CN113336546B - Integrated piezoelectric ceramic spherical shell and processing method thereof - Google Patents
Integrated piezoelectric ceramic spherical shell and processing method thereof Download PDFInfo
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Abstract
The invention discloses an integrated piezoelectric ceramic spherical shell and a processing method thereof, wherein the integrated piezoelectric ceramic spherical shell comprises two hemispherical shells, the two hemispherical shells are sintered by a piezoelectric ceramic low-temperature co-fired sintering agent, and the raw materials of the piezoelectric ceramic low-temperature co-fired sintering agent comprise PZT ceramic powder, low-melting mixed glass powder and terpineol. Mixing PZT ceramic powder, low-melting mixed glass powder and terpineol in proportion to prepare a piezoelectric ceramic low-temperature co-fired sintering agent, coating the prepared piezoelectric ceramic low-temperature co-fired sintering agent on a bonding part of an upper hemisphere and a lower hemisphere of piezoelectric ceramic, drying at normal temperature for 2-4 hours, and sintering the dried piezoelectric ceramic spherical shell at low temperature, wherein the sintering temperature is 700-800 ℃, and the sintering time is 1.5-3 hours. The invention sinters the piezoelectric ceramic semispherical shell into the piezoelectric ceramic spherical shell at low temperature, thereby realizing integration, and the prepared spherical transducer has excellent mechanical and electrical properties and is beneficial to improving the working power.
Description
Technical Field
The invention belongs to the technical field of spherical transducer preparation, and particularly relates to an integrated piezoelectric ceramic spherical shell and a processing method thereof.
Background
The spherical transducer is one of transducer types widely applied in the field of underwater sound, takes a piezoelectric ceramic ball as a functional element, and utilizes the positive and negative piezoelectric effect to realize the conversion of acoustic and electric signals. The underwater acoustic transducer has the characteristics of simple mechanical structure, convenient manufacture, low manufacturing cost, easy formation of the appearance, good consistency and the like, and becomes a research hotspot of the underwater acoustic transducer.
The spherical transducer generally achieves the purpose of high power by increasing the voltage of two poles of a ceramic ball, and if the voltage at two ends of the transducer is increased without limit, the transducer is damaged and is represented by serious reduction of radiation sound power of the transducer or change of performance indexes, which is mainly caused by depolarization or fracture of piezoelectric ceramics. Furthermore, even if the degree of depolarization is not reached, the material will break when the piezoelectric ceramic mechanical alternating stress exceeds a certain value, and even below this value, repeated changes in strain can lead to mechanical fatigue, resulting in damage to the transducer. Therefore, how to ensure that the spherical transducer can normally work under high voltage is a key technology for designing and developing the high-power spherical transducer.
For the spherical transducer, the working effect is inherently related to design and manufacture, but the bonding process also has an extremely important position in the transducer, and the bonding effect directly influences the working performance of the spherical piezoelectric ceramic. In an effort to achieve optimal interface coupling, improve the mechanical fatigue extreme value as much as possible, and achieve the purpose of broadband and high power of the spherical transducer, we need to improve the bonding process. Therefore, the bonding of the piezoelectric ceramic spherical shell is different from the common bonding, and the piezoelectric ceramic spherical shell has good mechanical property and excellent acoustic property. However, the traditional piezoelectric ceramic spherical shell is generally bonded by organic adhesives such as epoxy resin, and the composition, performance and structure of the organic adhesives are different from those of the ceramic substrate, so that the bonding force of the piezoelectric ceramic bonding part is insufficient, the interface coupling is poor, and the adhesive layer is easy to damage when the piezoelectric ceramic spherical shell works under high power.
