuit; the energy storage element is a flexible super capacitor, a common super capacitor, a lithium battery or a storage battery, and the charge and discharge modulation circuit is used for protecting the energy storage element when the circuit is charged and discharged.
Wherein, the energy storage module can be dismantled.
And a heat dissipation device is additionally arranged at the top of the highest-level refrigerating sheet.
The temperature sensor is packaged in a packaging box body and used for monitoring the temperature of the packaging box body and transmitting temperature data to a processor in a core circuit board of the electronic equipment; the processor judges the current average temperature in the packaging box body, and sets different temperature levels in the current electronic equipment according to the set levels of the thermoelectric generation chip and the refrigeration chip; under different temperature grades, the processor sends different instructions to control the working conditions of the thermoelectric generation piece, the refrigeration piece and the energy storage module.
The electronic equipment core circuit board is connected with the processor, and the processor is used for processing the temperature data of the electronic equipment core circuit board; the processor judges the current average temperature of the core circuit board of the electronic equipment and sets different temperature grades in the current electronic equipment according to the grades of the set thermoelectric generation piece and the refrigeration piece; under different temperature grades, the processor sends different instructions to control the working conditions of the thermoelectric generation piece, the refrigeration piece and the energy storage module.
Has the beneficial effects that:
the temperature difference between the cold end and the hot end of the thermoelectric power generation piece is improved due to the introduction of the refrigerating piece, so that the utilization rate of converting waste heat into electric energy is improved. The invention carries out innovative design on the installation structures of the thermoelectric generation pieces and the refrigeration pieces, and the structures of the multistage thermoelectric generation pieces and the refrigeration pieces can carry out multistage recycling on heat generated in electronic equipment, thereby increasing the energy utilization rate compared with one-time utilization.
The invention utilizes the packaging box to package the core circuit board of the integral electronic equipment, not only can collect a large amount of heat generated by the core processor, but also can collect heat generated by other heating elements in the circuit.
The invention reasonably utilizes the gradient change direction of the cold end and the hot end, can effectively improve the refrigeration effect and the power generation efficiency, converts surplus heat energy into electric energy by utilizing the thermoelectric power generation sheet, and does not increase the power supply burden of the original electronic equipment.
The invention designs a copper wire wrapped structure for the highest-level refrigerating sheet, reasonably utilizes the respective advantages of the thermoelectric generation sheet and the refrigerating sheet, and realizes the recycling of circuit waste heat.
The binding surfaces among all the components of the invention are provided with the heat-conducting silicone grease, so that the binding surfaces can be ensured to be in close contact, the thermal resistance is reduced, and the heat-conducting effect is enhanced.
The design of the invention can ensure that the used electronic equipment can have better cooling and temperature control effects without heat dissipation devices such as fans, water cooling and the like. Meanwhile, the heat dissipation device can be used together with a heat dissipation device originally installed on electronic equipment such as a fan and water cooling, and the effect is better.
The energy storage module used by the invention is convenient to disassemble, can be used for supplying power to other equipment after charging is finished, and can also be used as an emergency power supply of used electronic equipment to prevent data loss during sudden power failure.
The invention also comprises a temperature sensor which is used for monitoring the temperature of the core circuit board of the electronic equipment and intelligently judging the temperature state of the circuit through a processor in the core circuit board of the electronic equipment so as to provide better refrigeration effect and help the circuit to cool.
Drawings
FIG. 1 is a schematic side view of a multi-stage refrigeration system of the present invention with N at 2.
Fig. 2 is a schematic side view of an enlarged structure of the package case 3 according to the present invention.
The heat-dissipation type electronic equipment comprises 101-a secondary refrigeration piece, 102-a primary refrigeration piece, 201-a primary thermoelectric generation piece, 202-a secondary thermoelectric generation piece, 3-a packaging box body, 301-a hot-end exchanger, 302-an electronic equipment core circuit board, 303-a cold-end heat exchanger, 304-an electronic element and 4-a heat dissipation device.
Detailed Description
The invention is described in detail below by way of example with reference to the accompanying drawings.
