CN113333966A - Femtosecond laser fiber effect-based thin quartz glass cutting method - Google Patents
Femtosecond laser fiber effect-based thin quartz glass cutting method Download PDFInfo
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- CN113333966A CN113333966A CN202110520515.4A CN202110520515A CN113333966A CN 113333966 A CN113333966 A CN 113333966A CN 202110520515 A CN202110520515 A CN 202110520515A CN 113333966 A CN113333966 A CN 113333966A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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Abstract
The invention provides a method for cutting thin quartz glass based on femtosecond laser fiber effect, which is suitable for cutting thin quartz glass with the thickness less than or equal to 200 mu m; the high repetition frequency femtosecond laser is combined with a high-speed high-precision scanning galvanometer to serve as a processing platform, and the length of a femtosecond optical fiber, the energy distribution of the optical fiber, the pulse overlapping rate, the pulse energy deposition and the relative position of the optical fiber in the quartz glass are regulated and controlled by changing laser parameters, so that the high-quality and high-efficiency cutting of the quartz glass is realized; the invention can realize single-scanning direct cutting of the quartz glass material with the thickness less than or equal to 200 mu m without a post-treatment process, the roughness of the cutting section is less than 1.5 mu m, the edge breakage of the cutting edge is less than 12.5 mu m, and the processing speed reaches 10 mm/s; the method is simple to operate, the light path is convenient to debug, and the cutting processing efficiency and the processing quality of the thin quartz glass are synchronously improved.
Description
Technical Field
The invention belongs to the technical field of femtosecond laser micromachining, and particularly relates to a method for cutting thin quartz glass based on a femtosecond laser fiber effect.
Background
In recent years, with the rapid development of industries such as 3C, integrated electronics, MEMS, photovoltaic and the like, the hard and brittle transparent materials are widely applied, and quartz glass is widely applied to mobile phones, tablet computers, micromachines and other electronic devices with good physical and chemical properties, especially in the field of aerospace, and is applied to key components of inertial instruments such as quartz vibrating beam accelerometers, quartz pendulums, MEMS gyroscopes and the like. In the manufacturing process of the key parts, the quartz glass is required to be cut according to the size requirement, and the quality of cutting has great influence on the assembly, the performance and the service life of the parts. At present, the cutting of quartz glass mainly comprises the conventional and non-conventional processing methods. The traditional processing mainly adopts a diamond cutting wheel for cutting, and the cutting quality is poor; non-conventional methods include water jet and laser machining.
In recent years, ultrafast lasers have been the focus of research due to their high processing accuracy. The crack control method is widely applied to laser cutting of glass, and comprises the steps of firstly forming scratches on the surface of the glass by adopting a laser beam, and then enabling the glass to crack along a preset cutting path through subsequent mechanical stress or thermal stress; the method needs to strictly control the depth of the scratch and the process parameters of the subsequent splinting process, the processing process is complex, and the product yield is slightly low. The method of direct laser ablation cutting can avoid the subsequent cutting treatment process, but the ablation threshold of quartz glass is large, the peak power of picosecond laser and the like is low, the removal rate of materials in single scanning is low, repeated scanning is needed to realize complete cutting, and the processing efficiency is greatly reduced. The Bessel beam is adopted to cut glass, the equipment cost is high, the installation and debugging of the Bessel beam require higher technical requirements, the Bessel beam is very helpful for cutting thick glass, and the Bessel beam is unnecessary for cutting thin quartz glass.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a method for cutting thin quartz glass based on the femtosecond laser filament effect, which fully utilizes the characteristics that the femtosecond laser has high power density and can form stable long-focus deep light filaments in materials and the advantage that high repetition frequency laser can effectively improve the scanning speed on the premise of ensuring the overlapping rate of light spots, and realizes single direct high-quality and high-efficiency cutting of the thin quartz glass. The roughness of a cutting section is less than 1.5 mu m, and the edge breakage of a cutting edge is less than 12.5 mu m; the method is simple to operate, the light path is convenient to debug, and the cutting processing efficiency and the processing quality of the thin quartz glass are synchronously improved.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for cutting thin quartz glass based on femtosecond laser filament effect is suitable for cutting thin quartz glass with thickness less than or equal to 200 μm. The femtosecond optical fiber length, the optical fiber energy distribution, the pulse overlapping rate, the pulse energy deposition and the relative position of the optical fiber in the quartz glass are regulated and controlled by changing laser parameters, so that the high-quality and high-efficiency cutting of the quartz glass is realized.
