CN113315909B - Quick focusing and laminating method based on camera module AA (advanced manufacturing technology) process - Google Patents

Quick focusing and laminating method based on camera module AA (advanced manufacturing technology) process Download PDF

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CN113315909B
CN113315909B CN202110490977.6A CN202110490977A CN113315909B CN 113315909 B CN113315909 B CN 113315909B CN 202110490977 A CN202110490977 A CN 202110490977A CN 113315909 B CN113315909 B CN 113315909B
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lens
chip
data
field curvature
captured
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CN113315909A (en
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刘正
吴红
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Sunwin Hubei Optoelectronic Technology Co Ltd
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Sunwin Hubei Optoelectronic Technology Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60Control of cameras or camera modules
    • H04N23/67Focus control based on electronic image sensor signals
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Abstract

The invention relates to the technical field of camera module focusing, in particular to a quick focusing and attaching method based on an AA (advanced micro-electromechanical) process of a camera module, which comprises the following steps: s1, before the chip is captured, obtaining the data information of the chip surface, calculating the chip warping data through the background and storing the data; s2, capturing the field curvature of the lens before the lens seat is captured, aligning the field curvature of the lens with the background module, calculating and storing the field curvature data of the lens; and S3, comparing the chip warping data with the lens field curvature data for analysis so as to focus and attach the chip and the lens. According to the scheme, the warping information is calculated by capturing the background of the surface of the chip through the upper 3D camera, the bottom of the lens is captured through the lower industrial camera, the field curvature information of the lens is calculated according to the template, then focusing and attaching are carried out, the original other actions of AA are reduced, and the effect of rapid AA is achieved.

