CN113333261A - High-frequency array transducer - Google Patents
High-frequency array transducer Download PDFInfo
- Publication number
- CN113333261A CN113333261A CN202110681261.4A CN202110681261A CN113333261A CN 113333261 A CN113333261 A CN 113333261A CN 202110681261 A CN202110681261 A CN 202110681261A CN 113333261 A CN113333261 A CN 113333261A
- Authority
- CN
- China
- Prior art keywords
- electrode lead
- circuit board
- piezoelectric
- flexible circuit
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005284 excitation Effects 0.000 claims description 34
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000002604 ultrasonography Methods 0.000 claims description 5
- 230000001934 delay Effects 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003759 clinical diagnosis Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012285 ultrasound imaging Methods 0.000 description 1
- 210000001835 viscera Anatomy 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/50—Application to a particular transducer type
- B06B2201/55—Piezoelectric transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/70—Specific application
- B06B2201/76—Medical, dental
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
The invention provides an array transducer, which comprises an acoustic lens, a matching layer, a first flexible circuit board assembly, a piezoelectric layer, a second flexible circuit board assembly and a back lining layer which are sequentially arranged, wherein the first flexible circuit board assembly and the second flexible circuit board assembly respectively comprise at least one flexible circuit board; the first flexible circuit board assembly is arranged on the first electrode surface, a plurality of first electrode lead units are led out of the first flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same first electrode lead unit; the second flexible circuit board assembly is arranged on the second electrode surface, a plurality of second electrode lead units are led out of the second flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same second electrode lead unit.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers, in particular to a high-frequency array transducer.
Background
Ultrasound imaging is an important means of diagnosing disease through medical imaging. Ultrasonic waves are transmitted into a human body through an ultrasonic transducer and are scanned in a linear mode, a sector mode or other modes, when the ultrasonic waves meet the interface of two tissues with different acoustic impedances, the ultrasonic waves are reflected back to be received by the transducer, and are displayed on a screen after signal amplification and processing to form a human body tomogram which is called an ultrasonic image and used for clinical diagnosis. Multiple ultrasound images are displayed on the screen and dynamic organ activity is observed. Because of the different depth of the organ-tissue interface in the body, the echo can be received before the time, so that the depth of the interface and the shape and size of the viscera can be measured. High frequency array ultrasound has important applications in high resolution imaging diagnostics.
The array ultrasonic transducer mainly uses a flexible circuit board to lead out array elements of the transducer, in order to prevent side lobes from being generated in the ultrasonic imaging process, the distance of the array transducer is generally smaller than one wavelength, and the higher the frequency is, the smaller the distance is, and the smaller the array elements are. The wiring technology of high frequency array transducers has long been a key and difficult technology for transducer fabrication. The commonly used wiring technology in the array transducer is to use a flexible circuit board to lead out the array elements on the piezoelectric wafer, but due to the limitation of the manufacturing process of the flexible circuit board, the size and the spacing of the array elements which can be connected are limited.
Specifically, the prior art is affected by the flexible circuit board processing technology, the width (Wf) of the circuits on the flexible circuit board and the gap (Kf) between the circuits are generally greater than or equal to 50 micrometers, because the width (We) of the circuits on the flexible circuit board is less than or equal to the width (We) of the piezoelectric layer array elements, and the circuit pitch (Pf) of the flexible circuit board is equal to the array element pitch (Pe), so that the array element width on the piezoelectric layer of the transducer must be greater than or equal to 50 micrometers, and the array element pitch must be greater than or equal to 100 micrometers. In order to ensure the ultrasonic imaging quality, the array element spacing of the high-frequency array transducer is less than or equal to one half of the wavelength of ultrasonic in water, the array element spacing is 100 micrometers, a phased array of 7.5MHz can be manufactured at most, the manufacturing requirement of a higher-frequency array transducer cannot be met, and in many ultrasonic applications, the transducer with higher frequency needs to be applied to provide better diagnostic images.
Wherein Wf + Kf ═ Pf
We + Ke Pe, Ke is the array element gap.
In order to prepare the array transducer with higher frequency, two conductive circuit connection methods are mainly proposed in the prior art, however, the method of connecting the hollow pins of the flexible circuit board and the array elements is difficult to implement in practical application, and the method of electrically connecting the corresponding electrodes in the motor arranged in the array to the corresponding electric connectors based on the additive technology needs to use various precision devices, and is difficult to process and high in cost.
