CN113325017A - Equipment for high-energy beam processing and secondary electron detection method - Google Patents
Equipment for high-energy beam processing and secondary electron detection method Download PDFInfo
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- CN113325017A CN113325017A CN202110612421.XA CN202110612421A CN113325017A CN 113325017 A CN113325017 A CN 113325017A CN 202110612421 A CN202110612421 A CN 202110612421A CN 113325017 A CN113325017 A CN 113325017A
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- 238000012545 processing Methods 0.000 title claims abstract description 46
- 238000001514 detection method Methods 0.000 title claims abstract description 9
- 238000003466 welding Methods 0.000 claims abstract description 25
- 238000003754 machining Methods 0.000 claims abstract description 16
- 238000001816 cooling Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 8
- 238000012544 monitoring process Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
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- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
Abstract
The invention discloses equipment for high-energy beam processing, which comprises a numerical control platform and a welding cabin, wherein a high-energy beam generator is erected above the numerical control platform, a focusing system is arranged at a lower-end emitting port of the high-energy beam generator, a lower-end secondary electron collector is fixed on the numerical control platform, an upper-end secondary electron collector is arranged between the lower-end secondary electron collector and the high-energy beam generator, the upper-end secondary electron collector and the lower-end secondary electron collector are respectively provided with a plurality of collecting boards and a fixed-value resistor, the upper-end secondary electron collector and the lower-end secondary electron collector are respectively and electrically connected with an oscilloscope, the oscilloscope is electrically connected with a controller, the controller is electrically connected with a display, and the oscilloscope and the controller are respectively and electrically connected with a power supply. The invention has the beneficial effects that: the detection of the direction and the distribution of secondary electrons on the upper surface and the lower surface of a machined workpiece is realized, the strength of the energy density of high-energy beams is judged, the monitoring of the machining process is ensured, the machining yield is improved, and a basis is provided for controlling the parameters of the high-energy beams in real time.
Description
Technical Field
The invention relates to the technical field of high-energy beam processing, in particular to equipment for high-energy beam processing and a secondary electron detection method.
Background
The high energy beam emitted from the high energy beam generator comprises laser beam, electron beam, ion beam, electric spark, etc., and the power density supplied to the surface of the material is not less than 103W/cm2The processing forms include welding, additive, drilling, sintering and the like. When the high energy beam bombards the material, a small amount of electrons overflow from the surface of the material due to particle impact or temperature rise of the material, the overflowing electrons are called secondary electrons, and the molten pool of the material which is bombarded by the high energy beam is vaporized to generate fine air pockets called air holes. The secondary electron direction is closely related to the molten pool and the air holes, and the drastic change of the secondary electron distribution can be summarized into the drastic change of the air hole state, so that whether the energy density is too strong or too weak can be represented. This function cannot be achieved by detecting only the total amount of secondary electrons, and the lack of secondary electron distribution does not indicate to the operator that the relevant adjustment is to be made, for example, the incident high energy beam is not perpendicular to the solder material, and the adjustment direction must be referenced to the secondary electron distribution data. The completely melted through high-energy beam processing material also has a small amount of secondary electrons at the bottom, and the electrons can effectively represent the melting through state and are represented as follows: not melted through, melted through and air hole penetration.
High-energy beam processing is commonly used in the manufacturing fields of aerospace, medical instruments, precision instruments and the like, the cost of processed parts is high, the manufacturing cost is greatly increased due to excessive test pieces and rejection rate, and the production efficiency is reduced. High energy beam processing often needs to be done in the weld chamber because ambient gases can affect the quality of the processing of many high energy beams. Some high energy beams, such as electron beam machining, also require isolation by lead plates, where personnel operate outside of the isolation, because some high energy beams can produce radiation that is harmful to humans, such as X-rays, that must be shielded by a metal plate, such as a lead plate, of suitable thickness.
During high-energy beam processing, the phenomenon of unstable molten pool cannot be monitored in real time, or the phenomenon depends on direct observation of naked eyes, quantitative data is lacked, and processing parameters cannot be adjusted in real time. During the processing, experimenters often need to adjust the parameters of the high energy beam through observation and experience, and the method has great uncertainty and is an important factor causing the increase of the rejection rate. At the present stage, an effective technology for monitoring the processing quality of the high-energy beam in real time is lacked, and index data cannot be obtained for reference so as to adjust the processing parameters.
