CN113334148A - Processing technology for large-size sapphire plate surface - Google Patents
Processing technology for large-size sapphire plate surface Download PDFInfo
- Publication number
- CN113334148A CN113334148A CN202110675616.9A CN202110675616A CN113334148A CN 113334148 A CN113334148 A CN 113334148A CN 202110675616 A CN202110675616 A CN 202110675616A CN 113334148 A CN113334148 A CN 113334148A
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- China
- Prior art keywords
- grinding
- sapphire plate
- sapphire
- tool
- main shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 101
- 239000010980 sapphire Substances 0.000 title claims abstract description 101
- 238000005516 engineering process Methods 0.000 title claims abstract description 16
- 238000005498 polishing Methods 0.000 claims abstract description 13
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 12
- 239000010432 diamond Substances 0.000 claims abstract description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000012530 fluid Substances 0.000 claims abstract description 7
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 5
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 5
- 238000007667 floating Methods 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 229910001018 Cast iron Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000003672 processing method Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention discloses a processing technology for a large-size sapphire plate surface, which comprises the following steps: using a diamond grinding wheel with the diameter phi 320, the granularity of 300-400, the rotating speed of a main shaft of 2000 revolutions and the grinding amount of 0.1mm to perform rough grinding and semi-finish grinding on the sapphire plate, using a diamond grinding wheel with the diameter phi 320, the granularity of 2000, the rotating speed of the main shaft of 2000 revolutions and the grinding depth of 0.002mm to enable the grinding roughness of the sapphire plate surface to reach Ra0.126 mu m, fine grinding, forming a pressure value of 0.15-0.25 MPa on the sapphire plate surface through spring deformation, rotating speed of the main shaft of 150-160 revolutions and the feeding speed of 200mm/min, using diamond grinding fluid with the granularity of 4 mu m to perform polishing, forming a pressure value of 0.15-0.25 MPa on the sapphire plate surface through spring deformation, rotating speed of the main shaft of 180 revolutions and the feeding speed of 200mm/min, and using silicon dioxide polishing fluid; the large-size sapphire window plate is processed by using general processing equipment on the premise of fully meeting the processing requirements, so that the working efficiency is greatly improved, the processing quality is improved, and the blank of the large-size sapphire processing method is filled.
Description
Technical Field
The invention relates to a processing technology, in particular to a processing technology for a large-size sapphire plate surface.
Background
At present, the processing of large-scale sapphire board face is roughly, the fine grinding is carried out through the manual work basically, and the form of artifical polishing is processed, finally reaches the visual requirement that the sapphire board is as the perspective window, processes a sapphire board, needs nearly one month's process time, makes the price of large-scale sapphire window board very expensive, has restricted the application of sapphire window board greatly.
The sapphire processing equipment and the sapphire processing technology in the current market can only meet the processing requirements of sapphire with smaller size.
Disclosure of Invention
The invention provides a processing technology for a large-size sapphire plate surface, which is used for overcoming the defect that in the prior art, sapphire processing equipment and the processing technology can only meet the processing requirement of sapphire with a smaller size.
In order to solve the technical problems, the invention provides the following technical scheme:
the invention discloses a processing technology for a large-size sapphire plate surface, which comprises the following steps:
coarse grinding, namely gluing a large-size sapphire plate on a tool, adsorbing the tool on a workbench of a grinding machine, grinding the sapphire plate by using a diamond grinding wheel with the diameter phi of 320, the granularity of 300-400, the rotating speed of a main shaft of 2000 revolutions and the grinding amount of 0.1mm until the whole surface of the sapphire plate is exposed to light, wherein the whole grinding amount is 1.1mm, and setting 9 measuring points for measuring roughness on the surface of the sapphire plate.
Semi-finish grinding, namely taking down the tool adhered with the large-size sapphire plate and the sapphire plate, adsorbing the tool and the sapphire plate on a workbench of another grinding machine, grinding the sapphire plate by using a diamond grinding wheel with the diameter phi of 320, the granularity of 2000, the rotating speed of a main shaft of 2000 revolutions and the grinding depth of 0.002mm, wherein the grinding roughness of the surface of the sapphire plate reaches about Ra0.126 mu m, the grinding depth is increased, the influence on the roughness is large, and finally the grinding depth of 0.002 is determined.