In summary, the wiring technology commonly used in the array transducer is affected by the flexible board processing technology, and the transducer with the highest frequency that can be prepared cannot meet the requirements of practical application.
Disclosure of Invention
In view of the above, in order to overcome the above-mentioned drawbacks of the prior art, the present invention provides an array transducer capable of manufacturing an array transducer with higher frequency without increasing process complexity and difficulty.
The array transducer comprises an acoustic lens, a matching layer, a first flexible circuit board assembly, a piezoelectric layer, a second flexible circuit board assembly and a backing layer which are sequentially arranged, wherein the first flexible circuit board assembly and the second flexible circuit board assembly respectively comprise at least one flexible circuit board, a first electrode surface and a second electrode surface of the piezoelectric layer are respectively provided with an electrode, and the electrodes on each side surface of the first electrode surface and the second electrode surface are cut off to enable the piezoelectric layer to form a plurality of piezoelectric array elements;
the first flexible circuit board assembly is arranged on the first electrode surface, a plurality of first electrode lead units are led out of the first flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same first electrode lead unit;
the second flexible circuit board assembly is arranged on the second electrode surface, a plurality of second electrode lead units are led out of the second flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same second electrode lead unit.
The piezoelectric layer comprises N piezoelectric array elements, and when N is an even number, the number of the first electrode lead units is
Every two adjacent piezoelectric array elements are connected with one first electrode lead unit; the number of the second electrode lead units is
The piezoelectric array elements at the head end and the tail end are respectively connected with one second electrode lead unit, and the rest are
In each piezoelectric array element, every two adjacent piezoelectric array elements are connected with one second electrode lead unit;
when N is odd number, the number of the first electrode lead units is
The piezoelectric array element at the head end or the tail end is connected with one first electrode lead unit, and the rest are connected with the other electrode lead units
In each piezoelectric array element, every two adjacent piezoelectric array elements are connected with one first electrode lead unit; the number of the second electrode lead units is
The piezoelectric array element at the head end or the tail end is connected with one second electrode lead unit, and the rest are
In each piezoelectric array element, every two adjacent piezoelectric array elements are connected with one second electrode lead unit.
Specifically, the first electrode lead units may be distributed on the same side of the first electrode surface, and the second electrode lead units may be distributed on the same side of the second electrode surface; or the first electrode lead units are alternately distributed on two sides of the first electrode surface, and the second electrode lead units are alternately distributed on two sides of the second electrode surface, so that the space between adjacent circuits on the flexible board is enlarged. The flexible plate with the same specification can lead out transducer array elements with smaller array element width and array element gap.
And insulating layers are arranged on two sides of the piezoelectric layer, a first electrode surface of the piezoelectric layer extends to cover one side surface of the insulating layer, a second electrode surface of the piezoelectric layer extends to cover the other side surface of the insulating layer, and the electrodes of the first electrode surface and the second electrode surface of each array element are divided by the insulating layers.
The connection between the flexible circuit board assembly and the piezoelectric layer may be that the first flexible circuit board assembly and/or the second flexible circuit board assembly is bonded to the insulating layer; and/or the first flexible circuit board assembly and/or the second flexible circuit board assembly are/is adhered with the piezoelectric layer. When the matching layer and the backing layer are conductive layers, the first flexible circuit board assembly and/or the second flexible circuit board assembly can be adhered to the matching layer; and/or the first flexible circuit board assembly and/or the second flexible circuit board assembly are bonded to the backing layer, and the applied signal is transmitted to the piezoelectric layer through the conductive layer to achieve electrical connection with the piezoelectric layer.
Preferably, the first flexible circuit board assembly and the second flexible circuit board assembly are electrical connectors including an integrated circuit, a soft FPC board, and a hard FPC board. The acoustic lens includes a concave lens and a convex lens.
The number of each layer of the transducer is not limited, and the backing layer is one or more layers; and/or, the piezoelectric layer is one or more layers; and/or, the matching layer is one or more layers; and/or the acoustic lens is one or more layers.
The invention also provides an ultrasonic system which comprises the array transducer, the electronic delay and the switch, wherein the array transducer comprises a plurality of piezoelectric array elements, each piezoelectric array element is connected with one electronic delay, and the switch is connected between each electronic delay and the piezoelectric array element. Preferably, the electronic delays differ in time length.