Disclosure of Invention
The present invention is directed to a high energy beam processing apparatus and a secondary electron detection method, which solve the above problems.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an equipment for high energy beam processing, includes numerical control platform and welds the cabin, high energy beam generator has been erect to numerical control platform's top, numerical control platform and high energy beam generator all set up in welding the under-deck, the lower extreme delivery port department of high energy beam generator is equipped with the focus system, be fixed with lower extreme secondary electron collector on the numerical control platform, be equipped with upper end secondary electron collector between lower extreme secondary electron collector and the high energy beam generator, upper end secondary electron collector and lower extreme secondary electron collector all are equipped with polylith collection board and a plurality of definite value resistance, the equal electric connection of upper end secondary electron collector and lower extreme secondary electron collector has the oscilloscope, oscilloscope electric connection has the controller, controller electric connection has the display, the equal electric connection of oscilloscope and controller has the power.
Preferably, the upper secondary electron collector is provided with four collecting plates and four constant-value resistors.
Preferably, the four collecting plates of the upper secondary electron collector are combined into a frustum structure with a rectangular horizontal section, the surface area of the upper section of the frustum structure is smaller than that of the lower section of the frustum structure, and the four collecting plates are respectively and correspondingly connected with the four fixed-value resistors.
Preferably, the lower secondary electron collector is provided with three collecting plates and three constant-value resistors.
Preferably, the three collecting plates of the lower secondary electron collector form a groove structure with an isosceles trapezoid vertical section, the length of the upper bottom of the groove structure is greater than that of the lower bottom of the groove structure, the three collecting plates are respectively and correspondingly connected with the three constant value resistors, and the three collecting plates are designed to be rectangular strip-shaped structures.
Further preferably, the oscilloscope, the controller and the power supply are all installed in the same sealed box with good heat conductivity.
Further preferably, the seal box is made of metal materials, and a cooling plate is arranged below the seal box.
Further preferably, the controller is electrically connected with an indicator light, and a camera is arranged above the indicator light.
Further preferably, a viewing window is arranged on the welding cabin corresponding to the display.
The invention also provides a secondary electron detection method for high-energy beam processing, which comprises the following steps:
s1) fixing the processing workpiece on the numerical control platform, wherein the processing workpiece is fixed between the upper secondary electron collector and the lower secondary electron collector;
s2), the numerical control platform acts to adjust the position of the processed workpiece and align the processing surface of the processed workpiece to the high-energy beam generator;
s3) starting the high-energy beam generator, adjusting the focusing system, and converging the high-energy beam emitted by the high-energy beam generator at one point and acting on the surface of the processed workpiece;
and S4) the numerical control platform acts to drive the machined workpiece to move along the welding seam on the machined surface, the upper secondary electron collector and the lower secondary electron collector collect secondary electrons overflowing from the machined workpiece, and voltage signals of the secondary electrons are converted into visual information through the oscilloscope and the controller and are output by the display.
Has the advantages that: according to the high-energy beam processing equipment, the detection of the secondary electrons on the upper surface and the lower surface of a processed workpiece is realized through the upper secondary electron collector and the lower secondary electron collector, the direction and the distribution of the secondary electrons can be detected, the offset of a welding seam in each direction is calculated, the air hole state is detected, and the energy density of the high-energy beam and whether the incident angle is proper or not are judged; the processing quality can be monitored in real time through the camera and the display, real-time adjustment is facilitated, monitoring of the high-energy beam processing process is guaranteed, the high-energy beam processing yield is improved, and a basis is provided for real-time control of high-energy beam parameters; the welding cabin can be used without leading out of the welding cabin and transforming the welding cabin, and the plug and play method can ensure the air tightness of high-energy beam processing equipment, and is simple to implement and strong in compatibility.
Drawings
Fig. 1 is a schematic structural diagram of a high-energy beam processing apparatus according to an embodiment of the present invention.
