CN113314679B - Bonding structure, manufacturing method thereof and display device - Google Patents
Bonding structure, manufacturing method thereof and display device Download PDFInfo
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- CN113314679B CN113314679B CN202110570752.1A CN202110570752A CN113314679B CN 113314679 B CN113314679 B CN 113314679B CN 202110570752 A CN202110570752 A CN 202110570752A CN 113314679 B CN113314679 B CN 113314679B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims abstract description 103
- 239000012790 adhesive layer Substances 0.000 claims abstract description 98
- 239000004568 cement Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 14
- 238000005507 spraying Methods 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000007493 shaping process Methods 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 7
- 239000002313 adhesive film Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The application relates to a bonding structure, a manufacturing method of the bonding structure and a display device, wherein the bonding structure is provided with a first bonding surface and a second bonding surface which are oppositely arranged, the bonding structure comprises a plurality of optical adhesive layers which are arranged between the first bonding surface and the second bonding surface in a stacked mode, each optical adhesive layer is provided with a through hole, in any two adjacent optical adhesive layers, the orthographic projection of the through hole on the optical adhesive layer close to one side of the second bonding surface on the first bonding surface completely covers the orthographic projection of the through hole on the optical adhesive layer close to one side of the first bonding surface on the first bonding surface. The bonding structure of this application can be directed against the nimble size that sets up each through-hole of user demand of difference, the light leak phenomenon that can not appear because the through-hole size is too big leads to. And the through-hole shaping is convenient, and each through-hole can not influence the machine-shaping of other through-holes when machine-shaping, when the bonding structure uses, accommodates protruding electronic component in the through-hole, excellent in use effect.
Description
Technical Field
The application relates to the technical field of display equipment bonding, in particular to a bonding structure, a manufacturing method of the bonding structure and a display device.
Background
With the upgrading and upgrading speed of electronic devices being increased, for electronic devices using an Organic Light Emitting Diode (OLED) display screen as a display component, the requirements for high integration and high performance are higher and lower, and the requirement for volume and size is smaller and smaller. In the related art, an opening on a bonding structure for bonding a display module and a touch module in an OLED display screen is usually needed to avoid a camera or other electronic components, so that a better imaging effect is obtained.
At present, the opening is mainly formed in the bonding structure in a cutting mode, but the cutting process is limited, the opening precision is not high, and the normal use is influenced.
Disclosure of Invention
Accordingly, it is necessary to provide a bonding structure, a method for manufacturing the same, and a display device, which are directed to the problems of low opening accuracy of the bonding structure, easy light leakage around the opening region, and influence on normal use.
The embodiment of the application provides a bonding structure, bonding structure has relative first bonding surface and the second bonding surface that sets up, bonding structure includes a plurality of optical cement layers of range upon range of each other arrangement between first bonding surface and second bonding surface, all is equipped with the through-hole on every optical cement layer, in arbitrary two adjacent optical cement layers, be close to the orthographic projection of through-hole on first bonding surface on the optical cement layer of second bonding surface one side, cover completely and be close to the orthographic projection of through-hole on first bonding surface on the optical cement layer of first bonding surface one side.
In some embodiments, the bonding structure includes a first adhesive layer and a second adhesive layer, a surface of the first adhesive layer facing away from the second adhesive layer is a first bonding surface, a surface of the second adhesive layer facing away from the first adhesive layer is a second bonding surface, a first through hole is formed in the first adhesive layer, a second through hole is formed in the second adhesive layer, and an orthographic projection of the second through hole on the first bonding surface completely covers an orthographic projection of the first through hole on the first bonding surface.
In some of these embodiments, the first through hole has a first central axis, the second through hole has a second central axis, and the first central axis and the second central axis coincide.
In some embodiments, the first through hole and the second through hole are both round holes, and the aperture of the first through hole is smaller than that of the second through hole.
In some embodiments, the optical adhesive layers are all liquid optical adhesive layers.
In some of these embodiments, the viscosity of the optical subbing layers is less than 100cps.
