CN112652692A

CN112652692A - Light emitting module, method of manufacturing the same, and display device having the same

Info

Publication number: CN112652692A
Application number: CN202011441279.9A
Authority: CN
Inventors: 陈彦年; 陈志添; 曾明辉; 许盛翔; 苏淑凤
Original assignee: Sumika Technology Co Ltd
Current assignee: Sumika Technology Co Ltd
Priority date: 2020-05-22
Filing date: 2020-12-08
Publication date: 2021-04-13
Also published as: TWI772804B; TW202144523A

Abstract

A light emitting module, a method of manufacturing the same, and a display device having the light emitting module. A light-emitting module comprises a light-emitting unit and an adhesive layer arranged on the light-emitting unit, wherein the adhesive layer has a light transmittance of 5-80%. The adhesive layer comprises a coloring layer arranged on the light-emitting unit, and a plurality of coloring particles are dispersed in the coloring layer.

Description

Light emitting module, method of manufacturing the same, and display device having the same

Technical Field

The present invention relates to a light emitting module, a method of manufacturing the same, and a display device having the same, and more particularly, to a micro light emitting module, a method of manufacturing the same, and a display device having the same.

Background

Display devices (e.g., comprising a combination of a display panel and a light emitting module) have been indispensable items in people's daily life, work, and production. In recent years, in order to increase the number of area-split lights, a combination of a micro light emitting module and a display panel has been more developed. The micro light emitting module is, for example, a sub-millimeter level light emitting diode (mini LED) or a micro level light emitting diode (micro LED). Moreover, the light emitting diodes are not packaged but directly disposed on the substrate due to the small pitch, and thus are easily exposed and not protected. Moreover, the number of light emitting diodes required for manufacturing a micro light emitting module is tens of thousands to millions, the factor is too large, and the conventional packaging method (such as flip chip packaging) cannot be used for efficient packaging, so that mass production cannot be performed.

Therefore, a suitable and efficient packaging method must be developed to complete the packaging of the micro light emitting module. Furthermore, the conventional micro light emitting module also has problems of metal reflection and color interference between adjacent light emitting diodes, and needs to be solved.

Disclosure of Invention

Some embodiments of the present invention disclose a light emitting module, which includes a light emitting unit, and an adhesive layer disposed on the light emitting unit, wherein the adhesive layer has a light transmittance of 5% to 80%. The adhesive layer comprises a coloring layer arranged on the light-emitting unit, and a plurality of coloring particles are dispersed in the coloring layer.

In some embodiments, the light emitting module further includes a substrate disposed above the light emitting unit, and the adhesive layer is disposed between the light emitting unit and the substrate. The substrate is a plastic substrate or a glass substrate.

In some embodiments, the substrate comprises a single or multilayer optical film.

In some embodiments, the substrate further comprises a polarizer disposed on the substrate, wherein the adhesive layer is disposed between the light-emitting unit and the polarizer.

In some embodiments, the substrate has a first surface and a second surface opposite to the first surface, the first surface has the optical adjustment thereon, and the adhesive layer adheres to the second surface of the substrate and the light emitting unit.

The optical adjustment includes disposing a Hard Coating (HC), an anti-glare film (ag), an anti-reflection film (ar), an anti-glare and anti-reflection film (agar), a low-reflection film (lr), an anti-glare and low-reflection film (aglr), or a combination thereof on the first surface of the substrate.

In some embodiments, the colored particles comprise a black colorant.

In some embodiments, the whole of the adhesive layer is the colored layer.

In some embodiments, the colored layer is disposed on the light emitting unit, and the adhesive layer further includes a transparent adhesive layer disposed above the colored layer. Furthermore, in some embodiments, the colored layer covers the side surfaces and the top surface of the light emitting diode.

In some embodiments, the light emitting unit includes a substrate and a plurality of light emitting diodes disposed on the substrate, wherein the size of the light emitting diodes is smaller than 500 μm.

In some embodiments, the thickness of the adhesive layer is greater than or equal to the height of the light emitting diode.

Some embodiments of the present invention disclose a display device, comprising: the light emitting module as described above; and a display module disposed on the light emitting module.

Some embodiments of the present invention further disclose a display device, which includes a light emitting module and a driving circuit electrically connected to the light emitting module. The light emitting module comprises a light emitting unit and an adhesive layer arranged on the light emitting unit. The light-emitting unit comprises a substrate and a plurality of light-emitting diodes arranged on the substrate. The adhesive layer has a light transmittance of 5-80%, and the adhesive layer comprises a coloring layer disposed on the light-emitting unit, wherein the coloring layer has a plurality of coloring particles dispersed therein. The driving circuit comprises a plurality of pixel driver circuits which are respectively arranged at the light emitting diodes of the light emitting unit to control the light emitting diodes.

Some embodiments of the present invention disclose a method for manufacturing a light emitting module, comprising: preparing an adhesive layer containing colored particles, wherein the adhesive layer has a light transmittance of 5-80%; attaching the adhesive layer to a substrate; and attaching the adhesive layer to a position above a light-emitting unit, wherein the adhesive layer is arranged between the light-emitting unit and the substrate.

Drawings

FIG. 1A is a schematic view of a light emitting module according to some embodiments of the present disclosure;

FIG. 1B is a schematic cross-sectional view taken along line 1B-1B of FIG. 1A;

FIG. 2 is a schematic cross-sectional view illustrating another light emitting module according to some embodiments of the present disclosure;

FIG. 3 is a schematic cross-sectional view illustrating another light-emitting module according to some embodiments of the present disclosure;

FIG. 4 is a schematic cross-sectional view illustrating another light-emitting module according to some embodiments of the present disclosure;

FIG. 5 is a schematic cross-sectional view illustrating a light emitting module according to some other embodiments of the present disclosure;

FIG. 6A is a schematic cross-sectional view of a display device according to some embodiments of the present disclosure;

FIG. 6B is a schematic cross-sectional view of a Light Emitting Diode (LED) display device according to some embodiments of the present disclosure;

fig. 7A to 7D are schematic cross-sectional views illustrating a first method for manufacturing a light emitting module according to some embodiments of the invention.