The invention also provides an excitation method for the ultrasonic system, wherein excitation signals adjust the excitation sequence and the starting time of the piezoelectric array elements through the electronic delays with different time lengths, and the working and the disconnection states of the excitation signals are controlled through the switch; the excitation signal drives the piezoelectric array element to work;
the step of driving the piezoelectric array element to work by the excitation signal comprises the following steps:
when the first electrode surfaces of two adjacent piezoelectric array elements are connected with the same first electrode lead unit and the second electrode surfaces are connected with two second electrode lead units respectively, excitation is applied to the first electrode lead unit and one second electrode lead unit, one piezoelectric array element works, excitation is applied to the first electrode lead unit and the other second electrode lead unit, and the other piezoelectric array element works;
when two are adjacent piezoelectric array element first electrode face connect two respectively first electrode lead wire unit, the second electrode face is same jointly connected during the second electrode lead wire unit, to one first electrode lead wire unit with the excitation is applyed to second electrode lead wire unit, one piezoelectric array element work, to another first electrode lead wire unit with the excitation is applyed to second electrode lead wire unit, another piezoelectric array element work.
In summary, based on the existing transducer connection technology, the array transducer of the present invention adopts the connection manner that the first flexible circuit board assembly and the second flexible circuit board assembly respectively stagger the two side surfaces of the piezoelectric layer to lead out the piezoelectric array elements, so as to realize the electrical interconnection between the piezoelectric layer and the external circuit. The transducer connection mode of the invention adopts the flexible circuit board with the same specification to lead out the transducer array elements with smaller array element width and array element gap, and can prepare the array transducer with higher frequency without increasing the process complexity and difficulty.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of an array transducer of the present invention;
FIG. 2 is a schematic diagram of the structure of an array transducer of the present invention;
FIG. 3 is a schematic view of a connection of a piezoelectric layer to a flexible circuit board assembly;
FIG. 4 is a schematic circuit diagram of the connection shown in FIG. 3;
FIG. 5 is a schematic view of another alternative connection of the piezoelectric layer to the flexible circuit board assembly;
FIG. 6 is a schematic circuit diagram of the connection shown in FIG. 5;
fig. 7 is an excitation schematic diagram of an ultrasound system employing an array transducer of the present invention.
Reference numerals:
1-backing layer; 2-a piezoelectric layer; 21-a first electrode face; 22-a second electrode face; 23-piezoelectric array elements; 24-array element spacing; 3-an insulating layer; 4-a matching layer; 51-a first flexible circuit board assembly; 511-a first electrode lead unit; 52-a second flexible circuit board assembly; 521-a second electrode lead element; 6-acoustic lens; 71-the excitation signal; 72-electronic retardation; 73-a switch; 74-target tissue.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an array transducer, which adopts a new wiring mode to relieve the restriction of a flexible plate processing technology on the preparation of the array transducer and prepares the array transducer with higher frequency under the condition of not increasing the complexity and difficulty of the technology.
Referring to fig. 1 of the specification, the array transducer structure of the present invention includes a backing layer 1, a piezoelectric layer 2, an insulating layer 3, a matching layer 4, a first flexible circuit board assembly 51, a second flexible circuit board assembly 52, and an acoustic lens 6, wherein the acoustic lens 6, the matching layer 4, the first flexible circuit board assembly 51, the piezoelectric layer 2, the second flexible circuit board assembly 52, and the backing layer 1 are sequentially stacked. Specifically, the piezoelectric layer 2 is used for emitting ultrasonic waves, and has a first electrode surface 21 disposed on one side surface of the piezoelectric layer 2 and a second electrode surface 22 disposed on the other side surface of the piezoelectric layer 2, the first electrode surface 21 and the second electrode surface 22 have electrodes, respectively, and the electrodes on each of the first electrode surface 21 and the second electrode surface 22 are cut apart to make the piezoelectric layer 2 form a plurality of piezoelectric array elements 23, each piezoelectric array element 23 has a first electrode on the first electrode surface 21 and a second electrode on the second electrode surface 22, respectively, and an array element gap 24 is formed between the piezoelectric array elements 23. In some embodiments, the array element gaps 24 are filled with an isolating substance. The matching layer 4 is used to match acoustic impedance between the piezoelectric layer 2 and an external object. The backing layer 1 absorbs the ultrasonic waves emitted in the direction of the backing layer 1. The acoustic lens 6 focuses the acoustic field and focuses the acoustic waves emitted by the piezoelectric layer 2, and may be a convex lens or a concave lens. The backing layer 1, piezoelectric layer 2, matching layer 4 and acoustic lens 6 can each be one or more layers. Preferably, the piezoelectric layer 2 is disposed between two insulating layers 3, and the electrodes of the piezoelectric layer 2 extend to cover the surface of the insulating layer 3 and share the electrodes with the insulating layer 3, so that the electrodes of the first electrode surface 21 and the second electrode surface 22 of each piezoelectric array element 23 are separated.
