CN113311605B

CN113311605B - Decorative film, shell assembly and electronic equipment

Info

Publication number: CN113311605B
Application number: CN202110559740.9A
Authority: CN
Inventors: 李辉; 吴中正; 王雷
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-05-21
Filing date: 2021-05-21
Publication date: 2022-11-29
Anticipated expiration: 2041-05-21
Also published as: CN113311605A

Abstract

The application provides a decorative film, a shell assembly and an electronic device. The decoration film includes: a first conductive layer; the light adjusting layer is arranged on the surface of the first conducting layer and used for adjusting haze so as to enable the light adjusting layer to change color, and the light adjusting layer comprises the following raw material components: acrylate glue; a biphenyl group-containing liquid crystal; and a phenyl-containing liquid crystal comprising 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexane ] -4-tolyl, the response voltage of the dimming layer to haze adjustment being greater than or equal to 20V and less than 36V; and the second conducting layer is arranged on the surface, far away from the first conducting layer, of the dimming layer. The decoration film of the embodiment of the application can change color when being loaded with voltage.

Description

Decorative film, shell assembly and electronic equipment

Technical Field

The application relates to the field of electronics, concretely relates to decorative film, shell body assembly and electronic equipment.

Background

With the increase of the consumption level of people, the requirements of people on the appearance of electronic equipment such as mobile phones, tablet computers and the like are more and more diversified. However, the existing electronic device has a single shell, cannot change color, tends to be homogeneous, and is easy to be aesthetically fatigued by consumers and poor in user experience.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide a decoration film that can change color when a response voltage is applied.

An embodiment of the present application provides a decorative film, it includes:

a first conductive layer;

the light adjusting layer is arranged on the surface of the first conducting layer and used for adjusting haze so as to enable the light adjusting layer to change color, and the light adjusting layer comprises the following raw material components: acrylate glue; a liquid crystal containing a biphenyl group; and a phenyl-containing liquid crystal comprising 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexane ] -4-tolyl, the response voltage of the dimming layer to haze adjustment being greater than or equal to 20V and less than 36V; and

and the second conducting layer is arranged on the surface of the dimming layer, which is far away from the first conducting layer.

An embodiment of the present application further provides a housing assembly, which includes:

a housing body;

the adhesive layer is arranged on the surface of the shell body; and

the embodiment of this application the decorating film, the viscose layer that decorating film set up in keep away from the surface of casing body, and pass through the viscose layer bond in casing body, first conducting layer compare in the second conducting layer is kept away from casing body sets up.

An embodiment of the present application provides an electronic device, which includes:

a display component for displaying;

according to the shell assembly, the shell assembly and the display assembly form an accommodating space in an enclosing mode; and

and the circuit board assembly is arranged in the accommodating space, is electrically connected with the display assembly and is used for controlling the display assembly to display.

The decorative film comprises a first conducting layer, a dimming film and a second conducting layer, wherein the raw material components of the dimming layer comprise liquid crystal containing biphenyl and liquid crystal containing phenyl, when response voltage is not loaded on the first conducting layer and the second conducting layer, liquid crystal molecules of the dimming layer are arranged in a disordered mode, so that the dimming layer is in a matte state, and after the response voltage is loaded on the first conducting layer and the second conducting layer, the liquid crystal molecules in the dimming layer are arranged in an ordered mode, so that the haze of the dimming layer is reduced, and the matte state is changed into a transparent state, so that the color of the decorative film can be adjusted through voltage.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a decoration film according to an embodiment of the present application.

FIG. 2 is a schematic structural diagram of a decoration film according to another embodiment of the present application.

Fig. 3 is a schematic structural view of a decorative film according to still another embodiment of the present application.

FIG. 4 is a schematic flow chart illustrating a method for manufacturing a decoration film according to an embodiment of the present disclosure.

FIG. 5 is a schematic flow chart of a method for manufacturing a decorative film according to another embodiment of the present disclosure.

FIG. 6 is a flow chart of a method for manufacturing a decorative film according to yet another embodiment of the present disclosure.

FIG. 7 is a high temperature and high humidity test chart of the decorative films of examples and comparative examples of the present application.

Fig. 8 is a schematic structural diagram of a housing assembly according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 10 is a circuit block diagram of an electronic device according to an embodiment of the present application.

Description of reference numerals:

100-decorative film 30-dimming layer

10-first conductive layer 40-second substrate

20-first substrate 50-second conductive layer

70-texture layer 301-containing space

90-cover and bottom layer 310-display assembly

200-housing assembly 330-circuit board assembly

210-housing body 331-processor

230-adhesive layer 333-memory

300-electronic device

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the foregoing drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

Smart dimming films (STFs), also known as Polymer Dispersed Liquid Crystal (PDLC), electrically controlled dimming films, electronic curtains, and the like. The polymer dispersed liquid crystal is a liquid crystal dispersed in an organic solid polymer matrix in the form of small microdroplets of micron order, and because the optical axis of the small microdroplets composed of liquid crystal molecules is in free orientation, the refractive index of the microdroplets is not matched with that of the matrix, and when light passes through the matrix, the microdroplets are strongly scattered by the light to form an opaque milky white state or a semitransparent state. Application of an electric field can adjust the optical axis orientation of the liquid crystal droplets, which when index matched, appear transparent. The electric field is removed and the liquid crystal droplets restore the original state of astigmatism, thereby performing the display.