A cutting method of thin quartz glass based on femtosecond laser filament effect comprises the following steps:
1) respectively carrying out ultrasonic cleaning on the surface of a quartz glass sample by using acetone, absolute ethyl alcohol and deionized water, and then drying by using dry air to obtain a clean quartz glass sheet sample;
2) a light path is set up, the light path comprises a high-repetition-frequency femtosecond laser 1, the output light of the high-repetition-frequency femtosecond laser 1 is rotated by 90 degrees through a first reflector 2, the reflected light vertically irradiates a processing station of a scissor type lifting platform 8 through a second reflector 3, an eyelet diaphragm 4, a beam expander 5, a third reflector 6 and a high-speed high-precision scanning galvanometer 7 in sequence, and a galvanometer control unit 9 of the high-repetition-frequency femtosecond laser 1 and the high-speed high-precision scanning galvanometer 7 is connected with a computer 10;
3) adjusting the output laser of the high repetition frequency femtosecond laser 1 by using a computer 10, wherein the laser wavelength is 1030nm, the pulse width is 240fs, the repetition frequency is 1-200KHz, and the maximum single pulse energy is 200 muJ;
4) fixing a clean quartz glass sample on a processing station of a scissor-type lifting table 8;
5) cutting the quartz glass in a laser scribing mode, and adjusting laser single pulse energy, scanning speed, repetition frequency and defocusing amount to obtain the optimal basic parameters of the laser-cut thin quartz glass: the single pulse energy is 80-120 muJ, the repetition frequency is 100KHz, the scanning speed is 8-10mm/s, and the defocusing amount is-100μm;
6) after the cutting processing is finished, the quartz glass sample is respectively ultrasonically cleaned for 15min by acetone and absolute ethyl alcohol, and then dried by dry air.
The invention has the following beneficial effects:
the invention utilizes high repetition frequency femtosecond laser and a high-speed high-precision scanning galvanometer as a cutting processing platform, laser with high single pulse energy can form a stable long optical fiber in the air, and the roughness and edge breakage of the cut section of the thin quartz glass are optimized by adjusting the single pulse energy, the repetition frequency, the scanning speed and the defocusing amount of the laser to change the length of the femtosecond optical fiber, the energy distribution of the optical fiber, the pulse overlapping rate, the pulse energy deposition and the relative position of the optical fiber in the glass material.
The invention utilizes the characteristic that the femtosecond laser fiber effect is longer than Gaussian beam without diffraction length, can realize one-step forming in the cutting of transparent glass material, does not need to adopt a method of scanning for many times to increase the cutting depth, and improves the processing efficiency of thin glass cutting; because single scanning is adopted for direct cutting, the section roughness and the edge breakage are small; meanwhile, compared with Bessel beams, the femtosecond optical fiber has no energy loss caused by side lobes, so that the energy utilization rate is higher; the high repetition frequency femtosecond laser is combined with the optical path system of the high-speed high-precision scanning galvanometer, so that the scanning speed can be effectively improved on the premise of ensuring the overlapping rate of cutting processing light spots. The method is simple to operate, the light path is convenient to debug, and the cutting processing quality and efficiency of the thin quartz glass are synchronously improved.
Drawings
FIG. 1 is a schematic diagram of the femtosecond laser cutting of thin quartz glass: wherein (a) is a schematic diagram of femtosecond laser multi-scanning cutting quartz glass; (b) the schematic diagram of the femtosecond laser optical fiber single-time direct cutting quartz glass is shown; (c) the schematic diagram of cutting quartz glass by combining femtosecond laser optical fiber single scanning with splinter is shown.
Fig. 2 is a schematic diagram of the optical path of the present invention.
FIG. 3 is a graph showing the effect of cutting quartz glass according to example 1 of the present invention.
FIG. 4 is a graph showing the effect of cutting quartz glass according to example 2 of the present invention.
FIG. 5 is a graph showing the effect of cutting quartz glass according to example 3 of the present invention.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
As shown in FIG. 1, a cutting method of thin quartz glass based on femtosecond laser filament effect is suitable for cutting thin quartz glass with thickness less than or equal to 200 μm. The basic principle is that the length of a femtosecond optical fiber, the energy distribution of the optical fiber, the pulse overlapping rate, the pulse energy deposition and the relative position of the optical fiber in quartz glass are regulated and controlled by changing laser parameters, so that the high-quality and high-efficiency cutting of the quartz glass is realized.
