CN113342087A - Dual-mode electronic temperature control unit - Google Patents
Dual-mode electronic temperature control unit Download PDFInfo
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- CN113342087A CN113342087A CN202110788520.3A CN202110788520A CN113342087A CN 113342087 A CN113342087 A CN 113342087A CN 202110788520 A CN202110788520 A CN 202110788520A CN 113342087 A CN113342087 A CN 113342087A
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- control unit
- temperature control
- dual
- electronic temperature
- heat
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Thermotherapy And Cooling Therapy Devices (AREA)
Abstract
The invention relates to the technical field of cold and hot compress, and adopts the technical scheme that: the utility model provides a bimodulus electron temperature control unit, includes the fixed band, be equipped with a plurality of mounting holes that are the array and distribute on the fixed band, be equipped with the semiconductor refrigeration piece in the mounting hole, the fixed band is located and is equipped with the heat-conducting layer on the side of the face that heats of semiconductor refrigeration piece. The invention can be recycled and is environment-friendly; moreover, as external energy is directly supplied, the temperature-changing function takes effect for a long time, and the obvious effect is maintained for a long time; the invention can be used for a plurality of parts, such as eyes, forehead, neck, shoulder, waist and leg, etc.; and can be used in places with large area and places with small area. The temperature-changing unit can be used for realizing warm keeping and temperature reduction, such as wearing clothes, hats and the like, ice blankets and electric blankets.
Description
Technical Field
The invention relates to the technical field of cold and hot compress, in particular to a dual-mode electronic temperature control unit.
Background
At present, a plurality of hot pastes or cold pastes are available in the health care or medical market.
A. Or directly used in the field of dress wearing, such as air-conditioning clothes with a fan, an electric blanket, an ice blanket and the like. This class is directly powered. Has the advantage of quick action. The disadvantage is that the effect is single, either cold or hot.
B. Or in the healthcare or medical field. Such as:
the heat patch comprises a moxa heat patch (for muscle joint pain), a hot compress eye patch (or called steam eye patch) and the like. The principle mainly utilizes chemical reaction temperature change, and utilizes exothermic reaction of adding liquid or reaction of iron and oxygen, etc. to release heat.
The cold patch comprises loxoprofen gel, flurbiprofen gel, defervescence patch, direct ice bag external application and the like. The principle is that the excessive heat in the body is volatilized by the vaporization of the water in the gel, thereby achieving the effect of reducing the body temperature.
The two kinds of pastes have the advantage of both playing the effect of short time temperature regulation, and are convenient and easy to operate.
The prior art has the following defects: 1. disposable and is not environment-friendly; 2. the acting part is single; 3. the effect is single and the effect is remarkable and the time is not lasting.
Disclosure of Invention
The invention aims to provide a dual-mode electronic temperature control unit.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: the utility model provides a bimodulus electron temperature control unit, includes the fixed band, be equipped with a plurality of mounting holes that are the array and distribute on the fixed band, be equipped with the semiconductor refrigeration piece in the mounting hole, the fixed band is located and is equipped with the heat-conducting layer on the side of the face that heats of semiconductor refrigeration piece.
Preferably, the mounting holes are distributed in a 1 × n linear array, wherein n is a natural number 2, 3 or 4, and the fixing band is made of a heat insulation material.
Preferably, the mounting holes are distributed in a rectangular array with multiple rows and multiple columns, the refrigerating surfaces and the heating surfaces of the semiconductor refrigerating sheets in every row or every row of two adjacent mounting holes are alternately arranged, and the fixing band is made of heat insulation materials.
Preferably, the mounting holes are arranged in 3 rows and 6 columns.
Preferably, the other side of the fixing band is also provided with a heat conduction layer.
Preferably, the heat conducting layer comprises a heat conducting silicone rubber layer and a copper sheet layer, and the copper sheet layer is arranged between the heat conducting silicone rubber layer and the fixing belt.
Preferably, still include energy supply device, be equipped with power wiring hole on the lateral wall of fixed band, power wiring hole passes through the power cord and links to each other with energy supply device electrical property.
Preferably, the side wall of the mounting hole is provided with a limiting groove, and the edge of the semiconductor refrigeration piece is clamped in the limiting groove.
Preferably, the semiconductor refrigeration piece is provided with a connector lug, an inner cavity for placing the connector lug is arranged in the fixing band, and the inner cavity is communicated with the limiting groove.