The low temperature co-fired ceramic technology is a novel electronic packaging technology developed by U.S. Huss company in 1982, namely, glass powder is added into a ceramic substrate as a sintering aid, a proper amount of organic solvent is used as a fluxing agent, and the low melting property of the glass powder is utilized to soften glass and reduce viscosity during sintering, so that the sintering temperature can be reduced, and the sintering at 900 ℃ is realized. At present, the technology is widely applied to various aspects such as base stations, automotive electronics, bluetooth, aerospace and the like, and the research of the technology draws wide attention of people. However, the research on the integration preparation of the spherical piezoelectric ceramic shell by using the spherical piezoelectric ceramic shell as a low-temperature sintering agent so as to realize good coupling of the interface is not reported, and the research on the conversion of the traditional bonding process to the sintering process with better electrical and mechanical properties so as to realize the improvement of the broadband high-power performance of the spherical transducer is blank.
Disclosure of Invention
The invention provides an integrated piezoelectric ceramic spherical shell and a processing method thereof, aiming at the problems that the adhesive force between piezoelectric ceramic hemispherical shells and the adhesive between adherends is small, the interface coupling is poor, and the adhesive layer is easy to damage when the piezoelectric ceramic hemispherical shell works under high power in the prior art.
The invention is realized by the following technical scheme:
the integrated piezoelectric ceramic spherical shell comprises two hemispherical shells, wherein the two hemispherical shells are sintered by a piezoelectric ceramic low-temperature co-fired sintering agent
The raw materials of the low-temperature co-fired sintering agent for piezoelectric ceramics comprise PZT ceramic powder, low-melting mixed glass powder and terpineol.
Further, the mass ratio of the PZT ceramic powder to the low-melting-point mixed glass powder is 1-5, and the mass ratio of the PZT ceramic powder to the low-melting-point mixed glass powder to the terpineol is 2.
Further, the low-melting-point mixed glass powder comprises the following components in parts by weight: siO 2 2 20~50%，Al 2 O 3 0~5.0%，B 2 O 3 15~30%，Na 2 O 1~10%，K 2 O 0~2.0%，Li 2 O 1~5%,CaO0~5%，MgO 1~5%，ZnO 15~25%，ZrO 2 1~5%，TiO 2 0~2.0%，Bi 2 O 3 0~5.0%。
Further, the low-melting-point mixed glass powder comprises the following components in parts by weight: siO 2 2 27.0%，Al 2 O 3 2.0%，B 2 O 3 30.0%，Na 2 O 5.0%，K 2 O 2.0%，LiO 2 3.0%，CaO 3.0%，MgO 1.0%，ZnO19.0%，ZrO 2 3.0%，Bi 2 O 3 5.0%。
Furthermore, the mass ratio of the PZT ceramic powder to the low-melting-point mixed glass powder is 1.
Furthermore, the piezoelectric ceramic spherical shell is PZT piezoelectric ceramic; the thickness of the piezoelectric ceramic low-temperature co-fired sintering agent is 0.05 to 0.15mm.
The processing method of the integrated piezoelectric ceramic spherical shell comprises the following steps:
(1) Mixing PZT ceramic powder, low-melting mixed glass powder and terpineol in proportion to prepare a piezoelectric ceramic low-temperature co-fired sintering agent;
(2) Coating the piezoelectric ceramic low-temperature co-fired sintering agent prepared in the step (1) on the bonding part of the upper hemisphere and the lower hemisphere of the piezoelectric ceramic, and drying for 2-4 hours at normal temperature;
(3) And sintering the dried piezoelectric ceramic spherical shell at low temperature, wherein the sintering temperature is 700 to 800 ℃, and the sintering time is 1.5 to 3 hours.
Further, the sintering temperature in the step (3) is 750 ℃, and the sintering time is 2h.