Referring to fig. 1, an embodiment of the present application provides an decoration film 100, where the decoration film 100 includes a first conductive layer 10 for loading an electrical signal; the light modulation layer 30 is disposed on the surface of the first conductive layer 10, and is used for performing haze modulation, so that the light modulation layer 30 generates a color change, and the light modulation layer 30 includes: acrylate glue; a biphenyl group-containing liquid crystal; and phenyl-containing liquid crystals including 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexane ] -4-tolyl; the response voltage of the light modulation layer 30 for haze modulation is greater than or equal to 20V and less than 36V; and a second conductive layer 50 for loading an electrical signal, disposed on a surface of the dimming layer 30 away from the first conductive layer 10. Optionally, the electrical signal is a voltage signal.

The decorative film 100 of the embodiment of the application includes a first conductive layer 10, a dimming layer 30 and a second conductive layer 50, the raw material components of the dimming layer 30 include a biphenyl group-containing liquid crystal and a phenyl group-containing liquid crystal, when the first conductive layer 10 and the second conductive layer 50 are not loaded with a response voltage, liquid crystal molecules of the dimming layer 30 are arranged in a disordered manner, so that the dimming layer 30 presents a fog-surface state, and when the first conductive layer 10 and the second conductive layer 50 are loaded with the response voltage, liquid crystal molecules in the dimming layer 30 are arranged in an ordered manner, so that the haze of the dimming layer 30 is reduced, and the fog-surface state is changed into a transparent state, so that the visual effect of the decorative film 100 can be adjusted through the voltage (i.e., color adjustment is performed, and color change is achieved).

The decoration film 100 of the embodiment of the application can be applied to the housing of the electronic device, and is used for enabling the housing of the electronic device to have a color changing effect. In addition, the decoration film 100 of the embodiment of the present application may be applied to architectural glass, automotive glass, and the like, and is in a matte state when no response voltage is applied, so as to achieve a shielding effect, and is in a transparent state when a voltage is applied, so that the electric connection is disconnected when shielding is required, and a response voltage is applied when a visual effect is required.

Alternatively, the response voltage may be, but is not limited to, 20V, 21V, 22V, 23V, 24V, 25V, 26V, 27V, 28V, 29V, 30V, 31V, 32V, 33V, 34V, 35V, and the like. Further, the response voltage is greater than or equal to 20V and less than 26V. When the response voltage loaded by the decorative film 100 is lower than 20V, the haze change of the dimming layer 30 is very small, and the dimming layer cannot be in a transparent state, so that the color change effect is difficult to realize; when the response voltage loaded by the decorative film 100 is higher than 26V, the haze change of the dimming layer 30 is very small, the dimming layer 30 does not become more transparent, and the influence on the color change of the dimming layer 30 is very small; and when the response voltage is higher than 36V, the response voltage is higher than the safety voltage of a human body, which greatly increases the danger of using the decoration film 100 and affects the use scene of the decoration film 100.

The dimming layer 30 of the decoration film 100 in the embodiment of the present application is matched with the acrylate glue, the liquid crystal containing biphenyl and the liquid crystal containing phenyl, so that the dimming layer 30 has better high temperature resistance and high humidity resistance, the decoration film 100 can be applied to the environment of high temperature and high humidity (for example, the housing of an electronic device such as a mobile phone and a tablet), and the color change performance of the dimming layer 30 is prevented from being invalid when the decoration film 100 is in the high temperature or high humidity environment. In addition, the voltage loaded when the decoration film 100 of the embodiment of the application changes color is less than 36V, which is lower than the safety voltage of a human body, and the decoration film can be applied to some scenes that the human body often contacts, such as the shell of an electronic device, and is safer to use.

In the dimming layer 30 of the embodiment of the present application, before the response voltage is not applied, the haze of the dimming layer 30 is greater than or equal to 80%. Further, the haze of the dimming layer 30 is 80% to 92%, such as 80%, 81%, 83%, 85%, 88%, 90%, 92%, and the like. When the haze of the dimming layer 30 before the response voltage is applied is less than 80%, the haze is too low, and the shielding effect is not good, so that the haze of the dimming layer 30 before the response voltage is applied is better.

The haze of the dimming layer 30 of the embodiment of the present application is less than 10% when the response voltage is applied, and further, the haze of the dimming layer 30 is 4% to 10%, for example, 9%, 8%, 7%, 6%, 5%, 4%, and the like. The lower the haze of the light modulation layer 30 after the application of the response voltage, the better, and when the haze of the light modulation layer 30 is too high, the light modulation layer 30 cannot become transparent even when the response voltage is applied, which is not favorable for realizing color change.

Alternatively, the transmittance of the dimming layer 30 when the response voltage is applied is 75% to 90%, and specifically, may be, but not limited to, 75%, 80%, 83%, 85%, 88%, 90%, and the like.

Alternatively, the thickness of the light modulation layer 30 is 5 μm to 12 μm, and specifically, may be, but is not limited to, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, and the like. When the thickness of the dimming layer 30 is too thin, the haze is low when the response voltage is not applied, and the shielding effect is not good; when the thickness of the dimming layer 30 is too thick, the response voltage is applied, and the response voltage is slightly fogged and cannot be completely transparent, thereby affecting the color change effect. Therefore, when the thickness of the light adjusting layer 30 is in the range of 5 μm to 12 μm, the light adjusting layer 30 has the best color changing effect before and after the adjustment response voltage is applied.

Optionally, the light modulation layer 30 comprises the following raw material components in parts by weight: 85-150 parts of acrylate glue; 18 to 28 parts of a biphenyl group-containing liquid crystal; and 70 to 85 parts of a phenyl-containing liquid crystal. In other words, in the raw material composition of the dimming layer 30, the weight ratio of the acrylate glue to the biphenyl group-containing liquid crystal to the phenyl group-containing liquid crystal satisfies (85 to 150): (18 to 28): (70 to 85); specifically, the following can be found in the following formula (85, 100). This can make the dimming layer 30 have better high temperature and high humidity resistance, and the haze adjustment has lower response voltage, and the haze adjustment has higher haze when the response voltage is not applied, and has lower haze when the response voltage is applied.