Preferably, the fixing band is provided with a magic tape.
The beneficial effects of the invention are concentrated and expressed as follows:
1. the invention can be recycled and is environment-friendly;
2. the invention directly supplies energy from the outside, and the temperature change effect takes effect for a long time, so that the obvious effect is maintained for a long time;
3. the invention can be used in a plurality of parts, such as eyes, forehead, neck, shoulder, waist and leg and other small-area places, such as children's forehead heat or eye hot compress to improve eyesight and the like; and the temperature-variable unit can be continuously used in large-area places such as medical ice blanket cooling, electric blanket heating and the like, and even can be provided with a wearable clothes hat and the like which can realize warm keeping and cooling by the temperature-variable unit combination.
Drawings
FIG. 1 is a schematic view showing the overall structure of a first embodiment of the present invention;
FIG. 2 is a side view of a fastening strip according to a first embodiment of the present invention;
FIG. 3 is a sectional view of a fastening tape according to a first embodiment of the present invention;
FIG. 4 is a schematic view showing the overall structure of a second embodiment of the present invention;
FIG. 5 is a sectional view of a fastening tape according to a second embodiment of the present invention;
illustration of the drawings: 1. fixing belts; 2. mounting holes; 3. a semiconductor refrigeration sheet; 4. a heat-conducting silicone rubber layer; 5. a copper sheet layer; 6. a power supply wiring hole; 7. a limiting groove; 8. a connector lug; 9. an inner cavity; 10. magic tape.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.
Example 1
As shown in fig. 1-3, a dual-mode electronic temperature control unit includes a fixing band 1, wherein a plurality of mounting holes 2 distributed in an array are formed in the fixing band 1, semiconductor cooling fins 3 are disposed in the mounting holes 2, and a magic tape 10 is disposed on the fixing band 1, and the fixing band 1 is worn on the body of a user through the magic tape 10, and then the fixing band can be fixed to the body by using a rubber band with elasticity (such as the style of goggles); in this embodiment, the fixing straps are not limited to be connected by a magic tape, but can be connected by magnetic attraction or a watch strap-like structure or a buckle fixing method; the side wall of the fixing band 1 is provided with a power supply wiring hole 6, and the power supply wiring hole 6 is electrically connected with an energy supply device through a power supply wire; in the embodiment, the energy supply device can adopt a portable high-capacity rechargeable lithium battery, a USB power line is used for supplying power, and the lithium battery can be carried on the body of a user; in the present embodiment, not only a dc power supply such as a lithium battery, but also an ac power supply may be used, and an ac power supply is converted into a dc power supply by using a charging head commonly used in the market.
When the small-area cold compress belt is used in a small area, after the semiconductor refrigeration piece 3 is powered on, one surface of the semiconductor refrigeration piece 3 is a heating surface, and the other surface of the semiconductor refrigeration piece 3 is a refrigeration surface, and when cold compress is needed, the cold surface of the fixing belt 1 is attached to a cold compress part of a user body; when hot compress is needed, the hot surface of the fixing band 1 is pasted on the hot compress part of the body of a user; in this embodiment, the positive and negative poles of the power supply wiring hole 6 are specified, and the reverse-plugging prevention structure is arranged, so that the refrigerating surface and the heating surface of the semiconductor refrigerating sheet 3 are determined, and when hot compress or cold compress needs to be switched, the fixing belt 1 is turned over for use.
In this embodiment, the mounting holes 2 are distributed in a 1 × n linear array, where n is a natural number 2, 3, or 4, and the number of the mounting holes 2 can be flexibly selected according to actual requirements; that is to say, set up one row of mounting hole 2 on the fixed band 1, installation semiconductor refrigeration piece 3 in each mounting hole 2, if the value of n is 2, have two semiconductor refrigeration pieces 3 this moment, can be used to the fever that moves back of forehead, eye heating health care etc.. Secondly, be equipped with spacing groove 7 on the mounting hole 2 lateral wall, the border card of semiconductor refrigeration piece 3 is established in spacing groove 7, and the direct card of semiconductor refrigeration piece 3 is established in spacing groove 7 in mounting hole 2, is convenient for to the installation or the dismantlement of semiconductor refrigeration piece 3.