Further, before the upper and lower piezoelectric ceramic hemispheres are bonded in the step (2), a sulfur-free rubber is used for wiping the positive and negative electrodes of the upper piezoelectric ceramic hemisphere shell and the lower piezoelectric ceramic hemisphere shell, alcohol and acetone are used for cleaning sequentially, then the inner and outer electrodes of the piezoelectric ceramic hemisphere shell are additionally coated, the piezoelectric ceramic hemispheres with the newly led-out undried high-temperature silver electrodes are placed into an oven for drying, the drying is carried out for 6 hours at the temperature of 90 ℃, and the dried upper and lower piezoelectric ceramic hemispheres are taken out and then the bonded part of the upper and lower piezoelectric ceramic hemispheres is wiped by alcohol.
Further, after the piezoelectric ceramic ball shell in the step (3) is sintered, the outer surface and the open hole of the piezoelectric ceramic ball are cleaned by alcohol and acetone in sequence, the inner surface and the outer surface of the piezoelectric ceramic ball are welded with a series connection wire and a positive electrode lead wire and a negative electrode lead wire, and the sintered piezoelectric ceramic ball is subjected to high-voltage polarization treatment through the positive electrode lead wire and the negative electrode lead wire.
Advantageous effects
The invention applies the low-temperature sintering technology to the integrated preparation of the piezoelectric ceramic ball shell for the first time, constructs an interface sintering agent composition system similar to the components of the ceramic ball, realizes the matching of the structure, the mechanical property and the electrical property of the interface and the ceramic ball, and leads the piezoelectric ceramic ball to be an organic whole.
Drawings
FIG. 1 is the equivalent impedance/admittance/impedance curves of two PZT hemispherical shells (hemisphere 1 and hemisphere 2) in air for example 3;
FIG. 2 is an equivalent impedance/admittance/impedance curve of the piezoelectric ceramic spherical shell prepared in example 3 in air;
FIG. 3 is the equivalent impedance/admittance/impedance curves of two PZT hemispherical shells (hemisphere 3 and hemisphere 4) in air for comparative example 1;
fig. 4 is an equivalent impedance/admittance/impedance curve of the piezoelectric ceramic spherical shell prepared in comparative example 1 in air.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following clear and complete description of the technical solution of the present invention shall be made, and other similar embodiments obtained by those skilled in the art without making creative efforts shall fall within the protection scope of the present application based on the embodiments in the present application.
The parts described in the following examples are parts by weight.
Example 1
A. B and C, mixing glass powder with low melting point and three different components:
a: the mixed glass powder with low melting point comprises the following components in percentage by weight: siO 2 2 45.0%，B 2 O 3 15.0%，Na 2 O 6.0%，K 2 O 1.0%，LiO 2 3.0%，CaO1.0%，ZnO 2 4.0%，ZrO 2 4.0%，TiO 2 2.0%；
B: the mixed glass powder with low melting point comprises the following components in percentage by weight: siO 2 2 27.0%，Al 2 O 3 2.0%， B 2 O 3 30.0%，Na 2 O 5.0%，K 2 O 2.0%，LiO 2 3.0%，CaO 3.0%，MgO 1.0%，ZnO19.0%， ZrO 2 3.0%，Bi 2 O 3 5.0%；
C: the mixed glass powder with low melting point comprises the following components in percentage by weight: siO 2 2 40.0%，Al 2 O 3 3.0%， B 2 O 3 18.0%，Na 2 O 10.0%，LiO 2 1.0%，ZnO 22.0%，ZrO 2 4.0%，TiO 2 2.0%；
The thermal expansion coefficients and the thermal phase transition temperatures of three groups of low-melting-point mixed glass powders A, B and C in different temperature ranges are detected, and the results are shown in the following tables 1 and 2:
TABLE 1 thermal expansion coefficient (mum/DEG C) of three groups A, B and C of low-melting mixed glass powder in different temperature ranges
TABLE 2 thermal transition temperature (deg.C) of three groups of low-melting point mixed glass powder of A, B and C
As can be seen from table 1, the three low-melting-point mixed glass powders in example 1 of the present invention have the same or similar thermal expansion coefficient to the PZT piezoelectric ceramic material, and can achieve good matching with the PZT piezoelectric ceramic material. From table 2, it can be seen that the phase transition temperatures of the three low-melting mixed glass powders in example 1 of the present invention are set to 700 ℃ and 750 ℃ in order to ensure complete melting and uniform flow of the low-temperature sintering agent.