And finely grinding, namely taking down the tool adhered with the large-size sapphire plate and the sapphire plate, fixing the tool and the sapphire plate on a vertical machining center workbench, mounting a floating grinding head on a main shaft, mounting a spring in the floating grinding head, mounting a resin cast iron disc with the diameter phi of 150 at the front end, enabling the resin cast iron disc to contact the sapphire plate and press down through the Z-axis movement of a machine tool, forming a certain pressure on the surface of the sapphire plate through the deformation of the spring, wherein the pressure value is 0.15-0.25 MPa, the rotating speed of the main shaft is 150-160 revolutions, the feeding speed is 200mm/min, and diamond grinding fluid with the granularity of 4 mu m is used.
Polishing, namely fixing the tool adhered with the large-size sapphire plate and the sapphire plate on a vertical machining center workbench, installing a floating grinding head on a main shaft, installing a spring in the floating grinding head, installing a resin copper disc with the diameter phi of 150 at the front end of the floating grinding head, enabling the resin copper disc to contact the sapphire plate and press down through the Z-axis movement of a machine tool, forming a certain pressure on the surface of the sapphire plate through the deformation of the spring, wherein the pressure value is 0.15-0.25 MPa, the rotating speed of the main shaft is 180 revolutions, the feeding speed is 200mm/min, and silicon dioxide polishing solution is used.
Further, in the rough grinding, in order to ensure that the sapphire plate is not cracked, the grinding amount is gradually increased from 0.002mm, the roughness is gradually increased along with the increase of the grinding depth, but the processing time is greatly shortened, and after the grinding depth is increased to 0.01mm, the grinding depth is further increased, the machine tool is slightly shaken, so that the cutting depth of 0.01mm is finally determined as the final grinding depth.
Further, in the semi-finish grinding, the grinding depth is increased, the influence on the roughness is large, and finally the grinding depth of 0.002 is determined.
Further, in the lapping, the tool path is in 8-shaped motion, the lapping processing is carried out on the sapphire surface, and the sapphire plate surface is ground until the roughness reaches Ra0.0174 μm.
Further, during polishing, the cutter track moves in a shape like a Chinese character '8', the surface of the sapphire is polished, and the surface of the sapphire plate is ground until the roughness reaches about Ra0.003 mu m and is lower than the surface roughness Ra0.02 mu m of the glass.
The invention has the following beneficial effects: the large-size sapphire window plate is processed by using the general processing equipment, mature processing equipment can be selected according to the size requirement of sapphire, and a new processing technology is used for processing on the premise of fully meeting the processing requirement, so that the working efficiency is greatly improved, the processing quality is improved, and the blank of the large-size sapphire processing method is filled.
Detailed Description
The preferred embodiments described herein are merely illustrative and explanatory of the invention and are not restrictive thereof.
Example 1
A processing technology for a large-size sapphire plate surface comprises the following steps:
coarse grinding, namely gluing a large-size sapphire plate on a tool, adsorbing the tool on a workbench of a grinding machine, grinding the sapphire plate by using a diamond grinding wheel with the diameter phi of 320, the granularity of 300-400, the rotating speed of a main shaft of 2000 revolutions and the grinding amount of 0.1mm until the whole surface of the sapphire plate is exposed to light, wherein the whole grinding amount is 1.1mm, and setting 9 measuring points for measuring roughness on the surface of the sapphire plate.
Table 1: rough machining parameters
Table 2: test parameters
In order to ensure that the sapphire plate is not cracked, grinding tests are respectively carried out at different grinding depths, the grinding amount is gradually increased from 0.002mm, the roughness is gradually increased along with the increase of the grinding depth, but the processing time is greatly shortened, after the grinding depth is increased to 0.01mm, if the grinding depth is further increased, the load of a machine tool is larger, the test is carried out, the grinding depth is further increased, the machine tool is slightly shaken, in addition, the process mainly aims at thinning, the uneven surface is processed to be flat, and therefore the cutting depth of 0.01mm is finally determined as the final grinding depth.
Semi-finish grinding, namely taking down the tool adhered with the large-size sapphire plate and the sapphire plate, adsorbing the tool and the sapphire plate on a workbench of another grinding machine, grinding the sapphire plate by using a diamond grinding wheel with the diameter phi of 320, the granularity of 2000, the rotating speed of a main shaft of 2000 revolutions and the grinding depth of 0.002mm, wherein the grinding roughness of the surface of the sapphire plate reaches about Ra0.126 mu m, the grinding depth is increased, the influence on the roughness is large, and finally the grinding depth of 0.002 is determined.