The fixing band 1 is also provided with a temperature sensor for detecting the semiconductor refrigerating sheet 3, the temperature sensor monitors the temperature value of hot compress or cold compress in real time, the control circuit comprises a microcontroller, a power circuit, a temperature sensor, a switch circuit and a timer, the temperature sensor and the timer are both connected with the microcontroller, the timer is used for setting the working time of the semiconductor refrigerating chip 3, the power supply circuit comprises a storage battery and a DC-DC conversion circuit, the voltage value of the storage battery can adopt 12V, the working voltage of the microcontroller is DC5V, the working voltage of the temperature sensor is DC3.3V, therefore, the DC-DC conversion circuit comprises a voltage stabilizing chip for converting 12V into 5V and a voltage stabilizing chip for converting 5V into 3.3V, the switching circuit can be a relay or an integrated circuit formed by a triode, the control end of the switching circuit is connected with the microcontroller, and the switching circuit can communicate the storage battery with the semiconductor refrigerating chip 3.
In the cold compress process, the heating surface of the semiconductor refrigerating sheet 3 needs to be cooled and the heat is prevented from being transferred to the refrigerating surface, so that a heat conduction layer is arranged on one side surface, located on the heating surface of the semiconductor refrigerating sheet 3, of the fixing belt 1, the fixing belt 1 is made of heat insulation materials, scalding or cold injury is avoided, heat insulation silicon rubber is preferably adopted, and the fixing belt has good comfort when being worn; in this embodiment, the heat-conducting layer includes heat conduction silicone rubber layer 4 and copper sheet layer 5, and the copper sheet layer is not limited to selecting the copper material in this embodiment, still can select the good material of heat conductivity such as aluminum sheet, carbon nanotube composite film and dense tooth radiator for use, copper sheet layer 5 sets up between heat conduction silicone rubber layer 4 and fixed band 1, and copper sheet layer 5 contacts with the face of heating of semiconductor refrigeration piece 3, and the heat of the production of semiconductor refrigeration piece 3 can be quick transmit to on the heat conduction silicone rubber, realizes the heat dissipation to the heat-producing end of semiconductor refrigeration piece 3, is not enough to provide the heat dissipation of semiconductor refrigeration piece 3 when the heat-conducting layer, can adopt initiative radiating mode, like fan etc. When the cold compress heat-conducting layer is used, if the cold compress heat-conducting layer is used for cold compress, the heat-conducting layer plays a role in heat dissipation, and the heat-insulating silicon rubber prevents heat from being transferred to a refrigerating end to influence the cold compress effect; if hot compress, the heat conduction layer plays the dispersion heat, makes the position of hot compress be heated evenly, improves the travelling comfort, and thermal insulation silicon rubber reducible thermal loss.
Example 2
As shown in fig. 4 and 5, a dual-mode electronic temperature control unit includes a fixing band 1, a plurality of mounting holes 2 distributed in an array are disposed on the fixing band 1, semiconductor cooling fins 3 are disposed in the mounting holes 2, a magic tape 10 in this embodiment is disposed on a heat conduction layer, in this embodiment, the heat conduction layer not only plays a role of heat conduction, but also plays a role of cold conduction, the fixing band 1 is worn on the body of a user through the magic tape 10, and also includes an energy supply device, a power wiring hole 6 is disposed on a side wall of the fixing band 1, and the power wiring hole 6 is electrically connected with the energy supply device through a power line; the energy supply device can adopt a portable high-capacity rechargeable lithium battery in the embodiment, utilizes a USB power line and supplies power, and the lithium battery can be carried on the body of a user.
After the semiconductor refrigeration piece 3 is powered on, one surface of the semiconductor refrigeration piece 3 is a heating surface, and the other surface of the semiconductor refrigeration piece 3 is a refrigeration surface, and when cold compress is needed, the cold surface of the fixing band 1 is pasted on a cold compress part of the body of a user; when needing hot compress, the hot surface of the fixing band 1 is pasted on the hot compress part of the body of the user.
In embodiment 1, since the fixing band 1 needs to be turned over or the positive and negative electrodes need to be changed when cold or hot compress is switched, the operation is relatively cumbersome. Therefore, in this embodiment, the mounting holes 2 are distributed in a rectangular array with multiple rows and multiple columns, the cooling surfaces and the heating surfaces of the semiconductor cooling fins 3 in two adjacent mounting holes 2 in each row or each column are alternately arranged, that is, both the cooling surface and the heating surface are arranged on the same side of the fixing band 1, and when cold compression is needed, the semiconductor cooling fins 3 for cooling are started; when hot compress is needed, the semiconductor refrigerating sheet 3 for heating is started; the operation is simpler and more convenient.