The multistage refrigeration system for recovering and utilizing the waste heat of the intelligent circuit comprises an electronic equipment core circuit board, a hot end heat exchanger, a cold end heat exchanger, a temperature difference power generation module, a refrigeration module and an energy storage module; the thermoelectric power generation module comprises N stages of thermoelectric power generation pieces, N is an integer and is more than or equal to 2; the refrigeration module comprises refrigeration pieces with the same number as the thermoelectric generation piece;
the electronic equipment core circuit board is stuck and clamped between the hot end heat exchanger and the cold end heat exchanger;
the hot end heat exchanger is attached to the hot end of the first-stage thermoelectric generation piece, the cold end of the first-stage thermoelectric generation piece is attached to the cold end of the second-stage refrigeration piece, the hot end of the second-stage refrigeration piece is attached to the hot end of the third-stage thermoelectric generation piece, the cold end of the third-stage thermoelectric generation piece is attached to the cold end of the fourth-stage refrigeration piece, and the rest is done until the cold end of the N-1-stage thermoelectric generation piece is attached to the cold end of the N-stage refrigeration piece;
The cold end heat exchanger is attached to the cold end of the first-stage refrigerating sheet, the hot end of the first-stage refrigerating sheet is attached to the hot end of the second-stage thermoelectric generation sheet, the cold end of the second-stage thermoelectric generation sheet is attached to the cold end of the third-stage refrigerating sheet, the hot end of the third-stage refrigerating sheet is attached to the hot end of the fourth-stage thermoelectric generation sheet, and the rest is done until the hot end of the N-1-stage refrigerating sheet is attached to the hot end of the N-stage thermoelectric generation sheet;
the thermoelectric generation pieces in the same grade are respectively connected with the output interfaces of the refrigeration pieces, the thermoelectric generation pieces supply electric energy to the refrigeration pieces, and meanwhile the thermoelectric generation pieces are also connected with the energy storage module;
the energy storage module is used for storing electric energy.
Furthermore, the electronic device core circuit board 302, the cold-end heat exchanger 303 and the hot-end heat exchanger 301 are packaged by the packaging box body, so that not only a large amount of heat generated by the core processor can be collected, but also heat generated by other heating elements in the circuit can be collected, and the heat generated on the electronic device core circuit board can be conducted outwards along the heat flowing direction.
As a preferred embodiment of the present invention, the electronic device core circuit board 302 is closely sandwiched between the hot-side heat exchanger 301 and the cold-side heat exchanger 303, the hot-side heat exchanger 301 faces upward, and the cold-side heat exchanger 303 faces downward, so as to better conform to the direction of heat flow and improve the heat conduction capability of the device, but not limited to this direction.
Furthermore, the refrigeration piece of the highest level is wound with copper wires in an interactive mode, the respective advantages of the thermoelectric generation piece and the refrigeration piece are reasonably utilized, and the circuit waste heat is recycled.
As a preferable scheme of the invention, the binding surfaces between the components are all provided with the heat-conducting silicone grease, so that the binding surfaces can be ensured to be in close contact, the thermal resistance is reduced, and the heat-conducting effect is enhanced.
The energy storage module at least comprises an energy storage element and a charge-discharge modulation circuit; the energy storage element can be various types such as a flexible super capacitor, a common super capacitor, a lithium battery, a storage battery and the like, and the charging and discharging modulation circuit is used for protecting the energy storage element when the circuit is charged and discharged; preferably, the energy storage module is easy to disassemble.
As a preferred scheme of the invention, the top of the highest-level refrigerating sheet can be optionally provided with a heat dissipation device, so that the heat dissipation effect is improved, and the top of the highest-level refrigerating sheet can be not provided with the heat dissipation device, and only the designed refrigerating sheet which is wound by copper wires in an interactive mode is used.
The multi-stage refrigeration system of the present invention may also include a temperature sensor that is responsible for detecting the average temperature of the electronic device core circuit board 302 and transmitting the temperature data to a processor in the electronic device core circuit board 302; when the temperature is low, the processor controls the regulating and controlling circuit to carry out circuit control, the electric energy obtained by the thermoelectric generation piece is directly transmitted to the energy storage module to charge the energy storage module, and the power is not supplied to the refrigerating piece; when the temperature is higher, the processor controls the regulating and controlling circuit to carry out circuit control, the electric energy obtained by the thermoelectric generation sheet supplies power to the refrigeration sheet, and the surplus energy charges the energy storage module; when the temperature is very high, the processor controls the regulating and controlling circuit to carry out circuit control, the electric energy obtained by the thermoelectric generation piece supplies power to the refrigeration piece, and the energy storage module supplies power to the refrigeration piece simultaneously, so that a better refrigeration effect is provided, and the circuit is helped to be cooled. In order to fully utilize the obtained energy, the temperature grade can be set according to the grade of the power generation sheet and the refrigeration sheet.
Further, the temperature sensor can be packaged in the packaging box body 3, the temperature of the packaging box body is monitored, and temperature data are transmitted to a processor in the core circuit board of the electronic device; the processor judges the current average temperature in the packaging box body, and sets different temperature levels in the current electronic equipment according to the set levels of the thermoelectric generation chip and the refrigeration chip; under different temperature grades, the processor sends different instructions to control the working conditions of the thermoelectric generation piece, the refrigeration piece and the energy storage module.
