CN113345938B - Display panel, strengthening method thereof and display device - Google Patents

Display panel, strengthening method thereof and display device Download PDF

Info

Publication number
CN113345938B
CN113345938B CN202110533920.XA CN202110533920A CN113345938B CN 113345938 B CN113345938 B CN 113345938B CN 202110533920 A CN202110533920 A CN 202110533920A CN 113345938 B CN113345938 B CN 113345938B
Authority
CN
China
Prior art keywords
layer
display panel
substrate
display
functional layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110533920.XA
Other languages
Chinese (zh)
Other versions
CN113345938A (en
Inventor
王敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202110533920.XA priority Critical patent/CN113345938B/en
Publication of CN113345938A publication Critical patent/CN113345938A/en
Application granted granted Critical
Publication of CN113345938B publication Critical patent/CN113345938B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application discloses a display panel and a strengthening method and a display device thereof, wherein the display panel comprises: a substrate; the buffer layer is arranged on one side of the substrate; the display functional layer is arranged on one side, far away from the substrate, of the buffer layer; the blocking functional layer is arranged on one side, far away from the buffer layer, of the display functional layer and covers the outer side face of the display functional layer; and the adhesive layer is arranged on the outer side surfaces of the substrate and the buffer layer. The problem that microcracks are easily generated in the cutting process of the thinned glass substrate can be solved, so that the edge strength of the flexible display panel is improved, and the curling reliability of the flexible display panel is improved.