As shown in fig. 4, in the present embodiment, the mounting holes 2 are arranged in 3 rows and 6 columns, that is, the semiconductor chilling plates 3 have 18, 9 chilling plates on the same side are used for cooling and applying heat, and the other 9 chilling plates are used for heating and applying heat. Because the same side has both refrigeration face, has the face of heating again, consequently the another side of fixed band 1 also is provided with the heat-conducting layer, that is to say the both sides of fixed band 1 all are provided with the heat-conducting layer.
Secondly, be equipped with spacing groove 7 on the mounting hole 2 lateral wall, the border card of semiconductor refrigeration piece 3 is established in spacing groove 7, and the direct card of semiconductor refrigeration piece 3 is established in spacing groove 7 in mounting hole 2, is convenient for to the installation or the dismantlement of semiconductor refrigeration piece 3.
The fixing band 1 is also provided with a temperature sensor for detecting the semiconductor refrigerating sheet 3, the temperature sensor monitors the temperature value of hot compress or cold compress in real time, a control circuit comprises a microcontroller, a power circuit, a temperature sensor, a switch circuit, a state change-over switch and a timer, the temperature sensor and the timer are both connected with the microcontroller, the timer is used for setting the working time of the semiconductor refrigerating sheet 3, the power circuit comprises a storage battery and a DC-DC conversion circuit, the voltage value of the storage battery can adopt 12V, the working voltage of the microcontroller is DC5V, the working voltage of the temperature sensor is DC3.3V, therefore, the DC-DC conversion circuit comprises a voltage stabilizing chip which is 12V to 5V and a voltage stabilizing chip which is 5V to 3.3V, the switch circuit can be a relay or an integrated circuit formed by a triode, and the control end of the switch circuit is connected with the microcontroller, the switch circuit can communicate the storage battery with the semiconductor refrigerating sheet 3; the state switch is a ship-shaped switch which is arranged on the fixing band 1, and the ship-shaped switch is connected in series in a power supply loop of the storage battery and the semiconductor refrigeration sheet 3 and is used for switching the working states of two types of cold compress and hot compress.
In the cold compress process, the heating surface of the semiconductor refrigerating sheet 3 needs to be cooled and the heat is prevented from being transferred to the refrigerating surface, so that a heat conduction layer is arranged on one side surface, located on the heating surface of the semiconductor refrigerating sheet 3, of the fixing belt 1, the fixing belt 1 is made of heat insulation materials, preferably heat insulation silicon rubber, and the fixing belt has good comfort when being worn; in this embodiment, the heat-conducting layer includes heat conduction silicone rubber layer 4 and copper sheet layer 5, copper sheet layer 5 sets up between heat conduction silicone rubber layer 4 and fixed band 1, and copper sheet layer 5 contacts with the face of heating of semiconductor refrigeration piece 3, and the heat of the production of semiconductor refrigeration piece 3 can be quick transmit to on the heat conduction silicone rubber, realizes the heat dissipation to the heat-producing end of semiconductor refrigeration piece 3, is not enough to provide the heat dissipation of semiconductor refrigeration piece 3 when the heat-conducting layer, can adopt the initiative radiating mode, like the fan etc.. When the cold compress heat-conducting layer is used, if the cold compress heat-conducting layer is used for cold compress, the heat-conducting layer plays a role in heat dissipation, and the heat-insulating silicon rubber prevents heat from being transferred to a refrigerating end to influence the cold compress effect; if hot compress, the heat conduction layer plays the dispersion heat, makes the position of hot compress be heated evenly, improves the travelling comfort, and thermal insulation silicon rubber reducible thermal loss. Meanwhile, skin can be prevented from being burnt due to overhigh temperature, skin can be prevented from being injured due to cold due to overlow temperature, and the like.