The embodiment of the application also provides a manufacturing method of the bonding structure, which comprises the following steps: the method comprises the following steps that a plurality of optical adhesive layers provided with through holes are arranged in a stacked mode to form a bonding structure, the bonding structure is provided with a first bonding surface and a second bonding surface which are arranged oppositely, and in any two adjacent optical adhesive layers, the orthographic projection of the through holes in the optical adhesive layers close to one side of the second bonding surface on the first bonding surface completely covers the orthographic projection of the through holes in the optical adhesive layers close to one side of the first bonding surface on the first bonding surface.
In some embodiments, the step of arranging a plurality of optical adhesive layers provided with through holes on top of each other to form a bonding structure is specifically: and spraying the optical cement for multiple times to form a plurality of optical cement layers in a laminated arrangement.
In some embodiments, after the step of spraying the optical cement multiple times to form the multiple optical cement layers of the stacked arrangement, the method further comprises the following steps: and carrying out ultraviolet curing on each optical adhesive layer.
An embodiment of the present application further provides a display device, including: the display module is provided with a display area and a non-display area at least partially surrounding the display area, a photosensitive element is arranged in the non-display area, and the photosensitive element comprises a step positioning structure protruding out of the surface of the display module; the touch panel is arranged opposite to the display module; and according to the bonding structure, the first bonding surface is bonded with the surface of the touch panel, the second bonding surface is bonded with the surface of the display module, and the step positioning structure is accommodated in the through hole of each optical adhesive layer.
Based on bonding structure and preparation method, display device of this application embodiment, through setting up a plurality of optics glue film that range upon range of each other and arrange, all be equipped with the through-hole on every optics glue film, then each through-hole all is fashioned alone, can be directed against the nimble size that sets up each through-hole of different user demands to the shaping of through-hole is convenient, and the size setting of through-hole is also more accurate. In two arbitrary adjacent optical cement layers, the orthographic projection of the through hole on the optical cement layer close to the second bonding surface side on the first bonding surface completely covers the orthographic projection of the through hole on the optical cement layer close to the first bonding surface side on the first bonding surface, namely, the through holes are mutually communicated to form a stepped hole, so that the through hole can accommodate a photosensitive element with a convex step positioning structure, and the positioning of the photosensitive element is more accurate.
Drawings
FIG. 1 is a schematic view of a bonded structure provided by an embodiment of the present application from a perspective;
FIG. 2 is a schematic diagram of a bonding structure provided in accordance with an embodiment of the present application from another perspective;
fig. 3 is a schematic view illustrating a connection state between a display module and a touch panel and between the display module and a bonding structure in a display device according to an embodiment of the disclosure.
Description of the main elements
Optical adhesive layer 110
First adhesive layer 111
Second adhesive layer 112
Through-hole 120
First through hole 121
Second through hole 122
First adhesive surface 130
Second adhesive surface 140
Non-display area 220
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In the prior art, an opening is usually required in a bonding structure for bonding a display module and a touch module in an Organic Light Emitting Diode (OLED) display screen to avoid a camera or other electronic components. When opening an optical Adhesive (OCA) used as a bonding structure, a Die cutting technique (Die cut) is mainly used to cut a desired shape on a large piece of optical Adhesive film by a cutter, which can be generally used to cut a larger area of optical Adhesive film. However, as the integration and performance requirements of electronic devices are higher and higher, and the volume and size requirements are smaller and smaller, it is difficult to cut small-sized structures such as circular holes by using the above methods, and the use requirements cannot be met due to the problems of sticking or cutting deformation of a cutter.
Fig. 1 is a schematic structural view of a bonding structure 100 provided in an embodiment of the present application from a perspective; fig. 2 is a schematic structural diagram of a bonding structure 100 provided in an embodiment of the present application from another perspective.