[ notation ] to show

10,10-2,10-3,10-4,10-5 light-emitting module

12 light emitting unit

120: substrate

120a substrate surface

122 light emitting diode

122s side of light emitting diode

122a top surface of the light emitting diode

122R red light emitting diode

122G green light-emitting diode

122B blue light emitting diode

14 base material

141 first surface

142 second surface

15 polarizing plate

16, 16' adhesive layer

162 coloring layer

162a top surface of the colored layer

164 transparent adhesive layer

160P diffusion particles

18 optical adjustment layer

60, 60' display device

610 display module

650 pixel driver circuit

650R red pixel driver circuit

650G green pixel driver circuit

650B blue Pixel driver Circuit

Uc imaging Unit

S1 distance between

W1 width

H1, H2 height

T1, T2 thickness

Detailed Description

In an embodiment of the present disclosure, a light emitting module, a method for manufacturing the same, and a display device having the light emitting module are provided, and particularly, the light emitting module is suitable for being applied to a display device having a micro light emitting module. Various embodiments are described in detail below, which are provided as examples only and do not limit the scope of the disclosure, but the disclosure can be implemented with other features, elements, methods, and parameters. The embodiments are provided only for illustrating the technical features of the disclosure, and not for limiting the claims of the disclosure. Those skilled in the art will recognize that various modifications and changes may be made in the embodiments without departing from the scope of the present disclosure.

Furthermore, in describing some variations of the embodiments, like reference numerals are used to designate like elements in the different figures and illustrated embodiments. It will be understood that additional operations may be provided before, during, or after the method, and that some of the recited operations may be substituted or deleted for other embodiments of the method.

Furthermore, relative terms, such as "lower," "below," or "bottom" and "upper," "above," or "top," may be used in embodiments to describe one element's relative relationship to another element as illustrated. It will be understood that if the device is turned over, with the top and bottom of the device reversed, elements described as being on the "lower" side will be turned over to elements on the "upper" side.

As used herein, the term "about" generally means within 20%, preferably within 10%, and more preferably within 5% of a given value or range. The amounts given herein are approximate, meaning that the meaning of "about" or "approximately" may still be implied without particular recitation.

Refer to fig. 1A and 1B. Fig. 1A is a schematic diagram illustrating a light emitting module according to some embodiments of the present disclosure. FIG. 1B is a schematic cross-sectional view taken along line 1B-1B of FIG. 1A. In the embodiment, a micro light emitting module is exemplified.

As shown in fig. 1A and 1B, the light emitting module 10 includes a light emitting unit 12. In some embodiments, the light emitting unit 12 includes a substrate 120 and a plurality of light emitting diodes 122 disposed on the substrate 120. In some embodiments, the plurality of leds 122 are disposed on the substrate 120 by flip chip technology (flip chip). In some embodiments, the plurality of light emitting diodes 122 may be multi-colored or monochromatic. In some embodiments, the light emitting diodes 122 include, for example, a red light emitting diode 122R, a green light emitting diode 122G, a blue light emitting diode 122B, or a white blue light emitting diode (not shown) as the light emitting pixels of the light emitting unit 12. In some embodiments, the light emitting diodes 122 are micro light emitting diodes, and the size of each micro light emitting diode is less than 500 micrometers. For example, the light emitting diodes 122 are sub-millimeter light emitting diodes (mini LEDs) or micro LEDs (micro LEDs), and the light emitting diodes 122 are arranged on the surface 120a of the substrate 120 in an array, for example. Taking the sub-millimeter leds as an example, the dimension (e.g., the width W1 along the X-axis) of each sub-millimeter led 122 is between 100 micrometers and 500 micrometers, and the distance (e.g., the distance S1 along the X-axis) between two adjacent sub-millimeter leds 122 is between 50 micrometers and 100 micrometers. Whereas the size of a micrometer led is for example less than 100 micrometers, the spacing S1 is for example less than 50 micrometers.

In some embodiments, each led 122 can be used as a separately controllable light source. Compared to the conventional larger size leds (e.g. larger than 500 μm), the number of sub-millimeter leds or micro-leds included in the lighting module with the same area is larger, and the number of the controllable light sources is increased, so that the area dimming effect is better, but it is not easy to package the large number of leds. According to the embodiments of the present disclosure, a colored adhesive is integrated to encapsulate the led, and the entire surface is bonded to improve the encapsulation efficiency. In addition to the function of protecting the leds 122, the metal reflection of the leds 122 can be reduced by adjusting the light transmittance and/or the shielding property of the colored glue or by using the colored glue and matching the optical properties of the optical film, and even the color interference between the leds 122 can be reduced. Therefore, the embodiment not only improves the packaging efficiency of the light emitting diode 122, but also improves the display quality of the display device.

As shown in fig. 1A and 1B, the light emitting module 10 further includes an adhesive layer 16 disposed on the light emitting unit 12, wherein the adhesive layer 16 has a light transmittance of 5% to 80%, and the adhesive layer 16 includes a colored layer disposed on the light emitting unit, and a plurality of colored particles (not shown) are dispersed in the colored layer. In this embodiment, the adhesive layer 16 is a colored layer as a whole, but the disclosure is not limited to this embodiment.

According to the embodiment, the light emitting module 10 further includes a substrate 14 disposed above the light emitting unit 12. For example, as shown in FIG. 1B, substrate 14 is positioned over adhesive layer 16. The substrate 14 may be any sheet suitable for being coated with a subbing layer and having light transmission properties, and the substrate 14 may be a single sheet or a composite sheet. The substrate 14 of the embodiment includes, for example, plastic, glass, optical film, or a combination thereof.

In some embodiments, the substrate 14 is a plastic substrate, such as one comprising methyl methacrylate (PMMA), Polycarbonate (PC), non-crystalline polyolefin resins such as cyclic olefin monomer (co) polymers (COP), Acrylonitrile-Butadiene-Styrene (ABS), or combinations thereof. In some embodiments, the substrate 14 comprises one or more layers of optical film, such as a triacetyl cellulose (TAC) film, a Polyethylene Terephthalate (PET) film, a circular polarizer, an elliptical polarizer, or a combination thereof.