Table 3: semi-finishing parameters
Table 4: cycling test parameters
And finely grinding, namely taking down the tool adhered with the large-size sapphire plate and the sapphire plate, fixing the tool and the sapphire plate on a vertical machining center workbench, mounting a floating grinding head on a main shaft, mounting a spring in the floating grinding head, mounting a resin cast iron disc with the diameter phi of 150 at the front end, enabling the resin cast iron disc to contact the sapphire plate through the Z-axis movement of a machine tool, pressing down, forming a certain pressure on the surface of the sapphire plate through the deformation of the spring, wherein the pressure value is 0.15-0.25 MPa, the rotating speed of the main shaft is 150-160 revolutions, the feeding speed is 200mm/min, using diamond grinding fluid with the granularity of 4 mu m, enabling a cutter track to move in a shape like the Chinese character '8', finely grinding the surface of the sapphire plate, and grinding the surface of the sapphire plate until the roughness reaches Ra0.0174 mu m.
Table 5: lapping statistical table for water-based grinding fluid PC-4-0 grinding fluid
From the above four final data, the first effect is the best and is determined as the final process parameter.
Polishing, fixing the tool adhered with the large-size sapphire plate and the sapphire plate on a workbench of a vertical machining center, installing a floating grinding head on a main shaft, installing a spring in the floating grinding head, installing a resin copper disc with the diameter phi of 150 at the front end, enabling the resin copper disc to contact the sapphire plate through the Z-axis movement of a machine tool and press down, forming a certain pressure on the surface of the sapphire plate through the deformation of the spring, wherein the pressure value is 0.15-0.25 MPa, the rotating speed of the main shaft is 180 revolutions, the feeding speed is 200mm/min, using a silicon dioxide polishing solution, enabling a cutter to move along an 8-shaped track, polishing the surface of the sapphire plate, and grinding the surface of the sapphire plate until the roughness reaches about Ra0.003 mu m and is lower than the surface roughness Ra0.02 mu m of glass.
Table 6: polishing statistical table for silicon dioxide polishing solution
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A processing technology for a large-size sapphire plate surface is characterized by comprising the following steps:
1) roughly grinding, namely gluing a large-size sapphire plate on a tool, adsorbing the tool on a workbench of a grinding machine, grinding the sapphire plate by using a diamond grinding wheel with the diameter phi of 320 and the granularity of 300-400, rotating the main shaft at the speed of 2000 revolutions and grinding the sapphire plate by the grinding amount of 0.1mm until the whole surface of the sapphire plate is exposed to light, wherein the whole grinding amount is 1.1mm, and setting 9 measuring points for measuring roughness on the sapphire plate surface;
2) semi-finish grinding, namely taking down the tool adhered with the large-size sapphire plate and the sapphire plate, adsorbing the tool and the sapphire plate on a workbench of another grinding machine, grinding the sapphire plate by using a diamond grinding wheel with the diameter phi of 320, the granularity of 2000, the rotating speed of a main shaft of 2000 revolutions and the grinding depth of 0.002mm, and enabling the grinding roughness of the surface of the sapphire plate to reach Ra0.126 mu m;
3) finely grinding, namely taking down the tool adhered with the large-size sapphire plate and the sapphire plate, fixing the tool and the sapphire plate on a vertical machining center workbench, mounting a floating grinding head on a main shaft, mounting a spring in the floating grinding head, mounting a resin cast iron disc with the diameter phi of 150 at the front end of the floating grinding head, enabling the resin cast iron disc to contact the sapphire plate and press down through the Z-axis movement of a machine tool, forming a certain pressure on the surface of the sapphire plate through the deformation of the spring, wherein the pressure value is 0.15-0.25 MPa, the rotating speed of the main shaft is 150-160 revolutions, the feeding speed is 200mm/min, and a diamond grinding fluid with the granularity of 4 mu m is used;
4) polishing, namely fixing the tool adhered with the large-size sapphire plate and the sapphire plate on a vertical machining center workbench, installing a floating grinding head on a main shaft, installing a spring in the floating grinding head, installing a resin copper disc with the diameter phi of 150 at the front end of the floating grinding head, enabling the resin copper disc to contact the sapphire plate and press down through the Z-axis movement of a machine tool, forming a certain pressure on the surface of the sapphire plate through the deformation of the spring, wherein the pressure value is 0.15-0.25 MPa, the rotating speed of the main shaft is 180 revolutions, the feeding speed is 200mm/min, and silicon dioxide polishing solution is used.
2. The processing technology for the large-size sapphire plate surface as claimed in claim 1, wherein in 2), in order to ensure that the sapphire plate is not cracked, the grinding amount is gradually increased from 0.002mm, the roughness is gradually increased along with the increase of the grinding depth, but the processing time is greatly shortened, after the grinding depth is increased to 0.01mm, the grinding depth is further increased, the machine tool is slightly shaken, and finally, the cutting depth of 0.01mm is selected as the final grinding depth.