Example 2
A low-temperature co-fired sintering agent for piezoelectric ceramics comprises the following components: pure-phase PZT ceramic powder, low-melting-point mixed glass powder (A, B and C) prepared in example 1 and terpineol are used as raw materials and are mixed to obtain the piezoelectric ceramic low-temperature co-fired sintering agent, the specific mixture ratio of the raw materials is shown in the following table 3, and the parts are as follows:
TABLE 3 raw material composition and sintering temperature of the low-temperature co-fired sintering agent for piezoelectric ceramics
(1) Electrical performance test of low-temperature co-fired sintering agent for piezoelectric ceramics
A2 mm flat PZT ceramic sample with the thickness of 4mm, 4mm and 2mm is prepared, one side is bonded by the piezoelectric ceramic low-temperature co-firing sintering agents prepared in the above examples 1 to 11, then sintering is carried out (wherein the sintering temperature of 1 to 6 groups of piezoelectric ceramic low-temperature co-firing sintering agents is 700 ℃, the sintering time is 2h, the sintering temperature of 7 to 11 groups of piezoelectric ceramic low-temperature co-firing sintering agents is 750 ℃, and the sintering time is 2 h), high-voltage polarization treatment is carried out on the sintered PZT piezoelectric ceramic, the polarization temperature is 120 ℃, the polarization is carried out for 15min according to the voltage of 3KV/mm, and the electrical and mechanical properties of the PZT ceramic are tested. And set the epoxy resin group as a comparative study piezoelectric strain constant and relative dielectric constant, the results are shown in table 4 below, and from table 4, it is seen that, taking the piezoelectric ceramic low-temperature co-fired sintering agent as an integrated sintering agent, the sintered PZT ceramic has excellent electrical properties, which are much higher than those of the samples with the epoxy resin as the binder, and of these, the electrical properties of the 3 rd group and the 7 th group are the best.
TABLE 4 comparison of electrical Properties
(2) Mechanical property detection of low-temperature co-fired sintering agent for piezoelectric ceramics
The piezoelectric ceramic low-temperature co-fired sintering agent prepared in the 3 rd group and the 7 th group with the best electrical properties is selected as a sintering material, the PZT piezoelectric ceramics with a rod-shaped structure are selected as substrates and sintered at 700 ℃ and 750 ℃ respectively, so that the integration is realized, a three-point bending resistance test is carried out, and an original ceramic substrate sample group (PZT ceramic) which is not subjected to secondary sintering and an epoxy resin bonding group are set as controls to carry out a mechanical property test.
Three-point bending is a loading mode for measuring bending strength, namely, a sample is placed between two lower sticks and an upper stick, the upper stick is positioned between the lower sticks, and the upper stick and the lower stick move relatively to cause the sample to be bent. The principle is that the load is monitored through a displacement-time relation graph during the test, the bending load is applied to a long strip sample with a rectangular cross section until the sample is broken, and the bending strength of the sample is calculated through the critical load, the span and the sample size when the sample is broken.
Specific experimental method as follows, the low-temperature sintering agent of the components is subjected to a ceramic-bending resistance mechanical property test of stick bonding according to national standard (GB/T17671-1999), the beam velocity of the experimental machine is 0.5mm/min, the sample size is 3mm x 4mm x 45mm, the chamfer angle is 45 degrees, each group of samples is not less than ten, and the average bending strength is calculated by mechanical comparison with a blank sample group of the original ceramic matrix and an epoxy resin bonding group which are not subjected to secondary sintering. The average bending strength results of the sample groups are shown in the following table 5, and it can be seen from table 5 that the mechanical properties of PZT ceramics are the best, while group 3 has better electrical properties but poorer mechanical properties, while the samples prepared by the piezoelectric ceramic low-temperature co-fired sintering agent prepared in group 7 have not only good electrical properties, but also a certain degree of grain growth due to secondary sintering, which is slightly lower than that of pure phase ceramics, and the strength is still higher, and is obviously better than that of samples using epoxy resin as a binder.