The N-level power generation pieces can be divided into 2N + 1-level temperature levels, and all the power generation pieces transmit electric energy to the energy storage element at the first-level temperature; when the temperature of the second stage is high, the N-stage power generation pieces transmit electric energy to the N-stage refrigeration pieces, and the rest of stages of power generation pieces transmit electric energy to the energy storage element; when the temperature of the third stage is high, the (N-1) stage power generation pieces transmit electric energy to the (N-1) stage refrigeration pieces, and the other stages of power generation pieces transmit electric energy to the energy storage element; when the temperature of the fourth stage is higher than the first temperature, the N-stage power generation sheet supplies the N-stage refrigeration sheet, the (N-1) stage power generation sheet supplies the (N-1) stage refrigeration sheet, and the rest of the (N-1) stage power generation sheet supplies the energy storage element; in the 2N stage, the N-stage power generation sheet supplies power to the N-stage refrigeration sheet, the first-stage power generation sheet supplies power to the first-stage refrigeration sheet, and other stages supply power to the energy storage element; the 2N +1 time N level electricity generating piece gives N level refrigeration piece, (N-1) electricity generating piece gives (N-1) level refrigeration piece, (N-2) electricity generating piece gives (N-2) level refrigeration piece, until 1 level gives 1 level.
In the invention, a schematic side view of a multi-stage refrigeration system when N is 2 is shown in fig. 1, and the multi-stage refrigeration system comprises a packaging box body 3, a thermoelectric generation module, a refrigeration module and an energy storage module.
Fig. 2 shows a schematic side view of an enlarged structure of a package case 3 of the present invention, and an electronic device core circuit board 302, a cold-end heat exchanger 303, and a hot-end heat exchanger 301 are disposed in the package case 3.
The electronic device core circuit board 302 includes at least one processor; the thermoelectric generation module comprises 2-level thermoelectric generation pieces; the refrigeration module comprises a 2-stage refrigeration piece;
the electronic device core circuit board 302 is stuck and clamped between the hot-end heat exchanger 301 and the cold-end heat exchanger 303;
in the embodiment, two levels of thermoelectric power generation plates and two levels of refrigeration plate structures are selected and used. One-level thermoelectric generation piece 201 hot junction closely laminates with 3 hot junctions of encapsulation box, and one-level refrigeration piece 102 hot junction closely laminates with 3 cold junctions of encapsulation box, and one-level thermoelectric generation piece 201 is connected with one-level refrigeration piece 102 wire to one-level thermoelectric generation piece 201 is connected with energy storage module, and all binding faces scribble heat conduction silicone grease. Second grade thermoelectric generation piece 202 hot junction closely laminates with first grade refrigeration piece 102 hot junction, and second grade refrigeration piece 101 cold junction closely laminates with 201 cold junctions of first grade thermoelectric generation piece, and second grade thermoelectric generation piece 202 is connected with second grade refrigeration piece 101 to second grade thermoelectric generation piece 202 is connected with energy storage module, and all binding faces scribble heat conduction silicone grease.
The second-stage refrigeration piece 101 is used as the highest-level refrigeration piece in the embodiment, and the whole body is wrapped in a copper wire cross winding mode, so that the temperatures of the cold end and the hot end of the second-stage refrigeration piece 101 are balanced, and the influence of the heating of the hot end of the refrigeration piece on the temperature of equipment is reduced.
The thermoelectric power generation pieces and the refrigeration pieces in different levels have different functions in the structure, and the obtained or required energy levels are different, so that the connection of the thermoelectric power generation pieces and the refrigeration pieces in the same level can better utilize the heat energy in different levels in the system, and the environmental refrigeration effect is improved.
As a preferred scheme of this embodiment, an additional heat dissipation device 4 is further provided in fig. 1, and the heat dissipation device is tightly attached to the hot end of the secondary refrigeration sheet 101, so as to enhance the heat dissipation effect of the hot end of the secondary refrigeration sheet 101, and achieve better cooling of the circuit.
Specifically, the temperature sensor is packaged in the package box 3, and is responsible for detecting the average temperature of the package box 3, and transmitting the detected data to the electronic device core circuit board 302, and the processor in the electronic device core circuit board 302 determines the refrigeration strategy that needs to be provided by the package box 3 in the current state according to the received temperature. Since the present embodiment selects the use of two levels of thermoelectric generation chips and two levels of refrigeration chips, the temperature is classified into five levels at the time of analysis. When the temperature is in the first-level temperature, the processor sends a command, and the two-level temperature difference power generation pieces directly input the obtained electric energy to the energy storage module for electric energy storage. When the temperature is at the second-level temperature, the processor sends a command, the second-level thermoelectric generation piece 202 starts to supply power to the second-level refrigeration piece 101, and the first-level thermoelectric generation piece 201 still directly transmits the electric energy to the energy storage module for electric energy storage. When the temperature is at the third level, the processor sends a command, the first-level thermoelectric generation piece 201 starts to supply power to the first-level refrigeration piece 102, the second-level thermoelectric generation piece 202 stops supplying power to the first-level refrigeration piece 101, and then the electric energy is directly transmitted to the energy storage module to be stored. When the temperature of the four stages is reached, the processor sends out an order, the thermoelectric generation pieces of the two stages respectively supply power to the refrigeration pieces of the two stages, and the surplus energy is transmitted to the energy storage module for electric energy storage. When the temperature is at the fifth-level temperature, the processor sends out a command, and the thermoelectric generation piece and the energy storage module at the two levels supply power to the refrigeration pieces at the two levels together. The specifics of the temperature grading need to be determined according to the electronic equipment used. The specific grade number of the temperature division needs to be adjusted according to the used temperature difference power generation pieces and refrigeration pieces of different grades.