Furthermore, the adhesive layer 16 of the embodiment, such as the colored layer as a whole in this example, is disposed on the substrate 12 of the light emitting unit 12 and covers the light emitting diodes 122, such as covering the side surfaces and the top surface of the light emitting diodes 122, and filling the gaps between the adjacent light emitting diodes 122. As shown in fig. 1B. The thickness T1 of the adhesive layer 16 is greater than or equal to the height H1 of the light emitting diode 122. In some embodiments, the ratio of the height H1 of the LED 122 to the thickness T1 of the adhesive layer 16 is about 1: 1-10, preferably 1: 1.5-10. For example, if the height H1 of the LED 122 is 100 μm, the thickness T1 of the adhesive layer 16 may be 100 μm to 1000 μm, preferably 150 μm to 1000 μm. In some embodiments, the elastic modulus of the adhesive layer 16 is 1.0 × 10³Pa to 1.0X 10⁷Pa is between Pa. As the thickness of the adhesive layer 16 becomes thicker, the bonding yield and quality become better.

Further, in some embodiments, the adhesive layer 16 comprises a polymer, such as an acrylic polymer, a silicone polymer, a polyurethane, a polyamide, a polyvinyl ether, a vinyl acetate/vinyl chloride copolymer, an epoxy, a natural rubber, a synthetic rubber, or a combination thereof. In some embodiments, the colored particles added to the colored layer of the adhesive layer 16 comprise a black colorant, such as a black pigment or dye. The black colorant, for example, comprises carbon black, aniline black, or a combination thereof, such that the adhesive layer 16 has a light transmittance of about 5% to about 80%.

According to some embodiments, the adhesive layer 16 comprises a (meth) acrylic copolymer and an isocyanate compound, wherein the isocyanate compound is added in an amount of about 0.05% to about 1.0% of the mass of the (meth) acrylic copolymer.

In some examples, the (meth) acrylic copolymer comprises one or both of a (meth) acrylic monomer and a vinyl group-containing monomer in an amount of about 50% by mass or more and about 95% by mass or less; and a hydrophilic monomer which is a hydroxyl group-containing (meth) acrylic monomer and accounts for about 5 mass% to about 50 mass%.

In some examples, the (meth) acrylic monomer is one of methyl (meth) acrylate, butyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and isobornyl acrylate, or a combination of any two or more thereof.

In some examples, the vinyl-containing monomer is one of styrene, acrylonitrile, and acryloyl morpholine, or a combination of any two or more thereof.

In some examples, the hydrophilic monomer, that is, the hydroxyl group-containing acrylic monomer is one of 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate, or a combination of any two or more thereof.

In some examples, the isocyanate compound is an aliphatic isocyanate or an aromatic isocyanate, or a combination of both.

According to some embodiments, the adhesive layer 16 may further include a silane coupling compound in addition to the (meth) acrylic copolymer and the isocyanate compound to increase the adherence of the adhesive layer 16. The amount of the silane coupling compound added is, for example, about 0.05% to about 1.0% of the mass of the (meth) acrylic copolymer.

In some examples, the silane coupling compound is one of an epoxy silane coupling compound, a vinyl silane coupling compound, an amino silane coupling compound, a (meth) acrylic silane coupling compound, and an isocyanate silane coupling compound, or a combination of any two or more thereof.

Further, in some examples, the coloring particles added to the adhesive layer 16 to form a colored layer include, for example, carbon black, aniline black, or a combination thereof, and the amount of the coloring particles added is about 30% or less, for example, between about 1% and about 30% of the mass of the (meth) acrylic copolymer. In some other examples, the colored particles are added in an amount between about 1% and about 15% of the mass of the (meth) acrylic copolymer.

According to some embodiments, the adhesive layer 16 can be prepared, for example, by uniformly dissolving the above (meth) acrylic copolymer and isocyanate compound, preferably further containing a silane coupling compound, in an organic solvent, and adding an appropriate amount of black pigment to uniformly stir and disperse the mixture. The organic solvent is, for example, one of toluene, xylene, ethyl acetate, methanol, ethanol, n-butanol, isobutanol, acetone, methyl ethyl ketone, tetrahydrofuran, other suitable organic solvents, or a combination of two or more of the foregoing solvents. The resulting solution is then uniformly coated onto a peelable film or onto a substrate 14 as described above (without subsequent peeling), and dried by a suitable high temperature process at a temperature at least above the boiling point of the solvent (to remove the solvent) to form an adhesive layer. After the adhesive layer 16 is formed, another peelable film base (not shown) may be attached, and when the light-emitting unit 12 is to be attached later, the film base is peeled off, so that the adhesive layer 16 may be attached to the substrate 120 of the light-emitting unit 12 and cover the light-emitting diode 122.

Other embodiments of the light emitting module are further provided below to illustrate other aspects of the light emitting module applicable in the present disclosure. Of course, the light emitting module of the present disclosure is not limited to the aspects set forth herein.

Fig. 2 is a schematic cross-sectional view illustrating another light emitting module according to some embodiments of the present disclosure. Wherein FIG. 2 is also drawn corresponding to the location of section line 1B-1B of FIG. 1A. In fig. 2, the same reference numerals are used for the layers/components in the same embodiment as that in fig. 1B, and the related arrangement, materials and manufacturing methods of the layers/components of each layer/component can be referred to above, and are not repeated herein.

Unlike the embodiment of fig. 1B, the light emitting module of fig. 2 is further optically adjusted on another surface (opposite to the surface on which the adhesive layer is disposed) of the substrate 14. For example, in some embodiments, the roughness of the glass surface is physically or chemically altered on the surface of the glass substrate (e.g., the glass surface has a concave-convex shape) to reduce the reflectance of light or to achieve light collection, diffusion, or anti-glare effects. Alternatively, one or more optical films (e.g., having light-collecting, diffusing, or anti-glare functions) may be deposited, coated, or attached on the surface of the substrate 14 to further enhance the visual effect of the viewer when the display device displays images. In this embodiment, an example in which an optical film is provided on the surface of the base material 14 is described.

As shown in fig. 2, in some embodiments, the light emitting module 10-2 includes a light emitting unit 12 (e.g., including a substrate 120 and a plurality of light emitting diodes 122 disposed on the substrate 120), a base 14 disposed above the light emitting unit 12, and an adhesive layer 16 disposed between the light emitting unit 12 and the base 14, wherein the base 14 has a first surface 141 and a second surface 142 opposite to each other, the first surface 141 has an optical adjustment thereon, and the adhesive layer 16 adheres to the second surface 142 of the base 14 and the light emitting unit 12.