TABLE 5 comparison of mechanical properties of PZT ceramics, low-temperature co-fired ceramic sintering agent and samples prepared from epoxy resin
Example 3
Selecting two piezoelectric ceramic hemispherical shells (a hemisphere 1 and a hemisphere 2) with the sizes of the outer diameter and the outer diameter as the sum =26mm and the wall thickness t =2mm, wherein the two piezoelectric ceramic hemispherical shells are PZT piezoelectric ceramic materials; the polarities of the inner electrode and the outer electrode of the two ceramic hemispheres are opposite, the piezoelectric ceramic hemispheres are provided with holes along the wall in half, the length of the piezoelectric ceramic hemispheres is equal to the length of the holes =4mm, the holes are used for threading and mounting, and the equivalent impedance/admittance/impedance curves of the two PZT hemispherical shells in the air in the embodiment 3 are shown in the graph of fig. 1.
The piezoelectric ceramic ball integrated preparation method comprises the following steps:
(1) The low-melting-point glass powder is silicate glass and comprises the following components in percentage by weight: siO 2 2 27.0%，Al 2 O 3 2.0%， B 2 O 3 30.0%，Na 2 O 5.0%，K 2 O 2.0%，LiO 2 3.0%，CaO 3.0%，MgO 1.0%， ZnO19.0%， ZrO 2 3.0%，Bi 2 O 3 5.0%；
(2) Preparing a low-temperature co-fired sintering agent for piezoelectric ceramics: mixing the raw materials according to the amount of 10 parts of PZT ceramic powder, 90 parts of low-melting-point glass powder and 50 parts of terpineol, stirring to uniformly disperse the raw materials, and preparing a piezoelectric ceramic low-temperature co-fired sintering agent with certain viscosity;
(3) Wiping the positive and negative electrodes of the piezoelectric ceramic upper hemispherical shell and the piezoelectric ceramic lower hemispherical shell by using a sulfur-free eraser, cleaning the positive and negative electrodes by using alcohol and acetone in sequence, and then coating the internal and external electrodes of the piezoelectric ceramic spherical shell in a supplementing way, wherein the internal and external electrodes cannot be connected; putting the piezoelectric ceramic hemisphere with the newly led undried high-temperature silver electrode into an oven for drying, and drying at 90 ℃ for 6 hours;
(4) Wiping the bonding part of the upper hemisphere and the lower hemisphere of the dried piezoelectric ceramic by using alcohol, uniformly coating a layer of the piezoelectric ceramic low-temperature co-fired sintering agent prepared in the step (2), controlling the thickness of the piezoelectric ceramic low-temperature co-fired sintering agent not to exceed 0.5mm, bonding the upper hemisphere and the lower hemisphere by using the viscosity of the piezoelectric ceramic low-temperature co-fired sintering agent, and drying at normal temperature for 3 hours after fixing;
(5) Placing the dried piezoelectric ceramic spherical shell with certain bonding strength into a muffle furnace for low-temperature sintering, wherein the heating rate is 5 ℃/min, and the sintering is carried out at 750 ℃ for 2 hours, and the sintered piezoelectric ceramic spherical shell is compact in combination and good in uniformity of a sintered layer;
(6) Cleaning the outer surface and the open pore of the piezoelectric ceramic ball by using alcohol and acetone after sintering, and welding a series connection line and a positive and negative electrode lead-out line on the inner and outer surfaces of the piezoelectric ceramic ball;
(7) The sintered piezoelectric ceramic ball is subjected to high-voltage polarization treatment through the positive and negative lead wires, the polarization temperature is 120 ℃, the piezoelectric ceramic ball is polarized for 15min according to the voltage of 3KV/mm, and the equivalent impedance/admittance/impedance curve of the prepared piezoelectric ceramic ball shell in the air is shown in figure 2.