Embodiment 1, a method for cutting thin quartz glass based on femtosecond laser filament effect, comprising the following steps:
1) selecting the area of 20 multiplied by 20mm2The surface of a quartz glass sample with the thickness less than or equal to 200 mu m is respectively subjected to ultrasonic cleaning by using acetone, absolute ethyl alcohol and deionized water, and then dried by using dry air to obtain a clean quartz glass sample;
2) building a light path, referring to fig. 2, wherein the light path comprises a high repetition frequency femtosecond laser 1, the output light of the high repetition frequency femtosecond laser 1 makes the light path rotate by 90 degrees through a first reflector 2, and the reflected light vertically irradiates a processing station of a scissor type lifting platform 8 through a second reflector 3, an eyelet diaphragm 4, a beam expander 5, a third reflector 6 and a high-speed high-precision scanning galvanometer 7 in sequence, and the high repetition frequency femtosecond laser 1 and the galvanometer control unit 9 of the high-speed high-precision scanning galvanometer 7 are connected with a computer 10;
3) adjusting the output laser of the high repetition frequency femtosecond laser 1 by using a computer 10, wherein the laser wavelength is 1030nm, the pulse width is 240fs, the repetition frequency is 1-200KHz, and the maximum single pulse energy is 200 muJ;
4) fixing the clean quartz glass sample prepared in the step 1) on a processing station of a scissor type lifting table 8;
5) high repetition frequency femto second laser 1 is through high-speed high accuracy scanning galvanometer 7 to quartz glass scribing cutting, adjusts laser power, repetition frequency, scanning speed through computer 10, adjusts out of focus volume through cutting formula elevating platform 8, changes light silk length, energy distribution and the position of locating in quartz glass in the air through the regulation and control of laser parameter, and then realizes the high-quality high-efficient cutting of quartz glass, obtains the processing parameter combination: the laser single pulse energy is 100 muJ, the repetition frequency is 100KHz, the scanning speed is 10mm/s, and the defocusing amount is-100μm;
6) after the cutting processing is finished, respectively carrying out ultrasonic cleaning on the quartz glass sample for 15min by using acetone and absolute ethyl alcohol, then drying the quartz glass sample by using dry air, and then observing edge breakage and section roughness of the cut sample by using an optical microscope and a laser confocal microscope.
The beneficial effect of this embodiment does: referring to fig. 3, the cutting sample with edge breakage of 7.25 μm and section roughness of 0.98 μm can be obtained in the embodiment, the cutting speed reaches 10mm/s, the one-time direct cutting of the quartz glass sample is realized, the post-processing process is not needed, and the method is suitable for application scenes requiring high-speed high-quality direct cutting of thin glass; and because the one-step molding of cutting processing of the thin glass is realized, the secondary treatment is not needed in the device assembling process; by adopting the embodiment, the requirements of quartz glass cutting process can be met, and the requirements of subsequent acid washing and the like are not needed, so that the method has wide application in the fields of aerospace quartz accelerometers, 3C display and the like.
Example 2, the combination of processing parameters in step 5) of example 1 is changed into: the laser single pulse energy is 80 muJ, the repetition frequency is 100KHz, the scanning speed is 9mm/s, and the defocusing amount is-100μm. The processing effect is shown in fig. 4, a cutting sample with edge breakage of 9.55 μm and section roughness of 1.28 μm is obtained, the cutting speed reaches 10mm/s, the cutting sample does not realize direct cracking after one-time scanning, and the cutting sample needs subsequent mechanical stress to crack.
The beneficial effect of this embodiment does: referring to fig. 4, the quartz glass cutting sample obtained in this embodiment does not realize single-scan direct cutting of quartz glass, edge chipping and section roughness are slightly increased, and the scanning speed is unchanged, so that the quartz glass cutting process is suitable for being applied to MEMS chips of quartz glass substrates and cutting and manufacturing of glass-based micro devices with high requirements for surface cleanliness; meanwhile, as the glass is not completely cut through during cutting, dust and heat influence generated in the processing process cannot be deposited on the surface, the material integrity of the surface of the device can be effectively protected, and the influence of the processing dust, heat and the like on the service performance of the product is reduced; the embodiment has wide application in the fields of chip manufacturing and photovoltaics.
Example 3, the combination of processing parameters in step 5) of example 1 is changed into: the laser single pulse energy is 120 muJ, the repetition frequency is 100KHz, the scanning speed is 8mm/s, and the defocusing amount is-100μm. The processing effect is shown in figure 5, a cutting sample with edge breakage of 12.25 microns and section roughness of 1.4 microns is obtained, the cutting speed reaches 8mm/s, the cutting sample cannot be directly cracked after one-time scanning, but the femtosecond optical fiber completely penetrates through the whole glass thickness and needs subsequent mechanical stress to crack the glass.
The beneficial effect of this embodiment does: referring to fig. 5, the quartz glass cutting sample obtained in the embodiment is penetrated by the laser optical fiber but can not be separated autonomously, and needs subsequent mechanical stress to crack the quartz glass, the process increases the single pulse energy and reduces the scanning speed compared with the process of embodiment 1, so that the edge breakage and the section roughness of the cutting sample are correspondingly increased, but the deposition of the pulse energy on the cutting section is increased due to the increase of the single pulse energy and the reduction of the scanning speed, the melting adhesion is generated on the section, the cracking is difficult, and the process provides process exploration for the integration of cutting and connection of the high repetition frequency femtosecond laser and the high-speed scanning galvanometer on the thin quartz glass; the method has the advantages of simple process, high energy utilization rate and wide application exploration space in the aspect of ultrafast laser micro-connection processing of quartz glass.