In some embodiments, the optical tuning may include disposing the optical tuning layer 18 on the first surface 141 of the substrate 14, as desired. The optical adjustment layer 18 may be a single optical film or a multi-layer optical film, such as a Hard Coating (HC), an anti-glare film (ag) film), an anti-reflection film (ar) film, an anti-glare and anti-reflection film (agar) film), a low-reflection film (lr) film, an anti-glare and low-reflection film (aglr) film, or a combination thereof, to further improve the protection, light collection, diffusion, and other effects.

Therefore, the light emitting module 10-2 of this embodiment not only can reduce the metal reflection of the light emitting diodes 122 in the light emitting unit 12 and reduce the color interference between the adjacent light emitting diodes 122, but also can improve the visual effect of the applied display device during image viewing through the optical adjustment on the substrate 14.

Fig. 3 is a schematic cross-sectional view illustrating another light emitting module according to some embodiments of the present disclosure. Wherein FIG. 3 is also drawn corresponding to the location of section line 1B-1B of FIG. 1A. In fig. 3, the same reference numerals are used for the layers/components identical to those in the embodiments of fig. 1B and fig. 2, and the related arrangement, materials and manufacturing methods of the layers/components of each layer/component can be referred to above, and are not repeated herein.

In addition to the optical adjustment layer 18 disposed on the first surface 141 of the substrate 14, the light emitting module 10-3 of fig. 3 further includes a polarizer 15 disposed on another surface of the substrate 14, wherein the adhesive layer 16 is disposed between the light emitting unit 12 and the polarizer 15. The material of the optical adjustment layer 18 can be as described above with reference to the embodiment of fig. 2.

As shown in fig. 3, in some embodiments, the light emitting module 10-3 includes a light emitting unit 12 (e.g., including a substrate 120 and a plurality of light emitting diodes 122 disposed on the substrate 120), a base 14 disposed above the light emitting unit 12, an optical adjustment layer 18 disposed on a first surface 141 of the base 14, a polarizer 15 disposed on a second surface 142 of the base 14, and an adhesive layer 16 disposed between the light emitting unit 12 and the polarizer 15. In some embodiments, polarizer 15 is, for example, a circular polarizer, an elliptical polarizer, or other suitable polarizer. The material of the polarizer 15 may be a polyvinyl alcohol (PVA) resin film, which may be made by saponifying a polyvinyl acetate resin. The polyvinyl acetate resin is, for example, a homopolymer including vinyl acetate, i.e., polyvinyl acetate, and a copolymer of vinyl acetate and other monomers copolymerizable with vinyl acetate.

According to the light emitting module 10-3 of this embodiment, the adhesive layer 16 may reduce metal reflection of the light emitting diodes 122 in the light emitting unit 12, and reduce color interference between the light emitting diodes 122, and the optical adjustment on the substrate 14 may enable the applied display device to improve the visual effect when viewing images, and the arrangement of the polarizer 15 may further reduce the metal reflection phenomenon of the light emitting diodes 122.

Fig. 4 is a schematic cross-sectional view illustrating another light emitting module according to some embodiments of the present disclosure. Wherein FIG. 4 is also drawn corresponding to the location of section line 1B-1B of FIG. 1A. In fig. 4, the same reference numerals are used for the layers/components identical to those in the embodiments of fig. 1B and fig. 2, and the related arrangement, materials and manufacturing methods of the layers/components of each layer/component can be referred to above, and are not repeated herein.

In the light emitting module 10-4 of fig. 4, besides the optical adjustment layer 18 disposed on the first surface 141 of the substrate 14, diffusion particles are further added to the adhesive layer 16.

As shown in fig. 4, in some embodiments, the light emitting module 10-4 includes a light emitting unit 12 (e.g., including a substrate 120 and a plurality of light emitting diodes 122 disposed on the substrate 120), a base 14 disposed above the light emitting unit 12, an optical adjustment layer 18 disposed on a first surface 141 of the base 14, and an adhesive layer 16 disposed on a second surface 142 of the base 14 and between the light emitting unit 12 and the base 14. In this embodiment, the diffusion particles 160P are uniformly dispersed in the adhesive layer 16.

In some embodiments, the haze value of the diffusing particles 160P is between 10% to 90%. Alternatively, in some embodiments, the haze value of the diffusion particles 160P is between 10% and 80%. Alternatively, in some embodiments, the haze value of the diffusion particles 160P is between 50% and 80%. The diffusion particles 160P added in the adhesive layer 16 can improve the diffusion capability of the light emitting unit 12 after passing through the adhesive layer 16, so as to increase the light emitting brightness of the light emitting module 10-4.

In addition, according to the above embodiments, the refractive index of the adhesive layer 16 is different from the refractive index of the light emitting diode 122 of the light emitting unit 12. In an embodiment, the material of the adhesion layer 16 may have a high refractive index, for example, ranging from about 1.35 to about 1.75. In various embodiments, a nano powder with a high refractive index, such as a nano inorganic powder, may be added to the adhesive layer 16 to reduce the difference between the refractive indexes of the adhesive layer 16 and the light emitting diode 122, so that the light emitting module has better light emitting efficiency.

The material of the adhesive layer 16 is referred to above, and will not be repeated herein. In some embodiments, the nano-powder with high refractive index, such as titanium dioxide (TiO), is uniformly dispersed in the adhesive layer 16 according to practical requirements₂) Niobium pentoxide (Nb)₂O₅) Tantalum oxide (Ta)₂O₅) Zirconium dioxide (Zr)₂O₂) Silicon (Si), germanium (Ge), gallium phosphide (GaP), indium phosphide (InP), lead sulfide (PbS), other suitable nanopowder materials, or a combination of any of the foregoing nanopowder materials.

Fig. 5 is a schematic cross-sectional view illustrating a light emitting module according to some other embodiments of the present disclosure. Wherein FIG. 5 is also drawn corresponding to the location of section line 1B-1B of FIG. 1A. In fig. 5, the same reference numerals are used for the layers/components identical to those in the embodiments of fig. 1B and fig. 2, and the related arrangement, materials and manufacturing methods of the layers/components of each layer/component can be referred to above, and are not repeated herein.

Unlike the embodiment shown in fig. 1B and 2-4 in which the adhesive layer 16 includes colored particles throughout (the entire adhesive layer is a colored layer), the light-emitting module 10-5 in fig. 5 includes a colored layer 162 and a transparent adhesive layer 164 separated from each other in the adhesive layer 16'.