In this embodiment, because the number of the semiconductor cooling fins 3 is large, for the case of long-time heat release caused by long-time use of the temperature control element, the purpose of passive heat dissipation can be achieved by heat dissipation with the heat conduction layer having an area more than three times that of the semiconductor cooling fins in this embodiment, but not limited to passive heat dissipation. The invention keeps a limit groove, and active heat dissipation structures such as air cooling and water cooling can be additionally arranged if necessary, so that the temperature can be safely changed for a long time without damaging the original.
In this embodiment, when a large-area refrigeration or heat dissipation surface is formed by a plurality of semiconductor refrigeration sheets, the same surface is not limited to alternate arrangement of heating surfaces of the plurality of semiconductor refrigeration sheets, and meanwhile, the refrigeration surfaces or the heating surfaces of the plurality of semiconductor refrigeration sheets can be arranged on the same side.
For example, the water-cooling heat dissipation structure comprises a water tank, a water pump and a water pipe, wherein the water pipe is arranged in the fixing band in a coil shape in a penetrating mode, when the water pump is started, water circulation is formed in the water pipe, and the heating surface of the semiconductor refrigerating sheet is cooled.
The air cooling structure is as follows: and a micro fan is arranged on the heating surface of each semiconductor refrigerating sheet to cool and radiate the semiconductor refrigerating sheet.
It should be noted that, for simplicity of description, the above-mentioned embodiments of the method are described as a series of acts or combinations, but those skilled in the art should understand that the present application is not limited by the order of acts described, as some steps may be performed in other orders or simultaneously according to the present application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and elements referred to are not necessarily required in this application.
Claims (10)
1. A dual-mode electronic temperature control unit is characterized in that: including fixed band (1), be equipped with a plurality of mounting holes (2) that are the array and distribute on fixed band (1), be equipped with semiconductor refrigeration piece (3) in mounting hole (2), fixed band (1) is located and is equipped with the heat-conducting layer on the side of the face of heating of semiconductor refrigeration piece (3).
2. The dual-mode electronic temperature control unit of claim 1, wherein: the mounting holes (2) are distributed in a 1 x n linear array, wherein n is a natural number 2, 3 or 4, and the fixing band (1) is made of heat insulation materials.
3. The dual-mode electronic temperature control unit of claim 1, wherein: the mounting holes (2) are distributed in a multi-row and multi-column rectangular array mode, the refrigerating surfaces and the heating surfaces of the semiconductor refrigerating sheets (3) in every row or every row of the two adjacent mounting holes (2) are arranged alternately, and the fixing band (1) is made of heat insulation materials.
4. The dual-mode electronic temperature control unit of claim 3, wherein: the mounting holes (2) are arranged in 3 rows and 6 columns.
5. The dual-mode electronic temperature control unit of claim 3, wherein: and the other side surface of the fixing belt (1) is also provided with a heat conduction layer.
6. The dual-mode electronic temperature control unit of claim 5, wherein: the heat conducting layer comprises a heat conducting silicone rubber layer (4) and a copper sheet layer (5), and the copper sheet layer (5) is arranged between the heat conducting silicone rubber layer (4) and the fixing belt (1).
7. The dual-mode electronic temperature control unit of claim 1, wherein: still include energy supply device, be equipped with power wiring hole (6) on the lateral wall of fixed band (1), power wiring hole (6) pass through the power cord and link to each other with energy supply device electrical property.
8. The dual-mode electronic temperature control unit of claim 1, wherein: the side wall of the mounting hole (2) is provided with a limiting groove (7), and the edge of the semiconductor refrigeration piece (3) is clamped in the limiting groove (7).
9. The dual-mode electronic temperature control unit of claim 8, wherein: semiconductor refrigeration piece (3) have connector lug (8), be equipped with inner chamber (9) that are used for placing connector lug (8) in fixed band (1), inner chamber (9) are linked together with spacing groove (7).
10. The dual-mode electronic temperature control unit of claim 1, wherein: the fixing strap (1) is provided with a magic tape (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110788520.3A CN113342087A (en) | 2021-07-13 | 2021-07-13 | Dual-mode electronic temperature control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110788520.3A CN113342087A (en) | 2021-07-13 | 2021-07-13 | Dual-mode electronic temperature control unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113342087A true CN113342087A (en) | 2021-09-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110788520.3A Pending CN113342087A (en) | 2021-07-13 | 2021-07-13 | Dual-mode electronic temperature control unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113342087A (en) |
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2021
- 2021-07-13 CN CN202110788520.3A patent/CN113342087A/en active Pending
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