In order to at least partially solve the above problem, referring to fig. 1 to 2, an embodiment of the present application proposes a bonding structure 100, the bonding structure 100 having a first bonding surface 130 and a second bonding surface 140 disposed oppositely, the bonding structure 100 including a plurality of optical adhesive layers 110 arranged on top of each other between the first bonding surface 130 and the second bonding surface 140. The bonding structure 100 is used for packaging and fixing a display module and a touch panel in the display device 10, the bonding structure 100 has a first bonding surface 130 and a second bonding surface 140 which are oppositely arranged, one of the first bonding surface 130 and the second bonding surface 140 is used for bonding with the display module, and the other of the first bonding surface 130 and the second bonding surface 140 is used for bonding with the touch panel. Specifically, the bonding structure 100 includes a plurality of optical cement layers 110 arranged one on top of the other between a first bonding surface 130 and a second bonding surface 140. The optical adhesive layers 110 have high light transmittance and high bonding strength, and are convenient to cure, and two opposite surfaces of the optical adhesive layers 110 have viscosity, so that two adjacent optical adhesive layers 110 can be bonded together after being stacked, and meanwhile, the surfaces of the two optical adhesive layers 110 at the outermost layers of the bonding structure 100 can also be respectively used as a first bonding surface 130 and a second bonding surface 140 to be bonded with the display module and the touch panel respectively. The number of the optical adhesive layers 110 may be two, three, four, or more than four, and can be flexibly adjusted according to different practical application scenarios of the bonding structure 100. As shown in fig. 2, in the embodiment of the present application, a case that the bonding structure 100 includes two optical adhesive layers 110 is taken as an example for description, and a case that the number of the optical adhesive layers 110 is multiple is similar to that, and is not described herein again.
Each optical adhesive layer 110 is provided with a through hole 120, the shape, size and the like of the through hole 120 are not limited, and the through holes 120 on each optical adhesive layer 110 only need to satisfy the following conditions: in any two adjacent optical adhesive layers 110, the orthographic projection of the through hole 120 on the optical adhesive layer 110 on the side close to the second bonding surface 140 on the first bonding surface 130 completely covers the orthographic projection of the through hole 120 on the optical adhesive layer 110 on the side close to the first bonding surface 130 on the first bonding surface 130. The orthographic projection of the through hole 120 on the first adhesion surface 130, i.e., the projection of the through hole 120 on the first adhesion surface 130, is in the direction perpendicular to the first adhesion surface 130. The orthographic projection of the through hole 120 on the optical adhesive layer 110 close to the second bonding surface 140 on the first bonding surface 130 completely covers the orthographic projection of the through hole 120 on the optical adhesive layer 110 close to the first bonding surface 130 on the first bonding surface 130, that is, in any two adjacent optical adhesive layers 110, the size of the through hole 120 on the optical adhesive layer 110 close to the second bonding surface 140 is larger, the size of the through hole 120 on the optical adhesive layer 110 close to the first bonding surface 130 is smaller, and the two through holes 120 are communicated with each other. The through holes 120 of the respective optical adhesive layers 110 are communicated and formed with stepped holes in the entire bonding structure 100, so that the through holes 120 can accommodate the photosensitive elements having the protruding step positioning structures 231, and the positioning of the photosensitive elements is more accurate.
As shown in fig. 2, in some embodiments, the number of the optical adhesive layers 110 is two, at this time, the bonding structure 100 includes a first adhesive layer 111 and a second adhesive layer 112, a surface of the first adhesive layer 111 departing from the second adhesive layer 112 is a first bonding surface 130, a surface of the second adhesive layer 112 departing from the first adhesive layer 111 is a second bonding surface 140, a first through hole 121 is disposed on the first adhesive layer 111, a second through hole 122 is disposed on the second adhesive layer 112, and an orthographic projection of the second through hole 122 on the first bonding surface 130 completely covers an orthographic projection of the first through hole 121 on the first bonding surface 130. The first through hole 121 communicates with the second through hole 122 to form a stepped hole, and the size of the first through hole 121 at a side of the stepped hole close to the first adhesion surface 130 is smaller than the size of the second through hole 122 at a side close to the second adhesion surface 140. In addition to the above embodiments, the first through hole 121 has a first central axis, the second through hole 122 has a second central axis, and the first central axis coincides with the second central axis, so that the first through hole 121 and the second through hole 122 are both of a central symmetrical structure having central axes, and the cross-sectional shapes of the first through hole 121 and the second through hole 122 along the direction of the central axes of the first through hole 121 and the second through hole 122 may be regular triangles, regular quadrangles, regular hexagons, and the like. In some embodiments, the first through hole 121 and the second through hole 122 are both circular holes, and the aperture of the first through hole 121 is smaller than that of the second through hole 122. The first through hole 121 and the second through hole 122 are circular holes, which is convenient for processing and forming, and is also convenient for the first through hole 121 and the second through hole 122 to match with a photosensitive element with a protruding step positioning structure 231.