Optionally, the biphenyl group containing liquid crystal comprises one or more of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl and 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl. Alternatively, when the liquid crystal containing a biphenyl group includes 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl and 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl, the weight ratio of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl to 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl may be 1:2 to 2:1, specifically, but not limited to 1:2, 3:4, 1:1, 3:2, 2:1, and the like. When the weight ratio of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl to 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl is in this range, the dimming layer 30 produced can have better high temperature resistance and high humidity resistance, while the haze adjustment has a lower response voltage, and has a higher haze when the response voltage is not applied and a lower haze when the response voltage is applied.

Optionally, the phenyl-containing liquid crystal further comprises one or more of 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene and 2,3-difluoro-1-methoxy-4 [ (trans ) -4 '-propyl [1,1' -bicyclohexyl ] -4-yl ] butylbenzene. When the phenyl-containing liquid crystal comprises 1- [ (trans ) -4'- (3-butenyl) [1,1-bicyclohexane ] -4-tolyl, 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene and 2,3-difluoro-1-methoxy-4 [ (trans ) -4' -propyl [1,1 '-bicyclohexane ] -4-yl ] butylbenzene, the weight ratio of 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexane ] -4-tolyl, 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene and 2,3-difluoro-1-methoxy-4 [ (trans ) -4 '-propyl [1,1' -bicyclohexane ] -4-yl ] butylbenzene is (30 to 35): (19 to 23): (21 to 27); in particular, there may be, but is not limited to, 30:23: 27. 32:23: 27. 35:23: 27. 33:19: 27. 33:21: 27. 33:21: 21. 33:21: 23. 33:21:25, and the like. When the weight ratio of 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexyl ] -4-tolyl ] 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene to 2,3-difluoro-1-methoxy-4 [ (trans ) -4' -propyl [1,1' -bicyclohexyl ] -4-yl ] butylbenzene is in this range, the prepared dimming layer 30 can have better high temperature resistance and high humidity resistance, while the haze adjustment has lower response voltage, and has higher haze when the response voltage is not loaded and lower haze when the response voltage is loaded.

Optionally, the raw material components of the acrylate glue include an acrylate monomer, the acrylate monomer includes one or more of dimethylaminoethyl methacrylate, methyl methacrylate, ethyl methacrylate and butyl methacrylate, and the weight fraction of the acrylate monomer in the acrylate glue is 17% to 30%, specifically, but not limited to, 17%, 19%, 21%, 23%, 25%, 28%, 30%, and the like.

Optionally, the raw material composition of the acrylate glue further comprises a solvent, and the solvent comprises one or more of cyclohexanol, benzaldehyde, 2-ethylhexanol, 2-ethyl hexyl acetate, 3-hydroxy-4-methyl benzonitrile, ethanol, ethyl acetate, toluene and tetrahydrofuran.

In some embodiments, the raw material composition of the dimming layer 30 further includes an epoxy resin monomer, the weight of the epoxy resin monomer is 5% to 10% of the weight of the acrylate monomer, and specifically, may be, but is not limited to, 5%, 6%, 7%, 8%, 9%, 10%, and the like. The epoxy resin is not easy to absorb water, so that the prepared dimming layer 30 has better high temperature resistance and high humidity resistance, however, after the epoxy resin monomer is cured, the color is whitish, and the color change of the dimming layer 30 is not facilitated, so that the weight of the epoxy resin monomer is less than 10% of that of the acrylate monomer. Alternatively, the epoxy resin monomer may be, but is not limited to, a bisphenol a epoxy resin monomer.

In some embodiments, the raw material components of the dimming layer 30 include the following components in parts by weight: 8 to 12 parts of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl; 10 to 16 parts 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl; 19 parts to 23 parts of 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene; from 30 parts to 35 parts of 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexane ] -4-tolyl; 21 to 27 parts 2,3-difluoro-1-methoxy-4 [ (trans ) -4 '-propyl [1,1' -dicyclohexyl ] -4-yl ] butylbenzene; and 90 to 120 parts of dimethylaminoethyl methacrylate glue. When the ratio of the raw material components is within this range, the prepared dimming layer 30 has better high temperature resistance and high humidity resistance, and meanwhile, the haze adjustment has a lower response voltage, and has a higher haze when the response voltage is not applied and has a lower haze when the response voltage is applied.

Optionally, the raw material components of the dimming layer 30 further include a photoinitiator, and the weight of the photoinitiator is 1% to 11% of the weight of the acrylate monomer; specifically, it may be, but not limited to, 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, etc.

Alternatively, the photoinitiator may be, but is not limited to, one or more of 1-hydroxycyclohexyl phenyl ketone (photoinitiator 184), diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphite (Diphenyl (2,4,6-Trimethylbenzoyl) phenoline Oxide, TPO), 2-Hydroxy-4- (2-hydroxyethoxy) -2-methylpropiophenone (2-Hydroxy-4' - (2-hydroxyethoxy) -2-methylpropiophenone, photoinitiator 2959), propylthioxanthone (ITX), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinobenzylphenyl) butanone (photoinitiator 369), 2,4-Diethylthioxanthone (DETX), 2-Hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), benzophenone (Benzophenone, benzophenone BP). Alternatively, the thermal curing agent may be, but is not limited to, an isocyanate, for example, one or more of Hexamethylene Diisocyanate (HDI), diphenylmethane Diisocyanate (MDI), xylylene Diisocyanate (XDI), toluene Diisocyanate (TDI), isophorone Diisocyanate (IPDI), photoinitiator 1000 (20 wt% of 1-hydroxycyclohexyl phenyl ketone and 80wt% of 2-methyl-2-hydroxy-1-phenyl-1-propanone), photoinitiator 1300 (30 wt% of photoinitiator 369 and 70wt% of photoinitiator 651 (dimethyl benzil ketal, DMPA)), photoinitiator 1700 (25 wt% of photoinitiator BAPO (also called photoinitiator 819) and 75wt% of photoinitiator 1173), photoinitiator 500 (50 wt% of photoinitiator 1173 and 50wt% of BP).