The flexible circuit board assembly is an electrical connector for achieving electrical interconnection of the piezoelectric layer 2 with an external circuit, includes a plurality of electrode lead units, and may be an integrated circuit, a soft FPC board, a hard FPC board, or other objects that can achieve the relevant electrical connection function. The array transducer of the invention leads out the piezoelectric array element 23 by respectively staggering the first electrode surface 21 and the second electrode surface 22 of the piezoelectric layer 2 through the first flexible circuit board component 51 and the second flexible circuit board component 52, and the first flexible circuit board component 51 and the second flexible circuit board component 52 respectively comprise at least one flexible circuit board. The first flexible circuit board assembly 51 is arranged on the first electrode surface 21, a plurality of first electrode lead units 511 are led out of the first flexible circuit board assembly 51, and at least one pair of adjacent piezoelectric array elements 23 are connected with one first electrode lead unit 511; the second flexible circuit board assembly 52 is disposed on the second electrode surface 22, a plurality of second electrode lead units 521 are led out from the second flexible circuit board assembly 52, and at least one pair of adjacent piezoelectric array elements 23 are commonly connected with one second electrode lead unit 521. The flexible circuit board assembly with the same specification can be connected with the piezoelectric array elements 23 with smaller intervals of the piezoelectric array elements 23 and the piezoelectric array elements 23 with smaller width by adopting the method, so that the frequency of the prepared transducer can be improved. The flexible circuit board assembly can be directly bonded to the surface of the piezoelectric layer 2; or can be bonded to the surface of the insulating layer 3 that shares an electrode with the piezoelectric layer 2, resulting in a transducer that has superior performance compared to a transducer in which the flexible circuit board assembly is directly bonded to the surface of the piezoelectric layer 2. In some embodiments, the matching layer 4 and the backing layer 1 are conductive layers or contain conductive elements, and the flexible circuit board assembly can also be bonded to the matching layer 4 and/or the backing layer 1, with the applied signal being transmitted through the conductive layers to the piezoelectric layer 2 to make electrical connection with the piezoelectric layer 2.
Example 1
The present embodiment provides a specific connection structure of the flexible circuit board assembly and the piezoelectric layer 2. Referring to the description of fig. 2, the piezoelectric layer 2 is disposed between two insulating layers 3, each piezoelectric array element 23 has a first electrode on a first electrode surface 21 and a second electrode on a second electrode surface 22, the first electrode surface 21 on the piezoelectric layer 2 extends to cover one side surface of the insulating layer 3, and the second electrode surface 22 extends to cover the other side surface of the insulating layer 3 and shares an electrode with the insulating layer 3. The flexible circuit board assembly in this embodiment includes a first flexible circuit board assembly 51 and a second flexible circuit board assembly 52, and the flexible circuit board assemblies are bonded to the insulating layer 3.
It is possible that a first flexible circuit board assembly 51 is attached to the upper surface of the left insulating layer 3 to connect the first electrodes of the piezoelectric layer 2 and a second flexible circuit board assembly 52 is attached to the lower surface of the right insulating layer 3 to connect the second electrodes of the piezoelectric layer 2. Alternatively, the first flexible circuit board assembly 51 is attached to the upper surface of the right side insulating layer 3 to connect the first electrodes of the piezoelectric layer 2, and the second flexible circuit board assembly 52 is attached to the lower surface of the left side insulating layer 3 to connect the second electrodes of the piezoelectric layer 2. Alternatively, the first flexible circuit board assembly 51 is attached to the upper surface of the left insulating layer 3 to connect the first electrodes of the piezoelectric layer 2, and the second flexible circuit board assembly 52 is attached to the lower surface of the left insulating layer 3 to connect the second electrodes of the piezoelectric layer 2. It is also possible that a first flexible circuit board assembly 51 is attached to the upper surface of the right insulating layer 3 to connect the first electrodes of the piezoelectric layer 2, and a second flexible circuit board assembly 52 is attached to the lower surface of the right insulating layer 3 to connect the second electrodes of the piezoelectric layer 2.