Reference numerals: 1-numerical control platform, 2-high energy beam generator, 3-focusing system, 4-workpiece fixture, 5-processing workpiece, 6-upper end secondary electron collector, 7-lower end secondary electron collector, 8-oscilloscope, 9-controller, 10-power supply, 11-seal box, 12-cooling plate, 13-indicator light, 14-display, 15-camera, 16-welding cabin, and 17-observation window.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
Examples
As shown in fig. 1, an apparatus for high energy beam processing comprises a numerical control platform 1 and a welding cabin 16, a high energy beam generator 2 is erected above the numerical control platform 1, the numerical control platform 1 and the high energy beam generator 2 are both arranged in the welding cabin 16, a focusing system 3 is arranged at a lower end emitter of the high energy beam generator 2, a lower end secondary electron collector 7 is fixed on the numerical control platform 1, an upper end secondary electron collector 6 is arranged between the lower end secondary electron collector 7 and the high energy beam generator 2, the upper end secondary electron collector 6 and the lower end secondary electron collector 7 are both provided with a plurality of collecting plates and a plurality of fixed value resistors, the upper end secondary electron collector 6 and the lower end secondary electron collector 7 are both electrically connected with an oscilloscope 8, the oscilloscope 8 is electrically connected with a controller 9, the controller 9 is electrically connected with a display 14, the oscilloscope 8 and the controller 9 are both electrically connected with a power supply 10.
In the application, the numerical control platform 1 is used for installing, fixing and moving a machining workpiece 5, a plurality of workpiece clamps 4 are arranged on the numerical control platform 1, the machining workpiece 5 is fixed through the workpiece clamps 4, the machining workpiece 5 is ensured to be fixed between an upper-end secondary electron collector 6 and a lower-end secondary electron collector 7, and the secondary electron collector is ensured to be capable of collecting secondary electrons overflowing during machining of the machining workpiece 5; the high-energy beam generator 2 is used for emitting high-energy beams, and the focus of the high-energy beams is adjusted through the focusing system 3 to realize the welding of products; the upper secondary electron collector 6 is used for detecting secondary electrons of the processed upper surface of the processed workpiece 5, and the lower secondary electron collector 7 is used for detecting secondary electrons of the processed lower surface of the processed workpiece 5; the oscilloscope 8 is used for converting the voltage signal into a digital signal, the controller 9 is used for visualizing the related data and outputting the data through the display 14, and an operator observes the display content on the display 14 through the observation window 17 in real time, so that the processing quality can be detected and the processing parameters can be adjusted conveniently.
In this application, numerical control platform 1, high energy beam generator 2, focusing system 3, upper end secondary electron collector 6, lower extreme secondary electron collector 7, oscilloscope 8, controller 9, power 10, pilot lamp, 14 grades of cameras 15 of display all set up in welding cabin 16, need not to lead wire outside the welding cabin, need not to reform transform (like trompil or wiring) the welding cabin and can use, plug-and-play, guarantee the gas tightness of high energy beam processing equipment, implement simply and compatible strong.
Preferably, the upper secondary electron collector 6 is provided with four collecting plates and four constant value resistors; the four collecting plates of the upper secondary electron collector 6 are combined into a frustum structure with a rectangular horizontal section, the surface area of the upper section of the frustum structure is smaller than that of the lower section of the frustum structure, and the four collecting plates are respectively and correspondingly connected with the four fixed-value resistors. In this application, upper end secondary electron collector 6 is fixed in between processing work piece 5 and the high energy beam generator 2, a collection for the secondary electron of machined surface, four orientations all around of the direction of feed of processing work piece 5 are located to its four collection board branches, be the frustum structure, can gather the distribution of the secondary electron of all directions, be connected through four definite value resistance and four collection boards, realize the difference output of the data on the collection board of four directions, the direction and the distribution of detectable secondary electron, can calculate the offset of all directions welding seams, and then detect the pore state, judge whether too strong or too weak of high energy beam energy density, incident angle is suitable.