To further facilitate the forming of the bonding structure 100, in some embodiments, the optical adhesive layer 110 is a liquid optical adhesive layer. The Liquid Optical Adhesive (LOCA) is a special Adhesive which is colorless and transparent, has light transmittance of more than 98 percent and good bonding strength and can be cured at normal temperature or moderate temperature. The use of the liquid optical adhesive layer as the optical adhesive layer 110 can provide a durable and high-strength adhesive effect while ensuring high light transmittance of the adhesive structure 100.
To avoid the adhesion of the optical adhesive layer 110 to the processing tool during the processing of the bonded structure 100, which may affect the processing precision, in some embodiments, the viscosity of the optical adhesive layer 110 is less than 100cps (centipoise). Viscosity is a measure of the viscosity of a fluid and is an indication of the fluid's flow forces versus its internal friction phenomena. High viscosity indicates high internal friction, and the higher the molecular weight, the more hydrocarbon bonds. The optical adhesive layers 110 having the viscosity of less than 100cps (centipoise. Sec.) are ultra-low viscosity colloids, and the optical adhesive layers 110 do not adhere to a processing tool to affect the processing precision during the processing of the bonded structure 100.
To sum up, the bonding structure 100 in the embodiment of the present application can flexibly set the size of each through hole 120 according to different use requirements, and a light leakage phenomenon caused by the oversize size of the through hole 120 does not occur. The through holes 120 are convenient to form, the machining and forming of other through holes 120 cannot be influenced when each through hole 120 is machined and formed, protruding electronic elements can be conveniently contained in the through holes 120 when the bonding structure 100 is used, and the using effect is good.
The embodiment of the present application further provides a manufacturing method of the bonding structure 100, which includes the following steps: a plurality of optical adhesive layers 110 provided with through holes 120 are arranged on top of each other to form a bonding structure 100.
As described above, since the bonding structure 100 has the first bonding surface 130 and the second bonding surface 140 disposed oppositely, the orthographic projection of the through hole 120 on the optical adhesive layer 110 on the side close to the second bonding surface 140 on the first bonding surface 130 in any two adjacent optical adhesive layers 110 can be completely covered on the orthographic projection of the through hole 120 on the optical adhesive layer 110 on the side close to the first bonding surface 130 on the first bonding surface 130. The respective through holes 120 communicate with each other to form a stepped hole so that the through holes 120 can receive the photosensitive element having the protruding step positioning structure 231, and the positioning of the photosensitive element is more accurate.
In order to facilitate the arrangement of the optical adhesive layers 110 and the formation of the through holes 120, in some embodiments, the step of arranging a plurality of optical adhesive layers 110 provided with through holes 120 on top of each other to form the bonding structure 100 is specifically: the optical cement is sprayed multiple times to form a plurality of optical cement layers 110 arranged in a stack. The spraying is a coating method of dispersing the optical cement into uniform and fine droplets by means of pressure or centrifugal force through a spray gun or an atomizer, applying the droplets onto the surface of the object to be coated, and the spraying process is adopted in the arrangement process of the optical cement layer 110, so that parameters such as the position, shape, size and the like of the through hole 120 on the optical cement layer 110 can be preset to form the stepped through hole 120.
Further, on the basis of the above embodiment, after the step of sequentially spraying each optical adhesive layer 110 on the optical adhesive layer 110 adjacent to the optical adhesive layer, the method further includes the following steps: each of the optical adhesive layers 110 is uv-cured. One of the components of the optical adhesive is a photoinitiator, which accounts for about 2% -10% of the glue components, and is a photosensitive chemical substance, which chemically changes and decomposes into free radicals after absorbing radiation energy (such as ultraviolet light), and then further performs a chain chemical reaction with resin glue to generate a high molecular polymer, which is the ultraviolet curing process of the optical adhesive layer 110. The curing refers to a process of converting a substance from a low molecule to a high molecule, and the optical adhesive layer 110 can exert a strong connecting and fastening effect after being cured.