In the present embodiment, the first flexible circuit board assembly 51 leads out a plurality of first electrode lead units 511, the first flexible circuit board assembly 51 is bonded to the upper surface of the left insulating layer 3, and the first electrode lead units 511 are electrically connected to the first electrodes of the piezoelectric layer 2; a plurality of second electrode lead units 521 are led out of the second flexible circuit board assembly 52, the second flexible circuit board assembly 52 is adhered to the lower surface of the right side insulating layer 3, and the second electrode lead units 521 are electrically connected with the second electrodes of the piezoelectric layer 2.
The piezoelectric array elements 23 of the piezoelectric layer 2 have a certain number relationship with the electrode lead elements, specifically: the piezoelectric layer 2 is set to include N piezoelectric array elements 23, and when N is even number, the number of the first electrode lead units 511 is set to
Each two adjacent piezoelectric array elements 23 are connected with a first electrode lead unit 511; the number of the second electrode lead units 521 is
The piezoelectric array elements 23 at the head end and the tail end are respectively connected with a second electrode lead unit 521, and the rest are
In each piezoelectric array element 23, every two adjacent piezoelectric array elements 23 are connected with a second electrode lead wire unit 521;
when N is an odd number, the number of the first electrode lead units 511 is
The piezoelectric array element 23 at the head end or the tail end is connected with a first electrode lead unit 511, and the rest are
In each piezoelectric array element 23, every two adjacent piezoelectric array elements 23 are connected with a first electrode lead unit 511; the number of the second electrode lead units 521 is
The piezoelectric array element 23 at the head end or the tail end is connected with a second electrode lead unit 521, and the rest are
In each piezoelectric array element 23, two adjacent piezoelectric array elements 23 are connected with one second electrode lead unit 521.
Example 2
This embodiment provides a way of connecting the circuits of the wired array transducer to which the present invention is applied. Referring to fig. 3-6, the flexible circuit board assemblies respectively lead out the piezoelectric array elements 23 from the upper and lower surfaces of the piezoelectric layer 2 in a staggered manner, and the electrode lead units are arranged at intervals, specifically, any two electrode lead units are not on the same straight line. The spacing between adjacent electrode lead elements on the flexible circuit board assembly may be enlarged by placing the first electrode lead element 511 on the same side of the first electrode face 21, the second electrode lead element 521 on the same side of the second electrode face 22, the first and second electrode lead elements 511, 521 being disposed on opposite sides; the first electrode lead elements 511 may be alternately disposed on both sides of the first electrode surface 21, and the second electrode lead elements 521 may be alternately disposed on both sides of the second electrode surface 22.
Specifically, referring to fig. 3 and 4, there is a specific scheme in which the first electrode lead element 511 is disposed on the same side of the first electrode face 21, the second electrode lead element 521 is disposed on the same side of the second electrode face 22, and the first electrode lead element 511 and the second electrode lead element 521 are disposed on opposite sides to enlarge the interval between the adjacent electrode lead elements on the flexible circuit board assembly. The piezoelectric array element 23 is numbered as PE1, PE2, PE3, PE4 … … from left to right in sequence as shown, the first electrode lead unit 511 is numbered as UF1, the UF2 … … is numbered as UF1 in sequence, the second electrode lead unit 521 is numbered as DF1 in sequence, DF2 … … is provided, wherein UF1 is connected with the first electrodes of PE1 and PE2, and UF2 is connected with the first electrodes of PE3 and PE 4; DF1 was connected to the second electrode of PE1, DF2 was connected to the second electrodes of PE2 and PE 3; UF1, UF2 are located contralaterally to DF1, DF 2. PE1 works when excitation is applied to UF1 and DF 1; PE2 works when excitation is applied to UF1 and DF 2; when UF2 and DF2 are excited, PE3 works … … so that the width of the electrode lead elements is less than twice the width of the piezoelectric array element 23 plus the array element gap 24(2We + Ke), and the pitch of the electrode lead elements is 2 times the pitch (2PE) of the piezoelectric array element 23, so that the piezoelectric array element 23 of the transducer can be effectively led out. The flexible circuit board assembly with the same specification can lead out the piezoelectric array elements 23 of the transducer with smaller width of the piezoelectric array elements 23 and array element gaps 24.