Claims (3)
1. A cutting method of thin quartz glass based on femtosecond laser filament effect is characterized in that: the thin quartz glass is suitable for being less than or equal to 200 mu m in thickness, and the length of the femtosecond optical fiber, the energy distribution of the optical fiber, the pulse overlapping rate, the pulse energy deposition and the relative position of the optical fiber in the quartz glass are regulated and controlled by changing laser parameters, so that the high-quality and high-efficiency cutting of the quartz glass is realized.
2. A cutting method of thin quartz glass based on femtosecond laser filament effect is characterized by comprising the following steps:
1) carrying out ultrasonic cleaning on the surface of a thin quartz glass sample by using acetone, absolute ethyl alcohol and deionized water respectively, and then drying by using dry air to obtain a clean quartz glass sheet sample;
2) the method comprises the following steps of setting up a light path, wherein the light path comprises a high-repetition-frequency femtosecond laser (1), the output light of the high-repetition-frequency femtosecond laser (1) makes the light path rotate by 90 degrees through a first reflector (2), and the reflected light vertically irradiates a processing station of a scissor type lifting platform (8) through a second reflector (3), a small-hole diaphragm (4), a beam expander (5), a third reflector (6) and a high-speed high-precision scanning galvanometer (7) in sequence, and a galvanometer control unit (9) of the high-repetition-frequency femtosecond laser (1) and the high-speed high-precision scanning galvanometer (7) is connected with a computer (10);
3) a computer (10) is utilized to adjust the output laser of the high repetition frequency femtosecond laser (1), the laser wavelength is 1030nm, the pulse width is 240fs, the repetition frequency is 1-200KHz, and the maximum single pulse energy is 200 muJ;
4) fixing a clean quartz glass sample on a processing station of a scissor-type lifting table (8);
5) cutting the quartz glass in a laser scribing mode, and adjusting laser single pulse energy, scanning speed, repetition frequency and defocusing amount to obtain the optimal basic parameters of the laser-cut thin quartz glass: the single pulse energy is 80-120 muJ, the repetition frequency is 100KHz, the scanning speed is 8-10mm/s, and the defocusing amount is-100μm;
6) after the cutting processing is finished, the quartz glass sample is respectively ultrasonically cleaned for 15min by acetone and absolute ethyl alcohol, and then dried by dry air.
3. The method for cutting the thin quartz glass based on the femtosecond laser optical fiber effect according to the claim 2, which is characterized by comprising the following steps:
1) selecting the area of 20 multiplied by 20mm2The surface of a quartz glass sample with the thickness less than or equal to 200 mu m is respectively subjected to ultrasonic cleaning by using acetone, absolute ethyl alcohol and deionized water, and then dried by using dry air to obtain a clean quartz glass sample;
2) the method comprises the following steps of setting up a light path, wherein the light path comprises a high-repetition-frequency femtosecond laser (1), the output light of the high-repetition-frequency femtosecond laser (1) makes the light path rotate by 90 degrees through a first reflector (2), and the reflected light vertically irradiates a processing station of a scissor type lifting platform (8) through a second reflector (3), a small-hole diaphragm (4), a beam expander (5), a third reflector (6) and a high-speed high-precision scanning galvanometer (7) in sequence, and a galvanometer control unit (9) of the high-repetition-frequency femtosecond laser (1) and the high-speed high-precision scanning galvanometer (7) is connected with a computer (10);
3) a computer (10) is utilized to adjust the output laser of the high repetition frequency femtosecond laser (1), the laser wavelength is 1030nm, the pulse width is 240fs, the repetition frequency is 1-200KHz, and the maximum single pulse energy is 200 muJ;
4) fixing the clean quartz glass sample prepared in the step 1) on a processing station of a scissor type lifting table (8);
5) high repetition frequency femto second laser (1) is through high-speed high accuracy scanning galvanometer (7) to quartz glass scribing cutting, adjusts laser power, repetition frequency, scanning speed through computer (10), adjusts out of focus volume through cutting formula elevating platform (8), changes light silk length in the air, energy distribution and the position of locating in quartz glass through the regulation and control of laser parameter, and then realizes the high-quality high-efficient cutting of quartz glass, obtains the processing parameter combination: the single pulse energy is 100 muJ, the repetition frequency is 100KHz, the scanning speed is 10mm/s, and the defocusing amount is-100 mu m;
6) after the cutting processing is finished, respectively carrying out ultrasonic cleaning on the quartz glass sample for 15min by using acetone and absolute ethyl alcohol, then drying the quartz glass sample by using dry air, and then observing edge breakage and section roughness of the cut sample by using an optical microscope and a laser confocal microscope.
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