CN113286413A - Heat dissipation circuit board and manufacturing process thereof - Google Patents
Heat dissipation circuit board and manufacturing process thereof Download PDFInfo
- Publication number
- CN113286413A CN113286413A CN202110355190.9A CN202110355190A CN113286413A CN 113286413 A CN113286413 A CN 113286413A CN 202110355190 A CN202110355190 A CN 202110355190A CN 113286413 A CN113286413 A CN 113286413A
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- China
- Prior art keywords
- layer
- circuit board
- circuit
- guide holes
- heat
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Abstract
The invention discloses a heat dissipation circuit board and a manufacturing process thereof, the heat dissipation circuit board comprises a circuit layer, a heat conduction insulating layer, a base layer and a communicating piece, wherein the circuit layer is provided with a plurality of first guide holes, the first guide holes penetrate through the circuit layer, the heat conduction insulating layer is provided with a plurality of second guide holes, the second guide holes penetrate through the heat conduction insulating layer, the second guide holes are communicated with the corresponding first guide holes, the circuit board and the base layer are both made of copper, the circuit layer, the heat conduction insulating layer and the base layer are sequentially connected, the communicating piece is arranged on the inner walls of the first guide holes and the second guide holes, and the communicating piece is used for communicating the circuit layer with the base layer. The invention can quickly dissipate the heat generated by the circuit layer.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a heat dissipation circuit board and a manufacturing process thereof.
Background
The brushless direct current motor has obvious advantages and is rapidly developed. After entering China, the novel electric heating water heater is rapidly favored by industries such as household appliances, automobiles, ships and machinery, occupies a place in various industries, and develops rapidly.
The printed circuit board applied to the brushless motor driver at present does not have the functions of heat conduction and high current carrying, heat generated by long-time work of the driver cannot be rapidly dissipated, and the current carrying function cannot meet frequent damage.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a heat dissipation circuit board which can quickly dissipate heat generated by a circuit layer.
The heat dissipation circuit board according to the embodiment of the first aspect of the present invention includes a circuit layer, a heat conduction insulating layer, a base layer, and a communication member, wherein the circuit layer is provided with a plurality of first vias, the first vias penetrate through the circuit layer, the heat conduction insulating layer is provided with a plurality of second vias, the second vias penetrate through the heat conduction insulating layer, the second vias communicate with the corresponding first vias, the circuit board and the base layer are made of copper, the circuit layer, the heat conduction insulating layer, and the base layer are sequentially connected, the communication member is disposed on inner walls of the first vias and the second vias, and the communication member is used for communicating the circuit layer and the base layer.
The heat dissipation circuit board provided by the embodiment of the invention at least has the following beneficial effects: the heat conduction insulating layer has the functions of heat conduction and insulation, can prevent the circuits of the circuit layer from conducting electricity and can conduct the heat of the circuit layer to the base layer; the communicating piece is arranged between the first guide hole and the second guide hole, so that the circuit layer is in thermal communication with the base layer, and the heat dissipation effect of the circuit board is improved; copper is a material having thermal conductivity, and the base layer is made of copper, so that heat generated from the circuit layer can be rapidly transferred to the outside.
According to some embodiments of the invention, the first via is formed by chemical etching and the second via is formed by laser drilling.
According to some embodiments of the invention, the communication piece is formed by electroless copper plating.
According to a second aspect of the present invention, a manufacturing process of a heat dissipating circuit board includes the steps of: pressing, namely pressing the circuit layer, the heat conduction insulating layer and the base layer; etching, namely chemically etching a plurality of first guide holes on the circuit layer; laser drilling, namely etching a plurality of second guide holes on the heat-conducting insulating layer based on the corresponding first guide holes; and chemically depositing copper on the inner walls of the first guide hole and the second guide hole to form a communicating piece.