Referring to fig. 5 and 6, a specific scheme is that the first electrode lead units 511 are alternately disposed on both sides of the first electrode plane 21, and the second electrode lead units 521 are alternately disposed on both sides of the second electrode plane 22 to enlarge the interval between the adjacent electrode lead units on the flexible circuit board assembly. The piezoelectric array element 23 is numbered as PE01, PE02, PE03 and PE04 … … from left to right in sequence as shown in the figure, the first electrode lead unit 511 is numbered as UF01, UF02, UF03 and UF04 … …, the second electrode lead unit 521 is numbered as DF01, DF02, DF03 and DF04 … … in sequence, wherein UF01 is connected with the first electrodes of PE01 and PE02, UF02 is connected with the first electrodes of PE03 and PE04, and UF03 is connected with the first electrodes of PE05 and PE 06; DF01 was connected to the second electrode of PE01, DF02 was connected to the second electrodes of PE02 and PE03, DF03 was connected to the second electrodes of PE04 and PE 05; DF03, UF03 were placed opposite DF02, UF 02. PE01 works when excitation is applied to DF01 and UF 01; PE02 works when excitation is applied to UF01 and DF 02; PE03 works when excitation is applied to DF02 and UF 02; when excitation is applied to UF02 and DF03, PE04 works … … to further expand the spacing between adjacent electrode lead elements on a flexible circuit board assembly relative to the arrangement shown in fig. 3.
Example 3
Referring to the specification and to fig. 7, there is shown an excitation diagram of an ultrasound system employing an array transducer of the present invention. In the figure, taking an array of 8 piezoelectric array elements 23 as an example, the excitation signal 71 adjusts the sequence and start time of excitation through the electronic delays 72 with different time lengths, and controls the on and off states of the excitation signal 71 through the electronic switch 73, and then the excitation signal 71 drives the piezoelectric array elements 23 of the transducer to operate: the piezoelectric array element 23 emits ultrasonic waves to form a focus at the target tissue 74; the ultrasonic echo reflected by the tissue is received by the piezoelectric array element 23 of the transducer, converted into an electric signal and processed to form an ultrasonic image.
Wherein, the driving of the piezoelectric array element 23 of the transducer by the excitation signal 71 includes: when the first electrode surfaces 21 of two adjacent piezoelectric array elements 23 are connected with the same first electrode lead unit 511 together, and the second electrode surfaces 22 are connected with two second electrode lead units 521 respectively, the first electrode lead unit 511 and one second electrode lead unit 521 are excited, one piezoelectric array element 23 works, the first electrode lead unit 511 and the other second electrode lead unit 521 are excited, and the other piezoelectric array element 23 works;
when the first electrode surfaces 21 of two adjacent piezoelectric array elements 23 are respectively connected with two first electrode lead elements 511, and the second electrode surfaces 22 are commonly connected with the same second electrode lead element 521, one first electrode lead element 511 and the second electrode lead element 521 are excited, one piezoelectric array element 23 works, the other first electrode lead element 511 and the second electrode lead element 521 are excited, and the other piezoelectric array element 23 works.
In summary, the invention provides an array transducer, based on the existing transducer connection technology, the first flexible circuit board assembly and the second flexible circuit board assembly are adopted to respectively realize the electrical interconnection between the piezoelectric layer and the external circuit in a wiring mode of leading out the piezoelectric array elements on the two side surfaces of the piezoelectric layer in a staggered manner, the implementation is easy, the restriction of the flexible circuit board processing technology on the array transducer preparation is relieved, and the array transducer with higher frequency can be prepared without increasing the process complexity and difficulty.
The above-mentioned embodiments are only preferred embodiments of the present invention, and not intended to limit the present invention, and various modifications other than the above-mentioned embodiments may be made, and the technical features of the above-mentioned embodiments may be combined with each other, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. An array transducer is characterized by comprising an acoustic lens, a matching layer, a first flexible circuit board assembly, a piezoelectric layer, a second flexible circuit board assembly and a backing layer which are sequentially arranged, wherein the first flexible circuit board assembly and the second flexible circuit board assembly respectively comprise at least one flexible circuit board, a first electrode surface and a second electrode surface of the piezoelectric layer are respectively provided with an electrode, and the electrodes on each side surface of the first electrode surface and the second electrode surface are cut to enable the piezoelectric layer to form a plurality of piezoelectric array elements;
the first flexible circuit board assembly is arranged on the first electrode surface, a plurality of first electrode lead units are led out of the first flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same first electrode lead unit;
the second flexible circuit board assembly is arranged on the second electrode surface, a plurality of second electrode lead units are led out of the second flexible circuit board assembly, and at least one pair of adjacent piezoelectric array elements are connected with the same second electrode lead unit.