As shown in fig. 5, in some embodiments, the light emitting module 10-5 includes a light emitting unit 12 (e.g., including a substrate 120 and a plurality of light emitting diodes 122 disposed on the substrate 120), a base 14 disposed above the light emitting unit 12, an optical adjustment layer 18 disposed on a first surface 141 of the base 14, and an adhesive layer 16 'disposed on a second surface 142 of the base 14 and located between the light emitting unit 12 and the base 14, wherein the adhesive layer 16' includes a colored layer 162 and a transparent adhesive layer 164 located above the colored layer 162. In this embodiment, the coloring layer 162 is disposed conformally on the light emitting diodes 122, i.e., extends along the side surfaces 122s and the top surface 122a of the light emitting diodes 122, and covers the exposed surface of the substrate 120 between the adjacent light emitting diodes 122. As shown in fig. 5, the coloring layer 162 covers the side surfaces 122S and the top surface 122a of the light emitting diode 122 and fills the gap S1 between the adjacent light emitting diodes 122.

In some embodiments, the colored layer 162 and the clear adhesive layer 164 comprise the same or different polymeric materials, such as acrylic polymers, silicone polymers, polyurethanes, polyamides, polyvinyl ethers, vinyl acetate/vinyl chloride copolymers, epoxies, natural rubbers, synthetic rubbers, or combinations of the foregoing. The colored layer 162 of the adhesive layer 16 'is further added with colored particles, such as carbon black, aniline black, or a combination of the foregoing black pigments, so that the adhesive layer 16' has a light transmittance of about 5% to about 80%. In addition, according to some embodiments, the copolymer and the compound (e.g., (meth) acrylic acid copolymer, the isocyanate compound, and optionally the silane coupling compound) that may be included in the colored layer 162 and the transparent adhesive layer 164 are as described above and will not be repeated herein.

Further, in this example, the thickness T2 of the colored layer 162 is defined as the height of the colored layer deposited in the space between adjacent leds, and the thickness T2 of the colored layer 162 may be less than, equal to, or greater than the height H2 of the led 122. In some embodiments, the ratio of the thickness T2 of the colored layer 162 relative to the height H2 of the light emitting diode 122 is, for example, in the range of about 0.02 to about 5. As shown in fig. 5, the thickness T2 of the colored layer 162 is slightly less than the height H2 of the leds 122, such that the top surface 162a of the colored layer 162 filled between adjacent leds 122 is lower than the top surface 122a of the leds 122. Of course, in other embodiments, the thickness of the colored layer 162 can be larger than the height of the light emitting diode 122, so that the colored layer has a top surface substantially parallel to the surface 120a of the substrate 120.

According to some embodiments of the present disclosure, the coloring layer 162 preferably has a thickness that covers the light emitting diodes 122 and covers the exposed surface of the substrate 120 between the adjacent light emitting diodes 122, so as to reduce the color interference between the adjacent light emitting diodes 122.

According to some embodiments of the present disclosure, the coloring layer 162 preferably has a thickness that exposes the top surfaces 122a of the leds 122, but covers the exposed surface of the substrate 120 between adjacent leds 122 to reduce color interference between adjacent leds 122.

According to some embodiments of the present disclosure, the color layer 162 preferably has a thickness that covers the leds 122 and covers the exposed surface of the substrate 120 between adjacent leds 122, and the color layer 162 can form a semicircular microlens (not shown) on the top surface 122a of the leds 122, so as to reduce the color interference between adjacent leds 122 and increase the light-emitting efficiency of the leds 122.

According to this embodiment, when the thickness of the adhesive layer 16 is kept constant and the overall light transmittance and haze are also kept constant, and the adhesive layer 16 'includes the separated colored layer 162 and the transparent adhesive layer 164, the colored layer 162 of the adhesive layer 16' is disposed adjacent to the light emitting diodes 122 (as shown in fig. 5), so that the color interference between the adjacent light emitting diodes 122 is further reduced.

Fig. 6A is a schematic cross-sectional view illustrating a display device according to some embodiments of the present disclosure. The light emitting module 10-2 shown in fig. 2 is used as an example. Of course, the light emitting module of the above embodiments or other aspects can also be used as the light emitting module of the display device of the present disclosure. In fig. 6A, the display device 60 includes a light emitting module 10-2 and a display module 610 disposed on the light emitting module 10-2. In one embodiment, the display module 610 is, for example, a liquid crystal display module, and the light emitting module 10-2 can be, for example, a backlight module for providing a light source for the liquid crystal display module. The light emitting module 10-2 and the display module 610 may be adhered to each other by another adhesive layer (not shown) or may be combined with each other to complete the display device 60.

FIG. 6B is a cross-sectional schematic view of a Light Emitting Diode (LED) display device according to some embodiments of the present disclosure. The light emitting module 10-2 shown in fig. 2 is used as an example. Of course, the light emitting module of the above embodiments or other aspects can also be used as the LED display device of the present disclosure. In fig. 6B, the LED display device 60' includes a light emitting module 10-2 and a driving circuit electrically connected to the light emitting module 10-2, wherein the driving circuit includes a pixel driver circuit 650 disposed in the light emitting module 10-2. In one embodiment, each of the light emitting diodes 122 in the light emitting module 10-2 is configured with a pixel driver circuit, and each group of RGB light emitting diodes 122 is configured with an imaging unit Uc. For example, as shown in fig. 6B, in an embodiment, one red led 122R, one green led 122G and one blue led 122B are disposed in one imaging unit Uc, and each red led 122R is disposed with one red pixel driver circuit 650R, each green led 122G is disposed with one green pixel driver circuit 650G, each blue led 122B is disposed with one blue pixel driver circuit 650B, wherein all of the red pixel driver circuit 650R, the green pixel driver circuit 650G and the blue pixel driver circuit 650B constitute the pixel driver circuit 650. The

RGB leds

122R, 122G, and 122B can display according to the electrical signals received by the

pixel driver circuits

650R, 650G, and 650B.