The manufacturing process of the heat dissipation circuit board provided by the embodiment of the invention at least has the following beneficial effects: the heat conduction insulating layer has the functions of heat conduction and insulation, can prevent the circuits of the circuit layer from conducting electricity and can conduct the heat of the circuit layer to the base layer; the communicating piece is arranged between the first guide hole and the second guide hole, so that the circuit layer is in thermal communication with the base layer, and the heat dissipation effect of the circuit board is improved; copper is a material having thermal conductivity, and the base layer is made of copper, so that heat generated from the circuit layer can be rapidly transferred to the outside. According to some embodiments of the invention, + technical effect.
According to some embodiments of the present invention, the circuit layer thickness in the step of laminating is 0.5 ± 0.01 ounce, and the circuit line width of the circuit layer is 0.1 ± 0.01 mm.
According to some embodiments of the present invention, the thermally conductive and insulating layer in the step of laminating is composed of a plurality of components selected from bisphenol a epoxy resin, biphenyl epoxy resin, naphthalene ring epoxy resin, rubber, filler, amine curing agent and accelerator.
According to some embodiments of the present invention, the step of etching has a first via diameter of 0.15 ± 0.03 mm.
According to some embodiments of the present invention, the step of laser drilling the second via hole has a diameter of 0.15mm +0.1/-0 mm.
According to some embodiments of the present invention, the first via hole in the etching step and the corresponding second via hole in the laser drilling step are coaxial.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view of a heat dissipation circuit board according to an embodiment of the invention.
A wiring layer 100;
a thermally conductive insulating layer 200;
a communication member 400.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
Referring to fig. 1, a heat dissipating circuit board according to an embodiment of the first aspect of the present invention includes a circuit layer 100, a heat conductive insulating layer 200, a base layer 300, and a communication member 400, wherein the circuit layer 100 is provided with a plurality of first vias, the first vias penetrate through the circuit layer 100, the heat conductive insulating layer 200 is provided with a plurality of second vias, the second vias penetrate through the heat conductive insulating layer 200, the second vias communicate with corresponding first vias, the circuit board and the base layer 300 are made of copper, the circuit layer 100, the heat conductive insulating layer 200, and the base layer 300 are sequentially connected, the communication member 400 is disposed on inner walls of the first vias and the second vias, and the communication member 400 is used for communicating the circuit layer 100 and the base layer 300.
The heat dissipation circuit board provided by the embodiment of the invention at least has the following beneficial effects: the heat conductive insulating layer 200 has heat conductive and insulating functions, and can prevent electric conduction between circuits of the circuit layer 100 and conduct heat of the circuit layer 100 to the base layer 300; the communication piece 400 is arranged between the first guide hole and the second guide hole, so that the circuit layer 100 is in thermal communication with the base layer 300, and the heat dissipation effect of the circuit board is improved; copper is a material having thermal conductivity, and the base layer 300 is made of copper, and can rapidly transfer heat generated from the wiring layer 100 to the outside.
Referring to fig. 1, according to a manufacturing process of a heat dissipation circuit board according to an embodiment of the first aspect of the present invention, a circuit layer 100, a heat conductive insulating layer 200, and a base layer 300 are laminated; etching, namely chemically etching a plurality of first guide holes on the circuit layer 100; laser drilling, etching a plurality of second guide holes on the heat-conducting insulation layer 200 based on the corresponding first guide holes; electroless copper plating, which is performed on the inner walls of the first via and the second via to form the via 400.
The manufacturing process of the heat dissipation circuit board according to the embodiment of the invention at least has the following beneficial effects: the heat conductive insulating layer 200 has heat conductive and insulating functions, and can prevent electric conduction between circuits of the circuit layer 100 and conduct heat of the circuit layer 100 to the base layer 300; the communication piece 400 is arranged between the first guide hole and the second guide hole, so that the circuit layer 100 is in thermal communication with the base layer 300, and the heat dissipation effect of the circuit board is improved; copper is a material having thermal conductivity, and the base layer 300 is made of copper, and can rapidly transfer heat generated from the wiring layer 100 to the outside.