3. The processing technology for the large-size sapphire plate surface as claimed in claim 1, wherein the influence on the roughness is large as the grinding depth is increased in 3), and finally the grinding depth is selected to be 0.002.
4. The processing technology for the large-size sapphire plate surface as claimed in claim 1, wherein the tool track in 4) is in 8-shaped motion, the sapphire surface is subjected to fine grinding processing, and the sapphire plate surface is ground until the roughness reaches Ra0.0174 μm.
5. The processing technology for the large-size sapphire plate surface as claimed in claim 1, wherein the tool track in 5) is in 8-shaped motion, the sapphire surface is polished, and the sapphire plate surface is ground until the roughness reaches Ra0.003 μm and is lower than the surface roughness of glass Ra0.02 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110675616.9A CN113334148A (en) | 2021-06-18 | 2021-06-18 | Processing technology for large-size sapphire plate surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110675616.9A CN113334148A (en) | 2021-06-18 | 2021-06-18 | Processing technology for large-size sapphire plate surface |
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| CN113334148A true CN113334148A (en) | 2021-09-03 |
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| CN202110675616.9A Pending CN113334148A (en) | 2021-06-18 | 2021-06-18 | Processing technology for large-size sapphire plate surface |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1569396A (en) * | 2003-07-16 | 2005-01-26 | 上海新华霞实业有限公司 | Grind process for optical sapphire crystal substrate |
| CN104907895A (en) * | 2015-06-16 | 2015-09-16 | 哈尔滨秋冠光电科技有限公司 | Method for quickly processing doubly polished sapphire wafers |
| CN104999365A (en) * | 2015-06-16 | 2015-10-28 | 东莞市中微纳米科技有限公司 | Sapphire wafer grinding and polishing method |
| CN106078493A (en) * | 2016-06-23 | 2016-11-09 | 上海汉虹精密机械有限公司 | The method of ceramic disk grinding wheel twin grinding processing sapphire wafer |
| CN205734229U (en) * | 2016-07-13 | 2016-11-30 | 广东工业大学 | A kind of ultra-smooth plane lapping burnishing device of vac sorb clamping |
| CN106181747A (en) * | 2016-06-13 | 2016-12-07 | 江苏吉星新材料有限公司 | A kind of large-size sapphire ultrathin double-face polishing diaphragm processing method |
| CN106272010A (en) * | 2015-05-25 | 2017-01-04 | 蓝思科技股份有限公司 | A kind of abrasive polishing method of sapphire minute surface substrate indent flat surface |
| CN108527013A (en) * | 2018-05-22 | 2018-09-14 | 安徽全兆光学科技有限公司 | A kind of grinding and polishing manufacture craft of sapphire optical eyeglass |
| CN109262373A (en) * | 2017-07-18 | 2019-01-25 | 东莞华晶粉末冶金有限公司 | The grinding method of zirconia ceramics |
-
2021
- 2021-06-18 CN CN202110675616.9A patent/CN113334148A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1569396A (en) * | 2003-07-16 | 2005-01-26 | 上海新华霞实业有限公司 | Grind process for optical sapphire crystal substrate |
| CN106272010A (en) * | 2015-05-25 | 2017-01-04 | 蓝思科技股份有限公司 | A kind of abrasive polishing method of sapphire minute surface substrate indent flat surface |
| CN104907895A (en) * | 2015-06-16 | 2015-09-16 | 哈尔滨秋冠光电科技有限公司 | Method for quickly processing doubly polished sapphire wafers |
| CN104999365A (en) * | 2015-06-16 | 2015-10-28 | 东莞市中微纳米科技有限公司 | Sapphire wafer grinding and polishing method |
| CN106181747A (en) * | 2016-06-13 | 2016-12-07 | 江苏吉星新材料有限公司 | A kind of large-size sapphire ultrathin double-face polishing diaphragm processing method |
| CN106078493A (en) * | 2016-06-23 | 2016-11-09 | 上海汉虹精密机械有限公司 | The method of ceramic disk grinding wheel twin grinding processing sapphire wafer |
| CN205734229U (en) * | 2016-07-13 | 2016-11-30 | 广东工业大学 | A kind of ultra-smooth plane lapping burnishing device of vac sorb clamping |
| CN109262373A (en) * | 2017-07-18 | 2019-01-25 | 东莞华晶粉末冶金有限公司 | The grinding method of zirconia ceramics |
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Application publication date: 20210903 |