Comparative example 1
The PZT piezoelectric ceramic hemispherical shells (hemisphere 3 and hemisphere 4) made of the same material as in example 3 were used, the equivalent impedance/admittance/impedance curves of the two PZT hemispherical shells in air are shown in fig. 3, and epoxy resin was used as a binder for the upper and lower hemispheres, and the process for preparing the piezoelectric ceramic ball was as follows:
(1) Wiping the positive and negative electrodes of the piezoelectric ceramic upper hemispherical shell and the piezoelectric ceramic lower hemispherical shell by using a sulfur-free eraser, cleaning the positive and negative electrodes by using alcohol and acetone in sequence, connecting the internal positive electrode by using a lead, and leading the lead out of the sphere;
(2) Wiping the bonding part of the upper hemisphere and the lower hemisphere of the dried piezoelectric ceramic by using alcohol, uniformly coating a layer of epoxy resin, controlling the thickness of the epoxy resin to be 0.5mm, bonding the upper hemisphere and the lower hemisphere, fixing, and then placing in a 90 ℃ oven for curing for 6 hours;
(3) Cleaning the outer surface and the open pore of the piezoelectric ceramic ball by alcohol and acetone after drying, and welding a series connection wire and a negative electrode lead-out wire on the inner surface and the outer surface of the piezoelectric ceramic ball;
(4) The electrical performance of the bonded piezoelectric ceramic ball was tested by the positive and negative lead wires, and the equivalent impedance/admittance/impedance curve in air is shown in fig. 3.
And (3) detecting the electrical properties of the piezoelectric ceramic balls:
the electrical properties of the PZT-5 piezoelectric ceramic hemispherical shells (hemispherical shells 1 to 4) in example 2 and comparative example 1, the piezoelectric ceramic spherical shells prepared in example 3 and comparative example 1 were analyzed, and the capacitance Ct (nf), the resonant frequency Fs (kHz), the anti-resonant frequency Fp (kHz), the frequency range Fp-Fs (kHz), the minimum impedance (Ω) and the mechanical quality factor Qm of the two PZT-5 piezoelectric ceramic hemispherical shells, the piezoelectric ceramic spherical shells prepared in example 3 and comparative example 1 were measured, and the results are shown in table 6 below:
it can be known from table 6 that the PZT piezoelectric ceramic spherical shell after sintering and the piezoelectric ceramic hemispheres 1 and 2 before sintering in example 1, and the piezoelectric ceramic spherical shell after bonding with the epoxy resin and the piezoelectric ceramic hemispheres 3 and 4 before bonding in comparative example 3 found that the piezoelectric ceramic spherical shell finally prepared in example 3 has an improved capacitance, an increased relative dielectric constant and a reduced minimum equivalent impedance compared with the piezoelectric ceramic spherical shell in comparative example 1, i.e., the mechanical resistance caused by acoustic radiation is reduced, and the sound pressure required for driving the medium is reduced; the mechanical quality factor is slightly reduced, the frequency band is widened, and the overall electrical performance is improved. The comparison of the equivalent impedance/admittance/impedance curve diagram 1, fig. 2, fig. 3 and fig. 4 shows that the piezoelectric ceramic spherical shell of the embodiment 3 has smoother and flatter curve, more single resonance peak, more concentrated vibration energy in the radial direction and more excellent electromechanical coupling performance compared with the piezoelectric ceramic spherical shell of the comparative example 1, and is beneficial to improving the transmitting power of the spherical transducer.