Description

Quick focusing and laminating method based on camera module AA (advanced manufacturing technology) process
Technical Field
The invention relates to the technical field of camera module focusing, in particular to a quick focusing and attaching method based on an AA (advanced manufacturing) process of a camera module.
Background
The camera module of the mobile phone has the clearest shooting distance, and when the distance between a shot object and the lens is the clearest shooting distance, the image obtained by the camera module (the fixed-focus module or the non-focused AF module) is clearest. After the assembly process of the camera module is completed, module manufacturers can focus AA on the camera module, and by adjusting the relative position between the lens and the sensor, the clearest shooting distance of the camera module is the preset optimal shooting distance required by a customer, and finally the relative position between the lens and the sensor is fixed.
The AA machine is a lens welder for dynamically calibrating a lens holder applied in the camera module industry, and in the production process of the camera module field, the AA machine faces the biggest problem of post-AA variation, and how to control the post-AA variation is the key to determine the AA yield, the process cost control and the quality control. In the industry, the AA equipment A has tedious product actions, so that the product quality is reduced, and the productivity and the efficiency are difficult to reach the standard.
Disclosure of Invention
The invention provides a quick focusing and laminating method based on an AA (auto focus) manufacturing process of a camera module, which solves the technical problem of low productivity caused by the fussy operation of the AA manufacturing process of the camera module.
The invention provides a quick focusing and attaching method based on an AA (advanced) manufacture procedure of a camera module, which aims to solve the technical problems and comprises the following steps:
s1, before the chip is captured, obtaining the data information of the chip surface, calculating the chip warping data through the background and storing the data;
s2, capturing the field curvature of the lens before the lens seat is captured, aligning the field curvature of the lens with the background module, calculating and storing the field curvature data of the lens;
and S3, comparing the chip warping data with the lens field curvature data for analysis to focus and joint the chip and the lens.
Optionally, the S1 specifically includes: before the chip is grabbed, the 3D industrial camera on the AA equipment is used for capturing the surface of the chip through 3D scanning, and the chip warping data is calculated through a background 3D algorithm.
Optionally, the S1 specifically includes: the chip surface was captured from top to bottom by 3D scanning with a 3D industrial camera on the AA device.
Optionally, the S2 specifically includes: and capturing the field curvature of the lens by an industrial camera at the bottom of the AA equipment, marking the field curvature of the lens with a reference surface of a standard module sample prestored in a background, and calculating and storing the field curvature data of the lens.
Optionally, the S2 specifically includes: the lens curvature of field is captured from bottom to top by an industrial camera at the bottom of the AA device.
Optionally, the lens is screwed into the lens holder.
Optionally, the S2 specifically includes: and (3) placing an industrial camera below to capture the bottom of the lens, and calculating the curvature of field data of the lens according to the template.
Has the advantages that: the invention provides a quick focusing and attaching method based on an AA (advanced manufacturing) process of a camera module, which comprises the following steps of: s1, before the chip is captured, obtaining the data information of the chip surface, calculating the chip warping data through the background and storing the data; s2, capturing the field curvature of the lens before the lens seat is captured, aligning the field curvature of the lens with the background module, calculating and storing the field curvature data of the lens; and S3, comparing the chip warping data with the lens field curvature data for analysis so as to focus and attach the chip and the lens. According to the scheme, the warping information is calculated by capturing the background of the surface of the chip through the upper 3D camera, the bottom of the lens is captured through the lower industrial camera, the field curvature data of the lens is calculated according to the template, then focusing and attaching are carried out, the original other actions of AA are reduced, and the effect of rapid AA is achieved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention and do not constitute a limitation of the invention. In the drawings:
FIG. 1 is a schematic flow chart of a method for rapid focusing and attaching based on an AA process of a camera module according to the present invention;
FIG. 2 is a schematic diagram of a surface of a 3D camera capture chip of the rapid focusing and attaching method based on the AA process of the camera module;
FIG. 3 is a schematic diagram of a capture lens of an industrial camera according to the present invention of an AA-based rapid focusing and attaching method.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention. The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 to 3, the present invention provides a method for fast focusing and attaching based on an AA process of a camera module, comprising the following steps: and S1, before the chip is captured, obtaining the data information of the chip surface, calculating the chip warping data through the background and storing the data. The method comprises the steps of firstly, scanning and obtaining surface data information of a chip by using an original 3D industrial camera on AA equipment, calculating chip warping data through a background 3D algorithm, and storing information in a background. Data processing is performed in the background. Wherein, the chip is on FPC, and the chip is located the 3D camera and is under 3D industry camera's the making a video recording for the whole complete exposure of chip is in the shooting scope of 3D camera, so that the clear quick complete acquisition chip surface data information of 3D camera, then carries out data processing and storage with data transmission to the host computer at backstage at the host computer.
And S2, capturing the field curvature of the lens before the lens base, aligning the captured field curvature of the lens with the background module, calculating the field curvature data of the lens and storing the field curvature data. The lens Holder, is integral with the lens, typically with the lens threaded into the Holder. On the AA device, below relative to the 3D camera, there is an industrial camera, i.e. the camera in fig. 3. The industrial camera shoots upwards to obtain the field curvature information of the lens, namely the lens base is placed right above the exposure range of the industrial camera, the camera can capture the field curvature of the lens, then the field curvature of the lens is transmitted to a background upper computer, a module is prestored in the upper computer, the module is the standard qualified lens field curvature and the fitting installation information corresponding to the chip, and the data of the field curvature of the lens is calculated and stored through the upper computer.
And S3, comparing the chip warping data with the lens field curvature data for analysis so as to focus and attach the chip and the lens. The focusing and laminating can be carried out by the chip warping data and the lens field curvature data. According to the scheme, warping information is calculated through an upper 3D camera capture chip surface background, the bottom of an industrial camera capture lens is arranged below, lens field curvature data is calculated according to a template, then focusing and attaching are carried out, the original other actions of AA are reduced, and the effect of rapid AA is achieved.
Optionally, the S1 specifically includes: before the chip is grabbed, the 3D industrial camera on the AA equipment is used for capturing the surface of the chip through 3D scanning, and the chip warping data is calculated through a background 3D algorithm. The original 3D industrial camera on the AA equipment is utilized to acquire the information of the surface of the chip, the original AA equipment is not required to be modified, the workload of upgrading and modifying is reduced, the material consumption and labor cost are saved, and the working efficiency is improved.
Alternatively, the chip surface is captured from top to bottom by 3D scanning with a 3D industrial camera on the AA device. The chip is scanned from top to bottom in a 3D mode, the lens is scanned from bottom to top correspondingly, the purpose of scanning and focusing is achieved, and the effect of rapid AA is achieved.
Optionally, the S2 specifically includes: and capturing the field curvature of the lens by an industrial camera at the bottom of the AA equipment, marking the field curvature of the lens with a reference surface of a standard module sample prestored in a background, and calculating and storing the field curvature data of the lens. The module is here a standard module sample. The standard module sample which can meet the delivery standard of a client is manufactured through processing, and the data of parts in the standard module sample, such as the data of the field curvature of the lens in the standard module sample, is stored. In the process of capturing the field curvature of the lens in the following actual production, the height of the field curvature of the lens is adjusted to be consistent with that of a standard module sample, so that the rapid focusing and fitting of the chip and the lens can be realized.
Optionally, the S2 specifically includes: the lens curvature of field is captured from bottom to top by an industrial camera at the bottom of the AA device. The method is corresponding to the method which uses a 3D industrial camera on the AA equipment to capture the surface of the chip from top to bottom through 3D scanning in the previous step, so that the consistency of the process is ensured, and the focusing and laminating efficiency is improved.
Optionally, the S2 specifically includes: and (3) placing an industrial camera below to capture the bottom of the lens, and calculating the curvature of field data of the lens according to the template. The industrial camera extracts the bottom information of the lens through the bottom of the lens base, so that the field curvature of the lens can be easily and accurately acquired. And an industrial camera is mounted on the AA device corresponding to the 3D industrial camera in the previous step.
Has the advantages that: the invention provides a quick focusing and attaching method based on an AA (advanced manufacturing) process of a camera module, which comprises the following steps of: s1, before the chip is captured, obtaining the data information of the chip surface, calculating the chip warping data through the background and storing the data; s2, capturing the field curvature of the lens before the lens seat is captured, aligning the field curvature of the lens with the background module, calculating and storing the field curvature data of the lens; and S3, comparing the chip warping data with the lens field curvature data for analysis so as to focus and attach the chip and the lens. According to the scheme, the warping information is calculated by capturing the background of the surface of the chip through the upper 3D camera, the bottom of the lens is captured through the lower industrial camera, the field curvature data of the lens is calculated according to the template, then focusing and attaching are carried out, the original other actions of AA are reduced, and the effect of rapid AA is achieved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the embodiments of the invention without departing from the spirit and scope of the invention, which is to be covered by the claims.