Compared with the die cutting method in the prior art in which a cutter is used for cutting a large optical adhesive film into a required shape, the manufacturing method in the embodiment is simpler and more convenient to implement, the position, the shape, the size and the like of the through hole 120 are easy to control, and the processing precision is higher. In addition, the bonding structure 100 manufactured by the manufacturing method in the embodiment can flexibly set the size of each through hole 120 according to different use requirements, and the light leakage phenomenon caused by the oversize size of each through hole 120 cannot occur. The through holes 120 are convenient to form, the through holes 120 do not affect the processing and forming of other through holes 120 during the processing and forming, the protruding electronic elements can be conveniently accommodated in the through holes 120 when the bonding structure 100 is used, and the using effect is good.
Fig. 3 is a schematic diagram illustrating a connection state between the display module 200, the touch panel 300 and the bonding structure 100 in the display device 10 according to an embodiment of the present disclosure.
Referring to fig. 3, an embodiment of the present disclosure further provides a display device 10, where the display device 10 includes a display module 200, a touch panel 300, and the bonding structure 100 in the above embodiments.
The display module 200 has a display area 210 and a non-display area 220 at least partially surrounding the display area 210, and a photosensitive element 230 is disposed in the non-display area 220. The Display module 200 is used for displaying image information, and specifically, the Display module 200 includes a Liquid Crystal Display (LCD) panel, a Light Emitting Diode (LED) Display panel, and the like, and the Display area 210 and the non-Display area 220 are different areas divided according to different functions on the surface of the Display module, and an actual and obvious boundary line for distinguishing the Display area 210 and the non-Display area 220 may not exist between the Display area 210 and the non-Display area 220. Specifically, the display area 210 is an area for displaying image information in the display module 200, the image information displayed in the display module 200 can be observed facing the display area 210, correspondingly, the non-display area 220 is an area which cannot display the image information in the display module 200, and the non-display area 220 is used for mounting an electronic component or for connecting with other components or assemblies. The non-display area 220 is at least partially disposed around the display area 210, i.e., the non-display area 220 is disposed at the periphery of the display area 210 and encloses the display area 210. The shapes, sizes, etc. of the display area 210 and the non-display area 220 can be adjusted according to different display requirements, and are not limited herein.
The light sensing element 230 may be a lens module, an Integrated Circuit (IC) electronic element, etc., and during the processing and assembling process of the display module 200, the display module 200 is cut away from the display circuit to form an installation space for installing the electronic element, and after the cutting is completed, the electronic element and the display module 200 can be combined at the position. In the embodiment of the present application, the photosensitive element 230 is disposed in the non-display area 220 of the display module 200, and more specifically, the photosensitive element 230 may be disposed on a fixed frame (not shown) of the display module 200. The electronic components and the display module 200 can be fixed by gluing. The photosensitive element 230 includes a step positioning structure 231 protruding from the surface of the display module 200. As shown in fig. 3, the photosensitive element 230 includes a main body and a step positioning structure 231 protruding from the main body, the main body is at least partially engaged with the display module 200, and the step positioning structure 231 protrudes from the main body and protrudes from the surface of the display module 200.