2. The array transducer of claim 1, wherein the piezoelectric layer comprises N piezoelectric array elements, and when N is an even number, the number of the first electrode lead elements is equal to
Every two adjacent piezoelectric array elements are connected with one first electrode lead unit; the number of the second electrode lead units is
The piezoelectric array elements at the head end and the tail end are respectively connected with one second electrode lead unit, and the rest are
In each piezoelectric array element, every two adjacent piezoelectric array elements are connected with one second electrode lead unit;
when N is odd number, the number of the first electrode lead units is
The piezoelectric array element at the head end or the tail end is connected with one first electrode lead unit, and the rest are connected with the other electrode lead units
In each piezoelectric array element, every two adjacent piezoelectric array elements are connected with one first electrode lead unit; the number of the second electrode lead units is
The piezoelectric array element at the head end or the tail end is connected with one second electrode lead unit, and the rest are
In each piezoelectric array element, every two adjacent piezoelectric array elements are connected with one second electrode lead unit.
3. The array transducer of claim 1, wherein the first electrode lead elements are distributed on the same side of the first electrode face and the second electrode lead elements are distributed on the same side of the second electrode face;
or the first electrode lead units are alternately distributed on two sides of the first electrode surface, and the second electrode lead units are alternately distributed on two sides of the second electrode surface.
4. The array transducer of claim 1, wherein the piezoelectric layer is provided with insulating layers on both sides, a first electrode surface of the piezoelectric layer extends to cover one side surface of the insulating layer, and a second electrode surface of the piezoelectric layer extends to cover the other side surface of the insulating layer.
5. The array transducer of claim 4, wherein the first flexible circuit board assembly and/or the second flexible circuit board assembly is bonded to the insulating layer;
and/or the first flexible circuit board assembly and/or the second flexible circuit board assembly are/is adhered with the piezoelectric layer.
6. The array transducer of claim 1 or 4, wherein the matching layer and the backing layer are conductive layers, the first flexible circuit board assembly and/or the second flexible circuit board assembly adhering to the matching layer;
and/or the first flexible circuit board assembly and/or the second flexible circuit board assembly are/is adhered to the backing layer.
7. The array transducer of claim 1, wherein the first and second flexible circuit board assemblies are electrical connectors comprising an integrated circuit, a soft FPC board, and a hard FPC board.
8. The array transducer of claim 1, wherein the acoustic lens comprises a concave lens and a convex lens.
9. The array transducer of claim 1, wherein the backing layer is one or more layers;
and/or, the piezoelectric layer is one or more layers;
and/or, the matching layer is one or more layers;
and/or the acoustic lens is one or more layers.
10. An ultrasound system comprising an array transducer as claimed in any one of claims 1 to 9, an electronic delay and a switch, said array transducer comprising a plurality of piezoelectric array elements, one said electronic delay being connected to each said piezoelectric array element, and said switch being connected between each said electronic delay and said piezoelectric array element.
11. The excitation method of the ultrasonic system as claimed in claim 10, wherein the excitation signal adjusts the excitation sequence and the start time of the piezoelectric array element by the electronic delays with different time lengths, and controls the on and off states of the excitation signal through the switch; then the excitation signal drives the piezoelectric array element to work;
the step of driving the piezoelectric array element to work by the excitation signal comprises the following steps:
when the first electrode surfaces of two adjacent piezoelectric array elements are connected with the same first electrode lead unit and the second electrode surfaces are connected with two second electrode lead units respectively, excitation is applied to the first electrode lead unit and one second electrode lead unit, one piezoelectric array element works, excitation is applied to the first electrode lead unit and the other second electrode lead unit, and the other piezoelectric array element works;
