CN113284829B - Automatic chip packaging machine and packaging method - Google Patents
Automatic chip packaging machine and packaging method Download PDFInfo
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- CN113284829B CN113284829B CN202110833478.2A CN202110833478A CN113284829B CN 113284829 B CN113284829 B CN 113284829B CN 202110833478 A CN202110833478 A CN 202110833478A CN 113284829 B CN113284829 B CN 113284829B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
The invention discloses an automatic chip packaging machine and a packaging method, and belongs to the technical field of chip processing equipment. The utility model provides an automatic chip packaging machine, includes install bin, point gum machine and rigging machine, still includes: the glue dispenser comprises a first working cavity, a second working cavity and a third working cavity which are separated by a partition plate, wherein the glue dispenser and the laminating machine are both arranged in the second working cavity, a first sliding groove is formed in the partition plate, and a through hole is formed in the first sliding groove; the invention provides the working environment filled with protective gas without oxygen and other gases for the dispenser and the laminating machine, thereby avoiding oxygen from being sealed in the chip to oxidize parts in the chip in the packaging process, prolonging the storage time and prolonging the service life of the chip.
Description
Technical Field
The invention relates to the technical field of chip processing equipment, in particular to an automatic chip packaging machine and a packaging method.
Background
The shell for installing the semiconductor integrated circuit chip plays the roles of placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit, namely, a contact on the chip is connected to pins of the packaging shell by leads, the pins are connected with other devices by leads on a printed board, and the chip needs to be packaged in the process of producing the chip.
In the prior art, because the packaging environment is not sealed, air can enter the packaging machine and can be packaged in the chip during the packaging process, so that the internal oxidation of the chip is caused, the storage time of the chip is shortened, and an automatic chip packaging machine and a packaging method are required to be designed for prolonging the storage time of the chip.
Disclosure of Invention
The invention aims to solve the problem that oxygen remains in a chip to cause oxidation of the chip in the prior art, and provides an automatic chip packaging machine and a packaging method.
In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides an automatic chip packaging machine, includes install bin, point gum machine and rigging machine, still includes: the glue dispenser and the laminating machine are arranged in the second working cavity, a first sliding chute is formed in the partition plate, a through hole is formed in the first sliding chute, a first motor is fixedly connected to the mounting box, a threaded cylinder is fixedly connected to the output end of the first motor, the threaded cylinder extends to the first sliding chute and is connected with a threaded rod in a threaded manner, and a sealing plate is fixedly connected to the output end of the threaded rod and used for sealing the through hole;
the first exhaust assembly is arranged in the installation box;
and the second exhaust assembly is arranged in the installation box.
In order to facilitate air evacuation, preferably, first exhaust subassembly includes dryer and flabellum, dryer fixed connection is on the installation box, the dryer internal rotation is connected with the installation axle, flabellum fixed connection is on the installation axle, the outer fixedly connected with fourth motor of installation box, the output shaft and the installation axle of fourth motor link to each other in step through taking transmission group, the inlet end of dryer is equipped with the control valve, first exhaust subassembly is equipped with two sets ofly, and is two sets of first exhaust subassembly sets up respectively in first working chamber and third working chamber.
In order to prevent that the protection gas from leaking, it is preferred, the second exhaust subassembly includes third motor and piston cylinder, the equal fixed connection of third motor and piston cylinder is at the inner wall of install bin, the output fixedly connected with pivot of third motor, fixedly connected with bent axle in the pivot, the drive end rotation of piston cylinder is connected on the bent axle, the second exhaust subassembly is equipped with two sets ofly, and is two sets of the second exhaust subassembly sets up respectively in first working chamber and third working chamber, the input of piston cylinder is linked together with first working chamber and third working chamber respectively, and is two sets of the output of piston cylinder all is linked together through trachea and second working chamber.
In order to facilitate loading, the loading device is preferable, the loading device further comprises a placing plate, a first placing groove and a second placing groove are formed in the placing plate, and separating grooves are formed in the first placing groove and the second placing groove.
In order to facilitate loading of the rectangular chip, the separation groove is further rectangular.
In order to facilitate loading of the circular chips, the separation groove is further circular.
In order to enable the placing plate to move, preferably, the bottom of the placing plate is rotatably connected with a roller, and a third sliding groove matched with the roller is formed in one surface, far away from the roller, of the placing plate.
In order to facilitate the movement of the support plate, the support plate is fixedly connected in the installation box, a second sliding groove matched with the roller is formed in the support plate, a second motor is fixedly connected to the outer wall of the installation box, a drive shaft is fixedly connected in the installation box, a gear is fixedly connected to the drive shaft, a rack meshed with the gear is formed in the top of the placement plate, and the second motor is synchronously connected with the drive shaft through a chain transmission set.
For the convenience of stock, it is preferred, fixedly connected with mounting bracket in the install bin, fixedly connected with telescopic cylinder on the mounting bracket, telescopic cylinder's output fixedly connected with roof.
A packaging method of an automatic chip packaging machine comprises the following steps: the method comprises the following steps: filling the second working cavity with protective gas;
step two: opening a box door of the feeding hole, and placing a chip shell base and a chip shell cover plate in a first working cavity;
step three: closing the box door of the feeding hole, and exhausting air in the first working cavity;
step four: communicating the first working cavity with the second working cavity, feeding the chip shell base and the chip shell cover plate in the first working cavity into the second working cavity, sealing the first working cavity and the second working cavity after feeding, feeding the protective gas entering the first working cavity into the second working cavity, and feeding again;
step five: packaging operation is carried out on the chip shell base and the chip shell cover plate by using the dispenser and the laminating machine in the second working cavity;
step six: evacuating air in the third working cavity to enable the second working cavity to be communicated with the third working cavity;
step seven: sending the packaged chip into a third working cavity;
step eight: sealing the second working cavity and the third working cavity, sending the protective gas entering the third working cavity into the second working cavity, opening a box door of a discharge port, and taking out the chip;
step nine: and exhausting the air in the third working cavity, and waiting for next material taking.
1. Compared with the prior art, the invention provides an automatic chip packaging machine, which has the following beneficial effects: 1. this automatic chip packaging machine, through the air evacuation with the second work intracavity, then make the second work intracavity be full of protective gas, to second work intracavity pay-off and when clapping the material of second work intracavity to the third work chamber, with the air evacuation of first work chamber and third work intracavity, thereby avoid oxygen in the air to get into the second work intracavity, avoid oxygen to be sealed into the inside of chip shell, and then avoid oxygen oxidation chip inside part, thereby prolong the life and the save life of chip.
2. This automatic chip packaging machine, through starting the third motor, the third motor makes the bent axle rotate through the pivot, and the bent axle makes piston cylinder work, and the second work intracavity is sent into to the protective gas of piston cylinder in with first work chamber or third work chamber, and the protective gas in first work chamber or the third work chamber leaks when avoiding opening the install bin chamber door, from avoiding extravagant protective gas and avoiding the staff to suffocate because of the protective gas of leaking is too thick.
3. This automatic chip packaging machine is flexible through making telescopic cylinder to the control roof goes up and down, and then transports the board of placing on the roof, through setting up multiunit mounting bracket, telescopic cylinder and roof, will place the board and leave temporarily on the roof, and stagger the time of depositing, thereby make things convenient for material loading and unloading, improve work efficiency.
The device has the advantages that the working environment filled with protective gas without oxygen and other gases is provided for the dispenser and the laminating machine, so that oxygen is prevented from being sealed into parts inside the chip during packaging, the storage time of the chip is prolonged, the service life of the chip is prolonged, and the protective gas is fed into the second working cavity before the box door is opened and the second working cavity is sealed, so that the leakage of the protective gas is prevented.
Drawings
FIG. 1 is a front view of an automatic chip packaging machine according to the present invention;
FIG. 2 is a front cross-sectional view of an automatic chip packaging machine in accordance with the present invention;
FIG. 3 is a first schematic structural diagram of a placement board of an automatic chip packaging machine according to the present invention;
FIG. 4 is a second schematic structural view of a placement board of an automatic chip packaging machine according to the present invention;
FIG. 5 is a schematic structural diagram of part A of FIG. 2 of an automatic chip packaging machine according to the present invention;
fig. 6 is a schematic structural diagram of a portion B in fig. 2 of an automatic chip packaging machine according to the present invention.
In the figure: 1. installing a box; 101. a first working chamber; 102. a second working chamber; 103. a third working chamber; 104. a first chute; 105. a through hole; 106. a partition plate; 2. a mounting frame; 201. a telescopic cylinder; 202. a top plate; 3. a first motor; 301. a threaded barrel; 302. a threaded rod; 303. a sealing plate; 4. a second motor; 401. a drive shaft; 402. a chain transmission set; 403. a gear; 5. a support plate; 501. a second chute; 6. placing the plate; 601. a third chute; 602. a roller; 603. a rack; 604. a first placing groove; 605. a second placing groove; 606. a separation tank; 7. a glue dispenser; 701. a laminating machine; 8. a third motor; 801. a rotating shaft; 802. a crankshaft; 803. a piston cylinder; 804. an air tube; 9. an air duct; 901. installing a shaft; 902. a fourth motor; 903. a belt drive set; 904. a control valve; 905. a fan blade.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
The first embodiment is as follows:
referring to fig. 1-6, an automatic chip packaging machine includes an installation box 1, a dispenser 7 and a laminating machine 701, and further includes: the glue dispenser comprises a first working chamber 101, a second working chamber 102 and a third working chamber 103 which are separated by a partition plate 106, wherein the glue dispenser 7 and the laminating machine 701 are both arranged in the second working chamber 102, the partition plate 106 is provided with a first sliding chute 104, the first sliding chute 104 is provided with a through hole 105, the installation box 1 is fixedly connected with a first motor 3, the output end of the first motor 3 is fixedly connected with a threaded cylinder 301, the threaded cylinder 301 extends to the first sliding chute 104 and is connected with a threaded rod 302 in a threaded manner, and the output end of the threaded rod 302 is fixedly connected with a sealing plate 303 for sealing the through hole 105; the first exhaust assembly is arranged in the installation box 1; and the second exhaust assembly is arranged in the installation box 1.
Evacuating air in the second working chamber 102 by using an air pump and a pipeline installed on the installation box 1, then filling a protective gas such as nitrogen into the second working chamber 102, then opening a box door at the feeding end of the installation box 1, wherein a sealing ring is arranged on the box door to prevent gas leakage, placing a chip part to be packaged into the first working chamber 101, then closing the box door to seal the first working chamber 101, discharging the air in the first working chamber 101 out of the installation box 1 through a first exhaust component installed in the first working chamber 101, starting a first motor 3 installed at the top of the first working chamber 101, rotating a threaded cylinder 301 by the first motor 3, enabling the sealing plate 303 to slide in a first sliding groove 104 through a threaded rod 301 by the threaded cylinder 301, communicating the first working chamber 101 with the second working chamber 102, sending the chip part into the second working chamber 102, and after sending the chip part, starting the first motor 3 installed above a partition plate 106 between the first working chamber 101 and the second working chamber 102 again, sealing the first working chamber 101 and the second working chamber 102 by a sealing plate 303, feeding the shielding gas in the first working chamber 101 into the second working chamber 102 by a second exhaust assembly, opening the box door for feeding again, opening an air inlet valve arranged at the feeding end of the mounting box 1 before opening the box door, allowing external air to enter the first working chamber 101, preventing negative pressure in the first working chamber 101 from sucking the box door and being incapable of opening, dispensing the chip part in the second working chamber 102 by a dispenser 7, coating the edge of a housing base in the chip part, which is not described herein, pressing a cover plate in the chip part on the housing base by a laminator 701, completing chip packaging, which is not described herein, a glue source of the dispenser 7 is arranged outside the mounting box 1, facilitating glue adding, evacuating air in the third working chamber 103 by the first exhaust assembly arranged in the third working chamber 103 after packaging is completed, then, the first motor 3 at the top of the third working chamber 103 is started to communicate the second working chamber 102 with the third working chamber 103, the packaged chip in the second working chamber 102 is sent into the third working chamber 103, then the first motor 3 installed at the top of the third working chamber 103 is started again to seal the second working chamber 102 and the third working chamber 103, the protective gas in the third working chamber 103 is exhausted into the second working chamber 102 by using the second exhaust component installed in the third working chamber 103, the air inlet at the discharge port of the installation box 1 is opened to allow the external air to enter the third working chamber 103, the box door at the discharge port of the installation box 1 is opened to take out the chip in the third working chamber 103, then the box door is closed to exhaust the air in the third working chamber 103 to wait for the next material taking, and the device provides a working environment of protective gas such as oxygen without other gases for the dispenser 7 and the laminating machine 701, therefore, oxygen is prevented from being sealed in the chip to oxidize parts in the chip in the packaging process, and the storage time and the service life of the chip are prolonged.
Example two:
referring to fig. 2 and 5, an automatic chip packaging machine, the same as the first embodiment, further, the first exhaust component includes an air duct 9 and fan blades 905, the air duct 9 is fixedly connected to the installation box 1, an installation shaft 901 is connected to the air duct 9 in a rotating manner, the fan blades 905 are fixedly connected to the installation shaft 901, a fourth motor 902 is fixedly connected to the outside of the installation box 1, an output shaft of the fourth motor 902 is synchronously connected to the installation shaft 901 through a belt transmission set 903, a control valve 904 is arranged at an air inlet end of the air duct 9, the first exhaust components are provided with two sets, and the two sets of first exhaust components are respectively arranged in the first working chamber 101 and the third working chamber 103.
The fourth motor 902 is started, the control valve 904 is opened, the fourth motor 902 enables the mounting shaft 901 to rotate, the mounting shaft 901 enables the fan blades 905 to rotate, and the fan blades 905 rotate to enable the inside of the air duct 9 to generate negative pressure, so that air in the first working cavity 101 or the third working cavity 103 is emptied, the air is prevented from entering the second working cavity 102, and oxygen in the air is prevented from being sealed in the chip.
Example three:
referring to fig. 2 and 6, an automatic chip packaging machine is substantially the same as the first embodiment, and further includes a second exhaust assembly including a third motor 8 and a piston cylinder 803, the third motor 8 and the piston cylinder 803 are both fixedly connected to an inner wall of the mounting box 1, an output end of the third motor 8 is fixedly connected to a rotating shaft 801, the rotating shaft 801 is fixedly connected to a crankshaft 802, a driving end of the piston cylinder 803 is rotatably connected to the crankshaft 802, two sets of the second exhaust assemblies are provided, the two sets of the second exhaust assemblies are respectively disposed in the first working chamber 101 and the third working chamber 103, an input end of the piston cylinder 803 is respectively communicated with the first working chamber 101 and the third working chamber 103, and output ends of the two sets of the piston cylinders 803 are respectively communicated with the second working chamber 102 through an air pipe 804.
Two sets of third motors 8 are started, two sets of third motors 8 respectively enable two sets of rotating shafts 801 to rotate, two sets of rotating shafts 801 respectively enable two sets of crankshafts 802 to rotate, two sets of crankshafts 802 respectively enable two sets of piston cylinders 803 to work, the input ends and the output ends of the two sets of piston cylinders 803 are respectively provided with a one-way valve, the two sets of piston cylinders 803 respectively absorb shielding gas in the first working cavity 101 or the third working cavity 103 and send the shielding gas into the second working cavity 102 through a gas pipe 804, and therefore leakage of the shielding gas is prevented.
Example four:
referring to fig. 2-5, an automatic chip packaging machine is substantially the same as the first embodiment, and further includes a placing plate 6, the placing plate 6 is provided with a first placing groove 604 and a second placing groove 605, the first placing groove 604 and the second placing groove 605 are both provided with a separating groove 606, the separating groove 606 is rectangular, the separating groove 606 is circular, the bottom of the placing plate 6 is rotatably connected with a roller 602, one side of the placing plate 6, which is far away from the roller 602, is provided with a third sliding groove 601 matched with the roller 602, a supporting plate 5 is fixedly connected in the installation box 1, the supporting plate 5 is provided with a second sliding groove 501 matched with the roller 602, the outer wall of the installation box 1 is fixedly connected with a second motor 4, the installation box 1 is fixedly connected with a driving shaft 401, the driving shaft 401 is fixedly connected with a gear 403, the top of the placing plate 6 is provided with a rack 603 engaged with the gear 403, the second motor 4 is synchronously connected with the drive shaft 401 via a chain drive 402.
The chip shell cover plate and the chip shell base are respectively placed in a separation groove 606 in a first placing groove 604 and a second placing groove 605, the placing plate 6 is placed on a supporting plate 5, a roller 602 is placed in a second sliding groove 501, a second motor 4 is started, the second motor 4 enables a driving shaft 401 to rotate through a chain transmission set 402, the driving shaft 401 enables the placing plate 6 to slide through a gear 403 and a rack 603, chip parts on the placing plate 6 are transported, the driving shaft 401 is provided with multiple sets, the multiple sets of driving shafts 401 are synchronously connected, the second motor 4 is provided with three sets, the placing plate 6 is transported in a three-stage mode, feeding and taking of workers are facilitated, when rectangular chips are packaged, the placing plate 6 with rectangular separation grooves 606 can be adopted, and when circular chips are packaged, the placing plate 6 with circular separation grooves 606 can be adopted.
Example five:
referring to fig. 2, an automatic chip packaging machine is substantially the same as the fourth embodiment, further, a mounting frame 2 is fixedly connected in the mounting box 1, a telescopic cylinder 201 is fixedly connected to the mounting frame 2, and a top plate 202 is fixedly connected to an output end of the telescopic cylinder 201.
Mounting bracket 2 is injectd the position of placing board 6, telescopic cylinder 201 extends or shortens, utilize roof 202 messenger to place board 6 and rise or descend, mounting bracket 2, telescopic cylinder 201 and roof 202 all are equipped with four groups, the first group sets up in first working chamber 101, the second group sets up in second working chamber 102 with the third group, the fourth group sets up in third working chamber 103, the first group is the material loading unit, the material loading of being convenient for, the second group is the stock unit with the third group, the fourth group is the unloading unit, when feeding, place board 6 in the material loading unit and deposit on the first group stock unit, thereby make things convenient for the material loading, avoid unrestrained material loading time, when unloading unit is full of and places board 6, the chip that has temporarily been capsulated in second working chamber 102 is put into on the second group stock unit, thereby conveniently take out the chip on the unloading unit.
A packaging method of an automatic chip packaging machine comprises the following steps:
the method comprises the following steps: filling the second working chamber 102 with a shielding gas;
step two: opening a box door of the feeding hole, and placing a chip shell base and a chip shell cover plate in the first working cavity 101;
step three: the door of the feed inlet is closed, and the air in the first working chamber 101 is evacuated:
step four: communicating the first working cavity 101 with the second working cavity 102, feeding the chip shell base and the chip shell cover plate in the first working cavity 101 into the second working cavity 102, sealing the first working cavity 101 and the second working cavity 102 after feeding, feeding the shielding gas entering the first working cavity 101 into the second working cavity 102, and feeding again;
step five: packaging operation is carried out on the chip shell base and the chip shell cover plate in the second working cavity 102 by using the dispenser 7 and the laminating machine 701;
step six: evacuating air in the third working chamber 103 to communicate the second working chamber 102 with the third working chamber 103;
step seven: the packaged chip is sent into the third working cavity 103;
step eight: sealing the second working chamber 102 and the third working chamber 103, sending the protective gas entering the third working chamber 103 into the second working chamber 102, opening a box door of a discharge opening, and taking out the chip;
step nine: and exhausting the air in the third working chamber 103 to wait for next material taking.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The utility model provides an automatic chip packaging machine, includes install bin (1), point gum machine (7) and rigging machine (701), its characterized in that still includes: the glue dispenser comprises a first working cavity (101), a second working cavity (102) and a third working cavity (103) which are separated by a partition plate (106), wherein the glue dispenser (7) and a laminating machine (701) are arranged in the second working cavity (102), a first sliding groove (104) is formed in the partition plate (106), a through hole (105) is formed in the first sliding groove (104), a first motor (3) is fixedly connected to the installation box (1), a threaded barrel (301) is fixedly connected to the output end of the first motor (3), the threaded barrel (301) extends to the first sliding groove (104) and is connected with a threaded rod (302) in an internal thread manner, and a sealing plate (303) is fixedly connected to the output end of the threaded rod (302) and used for sealing the through hole (105);
the first exhaust component is arranged in the installation box (1);
the second exhaust component is arranged in the installation box (1);
the second exhaust assembly comprises a third motor (8) and a piston cylinder (803), the third motor (8) and the piston cylinder (803) are fixedly connected to the inner wall of the installation box (1), an output end of the third motor (8) is fixedly connected with a rotating shaft (801), a crankshaft (802) is fixedly connected to the rotating shaft (801), a driving end of the piston cylinder (803) is rotatably connected to the crankshaft (802), the second exhaust assembly is provided with two sets of exhaust assemblies, the second exhaust assemblies are respectively arranged in a first working cavity (101) and a third working cavity (103), an input end of the piston cylinder (803) is respectively communicated with the first working cavity (101) and the third working cavity (103), and the output end of the piston cylinder (803) is communicated with the second working cavity (102) through an air pipe (804).
2. The automatic chip packaging machine according to claim 1, wherein the first exhaust assembly comprises an air duct (9) and fan blades (905), the air duct (9) is fixedly connected to the mounting box (1), a mounting shaft (901) is rotatably connected to the air duct (9), the fan blades (905) are fixedly connected to the mounting shaft (901), a fourth motor (902) is fixedly connected to the outside of the mounting box (1), an output shaft of the fourth motor (902) is synchronously connected with the mounting shaft (901) through a belt transmission set (903), a control valve (904) is arranged at an air inlet end of the air duct (9), two sets of the first exhaust assemblies are arranged, and the two sets of the first exhaust assemblies are respectively arranged in the first working chamber (101) and the third working chamber (103).
3. The automatic chip packaging machine according to claim 1, further comprising a placing plate (6), wherein the placing plate (6) is provided with a first placing groove (604) and a second placing groove (605), and the first placing groove (604) and the second placing groove (605) are both provided with a separating groove (606).
4. The automatic chip packaging machine according to claim 3, characterized in that said separation channel (606) is rectangular in shape.
5. The automatic chip packaging machine according to claim 3, characterized in that said separation channel (606) is circular in shape.
6. The automatic chip packaging machine according to claim 3, characterized in that the bottom of the placing plate (6) is rotatably connected with a roller (602), and a third chute (601) matched with the roller (602) is formed on one surface of the placing plate (6) away from the roller (602).
7. The automatic chip packaging machine according to claim 6, wherein a support plate (5) is fixedly connected in the installation box (1), a second sliding groove (501) matched with the roller (602) is formed in the support plate (5), a second motor (4) is fixedly connected to the outer wall of the installation box (1), a driving shaft (401) is fixedly connected in the installation box (1), a gear (403) is fixedly connected to the driving shaft (401), a rack (603) meshed with the gear (403) is formed in the top of the placing plate (6), and the second motor (4) is synchronously connected with the driving shaft (401) through a chain transmission set (402).
8. The automatic chip packaging machine according to claim 1, characterized in that a mounting frame (2) is fixedly connected in the mounting box (1), a telescopic cylinder (201) is fixedly connected on the mounting frame (2), and a top plate (202) is fixedly connected at an output end of the telescopic cylinder (201).
9. A packaging method of an automatic chip packaging machine comprising the automatic chip packaging machine of claim 1, characterized by comprising the steps of:
the method comprises the following steps: filling the second working chamber (102) with protective gas;
step two: opening a box door of the feeding hole, and placing a chip shell base and a chip shell cover plate in a first working cavity (101);
step three: closing the door of the feeding hole, and exhausting the air in the first working chamber (101);
step four: communicating the first working cavity (101) with the second working cavity (102), sending a chip shell base and a chip shell cover plate in the first working cavity (101) into the second working cavity (102), sealing the first working cavity (101) and the second working cavity (102) after the sending is finished, sending the protective gas entering the first working cavity (101) into the second working cavity (102), and feeding again;
step five: packaging operation is carried out on the chip shell base and the chip shell cover plate in the second working cavity (102) by using a dispenser (7) and a laminating machine (701);
step six: evacuating air in the third working chamber (103) to enable the second working chamber (102) to be communicated with the third working chamber (103);
step seven: the packaged chip is sent into a third working cavity (103);
step eight: sealing the second working chamber (102) and the third working chamber (103), sending the protective gas entering the third working chamber (103) into the second working chamber (102), opening a box door of a discharge port, and taking out the chip;
step nine: and exhausting the air in the third working chamber (103) to wait for next material taking.
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| CN202110833478.2A CN113284829B (en) | 2021-07-23 | 2021-07-23 | Automatic chip packaging machine and packaging method |
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| CN202110833478.2A CN113284829B (en) | 2021-07-23 | 2021-07-23 | Automatic chip packaging machine and packaging method |
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| CN113284829B true CN113284829B (en) | 2021-10-01 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209266371U (en) * | 2019-02-19 | 2019-08-16 | 深圳市昌富祥智能科技有限公司 | A kind of semiconductor load all-in-one machine |
| CN211208420U (en) * | 2020-02-12 | 2020-08-07 | 上海根派半导体科技有限公司 | Chip packaging dispensing device |
| CN112289714A (en) * | 2020-11-02 | 2021-01-29 | 合肥高地创意科技有限公司 | Semiconductor chip packaging equipment |
| CN113070267A (en) * | 2021-04-15 | 2021-07-06 | 王翠平 | Electronic device insulation drying dust removal storage device and storage method thereof |
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2021
- 2021-07-23 CN CN202110833478.2A patent/CN113284829B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209266371U (en) * | 2019-02-19 | 2019-08-16 | 深圳市昌富祥智能科技有限公司 | A kind of semiconductor load all-in-one machine |
| CN211208420U (en) * | 2020-02-12 | 2020-08-07 | 上海根派半导体科技有限公司 | Chip packaging dispensing device |
| CN112289714A (en) * | 2020-11-02 | 2021-01-29 | 合肥高地创意科技有限公司 | Semiconductor chip packaging equipment |
| CN113070267A (en) * | 2021-04-15 | 2021-07-06 | 王翠平 | Electronic device insulation drying dust removal storage device and storage method thereof |
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