In addition, according to the present disclosure, the light emitting module of the embodiment can be manufactured through several different packaging modes and steps. Of course, the steps of packaging may be modified or varied, or additional steps may be eliminated or provided, depending on the conditions and requirements of the actual application. The manufacturing method of the light emitting module of the embodiment of the disclosure mainly comprises the following steps: providing a light emitting unit and preparing an adhesive layer containing colored particles, respectively, wherein the material of the prepared adhesive layer may be flowable or non-flowable, or in an incompletely or completely cured state; and the adhesive layer is arranged between the light-emitting unit and a substrate. Wherein the adhesive layer can be attached (e.g., coated) to the substrate prior to attaching the adhesive layer to the light-emitting unit; alternatively, the adhesive layer may be attached to the light emitting unit first, and then the substrate is covered on the adhesive layer. And a proper curing reaction is performed in the process to complete the overall packaging of the light emitting module. Three methods for fabricating the light emitting module of the embodiment are provided below, and an example of the steps is described.

Fig. 7A to 7D are schematic cross-sectional views illustrating a first method for manufacturing a light emitting module according to some embodiments of the invention. As shown in fig. 7A, a substrate 14 is provided. The substrate 14 has a first surface 141 and a second surface 142 opposite to each other, and the first surface 141 may have an optical adjustment (e.g., a pattern or an optical layer) thereon for protection, anti-reflection, anti-glare, or a combination thereof. The substrate 14 may comprise, for example, plastic, glass, one or more optical films, and may be a single layer or a composite layer. In this example of the manufacturing method, a single layer of the plate material is drawn without the optical adjustment layer to simplify the drawing. Further, please refer to the material of the applicable substrate 14 in the previous example, which is not repeated herein.

As shown in fig. 7B, the adhesive layer 16 containing the colored particles is attached to the second surface 142 of the substrate 14 by a first attaching process, wherein the adhesive layer 16 of the embodiment has a light transmittance of 5% to 80%. The related compounds, the colored particles and the preparation method thereof contained in the adhesive layer 16 of the embodiment, or the diffusion particles and/or the high refractive index nano inorganic powder additionally added in the adhesive layer 16, please refer to the foregoing examples, and will not be repeated here.

In the manufacturing method, after the preparing of the adhesive layer, the curing reaction (complete curing) of the adhesive layer is further performed, so that the first attaching process is performed to attach the completely cured adhesive layer to the second surface 142 of the substrate 14.

As shown in fig. 7C, a light emitting unit 12 is provided, which includes a substrate 120 and a plurality of leds 122 disposed on a surface 120a of the substrate 120. The light emitting diode 122 is, for example, a submillimeter light emitting diode (mini LED) or a micro light emitting diode (micro LED).

As shown in fig. 7D, the other surface of the adhesive layer 16 is attached to the light emitting unit 12 by a second bonding process, such that the adhesive layer 16 covers the light emitting diodes 122.

Therefore, according to the first method for manufacturing a light emitting module of the embodiment, the base material 14 is attached to the colored glue material (i.e., the adhesive layer 16 containing the colored particles) after the curing reaction is completed, and then attached to the light emitting unit 12 having the light emitting diode.

In addition, according to the second method of manufacturing a light emitting module of the embodiment, after the preparing of the adhesive layer, the partial curing reaction of the adhesive layer is further performed. During the first attaching process, the partially cured adhesive layer is attached to the second surface 142 of the substrate 14. Then, a second bonding process is performed to bond the partially cured adhesive layer to the light emitting unit 12, and then a complete curing reaction is performed on the adhesive layer.

Furthermore, according to the third method for manufacturing the light emitting module of the embodiment, the prepared adhesive layer has fluidity, for example, the material (usually liquid) of the adhesive layer which has not undergone the curing reaction is made to overflow on the substrate 120 of the light emitting unit 12 and fill the gaps between the light emitting diodes 122, preferably cover the side walls and the top surface of the light emitting diodes 122, and no air bubbles are confirmed between the light emitting diodes 122, then the substrate 14 is covered on the light emitting unit 12 and the adhesive layer 16, and the complete curing reaction is performed to cure the adhesive layer 16.

According to some embodiments, the curing reaction mentioned above is performed by, for example, irradiating ultraviolet light, heating at a high temperature, or other suitable means. And according to the energy and time of ultraviolet irradiation and the temperature and time of high-temperature heating, the curing reaction can be adjusted to partially cure or completely cure the material of the adhesive layer. For example, the adhesive layer is partially cured at a lower reaction temperature, and then the material of the adhesive layer is completely cured at a higher temperature after the material of the adhesive layer is attached or distributed at a predetermined position.

In addition, according to some embodiments, to manufacture the light emitting module 10-5 shown in fig. 5, the transparent adhesive layer 164 and the colored layer 162 containing the colored particles may be separately prepared, and the transparent adhesive layer 164 is attached to the substrate 14, the colored layer 162 is attached to the transparent adhesive layer 164, and the transparent adhesive layer 164 and the colored layer 162 are combined into the adhesive layer 16'. Then, similar to fig. 7C and 7D, the adhesive layer 16 'is attached to the light emitting unit 12, such that the colored layer 162 of the adhesive layer 16' covers the light emitting diode 122 of the light emitting unit 12, wherein the colored layer 162 is located between the light emitting unit 12 and the transparent adhesive layer 164.

In order to make the above and other objects, features, and advantages of the present disclosure more comprehensible, several embodiments and comparative examples are described below, wherein the film layer structures of the tested light emitting modules are respectively subjected to appearance detection (e.g., whether to generate a bonding bubble and to observe the degree of metal reflection) and optical measurements, including reflectivity and hue, of the packaged light emitting modules, wherein the color interference between the leds is observed by the difference between the chromaticity coordinates of the left and right 45 degree viewing angles and the chromaticity coordinates of the normal viewing angle. The structure of the light emitting module shown in fig. 2 or fig. 5 is used as a comparison example and an embodiment.

Table 1 shows the related materials and properties of the adhesive layer and the adhesive layer-coated substrate in the light emitting module of 2 comparative examples and 11 examples of the present disclosure, including the light transmittance of the adhesive layer; the thickness of the adhesive layer (e.g., fig. 2) having the colored particles as a whole, or the thickness of the adhesive layer including the colored layer and the transparent adhesive layer separated from each other (e.g., fig. 5); and the amount of the colored particles added (expressed as a percentage of the mass of the (meth) acrylic copolymer in the adhesive layer).