Description

Display panel, strengthening method thereof and display device
Technical Field
The present disclosure relates to the field of display technologies, and in particular, to a display panel, a strengthening method thereof, and a display device.
Background
The flexible OLED has the advantages of being light and thin, bendable, low in power consumption, high in PPI and the like, and has wide application prospects in the aspects of intelligent household appliances, wearable equipment and the like. For flexible OLED TVs, the mechanical strength requirements for curling are very high, typically requiring 10 ten thousand curl tests, and therefore, the requirements for flexible panel structure and material strength are very high.
At present, a large-size flexible OLED display panel has two manufacturing schemes, one is to coat a Polyimide (PI) material on rigid glass to form a flexible substrate, then sequentially form a TFT layer, an OLED layer and a flexible packaging layer on the PI flexible substrate, and finally strip the rigid glass and the PI flexible substrate by using a laser stripping technology to form a flexible screen, but the laser stripping mode is greatly influenced by factors such as environment, substrate size and the like, has low yield and is not suitable for mass production of the large-size OLED flexible screen; the second is that the flexible display can be realized only by thinning the rigid glass in the display panel to a certain thickness, and the thinned rigid glass is a brittle material and is easy to generate micro cracks in the cutting process, and the micro cracks can rapidly expand and crack in the curling process to cause the display panel to be broken, so that the curling reliability of the flexible OLED is reduced.
Therefore, improvement is urgently needed to overcome the defects in the prior art.
Disclosure of Invention
The application aims to provide a display panel, a strengthening method thereof and a display device, which can solve the problem that in the prior art, a thinned glass substrate is easy to generate micro cracks in a cutting process, so that the curling reliability of the flexible display panel is reduced.
The embodiment of the present application provides a display panel, display panel includes: a substrate; the buffer layer is arranged on one side of the substrate; the display functional layer is arranged on one side, far away from the substrate, of the buffer layer; the blocking functional layer is arranged on one side, far away from the buffer layer, of the display functional layer and coats the display functional layer; and the adhesive layer is arranged on the edges of the substrate and the buffer layer.
Optionally, in some embodiments of the present application, the display panel further includes: and the protective layer is arranged on one side of the substrate, which is far away from the buffer layer.
Optionally, in some embodiments of the present application, the display function layer includes a thin film transistor, a planarization layer, an anode, a light-emitting definition layer, a light-emitting layer, a cathode, an organic encapsulation layer, and an encapsulation protection layer, which are sequentially stacked and disposed on the buffer layer; the blocking functional layer comprises a base material layer, a blocking layer and an optical adhesive layer which are sequentially stacked on the display functional layer.
Optionally, in some embodiments of the present application, the elastic modulus of the glue layer is at least smaller than the elastic modulus of the substrate.
Optionally, in some embodiments of the present application, the elastic modulus of the substrate is X, the elastic modulus of the glue layer is Y, and the elastic modulus of the buffer layer is Z; the elastic modulus of the adhesive layer is smaller than that of the substrate and larger than that of the buffer layer, namely X is larger than Y and larger than Z.
Optionally, in some embodiments herein, the barrier functional layer and/or the protective layer has a transmittance of greater than 90%; when the light emitting side of the display functional layer faces the blocking functional layer, the transmittance of the blocking functional layer is greater than 90%; when the light emergent side of the display function layer faces the protective layer, the transmittance of the protective layer is larger than 90%; when the light emergent side of the display functional layer faces towards the display functional layer and the protective layer at the same time, the transmittances of the blocking functional layer and the protective layer are both larger than 90%.
Optionally, in some embodiments of the present application, a material used for the adhesive layer is an ultraviolet light curable adhesive, and a thickness of the adhesive layer is 30 μm to 50 μm.
Correspondingly, the application also provides a strengthening method of the display panel, which comprises the following steps: providing a display panel to be thinned; attaching anti-thinning materials to one side surface and the edge of the display panel to expose a surface to be thinned of the display panel; thinning the surface to be thinned of the display panel to form a thinned surface, and then removing the anti-thinning material; coating an adhesive layer on the edge of the thinned display panel and curing; and attaching a protective layer to the thinned surface of the display panel.
Optionally, in some embodiments of the present application, a surface to be thinned of the display panel is a glass substrate, and a thickness of the glass substrate is greater than 0.4mm.
Correspondingly, the present application further provides a display device, which includes the display panel described in any of the above embodiments.
Compared with the prior art, the application discloses a display panel, a strengthening method thereof and a display device, wherein the display panel comprises: a substrate; the buffer layer is arranged on one side of the substrate; the display functional layer is arranged on one side, far away from the substrate, of the buffer layer; the blocking functional layer is arranged on one side, far away from the buffer layer, of the display functional layer and covers the outer side face of the display functional layer; and the adhesive layer is arranged on the outer side surfaces of the substrate and the buffer layer. The problem that microcracks are easily generated in the cutting process of the thinned glass substrate can be solved, so that the edge strength of the flexible display panel is improved, and the curling reliability of the flexible display panel is improved.