The specific manufacturing process comprises the following steps:
1. the structure of the heat dissipation circuit board is divided into three layers, and the heat dissipation circuit board is formed by pressing a circuit layer 100, a heat conduction insulating layer 200 and a base layer 300 in three in one;
2. the circuit layer 100 provides dense signal circuits, the thickness of the heat conducting insulating layer 200 is 3MIL, the thermal conductivity can reach 8W/m.k, and the conductivity of the base layer 300 can reach 380W/m.k, and the three are subjected to hot-press bonding, so that the circuit board has high heat conducting performance;
3. firstly, etching a first guide hole on the circuit layer 100, and observing a dielectric layer through the first guide hole by using a hundredfold mirror;
4. after the surface layer is etched for the first time, blind hole laser is carried out, 2784 second guide holes are needed to be formed in the size of 250mmX410mm by laser, the second guide holes are required to be concentric with the first guide holes and penetrate through the dielectric layer, and the metal copper base layer 300 can be observed by using a hundredfold mirror;
5. after the through hole is formed, carrying out chemical copper deposition treatment on the first guide hole and the second guide hole to form a metallized through hole, and completing the connection of the circuit layer 100 and the metal copper base layer 300;
6. and after the secondary circuit manufacturing is finished, the qualified product meeting the customer requirements is manufactured through target shooting, solder mask oil printing, character printing, chemical gold deposition, appearance processing, function testing and the like.
In some embodiments of the present invention, the first via is formed by chemical etching, the second via is formed by laser drilling, and the via 400 is formed by electroless copper plating. Etching, also called etching or photochemical etching, refers to removing the protective film of the area to be etched after exposure plate making and developing, and contacting with chemical solution during etching to achieve the effect of dissolving and etching, and forming concave-convex or hollow-out molding. The copper deposition, also called hole metallization, can connect wires between double-sided or multilayer printed circuit board layers, and is characterized by that a thin layer of chemical copper is deposited on the hole wall after drilling hole by using chemical deposition method to provide conductivity for subsequent electroplating copper.
In some embodiments of the present invention, a signal line slot is etched on the connecting member 400, so as to ensure that the signal intercommunication between the product blind hole design surface layer circuit and the metal copper layer is completed, and at the same time, the problem of high-speed transmission and heat dissipation of the signal transmission line in the brushless motor driver is solved, and the line width signal line is supported by the 40-45um thick copper base layer 300, so that the current carrying capacity of the signal line is enhanced, and the equipment fault caused by current carrying failure reaching the standard is solved; the whole radiating circuit board is targeted and positioned, so that the circuit board is conveniently positioned; the circuit layer 100 is printed with solder resist oil, so that the purpose of insulating the heat dissipation circuit board from the outside is achieved, and circuits which do not need to be exposed outside are protected; printing characters on the circuit layer 100; for the circuit layer 100, the gold immersion process is a chemical deposition method, a plating layer is generated by a chemical oxidation-reduction reaction method, the thickness is generally thicker, the method is one of chemical nickel gold layer deposition methods, a thicker gold layer can be achieved, and the heat dissipation circuit board has stronger conductivity, oxidation resistance and long service life.
In some embodiments of the present invention, the circuit layer 100 is made of copper, and the circuit layer 100 forms a first concave-convex or hollow-out via after contacting the chemical solution; based on the first guide holes, laser drilling is carried out on the heat conduction insulating layer 200 to form second guide holes, and the second guide holes and the corresponding first guide holes are coaxial; the first and second vias are processed by electroless copper plating to become a metalized via hole, i.e., the via 400, and a signal line for transmitting a signal is formed on the via 400.
The circuit layer 100 and the base layer 300 are designed to complete signal intercommunication, the problem of high-speed transmission and heat dissipation of a signal transmission line in a brushless motor driver is solved, the current carrying capacity of the signal line is enhanced under the support of the base layer 300 made of copper, equipment faults caused by current carrying failure in standard are solved, and the use limitation of various regions is overcome.
In some embodiments of the present invention, the thermally conductive and insulating layer 200 is composed of a plurality of components of bisphenol a type epoxy resin, biphenyl epoxy resin, naphthalene ring epoxy resin, rubber, filler, amine curing agent, and accelerator. The heat conducting and insulating layer 200 is a resin composition comprising the following components in parts by weight: 5-35 parts of bisphenol A epoxy resin, 0-10 parts of biphenyl epoxy resin, 5-30 parts of naphthalene ring epoxy resin, 5-35 parts of rubber, 50-80 parts of filler, 1-10 parts of amine curing agent and 0.1-2 parts of accelerator.
In some embodiments of the invention, the first guide hole has a diameter of 0.15 + -0.03 mm and the second guide hole has a diameter of 0.15mm +0.1/-0 mm.
In some embodiments of the invention, the trace layer 100 has a thickness of 0.5 ± 0.01 ounces. A copper foil thickness of 35um to 1 ounce.
In some embodiments of the invention, the base layer 300 is 1.5 mm + 0.01mm thick.
In some embodiments of the invention, the electroless copper plating thickness is 0.2-0.8 um, the signal line copper thickness is 40-45um, and the hole wall thickness of the communication member 400 is greater than or equal to 18 um.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A heat dissipating circuit board, comprising:
the circuit comprises a circuit layer (100) and a plurality of first guide holes, wherein the first guide holes penetrate through the circuit layer (100);
the heat conduction insulating layer (200) is provided with a plurality of second guide holes, the second guide holes penetrate through the heat conduction insulating layer (200), and the second guide holes are communicated with the corresponding first guide holes;
a base layer (300) made of copper;
the circuit layer (100), the heat conduction insulating layer (200) and the base layer (300) are sequentially connected;
and a communication member (400) disposed on inner walls of the first and second vias, the communication member (400) being for communicating the circuit layer (100) with the base layer (300).
2. The heat dissipating circuit board of claim 1, wherein the first via is formed by chemical etching and the second via is formed by laser drilling.
3. The heat dissipating circuit board of claim 1, wherein the communication member (400) is formed by electroless copper plating.
4. A manufacturing process of a heat dissipation circuit board is characterized by comprising the following steps:
pressing, namely pressing the circuit layer (100), the heat conduction insulating layer (200) and the base layer (300);
etching, namely chemically etching a plurality of first guide holes on the circuit layer (100);
laser drilling, namely etching a plurality of second guide holes on the heat-conducting insulating layer (200) based on the corresponding first guide holes;
and chemically depositing copper on the inner walls of the first and second vias to form a via (400).
5. The manufacturing process of a heat dissipating circuit board according to claim 4, further comprising the step of,
etching a signal wire slot on the communicating piece (400);
the whole radiating circuit board is targeted and positioned;
printing solder mask oil on the circuit layer (100);
printing characters on the circuit layer (100);
and (3) performing chemical gold deposition on the circuit layer (100).
6. The manufacturing process of heat dissipation circuit board according to claim 4, wherein the thickness of the circuit layer (100) in the step of laminating is 0.5 ± 0.01 ounce, and the circuit line width of the circuit layer (100) is 0.1 ± 0.01 mm.
7. The manufacturing process of the heat dissipation circuit board as claimed in claim 4, wherein the heat conduction insulating layer (200) in the step of laminating is composed of a plurality of components selected from bisphenol A type epoxy resin, biphenyl epoxy resin, naphthalene ring epoxy resin, rubber, filler, amine curing agent and accelerator.
8. The manufacturing process of heat dissipation circuit board as claimed in claim 4, wherein the diameter of the first via hole in the etching step is 0.15 ± 0.03 mm.
9. The manufacturing process of heat dissipating circuit board according to claim 4, wherein the second via hole in the step of laser drilling has a diameter of 0.15mm +0.1/-0 mm.
10. The manufacturing process of heat dissipation circuit board as claimed in claim 4, wherein the first via hole in the etching step is coaxial with the corresponding second via hole in the laser drilling step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110355190.9A CN113286413A (en) | 2021-04-01 | 2021-04-01 | Heat dissipation circuit board and manufacturing process thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110355190.9A CN113286413A (en) | 2021-04-01 | 2021-04-01 | Heat dissipation circuit board and manufacturing process thereof |
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| CN113286413A true CN113286413A (en) | 2021-08-20 |
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| CN202110355190.9A Pending CN113286413A (en) | 2021-04-01 | 2021-04-01 | Heat dissipation circuit board and manufacturing process thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI809754B (en) * | 2022-03-11 | 2023-07-21 | 欣興電子股份有限公司 | Circuit board and method of manufacturing the same |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030223207A1 (en) * | 2002-05-28 | 2003-12-04 | Kwun-Yao Ho | High density laminated substrate structure and manufacture method thereof |
| US20070130761A1 (en) * | 2005-12-14 | 2007-06-14 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing printed circuit board having landless via hole |
| US20080094813A1 (en) * | 2006-10-19 | 2008-04-24 | Phoenix Precision Technology Corporation | Circuit board structure |
| US20080115355A1 (en) * | 2006-11-21 | 2008-05-22 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing printed circuit board |
| US20080216313A1 (en) * | 2007-03-09 | 2008-09-11 | Ting-Hao Lin | Method For Fabricating IC Board Without Ring Structure |
| US20080222886A1 (en) * | 2007-03-13 | 2008-09-18 | Jun-Chung Hsu | Method For Manufacturing Carrier Substrate |
| US20090083976A1 (en) * | 2007-09-28 | 2009-04-02 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing printed circuit board |
| US20090236137A1 (en) * | 2006-05-17 | 2009-09-24 | Yasuo Kaneda | Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board |
| US20090255722A1 (en) * | 2008-04-15 | 2009-10-15 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having landless via hole and method of manufacturing the same |
| KR20090119190A (en) * | 2008-05-15 | 2009-11-19 | 삼성전기주식회사 | A landless printed circuit board and a fabricating method of the same |
| US20090294164A1 (en) * | 2008-05-27 | 2009-12-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including landless via and method of manufacturing the same |
| US20100101851A1 (en) * | 2008-10-27 | 2010-04-29 | Shinko Electric Industries Co., Ltd. | Wiring substrate and method of manufacturing the same |
| KR20100136792A (en) * | 2009-06-19 | 2010-12-29 | 삼성전기주식회사 | A method for manufacturing of landless printed circuit board |
| CN102516718A (en) * | 2011-12-01 | 2012-06-27 | 珠海全宝电子科技有限公司 | Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer |
| US20150351257A1 (en) * | 2014-05-28 | 2015-12-03 | KYOCERA Circuit Solutions, Inc. | Method for producing wiring board |
| US20150366060A1 (en) * | 2014-06-17 | 2015-12-17 | Siliconware Precision Industries Co., Ltd. | Circuit structure and fabrication method thereof |
| US20170231083A1 (en) * | 2016-02-04 | 2017-08-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interconnect structure and method of manufacturing the same |
| US20170273174A1 (en) * | 2016-03-21 | 2017-09-21 | Industrial Technology Research Institute | Multi-layer circuit structure |
| CN109327957A (en) * | 2018-12-05 | 2019-02-12 | 景旺电子科技(龙川)有限公司 | A kind of conduction copper substrate and preparation method thereof |
| CN210112364U (en) * | 2018-12-13 | 2020-02-21 | 珠海精路电子有限公司 | Stepped copper circuit board |
| US20200107449A1 (en) * | 2018-09-27 | 2020-04-02 | Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. | Circuit board and method of making same |
| CN211152322U (en) * | 2019-12-23 | 2020-07-31 | 广东全宝科技股份有限公司 | Copper-based copper-clad plate with thin insulating layer and high thermal conductivity, car lamp and car |