In a specific embodiment, the raw material components of the light modulation layer 30 include the following components in parts by weight: 13 parts of cyclohexanol, 21 parts of benzaldehyde, 14 parts of 2-ethylhexanol, 17 parts of hexyl 2-ethylacetate, 16 parts of 3-hydroxy-4-methylbenzonitrile, 19 parts of dimethylaminoethyl methacrylate, 10 parts of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl, 21 parts of 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene, 13 parts of 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl, 32 parts of 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexyl ] -4-tolyl, 24 parts of 2,3-difluoro-1-methoxy-4 [ (trans ) -4' -propyl [1,1' -bicyclohexyl ] -4-yl ] butylbenzene and 2 parts of photoinitiator 184. When the raw material components are in this compounding ratio, the resultant light controlling layer 30 can be made to have better high temperature (85 ℃), high humidity (85 rh) resistance, while the response voltage for haze adjustment is low to 20V, and the haze is high to 88% when the response voltage is not applied, and the haze is low to 6% when the response voltage is applied.

Alternatively, the first conductive layer 10 is light-transmissive, and the first conductive layer 10 may include a conductive layer having a light transmittance of more than 80% such as an Indium Tin Oxide (ITO) layer, for example: 81%, 85%, 88%, 90%, 92%, 95%, etc., and the present application is not particularly limited.

Alternatively, the second conductive layer 50 is light-transmissive, and the second conductive layer 50 may include a conductive layer having a light transmittance of more than 80% such as an Indium Tin Oxide (ITO) layer, for example: 81%, 85%, 88%, 90%, 92%, 95%, etc., and the present application is not particularly limited.

Referring to fig. 2, in some embodiments, the decoration film 100 of the present embodiment further includes a first substrate 20 and a second substrate 40, where the first substrate 20 is disposed on a surface of the first conductive layer 10 away from the dimming layer 30, and is used for supporting the first conductive layer 10; the second substrate 40 is disposed on a surface of the second conductive layer 50 away from the dimming layer 30, and is used for supporting the first conductive layer 10.

Alternatively, the first substrate 20 may be, but is not limited to, one or more of polyethylene terephthalate, polycarbonate, polyimide, polymethyl methacrylate, and the like. The first substrate 20 may be a flexible substrate or a rigid substrate to adapt to different usage scenarios, and the present application is not limited specifically. When the first conductive layer 10 is prepared, the first conductive layer 10 is formed on the surface of the first substrate 20 by electroplating or the like. Alternatively, the thickness of the first substrate 20 is 50 μm to 60 μm, and specifically, may be, but is not limited to, 50 μm, 52 μm, 55 μm, 58 μm, 60 μm, and the like. Alternatively, the light transmittance of the first substrate 20 is greater than 85%, and specifically, may be, but is not limited to, 86%, 88%, 90%, 92%, 95%, 97%, 98%, and the like. The higher the light transmittance of the first substrate 20, the less the influence on the discoloration of the decorative film 100.

Alternatively, the second substrate 40 may be, but is not limited to, one or more of polyethylene terephthalate, polycarbonate, polyimide, polymethyl methacrylate, and the like. The second substrate 40 may be a flexible substrate or a rigid substrate to adapt to different usage scenarios, and the application is not limited in particular. When the first conductive layer 10 is prepared, the first conductive layer 10 is formed on the surface of the second substrate 40 by electroplating or the like. Alternatively, the thickness of the second substrate 40 is 50 μm to 60 μm, and specifically, may be, but is not limited to, 50 μm, 52 μm, 55 μm, 58 μm, 60 μm, and the like. Alternatively, the second substrate 40 has a light transmittance of more than 85%, and specifically, may be, but not limited to, 86%, 88%, 90%, 92%, 95%, 97%, 98%, and the like. The higher the light transmittance of the second substrate 40, the less the influence on the discoloration of the decoration film 100.

Referring to fig. 3, the decoration film 100 of the embodiment of the present application further includes: a texture layer 70, wherein the texture layer 70 is disposed on a side of the second conductive layer 50 away from the first conductive layer 10, and the texture layer 70 has a first texture (not shown). Optionally, the texture layer 70 is disposed on the surface of the second substrate 40 away from the first conductive layer 10.

When the light modulation layer 30 and the texture layer 70 are combined, and no response voltage is applied to the first conductive layer 10 and the second conductive layer 50, the liquid crystal molecules of the light modulation layer 30 are arranged in a disordered manner to present a matte state, and the texture layer 70 side of the decorative film 100 presents the color and texture after the light modulation layer 30 and the texture layer 70 are matched. When the first conductive layer 10 and the second conductive layer 50 are applied with a response voltage, liquid crystal molecules in the light modulation layer 30 are arranged in order, so that the haze of the light modulation layer 30 is reduced, the matte state is changed into a transparent state, and the color and texture of the texture layer 70 mainly appear on the texture layer 70 side of the decorative film 100. Therefore, the decorative film 100 presents different colors and textures before and after the response voltage is loaded, so that the color change effect of the decorative film 100 is realized, and the requirement of a user on color change can be better met.