Table 1 further shows whether or not the adhesive layer according to the comparative examples and examples generates the attachment bubble after being attached to the light emitting unit (including the substrate and the light emitting diode disposed on the substrate). The light-emitting module is prepared by laminating under vacuum environment and at 60 ℃ to attach the adhesive layer and the light-emitting unit. In the comparative examples and examples, the height of the light emitting diodes was 100 μm, and the pitch between the adjacent light emitting diodes was 50 μm. Moreover, the metal reflection degree of the prepared light-emitting module is observed more visually, wherein the judgment mode is as follows:

visual observation shows that the alloy has no metal reflection and is judged as excellent;

visually observing, slightly reflecting metal, and judging to be good;

the metal reflection was visually observed to be significant, and the result was judged to be X.

TABLE 1

(HC: hard coat;

AGAR: an anti-glare and anti-reflection film;

AGLR: an anti-glare low-reflection film;

TAC: cellulose triacetate;

PET: polyethylene terephthalate;

PC: a polycarbonate;

PMMA: methyl methacrylate)

Table 2 shows the results of optical measurements of the light-emitting modules fabricated with the adhesive layers of the comparative examples and examples of the display device, including the measurement of the reflectance of the display device as a whole; measuring the brightness (nit) Lv and the chromaticity coordinates x and y of the light-emitting module at a positive viewing angle; and measuring the difference between the chromaticity coordinates of the left 45-degree visual angle and the right 45-degree visual angle and the chromaticity coordinates of the positive visual angle respectively, wherein the smaller the difference is, the smaller the color interference between the light-emitting diodes is.

TABLE 2

Refer to both tables 1 and 2. According to the results in tables 1 and 2, the substrate 14 of the embodiment can be a single plate or a composite plate, and the adhesive layer of the embodiment with the coloring (including the colored particles) can greatly improve or even eliminate the metal reflection phenomenon no matter the material is polycarbonate resin, cellulose resin or polarizer.

Further, the lower the reflectance of the display device, the better. In general, the standard range of the overall reflectivity of the display device is about 4% to 5%, and the high-order model can even reach about 2% or even below 2%. According to the optical measurement results in table 2, the overall reflectivity of the display device including the light emitting modules of the embodiments is 1.5% to 4.7%, which is less than 5%, and particularly, the overall reflectivity of the display device of the embodiments 1 to 9 is less than 3%.

The differences Δ x and Δ y between the chromaticity coordinates of the display device at the left 45-degree viewing angle and the right 45-degree viewing angle and the chromaticity coordinates of the front viewing angle are respectively measured, the differences Δ x and Δ y (+9 ‰ -13 ‰) of the display device including the light emitting module of the embodiment are obviously smaller than the differences Δ x and Δ y (-15 ‰ -28 ‰) of the display device including the light emitting module of the comparative example, and particularly the differences Δ x and Δ y of the embodiments 1-9 are smaller than 10 ‰. Therefore, the display device manufactured by the light emitting module of the embodiment can obviously reduce the color interference among the light emitting diodes.

In addition, since the luminance (nit) of the display device at a positive viewing angle decreases with the addition amount of the colored particles and/or the thickness of the colored layer, the luminance of the display device can be adjusted to meet the luminance requirement by adjusting the addition amount of the colored particles and/or the thickness of the colored layer (or the ratio of the thickness of the colored layer to the thickness of the transparent adhesive layer) in practical use. According to the optical measurement results of table 2, the display devices including the light emitting modules of examples 4 to 11 had luminances at front viewing angles between 830nit and 2500 nit.

In light of the above, the adhesive layer of some embodiments has a light transmittance of 5% to 80%, which can reduce metal reflection of the light emitting diode (e.g., examples 1 to 11 of tables 1 to 2). In some embodiments, the adhesive layer has a light transmittance of 15% to 80%, which can reduce the metal reflection of the led 122 and can provide a display device with a front viewing angle brightness above about 800nit (e.g., examples 4-11 of tables 1-2). In some embodiments, the adhesive layer has a light transmittance of 5% to 50%, which can reduce metal reflection of the leds and reduce color interference between the leds 122 (e.g., examples 1-10 of tables 1-2). Moreover, the adhesive layer of some other embodiments has a light transmittance of 15% to 50%, which can reduce metal reflection of the leds, reduce color interference between the leds, and make the front viewing angle brightness of the applied display device above about 800 nit. The light transmittance of the adhesive layer can be adjusted according to different requirements of the display device in practical application, such as the front viewing angle brightness, the metal reflection and/or the improvement range of the color interference among the light-emitting diodes.

In summary, the embodiments of the present disclosure provide an adhesive layer containing colored particles (the adhesive layer contains the colored particles as a whole, or the adhesive layer contains a separate colored layer and a transparent adhesive layer), and the adhesive layer is bonded to the light emitting module by a full-surface bonding packaging method, so as to protect the light emitting unit of the light emitting module, such as the light emitting diode, and further improve the packaging efficiency of the light emitting module. Furthermore, the adhesive layer disclosed by the invention has the light transmittance of 5% -80%, and by adjusting the shielding property of the adhesive layer or using the adhesive layer and matching the optical characteristics of the optical film material, the metal reflection of the light-emitting diodes can be reduced, the color interference among the light-emitting diodes can be reduced, and the whole display device is maintained to have enough brightness. Therefore, the embodiment not only improves the packaging efficiency of the light emitting diode 122, but also improves the display quality of the display device. In addition, according to the manufacturing method of the light emitting module provided by the embodiment, the method is simple and easy, and the additional manufacturing cost is not greatly increased.

Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A light emitting module, comprising:

a light emitting unit; and

an adhesive layer arranged on the light-emitting unit and having a light transmittance of 5-80%, wherein the adhesive layer comprises a coloring layer arranged on the light-emitting unit, and a plurality of coloring particles are dispersed in the coloring layer.

2. The light-emitting module of claim 1, further comprising a substrate disposed above the light-emitting unit, wherein the substrate is a plastic substrate, a glass substrate, or a single-layer or multi-layer optical film.

3. The light-emitting module of claim 2, wherein the substrate comprises methylmethacrylate (PMMA), Polycarbonate (PC), cyclic olefin monomer (co) polymers (COP), Acrylonitrile-Butadiene-Styrene (ABS), or a combination thereof.

4. The light-emitting module of claim 2, further comprising a polarizer disposed on the substrate, wherein the adhesive layer is disposed between the light-emitting unit and the polarizer.