In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A multi-stage refrigeration system for recycling circuit waste heat is characterized by comprising an electronic equipment core circuit board, a hot end heat exchanger, a cold end heat exchanger, a temperature difference power generation module, a refrigeration module and an energy storage module; the thermoelectric generation module comprises N stages of thermoelectric generation pieces, N is an integer and is more than or equal to 2; the refrigeration module comprises refrigeration pieces with the same number as the thermoelectric generation pieces;
the electronic equipment core circuit board is stuck and clamped between the hot end heat exchanger and the cold end heat exchanger;
the hot end heat exchanger is attached to the hot end of the first-stage thermoelectric generation piece, the cold end of the first-stage thermoelectric generation piece is attached to the cold end of the second-stage refrigeration piece, the hot end of the second-stage refrigeration piece is attached to the hot end of the third-stage thermoelectric generation piece, the cold end of the third-stage thermoelectric generation piece is attached to the cold end of the fourth-stage refrigeration piece, and the rest is done until the cold end of the N-1-stage thermoelectric generation piece is attached to the cold end of the N-stage refrigeration piece;
the cold end heat exchanger is attached to the cold end of the first-stage refrigerating sheet, the hot end of the first-stage refrigerating sheet is attached to the hot end of the second-stage thermoelectric generation sheet, the cold end of the second-stage thermoelectric generation sheet is attached to the cold end of the third-stage refrigerating sheet, the hot end of the third-stage refrigerating sheet is attached to the hot end of the fourth-stage thermoelectric generation sheet, and the rest is done until the hot end of the N-1-stage refrigerating sheet is attached to the hot end of the N-stage thermoelectric generation sheet;
The thermoelectric generation pieces with the same grade are respectively connected with the output interfaces of the refrigeration pieces, the thermoelectric generation pieces supply electric energy to the refrigeration pieces, and meanwhile the thermoelectric generation pieces are also connected with the energy storage module;
the energy storage module is used for storing electric energy.
2. The system of claim 1 wherein the electronics core circuit board, the hot side heat exchanger, and the cold side heat exchanger are encapsulated with an encapsulation enclosure.
3. The system of claim 1 wherein the hot side heat exchanger faces upward and the cold side heat exchanger faces downward with reference to the orientation of the electronics core circuit board.
4. The system of claim 1, wherein the top-level cooling fins are intertwined with copper wires.
5. The system of claim 1, wherein the abutting surfaces between all of the components comprise thermally conductive silicone grease.
6. The system of claim 1, wherein the energy storage module comprises an energy storage element and a charge-discharge modulation circuit; the energy storage element is a flexible super capacitor, a common super capacitor, a lithium battery or a storage battery, and the charge and discharge modulation circuit is used for protecting the energy storage element when the circuit is charged and discharged.
7. The system of claim 1, wherein the energy storage module is removable.
8. The system of claim 1, wherein said top-level cooling fins have a heat sink attached to the top thereof.
9. The system of claim 2, further comprising a temperature sensor enclosed in an enclosure, the temperature sensor configured to monitor a temperature of the enclosure and transmit temperature data to a processor in the electronic device core circuit board; the processor judges the current average temperature in the packaging box body, and sets different temperature levels in the current electronic equipment according to the set levels of the thermoelectric generation chip and the refrigeration chip; under different temperature grades, the processor sends different instructions to control the working conditions of the thermoelectric generation piece, the refrigeration piece and the energy storage module.
10. The system of any one of claims 1 or 3-9, further comprising a temperature sensor to monitor the temperature of the electronics core board and to transmit temperature data to a processor in the electronics core board; the processor judges the current average temperature of the core circuit board of the electronic equipment and sets different temperature grades in the current electronic equipment according to the grades of the set thermoelectric generation piece and the refrigeration piece; under different temperature grades, the processor sends different instructions to control the working conditions of the thermoelectric generation piece, the refrigeration piece and the energy storage module.
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