Alternatively, the first texture may be, but is not limited to, one or more of a leather texture, a pattern, a color, a relief texture, and the like.

Alternatively, the texture layer 70 may be a UV light curing texture layer (UV texture layer). Optionally, the raw material component of the texture layer 70 is a photo-curing glue (e.g., UV glue), which may include urethane acrylate oligomer, photoinitiator, solvent, and auxiliary agent. In some embodiments, the photocurable glue may also include an acrylate monomer. Alternatively, the photoinitiator may be, but is not limited to, one or more of 1-hydroxycyclohexylphenylketone (1-hydroxycyclohexyl phenyl ketone, photoinitiator 184), diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphate (Diphenyl (2,4,6-trimethylbenzonyl) phenophine, TPO), benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2,4-Diethylthioxanthone (DETX), 2-hydroxy-2-methyl-1-phenylpropanone (photoinitiator 1173), photoinitiator 1000 (20 wt% of 1-hydroxycyclohexylphenylketone and 80wt% of 2-methyl-2-hydroxy-1-phenyl-1-propanone), photoinitiator 1300 (30 wt% of photoinitiator 369 and 70wt% of photoinitiator 651 (dimethylbenzyl ketal, DMPA)), photoinitiator BAPO (25 wt% of photoinitiator 819 (photoinitiator) and photoinitiator 1173), and photoinitiator 500 wt% of photoinitiator 1173. Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, methyl ethyl ketone, methyl butyl ketone. Optionally, the auxiliary agent includes an antifoaming agent, a leveling agent, and the like. The defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like.

Alternatively, the textured layer 70 may be formed by:

1) Providing a texture mold having a texture pattern thereon corresponding to a first texture of the texture layer 70; it should be understood that the texture pattern is a mirror image of the first texture.

2) Coating photocuring glue on the texture mould to form a photocuring glue layer; and

3) Transferring the photo-curing glue layer to the side of the second conductive layer 50 far away from the first conductive layer 10 (for example, the surface of the second substrate 40 far away from the first conductive layer 10), and curing at a curing energy of 800mj/cm ² To 1000mj/cm ² Is subjected to photocuring under ultraviolet light (e.g., mercury lamp) to cure the photocurable glue layer to form the texture layer 70.

Alternatively, the thickness of the texture layer 70 is 10 μm to 20 μm, and specifically, may be, but is not limited to, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 17 μm, 9 μm, 18 μm, 19 μm, 20 μm, and the like. When the thickness of the texture layer 70 is too thin, the formation of the first texture is not facilitated, when the thickness of the texture layer 70 is too thick, the thickness of the decoration film 100 is increased, when the decoration film is applied to a shell assembly of an electronic device, the thickness and the weight of the electronic device are increased, the hand feeling is affected, and the user experience is not good.

Referring again to fig. 3, in some embodiments, the decoration film 100 of the embodiment of the present application further includes: a cover substrate layer 90, wherein the cover substrate layer 90 is disposed on a side of the first conductive layer 10 away from the dimming layer 30, and the cover substrate layer 90 has a second texture (not shown). When the decoration film 100 is applied to an electronic device, the cover bottom layer 90 is used for shielding internal components of the electronic device, so as to prevent the internal components of the electronic device from affecting the appearance effect of the decoration film 100. Optionally, the cover bottom layer 90 is disposed on the surface of the first substrate 20 away from the texture layer 70.

Alternatively, the second texture may be, but is not limited to, one or more of a leather texture, a pattern, a color, a relief texture, and the like. When the response voltage is applied to the decorative film 100, the light modulation layer 30 becomes transparent, the texture presented on the texture layer 70 side of the decorative film 100 is the texture formed by overlapping the first texture and the second texture, when the response voltage is not applied to the decorative film 100, the light modulation layer 30 presents a matte surface, and the texture presented on the texture layer 70 side of the decorative film 100 is the first texture, so that the change of the texture of the decorative film 100 can be realized.

Alternatively, the cover bottom layer 90 may be, but is not limited to, a light-blocking ink that has an absorbing or reflecting effect on light. Alternatively, the cover bottom layer 90 may be black, white, or gray. When the decorative film 100 is loaded with the response voltage, the light modulation layer 30 becomes transparent, the texture layer 70 side of the decorative film 100 presents the color and texture of the base coat layer 90 combined with the texture layer 70, when the decorative film 100 is not loaded with the response voltage, the light modulation layer 30 presents a fog surface, and the texture layer 70 side of the decorative film 100 presents the color and texture of the light modulation layer 30 combined with the texture layer 70, so that the decorative film 100 has different colors by adjusting the voltage loading.

Alternatively, the thickness of the cover bottom layer 90 is 5 μm to 50 μm, and specifically, the thickness of the cover bottom layer 90 may be, but not limited to, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, or the like. Alternatively, the lid bottom layer 90 may be a single layer or a plurality of layers, such as 2,3, or 4 layers in a stacked arrangement. When the cover bottom layer 90 is a plurality of layers, the shielding effect is better than that of one layer. In one embodiment, the lid base layer 90 comprises two lid base layers 90. The thickness of each cap layer 90 is 8 μm to 12 μm, and specifically, may be, but not limited to, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, or the like. The cap bottom layer 90 may be formed by: 1) And (3) coating the shading ink on the surface of the optical coating layer far away from the texture layer 70, and baking for 30-60 min at 70-80 ℃ to form the cover bottom layer 90.