5. The light emitting module of claim 2, wherein the substrate comprises a triacetate cellulose (TAC) film, a Polyethylene Terephthalate (PET) film, a circular polarizer, an elliptical polarizer, or a combination thereof.

6. The illumination module of claim 2, wherein the substrate has a first surface and a second surface opposite to the first surface, the first surface having the optical adjustment thereon, the adhesive layer adhering the second surface of the substrate and the illumination unit.

7. The light-emitting module of claim 6, wherein the optical adjustment comprises disposing a Hard Coating (HC), an anti-glare film (AG) film), an anti-reflective film (AR) film, an anti-glare and anti-reflective (AGAR) film), a low-reflective film (low-reflective (LR) film), an anti-glare and low-reflective (AGLR) film, or a combination thereof on the first surface of the substrate.

8. The lighting module of claim 1, wherein the adhesive layer comprises an acrylic polymer, a silicone polymer, a polyurethane, a polyamide, a polyvinyl ether, a vinyl acetate/vinyl chloride copolymer, an epoxy, a natural rubber, a synthetic rubber, or a combination thereof.

9. The lighting module of claim 1, wherein the plurality of colored particles comprise a black colorant.

10. The light-emitting module of claim 1, wherein the adhesion layer is entirely the colored layer or further comprises a transparent adhesive layer disposed above the colored layer.

11. The light-emitting module of claim 1, wherein the light-emitting unit comprises a substrate and a plurality of light-emitting diodes disposed on the substrate, the plurality of light-emitting diodes having a size of less than 500 μm.

12. The lighting module of claim 11, wherein the thickness of the adhesive layer is greater than or equal to the height of the plurality of light emitting diodes.

13. The light-emitting module of claim 1, wherein the adhesive layer comprises:

a (meth) acrylic copolymer comprising:

one or both of a (meth) acrylic acid monomer and a vinyl group-containing monomer account for 50 to 95% by mass; and

a hydrophilic monomer which is a hydroxyl group-containing (meth) acrylic monomer and accounts for 5 to 50 mass%; and

the addition amount of the isocyanate compound is 0.05-1.0% of the mass of the (methyl) acrylic acid copolymer.

14. The light-emitting module according to claim 13, wherein the (meth) acrylic monomer is one, two, or more of methyl (meth) acrylate, butyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isobornyl acrylate, or a combination thereof;

the vinyl-containing monomer is one, two or more of styrene, acrylonitrile, acryloyl morpholine or the combination of the styrene, the acrylonitrile and the acryloyl morpholine;

the hydroxyl-containing acrylic monomer is 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, or a combination of the foregoing.

15. The lighting module of claim 13, wherein the isocyanate compound is an aliphatic isocyanate, an aromatic isocyanate, or a combination of the foregoing.

16. The light-emitting module of claim 13, wherein the adhesive layer further comprises a silane coupling compound in an amount of 0.05 to 1.0% by weight based on the amount of the (meth) acrylic copolymer.

17. The light-emitting module according to claim 13, wherein the plurality of colored particles comprise carbon black, nigrosine, or a combination thereof, and wherein the plurality of colored particles are added in an amount of between 1% and 30% by mass of the (meth) acrylic copolymer.

18. The light emitting module of claim 1, wherein the adhesive layer has a light transmittance of 5% to 50%; and/or the elastic modulus of the adhesive layer is 1.0 x 10³Pa to 1.0X 10⁷Pa; and/or the adhesive layer further comprises diffusing particlesThe haze is 10% -80%; and/or the adhesive layer further comprises nano inorganic powder containing titanium dioxide (TiO)₂) Niobium pentoxide (Nb)₂O₅) Tantalum oxide (Ta)₂O₅) Zirconium dioxide (Zr)₂O₂) Silicon (Si), germanium (Ge), gallium phosphide (GaP), indium phosphide (InP), lead sulfide (PbS), or combinations of the foregoing.

19. A display device, comprising:

the lighting module of any one of claims 1-18; and

and the display module is arranged on the light-emitting module.

20. A display device, comprising:

a light emitting module comprising:

a light-emitting unit including a substrate and a plurality of light-emitting diodes disposed on the substrate: and

an adhesive layer arranged on the light-emitting unit, wherein the adhesive layer has a light transmittance of 5-80%, and comprises a coloring layer arranged on the light-emitting unit, wherein a plurality of coloring particles are dispersed in the coloring layer; and

and the driving circuit is electrically connected with the light-emitting module and comprises a plurality of pixel driver circuits which are respectively configured on the plurality of light-emitting diodes of the light-emitting unit so as to control the plurality of light-emitting diodes.

21. A method of manufacturing a light emitting module, comprising:

preparing an adhesive layer containing colored particles, wherein the adhesive layer has a light transmittance of 5-80%;

attaching the adhesive layer to a substrate; and

the adhesive layer is attached to the upper part of a light-emitting unit, wherein the adhesive layer is arranged between the light-emitting unit and the substrate.

22. The method of claim 21, wherein a surface of the adhesive layer is attached to the substrate by a first bonding process; and

and attaching the other surface of the adhesive layer to the light-emitting unit by a second attaching process.

23. The method of claim 22, further comprising curing the adhesive layer after the step of preparing the adhesive layer, wherein the step of performing the first bonding process comprises bonding the cured adhesive layer to the substrate; or wherein the adhesive layer is partially cured after the adhesive layer is prepared, the adhesive layer is attached to the substrate during the first attaching process, and the adhesive layer is completely cured after the partially cured adhesive layer is attached to the light-emitting unit during the second attaching process.

24. The method of claim 21, wherein the light-emitting unit comprises a substrate and a plurality of LEDs disposed on the substrate, and the adhesive layer has fluidity, so that the adhesive layer overflows the substrate of the light-emitting unit and fills gaps between the LEDs when the adhesive layer is attached to the light-emitting unit, and then covers the substrate on the light-emitting unit and the adhesive layer, and then cures the adhesive layer.

25. The method as claimed in claim 21, further comprising preparing a transparent adhesive layer, attaching the transparent adhesive layer to the substrate, and attaching a color layer containing the colored particles to the transparent adhesive layer, wherein the color layer is disposed between the light-emitting unit and the transparent adhesive layer, and the color layer and the transparent adhesive layer form the adhesive layer.