Claims (5)

1. A quick focusing and attaching method based on an AA (advanced manufacturing) process of a camera module is characterized by comprising the following steps of:
s1, before the chip is captured, obtaining the data information of the chip surface, calculating the chip warping data through the background and storing the data; specifically, the chip surface was captured from top to bottom by 3D scanning with a 3D industrial camera on the AA device;
s2, capturing the field curvature of the lens before the lens base, aligning the field curvature of the lens with the background, calculating and storing the field curvature data of the lens; specifically, a lens field curvature is captured through an industrial camera at the bottom of the AA equipment, and is aligned with a reference surface of a standard module sample prestored in a background, and lens field curvature data is calculated and stored;
and S3, comparing the chip warping data with the lens field curvature data for analysis so as to focus and attach the chip and the lens.
2. The method of claim 1, wherein the step S1 specifically comprises: before the chip is grabbed, the 3D industrial camera on the AA equipment is used for capturing the surface of the chip through 3D scanning, and the chip warping data is calculated through a background 3D algorithm.
3. The method of claim 1, wherein the step S2 specifically comprises: the lens curvature of field is captured from bottom to top by an industrial camera at the bottom of the AA device.
4. The method of claim 1, wherein the lens is screwed into the lens holder.
5. The method of claim 1, wherein the step S2 specifically comprises: and (3) placing an industrial camera below to capture the bottom of the lens, and calculating the curvature of field data of the lens according to the template.
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CN101848333B (en) * 2009-03-25 2011-09-28 佛山普立华科技有限公司 Imaging device and focusing method thereof
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