Referring to fig. 4, an embodiment of the present application further provides a method for preparing a decorative film 100, where the method may be applied to prepare the decorative film 100 of the embodiment of the present application, and the method includes:

s201, providing a first conductive substrate and a second conductive substrate, where the first conductive substrate includes a first substrate 20 and a first conductive layer 10 disposed on a surface of the first substrate 20, and the second conductive substrate includes a second substrate 40 and a second conductive layer 50 disposed on a surface of the second substrate 40;

s202, mixing the raw material components of the dimming layer 30 to form glue solution;

s203, coating the glue solution between the first conductive substrate and the second conductive substrate by coating modes such as spin coating, spray coating, coil coating and the like to form a structure in which the first substrate 20, the first conductive layer 10, the glue solution layer, the second conductive layer 50 and the second substrate 40 are sequentially stacked; and

and S204, carrying out photocuring to enable the glue solution layer to form the light adjusting layer 30.

Specifically, the glue solution layer is irradiated under ultraviolet light to enable the acrylate monomer to be subjected to photocuring, and the light modulation layer with liquid crystal dispersed in a solid polymer structure is formed.

When the glue layer comprises epoxy monomers, the method further comprises performing a thermal cure to cure the epoxy monomers to form an epoxy (polymer).

For the description of the same parts as those in the above embodiments, reference is made to the above embodiments, which are not repeated herein.

Referring to fig. 5, in some embodiments, the method for preparing the decoration film 100 further includes:

and S205, forming a texture layer 70 on the surface of the second substrate 40, which is far away from the dimming layer 30.

Referring to fig. 6, in some embodiments, the method for preparing the decoration film 100 further includes:

s206, forming a cover bottom layer 90 on the surface of the first substrate 20 away from the dimming layer 30.

The decoration film 100 of the present application will be further described with reference to specific examples.

The decorative film of the examples was prepared using the following steps:

1) Providing a first conductive substrate and a second conductive substrate, wherein the first conductive substrate and the second conductive substrate comprise a PET layer and an ITO layer which are arranged in a stacked mode;

2) Preparing a dimming layer glue solution;

specifically, the dimming layer glue solution comprises the following components in parts by weight:

13 parts of cyclohexanol, 21 parts of benzaldehyde, 14 parts of 2-ethylhexanol, 17 parts of hexyl 2-ethylacetate, 16 parts of 3-hydroxy-4-methylbenzonitrile, 19 parts of dimethylaminoethyl methacrylate, 10 parts of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl, 21 parts of 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene, 13 parts of 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl, 32 parts of 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexyl ] -4-tolyl, 24 parts of 2,3-difluoro-1-methoxy-4 [ (trans ) -4' -propyl [1,1' -bicyclohexyl ] -4-yl ] butylbenzene and 2 parts of photoinitiator 184.

3) Coating the dimming layer glue solution between the first conductive substrate and the second conductive substrate in a roll coating mode to form a structure in which a PET layer, an ITO layer, the glue solution layer, the ITO layer and the PET layer are sequentially stacked;

4) And carrying out ultraviolet curing to enable the glue solution layer to form a light modulation layer.

The thickness of the light control layer of the decorative film obtained in this example was 9 μm, and the appearance of the decorative film was as shown in FIG. 7 (a).

The comparative example used a decorative film (i.e., a PDLC film sheet) of Nintendo corporation, in which the thickness of the light-adjusting layer was 9 μm and the appearance of the decorative film was as shown in FIG. 7 (b).

The high temperature resistance and high humidity resistance of the decorative films of the examples and the comparative examples, and the light transmittance and haze of the decorative films under the condition of no load and 23V voltage load are respectively tested, and the specific test method is as follows:

and (3) high temperature resistance test: the decorative films of examples and comparative examples were placed in a vacuum oven at a temperature of 85 ℃ and taken out after 10 days, and failure regions of the decorative films of examples and comparative examples were observed, and the test results of examples are shown in fig. 7 (c) and the test results of comparative examples are shown in fig. 7 (d).

High temperature and high humidity resistance test, the decorative films of examples and comparative examples were placed in an environment of 85 ℃ and 85% RH of humidity, taken out after 10 days of placement, and failure regions of the decorative films of examples and comparative examples were observed, and the test results of examples are shown in FIG. 7 (e) and the test results of comparative examples are shown in FIG. 7 (f).

Light transmittance and haze test: the light transmittance and haze of the examples and the comparative examples were measured by GB 2410-1980 under a voltage of 23V and no voltage, respectively, and the specific results are shown in Table 1 below.

TABLE 1 light transmittance and haze at no voltage and 23V voltage applied in examples and comparative examples

As can be seen from table 1 above, the decorative film of the embodiment of the present application has a higher haze when no voltage is applied, has a lower haze when a voltage is applied, is more transparent, and has a larger difference between the haze when no voltage is applied and the haze when a voltage is applied, so that the decorative film has a better shielding effect when no voltage is applied, and has a better color change effect when a voltage is applied for color change. In addition, compared with the decorative film of the comparative example, the decorative film of the embodiment has better light transmittance in a voltage loading state and a voltage unloading state, and therefore has better color change effect.