when two are adjacent piezoelectric array element first electrode face connect two respectively first electrode lead wire unit, the second electrode face is same jointly connected during the second electrode lead wire unit, to one first electrode lead wire unit with the excitation is applyed to second electrode lead wire unit, one piezoelectric array element work, to another first electrode lead wire unit with the excitation is applyed to second electrode lead wire unit, another piezoelectric array element work.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110681261.4A CN113333261B (en) | 2021-06-18 | 2021-06-18 | High-frequency array transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110681261.4A CN113333261B (en) | 2021-06-18 | 2021-06-18 | High-frequency array transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113333261A true CN113333261A (en) | 2021-09-03 |
| CN113333261B CN113333261B (en) | 2022-07-08 |
Family
ID=77477703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110681261.4A Active CN113333261B (en) | 2021-06-18 | 2021-06-18 | High-frequency array transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113333261B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024066372A1 (en) * | 2023-05-09 | 2024-04-04 | 深圳迈瑞生物医疗电子股份有限公司 | Array element leading-out structure of ultrasonic probe, sound head and ultrasonic probe |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2865867Y (en) * | 2006-03-09 | 2007-02-07 | 上海爱培克电子科技有限公司 | Ultrasonic transducer |
| CN104887264A (en) * | 2014-03-04 | 2015-09-09 | 三星麦迪森株式会社 | Ultrasound probe and method of manufacturing ultrasound probe |
| WO2016129829A1 (en) * | 2015-02-10 | 2016-08-18 | 경북대학교 산학협력단 | Ultrasonic transducer, and ultrasound device including same and method of manufacturing same |
| CN106805994A (en) * | 2015-11-27 | 2017-06-09 | 中国科学院深圳先进技术研究院 | ultrasonic probe and preparation method thereof |
| CN109700479A (en) * | 2019-02-25 | 2019-05-03 | 南京广慈医疗科技有限公司 | A kind of two-dimensional array ultrasound imaging probe |
-
2021
- 2021-06-18 CN CN202110681261.4A patent/CN113333261B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2865867Y (en) * | 2006-03-09 | 2007-02-07 | 上海爱培克电子科技有限公司 | Ultrasonic transducer |
| CN104887264A (en) * | 2014-03-04 | 2015-09-09 | 三星麦迪森株式会社 | Ultrasound probe and method of manufacturing ultrasound probe |
| WO2016129829A1 (en) * | 2015-02-10 | 2016-08-18 | 경북대학교 산학협력단 | Ultrasonic transducer, and ultrasound device including same and method of manufacturing same |
| CN106805994A (en) * | 2015-11-27 | 2017-06-09 | 中国科学院深圳先进技术研究院 | ultrasonic probe and preparation method thereof |
| CN109700479A (en) * | 2019-02-25 | 2019-05-03 | 南京广慈医疗科技有限公司 | A kind of two-dimensional array ultrasound imaging probe |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024066372A1 (en) * | 2023-05-09 | 2024-04-04 | 深圳迈瑞生物医疗电子股份有限公司 | Array element leading-out structure of ultrasonic probe, sound head and ultrasonic probe |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113333261B (en) | 2022-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2610860B1 (en) | Ultrasound probe and manufacturing method thereof | |
| US5957850A (en) | Multi-array pencil-sized ultrasound transducer and method of imaging and manufacture | |
| CN107398415B (en) | Ultrasonic transducer and method of manufacturing ultrasonic transducer | |
| US8604671B2 (en) | Ultrasound transducer, ultrasound probe, and a method for manufacturing ultrasound transducers | |
| US7622848B2 (en) | Transducer assembly with z-axis interconnect | |
| KR101137262B1 (en) | Probe for ultrasonic diagnostic apparatus and manufacturing method thereof | |
| JP4408974B2 (en) | Ultrasonic transducer and manufacturing method thereof | |
| KR101137261B1 (en) | Probe for ultrasonic diagnostic apparatus and manufacturing method thereof | |
| JP2011223468A (en) | Ultrasonic transducer and ultrasonic probe | |
| CN103202711A (en) | Ultrasonic probe and manufacturing method thereof | |
| CN113333261B (en) | High-frequency array transducer | |
| JP5038808B2 (en) | Ultrasonic transducer and ultrasonic probe with ultrasonic transducer | |
| Latham et al. | A 30-MHz, 3-D imaging, forward-looking miniature endoscope based on a 128-element relaxor array | |
| JP5461769B2 (en) | Ultrasonic transducer, ultrasonic probe, and method of manufacturing ultrasonic transducer | |
| JP5148359B2 (en) | Ultrasonic transducer, method for manufacturing ultrasonic transducer, and ultrasonic probe | |
| CN111317507B (en) | Acoustic head of area array ultrasonic probe and area array ultrasonic probe | |
| KR20140132991A (en) | Ultrasound probe of matrix array shape using stratification crisscross structure and manufacturing method thereof | |
| CN209252920U (en) | A kind of ultra-high density arrays energy converter | |
| JP3934202B2 (en) | Ultrasonic probe | |
| JP2010099245A (en) | Ultrasonic transducer, ultrasonic probe and method of manufacturing ultrasonic transducer | |
| CN108926362A (en) | A kind of ultra-high density arrays energy converter | |
| EP3900847B1 (en) | Ultrasonic probe | |
| JP2008054703A (en) | Ultrasonic transducer | |
| WO2023183978A1 (en) | A high frequency, high resolution 2d phased array ultrasonic transducer | |
| JP5268421B2 (en) | Ultrasonic transducer manufacturing method and ultrasonic probe manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |