CN113301712A - Circuit board processing method and circuit board - Google Patents

Circuit board processing method and circuit board Download PDF

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Publication number
CN113301712A
CN113301712A CN202110539479.6A CN202110539479A CN113301712A CN 113301712 A CN113301712 A CN 113301712A CN 202110539479 A CN202110539479 A CN 202110539479A CN 113301712 A CN113301712 A CN 113301712A
Authority
CN
China
Prior art keywords
layer
coating
copper
circuit board
copper layer
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Pending
Application number
CN202110539479.6A
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Chinese (zh)
Inventor
刘会敏
王文剑
刘金娸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Threetek Technology Co ltd
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Shenzhen Threetek Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Threetek Technology Co ltd filed Critical Shenzhen Threetek Technology Co ltd
Priority to CN202110539479.6A priority Critical patent/CN113301712A/en
Publication of CN113301712A publication Critical patent/CN113301712A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB

Abstract

The invention relates to a processing method of a circuit board and the circuit board, wherein the processing method comprises the following steps: providing an inner layer substrate, wherein the inner layer substrate is provided with inner layer dielectric layers, a line layer positioned between the inner layer dielectric layers and a copper layer positioned on the outer surface of the inner layer dielectric layer and corresponding to the line layer area; carrying out copper reduction and pattern manufacturing on the copper layer, and forming a blank pattern area corresponding to the circuit layer on the copper layer; mixing epoxy resin conductive silver paste with photosensitive printing ink to form coating paste; arranging the coating slurry on the copper layer to form a coating; pre-baking; after the pre-baking is finished, making a coating pattern; an outer medium layer is respectively laminated on two sides of the inner substrate; and attaching the reinforcing sheet to the outer dielectric layer, and then pressing to form the required circuit board. The invention has reasonable overall structural design and simple and convenient processing method, and can effectively improve the shielding property and high heat dissipation of circuit board products in fine fields such as medical treatment and the like.

Description

Circuit board processing method and circuit board
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board processing method and a circuit board.
Background
A Circuit Board, also called a Printed Circuit Board (PCB) or a Printed Circuit Board (PCB), is a support for electronic components and is a carrier for electrical connection.
The circuit board used in some precision fields such as medical equipment requires high shielding performance, prevents interference of other electronic components in the internal electric signal transmission process, and meanwhile, the local part of the equipment can generate large heat in the working process, so that the heat dissipation performance of the circuit board is required to be strong.
At present, the requirement of high shielding performance is generally realized by sticking an electromagnetic film on a line, namely sticking the electromagnetic film with insulating colloid on an area needing the high shielding performance to realize the high shielding performance of the circuit in the area; however, due to the fact that the laminating force of the electromagnetic film is limited, the problems that the electromagnetic film sideslips and falls off and the like easily occur in the subsequent processing process, the laminating precision is limited due to the fact that the electromagnetic film is attached in an aligning and laminating mode, the requirement for processing a circuit board with high precision is difficult to meet, and in addition, the electromagnetic film is easily affected by processing in the subsequent processing process, the situations that expansion and contraction are unstable and the like are generated, and the electromagnetic film is caused to lose efficacy.
For a high heat dissipation circuit board, there are many design and processing implementations, for example, the method of increasing the copper thickness of the circuit, or increasing a heat dissipation module in a region where heat dissipation is needed, or increasing a heat dissipation device outside the circuit board is adopted, but the volume of the circuit module in the device needs to be increased, or the original circuit design needs to be changed, so that the design of other modules is changed, the overall design cost is increased, and the design and manufacturing are complicated.
Based on the above problems, a circuit board with high shielding performance and high heat dissipation performance and a processing method thereof need to be designed and manufactured, so as to meet the circuit board requirements in fine fields such as medical treatment.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a circuit board processing method and a circuit board, which can have the effects of high shielding property and high heat dissipation property and meet the circuit board requirements in the fine field.
The first aspect of the present invention provides a method for processing a circuit board, including: providing an inner-layer substrate, wherein the inner-layer substrate is provided with inner-layer dielectric layers, a line layer positioned between the inner-layer dielectric layers and a copper layer positioned on the outer surface of the inner-layer dielectric layer and corresponding to the area of the line layer region, and the area of the copper layer is larger than that of the line layer; carrying out copper reduction and pattern manufacturing on the copper layer, and forming a blank pattern area corresponding to the circuit layer on the copper layer; mixing epoxy resin conductive silver paste with photosensitive printing ink to form coating paste; arranging the coating slurry on the copper layer to form a coating, wherein the coating fills the blank pattern region, the area of the coating is larger than that of the copper layer, and the coating completely covers the copper layer region; pre-baking; after the pre-baking is finished, manufacturing a coating pattern by adopting an exposure, development and post-baking mode, wherein the coating pattern completely covers the blank pattern area; respectively laminating an outer dielectric layer on two sides of the inner substrate; and attaching a reinforcing sheet to the outer dielectric layer, and then pressing to form the required circuit board.
Optionally, the area of the coating pattern is smaller than the area of the copper layer.
Optionally, the reinforcing sheet comprises a stainless steel sheet, a nickel layer and an adhesive layer, and the reinforcing sheet is attached to the region of the outer dielectric layer corresponding to the circuit layer through the adhesive layer.
Optionally, the copper reduction and patterning of the copper layer are specifically performed by forming a blank pattern region corresponding to the circuit layer on the copper layer in a manner of film pasting, exposure, development, and etching.
Optionally, the volume ratio of the epoxy resin conductive silver paste to the photosensitive ink in the coating paste is 10: 1-20: 1.
Optionally, the copper layer single side is 1-5 mm larger than the circuit layer single side.
Optionally, the baking parameters for pre-baking are 75 ℃ multiplied by 20-30 min.
Optionally, the step of disposing the coating paste on the copper layer includes silk-screening the coating paste on the copper layer by a silk-screen printing method.
The second aspect of the present invention provides a circuit board, which is manufactured by the above processing method, and includes: the inner-layer substrate is provided with inner-layer dielectric layers, line layers positioned between the inner-layer dielectric layers and copper layers positioned on the outer side surfaces of the inner-layer dielectric layers and corresponding to the line layer regions, and blank pattern regions corresponding to the line layers are arranged on the copper layers; the coating pattern is arranged on the copper layer and covers the blank pattern area; the outer dielectric layers are pressed on two sides of the inner substrate; and the reinforcing sheet is attached to the outer medium layer.
Optionally, the reinforcing sheet comprises a stainless steel sheet, a nickel layer and an adhesive layer, and the reinforcing sheet is attached to the region of the outer dielectric layer corresponding to the circuit layer through the adhesive layer.
Adopt above-mentioned technical scheme, mix epoxy conductive silver thick liquid with sensitization printing ink, form and scribble the thick liquid, scribble thick liquid silk screen printing and possess high shielding nature region in needs, promptly on the copper layer with the region that the circuit layer corresponds forms the coating, because epoxy conductive silver thick liquid possesses good metal level characteristic, and possesses good heat conduction characteristic, therefore the coating can play high shielding, high radiating effect, still simultaneously through the attached reinforcement piece in this region, on the one hand forms the intensive support effect to this region, on the other hand further plays the effect of reinforcing shielding performance from the surface, the overall structure of circuit board reasonable in design, the processing method is simple convenient, can effectively improve shielding nature, the high heat dissipation of the circuit board product in meticulous fields such as medical treatment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a method for processing a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic view of an inner substrate according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of the copper layer after copper reduction and patterning according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of the copper layer coated with the coating paste by screen printing in the embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a coating pattern formed according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a circuit board according to an embodiment of the invention.
The reference numbers are as follows:
101-inner dielectric layer, 102-circuit layer, 103-copper layer, 104-blank pattern area, 105-coating, 106-coating pattern, 107-outer dielectric layer, 108-reinforcing sheet, 1081-stainless steel sheet, 1082-nickel layer and 1083-glue layer.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1:
referring to fig. 1, an embodiment of the present invention provides a method for processing a circuit board, including:
s1: providing an inner layer substrate, wherein the inner layer substrate is provided with inner layer dielectric layers, a line layer positioned between the inner layer dielectric layers and a copper layer positioned on the outer side surface of the inner layer dielectric layer and corresponding to the area of the line layer region, and the area of the copper layer is larger than that of the line layer.
Referring to fig. 2 specifically, an inner substrate is taken, the inner substrate is provided with inner dielectric layers 101 and circuit layers 102 located between the dielectric layers 101, regions where the circuit layers 102 are located and corresponding regions of the inner substrate are both regions where high shielding performance and high heat dissipation performance need to be manufactured, a copper layer 103 is arranged on the outer side surface of the inner dielectric layer 101, the area of the copper layer 103 is larger than that of the circuit layer 102, and optionally, the single side of the copper layer 103 is 1-5 mm larger than that of the circuit layer 102.
S2: and carrying out copper reduction and pattern manufacturing on the copper layer, and forming a blank pattern area corresponding to the circuit layer on the copper layer.
Referring to fig. 3, the copper and the copper layer 103 are subjected to copper reduction and patterning, and a blank pattern region 104 corresponding to the circuit layer 102 is etched on the copper layer 103 by means of film pasting, exposure, development and etching, so as to reserve a position for subsequent coating manufacturing and provide a bonding force basis for the edge copper layer.
S3: and mixing the epoxy resin conductive silver paste with the photosensitive printing ink to form coating paste.
It should be further noted that, this step may also be performed before step S1, and the coating paste is prepared for standby, and optionally, the volume ratio of the epoxy resin conductive silver paste to the photosensitive ink in the coating paste is 10:1 to 20: 1.
S4: and arranging the coating slurry on the copper layer to form a coating, wherein the coating fills the blank pattern region, the area of the coating is larger than that of the copper layer, and the coating completely covers the copper layer region.
Looking up fig. 4, the prepared coating paste is applied on the copper layer 103 to form a coating layer 105, the blank pattern region 104 is filled with the coating layer 105, the area of the coating layer 105 is larger than that of the copper layer 103, the coating layer 103 is completely covered with the coating layer 105, and the epoxy resin conductive silver paste in the coating paste has good metal layer characteristics and good heat conduction characteristics, so that the coating layer 105 can achieve high shielding and high heat dissipation effects.
Optionally, disposing the pasting paste on the copper layer 103 includes: the coating paste is silk-screened on the copper layer 103 by a silk-screen printing method, and it should be noted that silk-screen printing is not the only method for disposing a coating on the copper layer, and is not limited herein.
S5: and (5) carrying out prebaking.
The coating 105 is cured by pre-baking.
Optionally, the coating 105 may be cured by baking at 75 ℃ for 20-30 min.
S6: and after the pre-baking is finished, manufacturing a coating pattern by adopting an exposure, development and post-baking mode, wherein the coating pattern completely covers the blank pattern area.
Referring to fig. 5, since the coating paste contains photosensitive ink components, the coating 105 has photosensitive characteristics, and after the pre-baking is completed, a coating pattern 106 is formed by exposure, development and post-baking, and the coating pattern 106 completely covers the blank pattern area 104.
Optionally, in order to make the bonding force of the coating pattern 106 stronger, after the development and etching, the area of the coating pattern 106 is smaller than the area of the copper layer 103, that is, the coating layer outside the area of the copper layer 103 is etched away, and the coating layer in the blank pattern area 104 and a part of the coating layer on the copper layer 103 are remained.
It will be appreciated that this step is aimed at further processing the coating 105, removing unwanted parts, obtaining the coating pattern 106, ensuring the flatness and regularity of the coating pattern 106.
S7: and respectively laminating an outer dielectric layer on two sides of the inner substrate.
Referring to fig. 6, after the coating pattern 106 is manufactured, an outer dielectric layer 107 is respectively stacked on both sides of the inner substrate, and the outer dielectric layer 107 protects the coating pattern 106 and the copper layer 103 and has an insulating effect.
S8: and attaching a reinforcing sheet to the outer dielectric layer, and then pressing to form the required circuit board.
Referring to fig. 6, a reinforcing sheet 108 is attached to the outer dielectric layer 107, and then pressed to form the desired circuit board.
Optionally, the reinforcing sheet 108 includes a stainless steel sheet 1081, a nickel layer 1082, and an adhesive layer 1083, and the reinforcing sheet 108 is attached to the outer dielectric layer 107 in a region corresponding to the circuit layer 102 through the adhesive layer 1083.
Optionally, the pressing can be performed at a temperature of 180 ℃ for 2-5 min.
It will be appreciated that the attachment of the reinforcing sheet 108 on the one hand provides a reinforcing support to this region and on the other hand further serves to enhance the shielding performance from the outer surface.
The size of the reinforcing sheet 108 is larger than that of the copper layer 103, and the reinforcing sheet 108 can be manufactured in the following manner: taking a stainless steel sheet, pasting a corrosion resistant film on one surface of the stainless steel sheet, then plating nickel on the other surface of the stainless steel sheet, after the nickel plating is finished, manufacturing a glue layer on the nickel layer, and tearing off the corrosion resistant film to obtain the finished reinforcing sheet 108.
The method of manufacturing the reinforcing sheet is not limited to the only method, and the reinforcing sheet may be obtained in other forms, and is not particularly limited herein.
Example 2:
referring to fig. 6, an embodiment of the present invention provides a circuit board, including:
the circuit board comprises an inner layer substrate, a plurality of first insulating layers and a plurality of second insulating layers, wherein the inner layer substrate is provided with inner layer dielectric layers 101, circuit layers 102 positioned between the inner layer dielectric layers 101 and a copper layer 103 positioned on the outer side surface of the inner layer dielectric layers 101 and corresponding to the circuit layers 102, and blank pattern areas corresponding to the circuit layers 102 are arranged on the copper layer 103;
a coating pattern 106 disposed on the copper layer 102 covering the blank pattern region;
outer dielectric layers 107 laminated on both sides of the inner substrate;
and the reinforcing sheet 108 is attached to the outer dielectric layer 107.
Optionally, the reinforcing sheet 108 includes a stainless steel sheet 1081, a nickel layer 1082, and an adhesive layer 1083, and the reinforcing sheet 108 is attached to the outer dielectric layer 107 in a region corresponding to the circuit layer 102 through the adhesive layer 1083.
Optionally, the inner dielectric layer 101 and the outer dielectric layer 107 are made of polyimide, epoxy resin-glass fiber, or polytetrafluoroethylene.
The circuit board provided by the embodiment of the invention can be prepared by adopting the method in the embodiment 1. For a more detailed description, refer to example 1.
According to the processing method of the circuit board and the circuit board, disclosed by the embodiment of the invention, the epoxy resin conductive silver paste and the photosensitive printing ink are mixed to form the coating paste, the coating paste is printed on the area needing high shielding property, namely the area corresponding to the circuit layer on the copper layer by silk screen printing to form the coating, and the epoxy resin conductive silver paste has good metal layer characteristics and good heat conduction characteristics, so that the coating can achieve the effects of high shielding and high heat dissipation.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
In the description of the present patent, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", "row", "column", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used only for convenience in describing and simplifying the description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present patent.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present patent application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.
In the patent of the invention, unless otherwise explicitly specified or limited, the terms "mounted", "connected", "fixed", and the like are to be understood in a broad sense, and for example, may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present patent can be understood by those skilled in the art according to specific situations.
In the patent of the invention, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacted with the first and second features or indirectly contacted with the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Claims (10)