Fig. 7 (a) and 7 (b) are pictures of examples and comparative examples of the present application when high temperature resistance and high humidity resistance were not performed, respectively. FIG. 7 (c) and FIG. 7 (d) are graphs showing the results of the high temperature resistance test conducted on the examples and comparative examples of the present application, respectively. FIG. 7 (e) and FIG. 7 (f) are graphs showing the results of tests performed on the examples and comparative examples of the present application after high temperature and high humidity tests, respectively. As can be seen from fig. 7 (c) and 7 (d), after the high temperature resistance test for 10 days, the width of the failure region of the decorative film according to the example of the present application was 500 μm, whereas the width of the failure region of the decorative film according to the comparative example was 1mm, and the width of the failure region of the decorative film according to the example of the present application was much lower than the width of the failure region of the decorative film according to the comparative example, and thus, the decorative film according to the example of the present application had better high temperature resistance. As can be seen from fig. 7 (e) and 7 (f), after a high temperature and high humidity resistance test for 10 days, the width of the failure region of the decorative film of the example of the present application was 500 μm, while the width of the failure region of the decorative film of the comparative example was 1mm, and the width of the failure region of the decorative film of the example of the present application was much smaller than that of the failure region of the decorative film of the comparative example, and thus, the decorative film of the example of the present application had better high temperature and high humidity resistance.

Referring to fig. 8, the present embodiment further provides a housing assembly 200, which includes: a housing body 210; the adhesive layer 230, the adhesive layer 230 is disposed on the surface of the housing body 210; the decoration film 100 of the embodiment of the present application, the adhesive layer 230 that the decoration film 100 is disposed on is far away from the surface of the housing body 210, and the adhesive layer 230 is adhered to the housing body 210, and the first conductive layer 10 is compared with the second conductive layer 50 which is far away from the housing body 210.

Alternatively, the structure of the housing assembly 200 may be a 2D, 2.5D, or 3D structure. The housing assembly 200 may be, but is not limited to, a rear cover, a battery cover, a middle frame, a decoration, etc. of the electronic device.

Alternatively, the housing body 210 is light-transmissive, and the housing body 210 may be, but not limited to, a Polycarbonate (PC) substrate, a Polymethyl Methacrylate (PMMA) substrate, a Polyethylene terephthalate (PET) substrate, a PC/PMMA composite plate, a PET/PMMA composite plate, a PC/PET/PMMA composite plate, an inorganic fiber resin plate, and the like. The light transmittance of the case body 210 is greater than or equal to 85%, and specifically, may be not limited to 85%, 88%, 90%, 91%, 92%, 93%, 94%, 95%, 96%, and the like. Optionally, the thickness of the housing body 210 is 0.25mm to 1mm; specifically, it may be, but not limited to, 0.25mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc. Alternatively, when the case body 210 is an inorganic fiber resin plate, the thickness of the inorganic fiber resin plate is 0.25mm to 0.4mm, and specifically, may be, but is not limited to, 0.25mm, 0.28mm, 0.3mm, 0.32mm, 0.35mm, 0.37mm, 0.4mm, and the like.

Alternatively, the raw material components of the inorganic fiber resin board include, but are not limited to, inorganic fiber cloth and polymerizable resin. The polymerizable resin can be, but is not limited to, an epoxy resin (e.g., bisphenol a epoxy), a phenolic resin, a polyester resin, a thermoplastic resin, and the like. The inorganic fiber resin plate is formed by soaking inorganic fiber cloth into polymerizable resin and curing the inorganic fiber cloth to form one or more layers of inorganic fiber resin plates which are arranged in a laminated manner. The inorganic fiber resin plate has good mechanical strength, and therefore, when the inorganic fiber resin plate is used as a base material, the housing assembly 200 can be made thinner, and the use experience of a user is improved. The inorganic fiber cloth can be, but is not limited to, an inorganic fiber cloth formed by one or more of glass fiber, carbon fiber quartz glass fiber, boron fiber, ceramic fiber and metal fiber. The inorganic fiber resin plate has good mechanical strength, and therefore, when the inorganic fiber resin plate is used as the housing body 210, the housing assembly 200 can be made thinner, and the user experience can be improved.

Optionally, the adhesive layer 230 may be transparent or translucent. The material composition of the adhesive layer 230 may be, but not limited to, hot melt adhesive, thermosetting adhesive, UV adhesive, etc. The hot melt adhesive may be, but is not limited to, a thermoplastic polyurethane hot melt adhesive. The thermosetting glue may be, but is not limited to, a polyurethane thermosetting glue. UV glues include, but are not limited to, urethane acrylates. The thickness of the adhesive layer 230 is 10 μm to 50 μm, and specifically, may be, but not limited to, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, and the like. When the raw material composition of the adhesive layer 230 is a hot melt adhesive, the thickness of the adhesive layer 230 may be 30 μm to 50 μm. When the raw material component of the adhesive layer 230 is a thermosetting glue or a UV glue, the thickness of the adhesive layer 230 may be 10 μm to 20 μm.

For a detailed description of the decoration film 100, please refer to the description of the corresponding parts of the above embodiments, which will not be repeated herein.

Referring to fig. 9, an embodiment of the present application further provides an electronic device 300, which includes: a display component 310 for displaying; in the housing assembly 200 according to the embodiment of the present application, the housing assembly 200 and the display assembly 310 enclose an accommodating space 301; and a circuit board assembly 330, wherein the circuit board assembly 330 is disposed in the accommodating space 301, electrically connected to the display assembly 310, and configured to control the display assembly 310 to display.

The electronic device 300 according to the embodiment of the present disclosure may be, but is not limited to, a portable electronic device 300 such as a mobile phone, a tablet, a notebook, a desktop, a smart band, a smart watch, an electronic reader, and a game machine.

For a detailed description of the housing assembly 200, please refer to the description of the corresponding parts of the above embodiments, which is not repeated herein.