TABLE 6 analysis of electrical properties of PZT piezoelectric ceramic spherical shell and hemispherical shell
Claims (8)
1. The integrated piezoelectric ceramic spherical shell is characterized by comprising two hemispherical shells, wherein the two hemispherical shells are sintered by a piezoelectric ceramic low-temperature co-fired sintering agent;
the raw materials of the piezoelectric ceramic low-temperature co-fired sintering agent comprise PZT ceramic powder, low-melting mixed glass powder and terpineol;
the mass ratio of the PZT ceramic powder to the low-melting-point mixed glass powder is 1-5;
the low-melting-point mixed glass powder comprises the following components in parts by weight: siO 2 2 20~50%，Al 2 O 3 0~5.0%，B 2 O 3 15~30%，Na 2 O 1~10%，K 2 O 0~2.0%，Li 2 O 1~5%，CaO0~5%，MgO 1~5%，ZnO 15~25%，ZrO 2 1~5%，TiO 2 0~2.0%，Bi 2 O 3 0~5.0%。
2. The integrated piezoelectric ceramic spherical shell according to claim 1, wherein the low-melting mixed glass powder comprises the following components in parts by weight: siO 2 2 27.0%，Al 2 O 3 2.0%，B 2 O 3 30.0%，Na 2 O 5.0%，K 2 O 2.0%，LiO 2 3.0%，CaO 3.0%，MgO 1.0%，ZnO19.0%，ZrO 2 3.0%，Bi 2 O 3 5.0%。
3. The integrated piezoelectric ceramic spherical shell according to claim 1, wherein the mass ratio of the PZT ceramic powder to the low-melting-point mixed glass powder is 1.
4. The integrated piezoelectric ceramic spherical shell according to claim 1, wherein the piezoelectric ceramic spherical shell is PZT piezoelectric ceramic; the thickness of the piezoelectric ceramic low-temperature co-fired sintering agent is 0.05-0.15mm.
5. A processing method of the integrated piezoelectric ceramic spherical shell according to any one of claims 1 to 4, characterized by comprising the following steps:
(1) Mixing PZT ceramic powder, low-melting mixed glass powder and terpineol in proportion to prepare a piezoelectric ceramic low-temperature co-fired sintering agent;
(2) Smearing the piezoelectric ceramic low-temperature co-fired sintering agent prepared in the step (1) on the bonding positions of the upper hemisphere and the lower hemisphere of the piezoelectric ceramic, and drying for 2-4 hours at normal temperature;
(3) And sintering the dried piezoelectric ceramic spherical shell at a low temperature of 700-800 ℃ for 1.5-3 hours.
6. The process according to claim 5, wherein the sintering temperature in step (3) is 750 ℃ and the sintering time is 2 hours.
7. The processing method according to claim 5, wherein before the upper and lower hemispheres of the piezoelectric ceramic are bonded in step (2), the positive and negative electrodes of the upper and lower hemispheres of the piezoelectric ceramic are wiped with a sulfur-free rubber, the upper and lower hemispheres of the piezoelectric ceramic are sequentially cleaned with alcohol and acetone, then high-temperature silver paste is applied, the piezoelectric ceramic hemisphere with the undried silver electrode is put into an oven to be dried, the dried hemisphere is dried at 90 ℃ for 6 hours, and after the hemisphere is taken out, the bonded part of the dried upper and lower hemispheres of the piezoelectric ceramic is wiped with alcohol.
8. The processing method according to claim 5, wherein after the piezoelectric ceramic ball shell in the step (3) is sintered, the outer surface and the opening of the piezoelectric ceramic ball are cleaned by alcohol and acetone in sequence, the inner surface and the outer surface of the piezoelectric ceramic ball are welded with a series connection wire and positive and negative lead wires, and the sintered piezoelectric ceramic ball is subjected to high-voltage polarization treatment through the positive and negative lead wires.
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| JPH09163498A (en) * | 1995-10-06 | 1997-06-20 | Murata Mfg Co Ltd | Solid sphere type piezoelectric speaker |
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