Preferably, the lower secondary electron collector 7 is provided with three collecting plates and three constant value resistors; the three collecting plates of the lower-end secondary electron collector 7 are combined into a groove structure with an isosceles trapezoid vertical section, the length of the upper bottom of the groove structure is larger than that of the lower bottom of the groove structure, the three collecting plates are respectively connected with three constant-value resistors in a corresponding mode, and the three collecting plates are designed to be rectangular strip-shaped structures. In the application, the lower secondary electron collector 7 is fixed below the processing workpiece 5, is used for detecting secondary electrons at the bottom of the processing, and can synchronously move along with the numerical control platform 1; three collecting plates of the lower secondary electron collector 7 are respectively arranged along the left, the middle and the right of the feeding direction of the processed workpiece 5, so that secondary electron distribution in two directions can be obtained, and the offset of a welding line in the left and the right directions can be calculated, wherein the thickness of the middle collecting plate is thick, and the direct impact of a high-energy beam can be absorbed. For a completely welded workpiece, the fusion state can be effectively detected, if the workpiece is not fused, fused and penetrated by air holes, the total energy of the high-energy beam is too small or the energy density is too weak if the workpiece is not fused, and the total energy of the high-energy beam is too large or the energy density is too strong if the workpiece is penetrated by the air holes.
Preferably, the oscilloscope 8, the controller 9 and the power supply 10 are all installed in the same sealed box 11 with good heat conductivity; the seal box 11 is made of metal materials, and a cooling plate 12 is arranged below the seal box 11. In this application, seal box 11 is used for protecting oscilloscope 8, controller 9 and power 10, prevents that high energy from restrainting, secondary electron from influencing it, leads to oscilloscope 8, controller 9 and power 10 to damage or detect data inaccurate, simultaneously cooling plate 12 can realize thermal-insulated and dispel the heat fast, guarantees oscilloscope 8, controller 9 and power 10's normal work.
Preferably, the controller 9 is electrically connected with an indicator light 13, a camera 15 is arranged above the indicator light 13, the indicator light 13 is used for displaying the working state of the equipment, and the camera 15 is used for observing the processing quality and the processing state.
Preferably, an observation window 17 is arranged on the welding cabin 16 corresponding to the display 14, so that an operator can monitor the processing quality in real time.
The application discloses a secondary electron detection method for high-energy beam processing, which comprises the following steps of:
s1) fixing the processed workpiece 5 on the numerical control platform 1, and fixing the processed workpiece 5 between the upper secondary electron collector 6 and the lower secondary electron collector 7 through the workpiece clamp 4;
s2), the numerical control platform 1 acts, the position of the processed workpiece 5 is adjusted through the movement of the numerical control platform 1 in the directions of x, y and z axes, and the processing surface of the processed workpiece 5 is aligned to the high-energy beam generator 2;
s3) starting the high-energy beam generator 2, adjusting the focusing system 3 to enable the high-energy beam emitted by the high-energy beam generator 2 to be converged at one point and act on the surface of the processed workpiece 5, and ensuring that the high-energy beam emitted by the high-energy beam generator 2 can weld the weld of the processed workpiece 5;
s4), the numerical control platform 1 acts to drive the processed workpiece 5 to move along the welding seam on the processed surface, the acquisition boards of the upper secondary electron collector 6 and the lower secondary electron collector 7 acquire secondary electrons overflowing from the processed workpiece 5, the secondary electrons flow to the ground through the fixed-value resistor, voltage signals generated in the fixed-value resistor are transmitted to the oscilloscope 8, the voltage signals are converted into digital signals through the oscilloscope 8, then the digital signals are transmitted to the controller 9, and relevant data are visualized through calculation of the controller and are output by the display 14.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the content of the present invention within the scope of the protection of the present invention.
Claims (10)
1. An apparatus for high energy beam processing, characterized by: the welding device comprises a numerical control platform and a welding cabin, wherein a high-energy beam generator is erected above the numerical control platform, the numerical control platform and the high-energy beam generator are both arranged in the welding cabin, a focusing system is arranged at a lower end emitting port of the high-energy beam generator, a lower end secondary electron collector is fixed on the numerical control platform, an upper end secondary electron collector is arranged between the lower end secondary electron collector and the high-energy beam generator, the upper end secondary electron collector and the lower end secondary electron collector are both provided with a plurality of collecting plates and a plurality of fixed-value resistors, the upper end secondary electron collector and the lower end secondary electron collector are both electrically connected with an oscilloscope, the oscilloscope is electrically connected with a controller, the controller is electrically connected with a display, and the oscilloscope and the controller are both electrically connected with a power supply.