Optionally, the display module 310 may be, but is not limited to, one or more of a liquid crystal display module 310, a light emitting diode display module 310 (LED display module 310), a micro light emitting diode display module 310 (micro LED display module 310), a sub-millimeter light emitting diode display module 310 (MiniLED display module 310), an organic light emitting diode display module 310 (OLED display module 310), and the like.

Referring also to fig. 10, optionally, the circuit board assembly 330 may include a processor 331 and a memory 333. The processor 331 is electrically connected to the display component 310 and the memory 333, respectively. The processor 331 is configured to control the display component 310 to display, and the memory 333 is configured to store a program code required by the processor 331 to operate, a program code required by the processor 310 to control the display component 310, display content of the display component 310, and the like.

Alternatively, processor 331 includes one or more general-purpose processors 331, wherein general-purpose processor 331 may be any type of device capable of Processing electronic instructions, including a Central Processing Unit (CPU) 331, a microprocessor 331, a microcontroller, a main processor 331, a controller, and an ASIC, among others. Processor 331 is configured to execute various types of digitally stored instructions, such as software or firmware programs stored in memory 333, which enable the computing device to provide a wide variety of services.

Alternatively, the Memory 333 may include a Volatile Memory 333 (Volatile Memory), such as a Random Access Memory 333 (RAM); the Memory 333 may also include a Non-volatile Memory 333 (NVM), such as a Read-Only Memory 333 (ROM), a Flash Memory 333 (FM), a Hard Disk (HDD), or a Solid-State Drive (SSD). Memory 333 may also include a combination of memory 333 of the sort described above.

Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A decorative film, comprising:

a first conductive layer;

the light adjusting layer is arranged on the surface of the first conducting layer and used for adjusting haze so as to enable the light adjusting layer to change color, and the light adjusting layer comprises the following raw material components: acrylate glue; a biphenyl group-containing liquid crystal; and a phenyl-containing liquid crystal including 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexyl ] -4-tolyl), the response voltage of the haze adjustment by the light adjustment layer being greater than or equal to 20V and less than 36V; the light modulation layer comprises the following raw material components in parts by weight: 85-150 parts of acrylate glue; 18 to 28 parts of a biphenyl group-containing liquid crystal and 70 to 85 parts of a phenyl group-containing liquid crystal; and

2. The decorative film of claim 1, wherein the biphenyl group containing liquid crystal comprises one or more of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl and 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl.

3. The decorative film of claim 2, wherein the phenyl-containing liquid crystal further comprises one or more of 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene and 2,3-difluoro-1-methoxy-4 [ (trans ) -4 '-propyl [1,1' -bicyclohexyl ] -4-yl ] butylbenzene.

4. The decoration film of claim 3, wherein the raw material components of the acrylate glue comprise an acrylate monomer, the acrylate monomer comprises one or more of dimethylaminoethyl methacrylate, methyl methacrylate, ethyl methacrylate and butyl methacrylate, and the weight fraction of the acrylate monomer in the acrylate glue is 17-30%.

5. The decorative film according to claim 4, wherein the raw material composition of the gloss control layer further comprises an epoxy resin monomer, and the weight of the epoxy resin monomer is 5 to 10% of the weight of the acrylate monomer.

6. The decorative film according to claim 4 or 5, wherein the raw material components of the gloss control layer comprise the following components in parts by weight:

8 to 12 parts of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl;

10 to 16 parts 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl;

19 to 23 parts of 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene;

30 to 35 parts of 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexane ] -4-tolyl;

21 to 27 parts 2,3-difluoro-1-methoxy-4 [ (trans ) -4 '-propyl [1,1' -dicyclohexyl ] -4-yl ] butylbenzene; and

90 to 120 parts of dimethylaminoethyl methacrylate glue.

7. The decorative film according to claim 6, wherein the raw material components of the gloss control layer comprise the following components in parts by weight: 13 parts of cyclohexanol, 21 parts of benzaldehyde, 14 parts of 2-ethylhexanol, 17 parts of hexyl 2-ethylacetate, 16 parts of 3-hydroxy-4-methylbenzonitrile, 19 parts of dimethylaminoethyl methacrylate, 10 parts of 4- (4-ethylcyclohexyl) -3,4-difluoro-1,1-biphenyl, 21 parts of 4- [ trans-4- (trans-4-propylcyclohexyl) cyclohexyl ] toluene, 13 parts of 3,4-dicyano-4- (4-pentylcyclohexyl) biphenyl, 32 parts of 1- [ (trans ) -4' - (3-butenyl) [1,1-bicyclohexyl ] -4-tolyl, 24 parts of 2,3-difluoro-1-methoxy-4 [ (trans ) -4' -propyl [1,1' -bicyclohexyl ] -4-yl ] butylbenzene and 2 parts of photoinitiator.

8. The decorative film of claim 1, wherein the dimming layer has a thickness of 5 to 12 μ ι η, a haze of 80% or more, and a haze of 10% or less when the response voltage is applied.

9. The decorative film according to claim 1, further comprising:

the texture layer is arranged on one side, far away from the first conductive layer, of the second conductive layer and is provided with a first texture.

10. The decorative film of claim 9, further comprising:

the cover bottom layer is arranged on one side, away from the dimming layer, of the first conducting layer and is provided with second textures.

11. A housing assembly, comprising:

a housing body;

the adhesive layer is arranged on the surface of the shell body; and

the decoration film of any one of claims 1 to 10, wherein the decoration film is disposed on an adhesive layer away from a surface of the housing body and is adhered to the housing body through the adhesive layer, and the first conductive layer is disposed away from the housing body than the second conductive layer.

12. An electronic device, comprising:

a display component for displaying;

the housing assembly of claim 11, said housing assembly and said display assembly enclosing a housing space; and