| US10939561B1 (en) * | 2019-08-27 | 2021-03-02 | Advanced Semiconductor Engineering, Inc. | Wiring structure and method of manufacturing the same |
| CN214800017U (en) * | 2021-04-01 | 2021-11-19 | 珠海精路电子有限公司 | Heat dissipation circuit board |
-
2021
- 2021-04-01 CN CN202110355190.9A patent/CN113286413A/en active Pending
Patent Citations (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030223207A1 (en) * | 2002-05-28 | 2003-12-04 | Kwun-Yao Ho | High density laminated substrate structure and manufacture method thereof |
| US20070130761A1 (en) * | 2005-12-14 | 2007-06-14 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing printed circuit board having landless via hole |
| US20090236137A1 (en) * | 2006-05-17 | 2009-09-24 | Yasuo Kaneda | Method for Forming Resist Pattern, Method for Producing Circuit Board, and Circuit Board |
| US20080094813A1 (en) * | 2006-10-19 | 2008-04-24 | Phoenix Precision Technology Corporation | Circuit board structure |
| US20080115355A1 (en) * | 2006-11-21 | 2008-05-22 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing printed circuit board |
| US20080216313A1 (en) * | 2007-03-09 | 2008-09-11 | Ting-Hao Lin | Method For Fabricating IC Board Without Ring Structure |
| US20080222886A1 (en) * | 2007-03-13 | 2008-09-18 | Jun-Chung Hsu | Method For Manufacturing Carrier Substrate |
| US20090083976A1 (en) * | 2007-09-28 | 2009-04-02 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing printed circuit board |
| US20090255722A1 (en) * | 2008-04-15 | 2009-10-15 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having landless via hole and method of manufacturing the same |
| KR20090119190A (en) * | 2008-05-15 | 2009-11-19 | 삼성전기주식회사 | A landless printed circuit board and a fabricating method of the same |
| US20090294164A1 (en) * | 2008-05-27 | 2009-12-03 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including landless via and method of manufacturing the same |
| US20100101851A1 (en) * | 2008-10-27 | 2010-04-29 | Shinko Electric Industries Co., Ltd. | Wiring substrate and method of manufacturing the same |
| KR20100136792A (en) * | 2009-06-19 | 2010-12-29 | 삼성전기주식회사 | A method for manufacturing of landless printed circuit board |
| CN102516718A (en) * | 2011-12-01 | 2012-06-27 | 珠海全宝电子科技有限公司 | Resin composition and metal-based copper-clad plate using resin composition as heat conducting insulation layer |
| US20150351257A1 (en) * | 2014-05-28 | 2015-12-03 | KYOCERA Circuit Solutions, Inc. | Method for producing wiring board |
| US20150366060A1 (en) * | 2014-06-17 | 2015-12-17 | Siliconware Precision Industries Co., Ltd. | Circuit structure and fabrication method thereof |
| CN105208763A (en) * | 2014-06-17 | 2015-12-30 | 矽品精密工业股份有限公司 | Circuit structure and manufacturing method thereof |
| US20170231083A1 (en) * | 2016-02-04 | 2017-08-10 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interconnect structure and method of manufacturing the same |
| US20170273174A1 (en) * | 2016-03-21 | 2017-09-21 | Industrial Technology Research Institute | Multi-layer circuit structure |
| US20200107449A1 (en) * | 2018-09-27 | 2020-04-02 | Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. | Circuit board and method of making same |
| CN109327957A (en) * | 2018-12-05 | 2019-02-12 | 景旺电子科技(龙川)有限公司 | A kind of conduction copper substrate and preparation method thereof |
| CN210112364U (en) * | 2018-12-13 | 2020-02-21 | 珠海精路电子有限公司 | Stepped copper circuit board |
| US10939561B1 (en) * | 2019-08-27 | 2021-03-02 | Advanced Semiconductor Engineering, Inc. | Wiring structure and method of manufacturing the same |
| CN211152322U (en) * | 2019-12-23 | 2020-07-31 | 广东全宝科技股份有限公司 | Copper-based copper-clad plate with thin insulating layer and high thermal conductivity, car lamp and car |
| CN214800017U (en) * | 2021-04-01 | 2021-11-19 | 珠海精路电子有限公司 | Heat dissipation circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI809754B (en) * | 2022-03-11 | 2023-07-21 | 欣興電子股份有限公司 | Circuit board and method of manufacturing the same |
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Application publication date: 20210820 |