1. A method for processing a circuit board, comprising:
providing an inner-layer substrate, wherein the inner-layer substrate is provided with inner-layer dielectric layers, a line layer positioned between the inner-layer dielectric layers and a copper layer positioned on the outer surface of the inner-layer dielectric layer and corresponding to the area of the line layer region, and the area of the copper layer is larger than that of the line layer;
carrying out copper reduction and pattern manufacturing on the copper layer, and forming a blank pattern area corresponding to the circuit layer on the copper layer;
mixing epoxy resin conductive silver paste with photosensitive printing ink to form coating paste;
arranging the coating slurry on the copper layer to form a coating, wherein the coating fills the blank pattern region, the area of the coating is larger than that of the copper layer, and the coating completely covers the copper layer region;
pre-baking;
after the pre-baking is finished, manufacturing a coating pattern by adopting an exposure, development and post-baking mode, wherein the coating pattern completely covers the blank pattern area;
respectively laminating an outer dielectric layer on two sides of the inner substrate;
and attaching a reinforcing sheet to the outer dielectric layer, and then pressing to form the required circuit board.
2. The method as claimed in claim 1, wherein the area of the coating pattern is smaller than the area of the copper layer.
3. The method as claimed in claim 1, wherein the stiffener comprises a stainless steel sheet, a nickel layer and a glue layer, and the stiffener is attached to the outer dielectric layer at a region corresponding to the circuit layer through the glue layer.
4. The method as claimed in claim 1, wherein the copper-reducing and patterning operation performed on the copper layer is to form a blank pattern region corresponding to the circuit layer on the copper layer by means of film-coating, exposure, development and etching.
5. The processing method of the circuit board as claimed in claim 1, wherein the volume ratio of the epoxy resin conductive silver paste to the photosensitive ink in the coating paste is 10: 1-20: 1.
6. The method as claimed in claim 1, wherein the copper layer side is 1-5 mm larger than the circuit layer side.
7. The method for processing a circuit board according to claim 1, wherein the pre-baking is performed at 75 ℃ for 20-30 min.
8. The method as claimed in claim 1, wherein said disposing the paste on the copper layer comprises screen printing the paste on the copper layer.
9. A circuit board, characterized in that the circuit board is manufactured by the processing method according to any one of claims 1 to 7, and comprises:
the inner-layer substrate is provided with inner-layer dielectric layers, line layers positioned between the inner-layer dielectric layers and copper layers positioned on the outer side surfaces of the inner-layer dielectric layers and corresponding to the line layer regions, and blank pattern regions corresponding to the line layers are arranged on the copper layers;
the coating pattern is arranged on the copper layer and covers the blank pattern area;
the outer dielectric layers are pressed on two sides of the inner substrate;
and the reinforcing sheet is attached to the outer medium layer.
10. The circuit board of claim 9, wherein the reinforcing sheet comprises a stainless steel sheet, a nickel layer and an adhesive layer, and the reinforcing sheet is attached to the outer dielectric layer in a region corresponding to the circuit layer through the adhesive layer.
CN202110539479.6A 2021-05-18 2021-05-18 Circuit board processing method and circuit board Pending CN113301712A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110539479.6A CN113301712A (en) 2021-05-18 2021-05-18 Circuit board processing method and circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110539479.6A CN113301712A (en) 2021-05-18 2021-05-18 Circuit board processing method and circuit board

Publications (1)

Publication Number Publication Date
CN113301712A true CN113301712A (en) 2021-08-24

Family

ID=77322618

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110539479.6A Pending CN113301712A (en) 2021-05-18 2021-05-18 Circuit board processing method and circuit board

Country Status (1)

Country Link
CN (1) CN113301712A (en)

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