Meanwhile, the touch panel 300 is disposed opposite to the display module 200, and the touch panel 300 has a touch function. The first bonding surface 130 of the bonding structure 100 is bonded to the surface of the touch panel 300, the second bonding surface 140 is bonded to the surface of the display module 200, and the step positioning structures 231 are accommodated in the through holes 120 of the optical adhesive layers 110. That is, the through hole 120 in the bonding structure 100 is disposed corresponding to the photosensitive element 230 on the surface of the display module 200, and the through hole 120 and the photosensitive element 230 maintain the corresponding position, shape and size. The step positioning structure 231 in the photosensitive element 230 can be accommodated in the step hole formed by combining the through holes 120 of the bonding structure 100, so that each through hole 120 is formed separately, the size of each through hole 120 can be flexibly set according to different use requirements, the forming of the through holes 120 is convenient, and the size setting of the through holes 120 is more accurate. The through-hole 120 can receive the photosensitive element 230 having the protruding step positioning structure 231, and the positioning of the photosensitive element 230 is more accurate. After the display module 200 and the touch panel 300 are bonded together by using the bonding structure 100, the display device 10 has both a display function and a touch function, and can better meet the use requirements of users.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The bonding structure is characterized by comprising a first bonding surface and a second bonding surface which are oppositely arranged, the bonding structure is formed by a plurality of optical adhesive layers which are arranged between the first bonding surface and the second bonding surface in a stacked mode, each optical adhesive layer is provided with a through hole, in any two adjacent optical adhesive layers, the through holes on the optical adhesive layers close to one side of the second bonding surface are in orthographic projection on the first bonding surface, and the through holes on the optical adhesive layers close to one side of the first bonding surface are completely covered with the orthographic projection on the first bonding surface.
2. The bonding structure of claim 1, wherein the bonding structure comprises a first adhesive layer and a second adhesive layer, a surface of the first adhesive layer facing away from the second adhesive layer is the first bonding surface, a surface of the second adhesive layer facing away from the first adhesive layer is the second bonding surface, the first adhesive layer is provided with a first through hole, the second adhesive layer is provided with a second through hole, and an orthographic projection of the second through hole on the first bonding surface completely covers an orthographic projection of the first through hole on the first bonding surface.
3. The bonded structure of claim 2, wherein the first through-hole has a first central axis and the second through-hole has a second central axis, the first central axis coinciding with the second central axis.
4. The bonding structure according to claim 3, wherein the first through-hole and the second through-hole are both circular holes, and the aperture of the first through-hole is smaller than the aperture of the second through-hole.
5. The bonding structure of claim 1, wherein each of the optical adhesive layers is a liquid optical adhesive layer.
6. The bonding structure of claim 5, wherein the viscosity of each optical adhesive layer is less than 100cps.
7. A method for manufacturing a bonding structure is characterized by comprising the following steps:
the optical adhesive layers with a plurality of through holes are stacked one on another to form a bonding structure, the bonding structure is provided with a first bonding surface and a second bonding surface which are arranged oppositely, and the optical adhesive layers are adjacent randomly.
8. The method for manufacturing a bonded structure according to claim 7, wherein the step of stacking a plurality of optical adhesive layers with through holes on each other to form a bonded structure comprises: and spraying optical cement for multiple times to form a plurality of optical cement layers in a laminated arrangement.
9. The method of fabricating a bonded structure according to claim 8, further comprising, after the step of spraying optical glue a plurality of times to form a plurality of layers of the optical glue arranged in a stack, the steps of: and carrying out ultraviolet curing on each optical adhesive layer.
10. A display device, comprising:
the display module is provided with a display area and a non-display area at least partially surrounding the display area, wherein a photosensitive element is arranged in the non-display area, and the photosensitive element comprises a step positioning structure protruding out of the surface of the display module;
the touch panel is arranged opposite to the display module; and
the bonding structure of any one of claims 1 to 6, wherein the first bonding surface is bonded to a surface of the touch panel, the second bonding surface is bonded to a surface of the display module, and the step positioning structure is received in the through hole of each optical adhesive layer.
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| CN202110570752.1A CN113314679B (en) | 2021-05-25 | 2021-05-25 | Bonding structure, manufacturing method thereof and display device |
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| CN109147595A (en) * | 2018-09-30 | 2019-01-04 | 厦门天马微电子有限公司 | Display device and preparation method thereof |
| CN111599841A (en) * | 2020-05-19 | 2020-08-28 | 京东方科技集团股份有限公司 | Display device and method for manufacturing the same |
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Effective date of registration: 20240109 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Patentee after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee after: Interface Technology (Chengdu) Co., Ltd. Patentee after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Patentee before: Interface Technology (Chengdu) Co., Ltd. Patentee before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Patentee before: GENERAL INTERFACE SOLUTION Ltd. |