Specifically, the buffer layer is used for adjusting stress distribution, and the display panel bending performance can be improved through the multi-layer arrangement. The blocking functional layer can prevent the display functional layer from being eroded by the external environment, for example: the display device can isolate water vapor in the air and prevent the display function layer from being oxidized to reduce the display effect. The glue layer is arranged on the outer side surfaces of the substrate and the buffer layer and has at least two functions, one is buffer stress, fine cracks are easy to generate on the outer side surface of the substrate in the bending process of the display panel, and the glue layer can form tensile stress opposite to crack expansion force in the bending process of the display panel, so that crack expansion is hindered, and the strength of the outer side edge of the substrate is improved; and when the adhesive layer is arranged, the adhesive layer can strengthen the adhesive force between the buffer layer and the substrate, and the problem that the film layer is peeled off between the buffer layer and the substrate is prevented. The protective layer can effectively protect the thinned substrate, can provide a certain supporting force for the substrate, and further prevents the substrate from cracking in the bending process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic view of a film layer structure of a display panel according to the present application;
FIG. 2 is a schematic diagram of a film structure of the barrier function layer of the display panel shown in FIG. 1;
FIG. 3 is a schematic diagram illustrating an enhancement process of the display panel of the present application.
Description of the main reference numerals:
Figure BDA0003068975450000041
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless otherwise stated, the use of directional terms such as "upper", "lower", "left" and "right" may refer to the actual use or operation of the device, may refer to the drawing direction in the drawings, and may refer to two opposite directions; while "inner" and "outer" are with respect to the outline of the device.
Specifically, referring to fig. 1 to fig. 2, an embodiment of the present application provides a display panel 10, where the display panel 10 includes: a substrate 100; at least one buffer layer 200, wherein the buffer layer 200 is disposed on one side of the substrate 100; a display function layer 300, wherein the display function layer 300 is disposed on a side of the buffer layer 200 away from the substrate 100; the barrier function layer 400 is arranged on one side of the display function layer 300, which is far away from the buffer layer 200, and coats the display function layer 300; a glue layer 500, wherein the glue layer 500 is disposed at the edges of the substrate 100 and the buffer layer 200. The buffer layer 200 is used to adjust stress distribution, and the multi-layer arrangement can improve the bending performance of the display panel 10. The blocking functional layer 400 can prevent the display functional layer 300 from being corroded by external environments, such as: it is possible to insulate water vapor in the air and prevent the display function layer 300 from being oxidized to lower the display effect. The adhesive layer 500 is disposed at the edge of the substrate 100 and the buffer layer 200, and one of the effects is to buffer stress, so that fine cracks are easily generated on the substrate 100 in the bending process of the display panel 10, and the adhesive layer 500 can form a tensile stress opposite to a crack propagation force in the bending process of the display panel 10, so as to hinder the crack propagation and improve the strength of the edge of the substrate 100; secondly, when the adhesive layer 500 is arranged, the adhesive layer can penetrate and fill the gap between the buffer layer 200 and the substrate 100, so that the adhesion between the buffer layer 200 and the substrate 100 can be enhanced, and the problem of film peeling in the bending process can be prevented.
Optionally, the buffer layer 200 is used to carry other components in the display panel 10, and the buffer layer 200 enables the display panel 10 to be stretchable, foldable, bendable, or rollable, thereby improving operability of bending, folding, and rolling the display panel 10. The buffer layer 200 may be formed of any suitable insulating material having flexibility. For example, it may be a polymer material such as Polyimide (PD), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP), and the buffer layer 200 may be transparent, translucent, or opaque. The material of the substrate 100 includes glass, but is not limited thereto, and the thickness of the substrate 100 is greater than 0.4mm, for example: 0.7mm, which makes it possible to achieve bending, folding, etc. of the substrate 100 together with the buffer layer 200 by thinning while securing rigidity of the substrate 100.
The display function layer 300 includes a thin film transistor 310, a planarization layer 320, an anode 330, a light-emitting definition layer 340, a light-emitting layer 350, a cathode 360, an organic encapsulation layer 370, and an encapsulation protection layer 380, which are sequentially stacked. The thin film transistor 310 may be a common thin film transistor in the art, and is not limited. The planarization layer 320 is used to planarize the thin film transistor 310 for deposition of subsequent layers. The anode 330 and the cathode 360 may be made of a metal material, or may be made of a transparent electrode material, and are specifically selected according to the actual situation, for example: ag. IZO, ITO, mo, al and other metals or metal compounds. The luminescence defining layer 340 is made of hydrophobic material or has a hydrophobic surface obtained by heating or the like. The light emitting layer 350 is prepared by using materials and preparation methods which are conventional in the art, and the application is not limited. The organic encapsulation layer 370 is made of an organic material, and can improve optical characteristics such as light extraction or viewing angle. The package protection layer 380 is a laminated structure including: at least one first inorganic layer 381, at least one organic layer 382, and at least one second inorganic layer 383, wherein the material of the first inorganic layer 381 and the second inorganic layer 383 includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; the organic layer 382 is preferably a low-viscosity ultraviolet curing adhesive, and has viscosity and flatness, so that the light transmittance of the encapsulation protection layer 380 is increased.