2. An apparatus for high energy beam machining according to claim 1, characterized in that: the upper secondary electron collector is provided with four collecting plates and four fixed-value resistors.
3. An apparatus for high energy beam machining according to claim 2, characterized in that: the four collecting plates of the upper secondary electron collector are combined into a frustum structure with a rectangular horizontal section, the surface area of the upper section of the frustum structure is smaller than that of the lower section of the frustum structure, and the four collecting plates are respectively and correspondingly connected with the four constant-value resistors.
4. An apparatus for high energy beam machining according to claim 1, characterized in that: the lower secondary electron collector is provided with three collecting plates and three constant value resistors.
5. An apparatus for high energy beam machining according to claim 4, characterized in that: the three collecting plates of the lower-end secondary electron collector form a groove structure with an isosceles trapezoid vertical section, the length of the upper bottom of the groove structure is larger than that of the lower bottom of the groove structure, the three collecting plates are respectively connected with the three constant-value resistors in a corresponding mode, and the three collecting plates are designed to be rectangular strip-shaped structures.
6. An apparatus for high energy beam machining according to claim 1, characterized in that: the oscilloscope, the controller and the power supply are all installed in the same sealed box with good heat conductivity.
7. An apparatus for high energy beam machining according to claim 6, characterized in that: the seal box is made of metal materials, and a cooling plate is arranged below the seal box.
8. An apparatus for high energy beam machining according to claim 1, characterized in that: the controller electric connection has the pilot lamp, the top of pilot lamp is equipped with the camera.
9. An apparatus for high energy beam machining according to claim 1, characterized in that: and an observation window is arranged on the welding cabin corresponding to the display.
10. A secondary electron detection method for high energy beam processing according to any one of claims 1 to 9, characterized by comprising the steps of:
s1) fixing the processing workpiece on the numerical control platform, wherein the processing workpiece is fixed between the upper secondary electron collector and the lower secondary electron collector;
s2), the numerical control platform acts to adjust the position of the processed workpiece and align the processing surface of the processed workpiece to the high-energy beam generator;
s3) starting the high-energy beam generator, adjusting the focusing system, and converging the high-energy beam emitted by the high-energy beam generator at one point and acting on the surface of the processed workpiece;
and S4) the numerical control platform acts to drive the machined workpiece to move along the welding seam on the machined surface, the upper secondary electron collector and the lower secondary electron collector collect secondary electrons overflowing from the machined workpiece, and voltage signals of the secondary electrons are converted into visual information through the oscilloscope and the controller and are output by the display.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110612421.XA CN113325017A (en) | 2021-06-02 | 2021-06-02 | Equipment for high-energy beam processing and secondary electron detection method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110612421.XA CN113325017A (en) | 2021-06-02 | 2021-06-02 | Equipment for high-energy beam processing and secondary electron detection method |
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| CN215179815U (en) * | 2021-06-02 | 2021-12-14 | 苏州鑫之博科技有限公司 | Equipment for high-energy beam processing |
-
2021
- 2021-06-02 CN CN202110612421.XA patent/CN113325017A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU1756070A1 (en) * | 1990-05-03 | 1992-08-23 | Сумское Производственное Объединение "Электрон" | Device for visualizing joints and seams for subsequent electron-beam welding |
| JP2001291485A (en) * | 2000-04-07 | 2001-10-19 | Jeol Ltd | Scanning electron microscope |
| CN101361153A (en) * | 2005-12-02 | 2009-02-04 | 阿利斯公司 | Ion sources, systems and methods |
| CN102324365A (en) * | 2005-12-02 | 2012-01-18 | 阿利斯公司 | Ion source, system and method |
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| CN215179815U (en) * | 2021-06-02 | 2021-12-14 | 苏州鑫之博科技有限公司 | Equipment for high-energy beam processing |
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