The glue layer 500 is made of ultraviolet light curing glue, and the thickness of the glue layer 500 is 30-50 μm. Ultraviolet light curing glue (UV glue) is a type of adhesive that is cured by irradiation of ultraviolet light. The photoinitiator (or photosensitizer) in the ultraviolet curing material generates active free radicals or cations after absorbing ultraviolet light under the irradiation of ultraviolet light, and initiates the chemical reaction of monomer polymerization and crosslinking, so that the adhesive is converted from a liquid state to a solid state within a few seconds. The ultraviolet curing adhesive is adopted, so that the manufacturing process is simple, the operation is convenient, and the production efficiency is high. Specifically, the thickness of the glue layer 500 may be 35 μm, 40 μm, 45m, or the like. The thickness of the glue layer 500 is set to 30 μm to 50 μm, which can effectively protect the edges of the substrate 100 and the buffer layer 200 from the erosion of the external environment and the buffer stress, and at the same time, the width of the outer side of the display panel 10 can be reduced as much as possible by the thickness design, without affecting other components of the display panel 10. Preferably, the thickness of the adhesive layer 500 is the same as the thickness of the blocking functional layer 400 covering the outer side of the display functional layer 300, which is not limited to fig. 1, that is, the side of the display panel 10 is a smooth surface, so as to further reduce the generation of bending stress.
In the present application, the elastic modulus of the glue layer 500 is at least smaller than that of the substrate 100. Preferably, the elastic modulus of the substrate 100 is X, the elastic modulus of the glue layer 500 is Y, and the elastic modulus of the buffer layer 200 is Z; the elastic modulus of the glue layer 500 is smaller than that of the substrate 100 and larger than that of the buffer layer 200, i.e. X > Y > Z. It is understood that the smaller the modulus of elasticity, the greater the elastic modulus deformation of the material is relative; the elastic modulus of the adhesive layer 500 is set to be the middle value of the elastic moduli of the substrate 100 and the buffer layer 200, so that the bending stress generated in the bending process of the substrate 100 and the buffer layer 200 can be effectively transited, and the substrate 100 and the buffer layer 200 are not peeled off due to the excessively large bending stress. Preferably, the elastic modulus of the glue layer 500 is equal to 1/2 of the sum of the elastic modulus of the substrate 100 and the elastic modulus of the buffer layer 200. This arrangement ensures a more uniform transition of bending stress between the substrate 100 and the buffer layer 200.
As shown in fig. 2, the barrier function layer 400 includes: a substrate layer 410; the barrier layer 420 is arranged on one side of the substrate layer 410; the optical adhesive layer 430 is arranged on one side of the barrier layer 420 far away from the substrate layer 410; wherein the substrate layer 410 is disposed adjacent to the display function layer 300. The barrier functional layer 400 is attached to the surface of the display functional layer 300 by a lamite attachment process. The LAMI process (lamii) is also called a full-lamination process, in which materials to be laminated are completely adhered together without gaps by using glue or optical glue. The full-lamination process has a better display effect, and dust and water vapor can be isolated from entering due to isolation of air between layers, so that the machine is prevented from being influenced by the environment. In addition, the machine body can be thinned, product assembly is simplified, assembly cost is reduced, and narrow frame design is facilitated. In addition, the full-lamination process can also reduce the interference of noise to touch signals and improve the smooth touch operation feeling. Specifically, the base material layer 410 is away from one side of the glue layer for dispensing, so that the blocking functional layer 400 is attached to one side of the display functional layer 300 away from the buffer layer 200 and wraps the display functional layer 300, and the effect of isolating the external environment is achieved.
In an embodiment, the display panel 10 further includes a protection layer 600, and the protection layer 600 is disposed on a surface of the substrate 100 far away from the buffer layer 200. The protection layer 600 can effectively protect the thinned substrate 100, and can provide a certain supporting force for the substrate 100, thereby further preventing the substrate 100 from cracking during the bending process.
The transmittance of the barrier functional layer 400 and/or the protective layer 600 is greater than 90%; when the light emitting side of the display functional layer 300 faces the blocking functional layer 400, the display panel 10 is a top emission structure, the anode 330 is a reflective anode, and the cathode 360 is a transparent cathode, and at this time, the transmittance of the blocking functional layer 400 is greater than 90%; when the light-emitting side of the display function layer 300 faces the protective layer 600, the display panel 10 is of a bottom emission structure, the anode 330 is a transparent anode, and the cathode 360 is a reflective cathode, at this time, the transmittance of the protective layer 600 is greater than 90%; when the light-emitting side of the display function layer 300 faces both the display function layer 300 and the protective layer 600, the display panel 10 is a dual-transparent light-emitting structure, the anode 330 and the cathode 360 are transparent cathodes, and at this time, the transmittances of the blocking function layer 400 and the protective layer 600 are both greater than 90%.
Referring to fig. 1 to fig. 3, in particular, the present application further provides a method for reinforcing a display panel 10, including the following steps:
step S1: providing a display panel 10 to be thinned; the display panel 10 to be thinned includes at least one buffer layer 200, a display functional layer 300, and a barrier functional layer 400 sequentially stacked on a substrate 100, where the barrier functional layer 400 covers the display functional layer 300. In one embodiment, the blocking functional layer 400 covers a side surface of the display functional layer 300 away from the buffer layer 200 and an edge position thereof;
step S2: attaching anti-thinning materials to one side surface and the edge of the display panel 10 to expose the surface to be thinned of the display substrate; in one embodiment, the anti-thinning material may be attached to the upper surface and the edge of the display panel 10, and the surface to be thinned is the lower surface of the display panel 10;
and step S3: thinning the surface to be thinned of the display panel 10 to form a thinned surface, and then removing the anti-thinning material; the thinning treatment is to etch the to-be-thinned surface of the display panel 10 with hydrofluoric acid etching solution, and after the etching is completed, the method further comprises the steps of washing and air-drying the display panel 10 with water and the like so as to prevent staff and the display panel 10 from being corroded in the process of removing the anti-thinning material, wherein the anti-thinning material does not physically or chemically react with the hydrofluoric acid etching solution, so that the non-thinned surface of the display panel 10 can be effectively prevented from being corroded by the hydrofluoric acid etching solution.
And step S4: coating an adhesive layer 500 on the edge of the thinned display panel 10 and curing; the glue layer 500 is made of ultraviolet light curing glue, and can be cured under the irradiation of ultraviolet light to reinforce the outer side surface of the display panel 10, and the glue layer 500 is at least coated on the outer side surfaces of the substrate 100 and the buffer layer 200.
Step S5: attaching a protective layer 600 on the thinned surface of the display panel 10; the thinned surface of the display panel 10 refers to a surface of the substrate 100 away from the buffer layer 200.
In this application, because the protection layer 600 is right in the process of attaching the display panel 10, the coating of the glue layer 500 is performed before the protection layer 600 is attached to the thinned surface of the display panel 10, so that the pressure can be relieved to a certain extent, the risk that the display panel 10 cracks due to too large pressure is avoided, and the reinforcing performance is improved. The to-be-thinned surface of the display panel 10, that is, the substrate 100 is a glass substrate, and the thickness of the glass substrate is greater than 0.4mm, so that the substrate 100 and the buffer layer 200 can be bent or folded by thinning under the condition that the rigidity of the substrate 100 is ensured.
In summary, the buffer layer 200 is used to adjust stress distribution, and the multi-layer arrangement can improve the bending performance of the display panel 10. The blocking functional layer 400 can prevent the display functional layer 300 from being corroded by external environments, such as: it is possible to insulate water vapor in the air and prevent the display function layer 300 from being oxidized to lower the display effect. The adhesive layer 500 is disposed on the outer side surfaces of the substrate 100 and the buffer layer 200, and has at least two functions, one of which is to buffer stress, so that fine cracks are easily generated on the outer side surface of the substrate 100 in the bending process of the display panel 10, and the adhesive layer 500 can form tensile stress opposite to crack propagation force in the bending process of the display panel 10, so as to hinder crack propagation and improve the strength of the outer side edge of the substrate 100; secondly, when the glue layer 500 is arranged, the glue layer 500 can strengthen the adhesion between the buffer layer 200 and the substrate 100, and prevent the buffer layer and the substrate 100 from peeling off. The protection layer 600 can effectively protect the thinned substrate 100, and can provide a certain supporting force for the substrate 100, thereby further preventing the substrate 100 from cracking during the bending process.
The present application further provides a display device, where the display device may include the display panel 10 according to any embodiment of the present application, and therefore, the display device provided by the present application has the technical effects of the technical solutions in any embodiment described above, and the beneficial technical effects of the display device provided by the present application can refer to the descriptions in the embodiments described above, and are not described herein again. The display device provided by the embodiment of the application can be a mobile phone, and can also be any electronic product with a display function, including but not limited to the following categories: the mobile terminal comprises a television, a notebook computer, a desktop display, a tablet computer, a digital camera, an intelligent bracelet, intelligent glasses, a vehicle-mounted display, medical equipment, industrial control equipment, a touch interaction terminal and the like, and the embodiment of the application is not particularly limited in this respect.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel 10, the strengthening method thereof, and the display device provided in the embodiments of the present application are described in detail above, and specific examples are applied herein to explain the principles and embodiments of the present application, and the description of the embodiments above is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (9)

1. A display panel, characterized in that: the display panel includes:
a substrate;
the buffer layer is arranged on one side of the substrate;
the display functional layer is arranged on one side, far away from the substrate, of the buffer layer;
the blocking functional layer is arranged on one side, far away from the buffer layer, of the display functional layer and wraps the display functional layer;
the adhesive layer is arranged at the edges of the substrate and the buffer layer;
the elastic modulus of the substrate is X, the elastic modulus of the adhesive layer is Y, and the elastic modulus of the buffer layer is Z; the elastic modulus of the adhesive layer is smaller than that of the substrate and larger than that of the buffer layer, namely X is larger than Y and larger than Z.
2. The display panel of claim 1, wherein: the display panel further includes:
and the protective layer is arranged on one side of the substrate, which is far away from the buffer layer.
3. The display panel of claim 1, wherein:
the display function layer comprises a thin film transistor, a flat layer, an anode, a light-emitting definition layer, a light-emitting layer, a cathode, an organic packaging layer and a packaging protection layer which are sequentially stacked on the buffer layer;
the blocking functional layer comprises a base material layer, a blocking layer and an optical adhesive layer which are sequentially stacked on the display functional layer.
4. The display panel of claim 1, wherein: the elastic modulus of the glue layer is at least smaller than that of the substrate.
5. The display panel of claim 2, wherein: the transmittance of the barrier functional layer and/or the protective layer is greater than 90%;
when the light emitting side of the display functional layer faces the blocking functional layer, the transmittance of the blocking functional layer is greater than 90%; when the light emergent side of the display function layer faces the protective layer, the transmittance of the protective layer is greater than 90%; when the light emergent side of the display functional layer faces towards the display functional layer and the protective layer at the same time, the transmittances of the blocking functional layer and the protective layer are both larger than 90%.
6. The display panel of claim 1, wherein: the glue layer is made of ultraviolet light curing glue, and the thickness of the glue layer is 30-50 microns.
7. A method for strengthening a display panel is characterized in that: the method comprises the following steps:
providing a display panel to be thinned, wherein the display panel to be thinned comprises at least one buffer layer, a display functional layer and a blocking functional layer which are sequentially stacked on a substrate, and the blocking functional layer wraps the display functional layer;
attaching anti-thinning materials to one side surface and the edge of the display panel to expose a surface to be thinned of the display panel;
thinning the surface to be thinned of the display panel to form a thinned surface, and then removing the anti-thinning material;
coating an adhesive layer on the edge of the thinned display panel and curing, wherein the adhesive layer is at least coated on the outer side surfaces of the substrate and the buffer layer, the elastic modulus of the substrate is X, the elastic modulus of the adhesive layer is Y, and the elastic modulus of the buffer layer is Z; the elastic modulus of the glue layer is smaller than that of the substrate and larger than that of the buffer layer, namely X is larger than Y and larger than Z;
and attaching a protective layer to the thinned surface of the display panel.
8. The method for strengthening a display panel according to claim 7, wherein: the surface to be thinned of the display panel is a glass substrate, and the thickness of the glass substrate is greater than 0.4mm.
9. A display device, characterized in that: the display device includes the display panel according to any one of claims 1 to 6.
CN202110533920.XA 2021-05-17 2021-05-17 Display panel, strengthening method thereof and display device Active CN113345938B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110533920.XA CN113345938B (en) 2021-05-17 2021-05-17 Display panel, strengthening method thereof and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110533920.XA CN113345938B (en) 2021-05-17 2021-05-17 Display panel, strengthening method thereof and display device

Publications (2)

Publication Number Publication Date
CN113345938A CN113345938A (en) 2021-09-03
CN113345938B true CN113345938B (en) 2023-04-07

Family

ID=77468775

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110533920.XA Active CN113345938B (en) 2021-05-17 2021-05-17 Display panel, strengthening method thereof and display device

Country Status (1)

Country Link
CN (1) CN113345938B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115064071B (en) * 2022-06-21 2023-07-18 合肥鑫晟光电科技有限公司 Bearing device and thinning method of display structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107068895A (en) * 2016-12-28 2017-08-18 上海天马微电子有限公司 Display panel and display thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4750969B2 (en) * 2001-06-27 2011-08-17 東芝モバイルディスプレイ株式会社 Method for manufacturing flat display device
CN101201490A (en) * 2007-12-04 2008-06-18 友达光电股份有限公司 Method for thinning display panel device
TWI434250B (en) * 2010-12-15 2014-04-11 Au Optronics Corp Flexible display panel
US20180013100A1 (en) * 2016-07-06 2018-01-11 Samsung Display Co., Ltd. Organic light-emitting diode display device
US10665494B2 (en) * 2018-01-31 2020-05-26 Applied Materials, Inc. Automated apparatus to temporarily attach substrates to carriers without adhesives for processing
CN110416273B (en) * 2019-07-31 2021-12-07 武汉天马微电子有限公司 Display panel and display device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107068895A (en) * 2016-12-28 2017-08-18 上海天马微电子有限公司 Display panel and display thereof

Also Published As

Publication number Publication date
CN113345938A (en) 2021-09-03

Similar Documents

Publication Publication Date Title
US11372451B2 (en) Display substrate, display device and method of forming display substrate
JP7048488B2 (en) Flexible display panel, its manufacturing method, display device
US11411189B2 (en) Flexible OLED module stacked structure and manufacturing method thereof
CN111338511B (en) Display panel, display device and preparation method of display panel
WO2019085486A1 (en) Flexible substrate and method for manufacturing flexible substrate
US9591749B2 (en) Capacitance touch panel module and fabrication method thereof
US8723413B2 (en) Touch-sensing display apparatus and fabricating method thereof
US8830202B2 (en) Touch-sensing display apparatus and fabricating method thereof
KR20160124756A (en) Light-emitting device and peeling method
CN113614816B (en) Array substrate, manufacturing method thereof, display panel and display device
WO2020124812A1 (en) Cover window structure and flexible display device
KR20040029061A (en) Touch panel having high durability
CN110212000B (en) Display panel, manufacturing method and display device
US11957031B2 (en) Display device
CN114170901B (en) Display panel and display device
US10338708B2 (en) Flexible touch screen, method for manufacturing the same and touch device
JP2019086564A (en) Panel module and display device
WO2019179431A1 (en) Heat transfer printing substrate, touch display panel and manufacturing methods therefor, and display device
CN113345938B (en) Display panel, strengthening method thereof and display device
CN111430428B (en) Flexible display panel, manufacturing method thereof and display device
CN113555408A (en) Display device, display module and manufacturing method thereof
US11249603B2 (en) Method of forming touch control module, touch control module and touch control display device
CN114946044A (en) Display module and method of manufacturing the same
CN111490067B (en) Flexible display panel and display device
CN113488515A (en) Display panel and preparation method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant