CN113283071A - Method for acquiring temperature rise of high-frequency transformer winding - Google Patents

Method for acquiring temperature rise of high-frequency transformer winding Download PDF

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CN113283071A
CN113283071A CN202110552059.1A CN202110552059A CN113283071A CN 113283071 A CN113283071 A CN 113283071A CN 202110552059 A CN202110552059 A CN 202110552059A CN 113283071 A CN113283071 A CN 113283071A
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thermal resistance
equivalent
contact
temperature rise
transformer
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CN113283071B (en
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李海林
申永鹏
刘普
王乾
梁伟华
杨小亮
王延峰
和萍
谢小品
于福星
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Xi'an Yuneng Power Equipment Co ltd
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Zhengzhou University of Light Industry
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H01F27/402—Association of measuring or protective means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/40—Structural association with built-in electric component, e.g. fuse
    • H01F27/402—Association of measuring or protective means
    • H01F2027/406—Temperature sensor or protection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract

The invention discloses a method for acquiring the temperature rise of a high-frequency transformer winding, which comprises the following steps: (1) selecting corresponding equivalent thermal resistance models according to contact modes between conductors in different transformer windings; (2) obtaining the equivalent contact thermal resistance of the equivalent thermal resistance model under the action of a pre-tightening force; (3) and obtaining the temperature rise of the transformer winding according to the equivalent contact thermal resistance. The invention considers the pre-tightening force directly influencing the heat conduction of the wires between the windings of the transformer, more accurately obtains the temperature rise of the transformer and is convenient for common engineering personnel to use.

Description

Method for acquiring temperature rise of high-frequency transformer winding
Technical Field
The invention relates to the technical field of high-frequency transformers, in particular to a method for acquiring the temperature rise of a high-frequency transformer winding.
Background
The accurate calculation of the temperature rise of the high-frequency transformer in the engineering field has important significance for the optimal design of the transformer. The temperature rise of the transformer directly determines whether the performance and the operation of the transformer are stable or not, and the transformer is used as an important electromagnetic device for electric energy transmission and has great significance for safe and stable operation of a power grid. The method for calculating the temperature rise of the transformer winding by adopting the hot circuit method has the advantage of quick calculation, but the calculation accuracy is slightly poor. At present, the influence of the pretightening force of the transformer is not considered when the temperature of the transformer is calculated by adopting a thermal circuit method, and the pretightening force directly influences the equivalent thermal resistance value of the heat conduction of the wires between the windings, so that the temperature rise of the transformer can be calculated more accurately and is convenient for common engineering personnel to use, and a novel method for acquiring the temperature rise of the windings of the high-frequency transformer is provided.
Disclosure of Invention
In order to solve the problems, the invention provides a method for acquiring the temperature rise of a high-frequency transformer winding, which considers the influence of pretightening force and is used for more accurately calculating the temperature rise of the high-frequency transformer winding; the method can be directly used for temperature rise calculation of the high-frequency transformer considering the influence of the pretightening force, and provides engineering reference for scientific research and engineering personnel to accurately design and optimize the high-frequency transformer.
A method for acquiring a high frequency transformer winding temperature rise, the method comprising the steps of:
step 1: selecting corresponding equivalent thermal resistance models according to contact modes between conductors in different transformer windings;
step 2: obtaining the equivalent contact thermal resistance of the equivalent thermal resistance model under the action of a pre-tightening force;
and step 3: and obtaining the temperature rise of the transformer winding according to the equivalent contact thermal resistance considering the influence of the pretightening force.
Further, the equivalent thermal resistance model comprises a rod-plate equivalent contact thermal resistance model and a cylindrical equivalent contact thermal resistance model.
Furthermore, in the rod-plate equivalent contact thermal resistance model, the equivalent contact thermal resistance considering the action of the pre-tightening force is Rc：
Figure RE-GDA0003133079860000021
N*＝NΔ/2wD
Figure RE-GDA0003133079860000022
Wherein k isc-thermal conductivity of the wire, kF-plate thermal conductivity, N-normal load, E-young's modulus, V-poisson's ratio, w-1/2 wire length, D-wire diameter, subscripts c, F denote conductor, plate respectively.
Further, in the cylindrical equivalent contact thermal resistance model, according to the Hertz elastic theory, the contact radius a is obtained under the condition that two contact surfaces are completely smoothHAnd maximum point pressure p0，HComprises the following steps:
Figure RE-GDA0003133079860000023
p0，H＝2P/πaH
Figure RE-GDA0003133079860000024
wherein a isHIs the Hertz contact radius, p0，HAt Hertz maximum contact pressure, E' is the equivalent modulus of elasticity, E1、E2Elastic dies with cylindrical surfaces 1 and 2 respectivelyQuantity, μ is poisson's ratio, P is uniform linear load, P ═ N/2w, N is load, 2w is cylinder length;
the equivalent contact thermal resistance of the cylindrical surface considering the action of the pre-tightening force is Rc：
Figure RE-GDA0003133079860000025
ks＝(k1+k2)/2k1k2
Wherein k isSIs the coefficient of thermal conductivity, k1Is the thermal conductivity, k, of the contact surface 12Is the thermal conductivity of the contact surface 2, aLIs the actual contact radius.
The invention also comprises an electronic device having a non-volatile storage medium in which an application file of the method according to any of claims 1-4 is stored.
The invention has the following technical effects:
(1) relevant factors in the process of acquiring the temperature of the high-frequency transformer winding are fully considered, and particularly the influence of a pretightening force factor on the heat conduction of the high-frequency transformer winding is fully considered; the influence of the pretightening force on the thermal resistance is taken into consideration in the equivalent thermal resistance model, so that the accuracy of the temperature rise calculation of the transformer winding can be improved;
(2) and aiming at different contact types between conductors in the transformer winding, the equivalent contact thermal resistance model is finely divided into a rod-plate model and a cylindrical equivalent thermal resistance model, and the proper contact thermal resistance model is selected according to different contact types to improve the calculation precision and accuracy as much as possible.
Drawings
FIG. 1 is a schematic diagram of a high-frequency transformer winding with each turn of wires and an iron core/winding framework;
FIG. 2 is a schematic diagram of a high-frequency transformer winding wire arrangement;
FIG. 3 is a basic cell in which conductors are arranged in parallel;
FIG. 4 is a schematic diagram of a basic cell with conductors arranged in a staggered manner;
FIG. 5 bar-plate equivalent contact thermal resistance model;
FIG. 6 cylinder equivalent contact resistance model.
Detailed Description
Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the present invention may be implemented in various different modes, and those skilled in the art will readily recognize that the modes and details of the present invention can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the description of the embodiments. Note that in the structure of the present invention described below, reference numerals indicating the same parts are used in common in different drawings.
A method for obtaining the temperature rise of a high-frequency transformer winding comprises the steps of firstly establishing an equivalent thermal resistance model of a high-frequency transformer, deducing each equivalent thermal resistance in a heat network model, and obtaining the temperature rise of each node position of the transformer. After considering the pre-tightening force effect, the heat transfer between the turns of the wires in the winding has two ways: air gaps between conductors and solid heat transfer between conductors. The equivalent thermal resistance of the conductor air gap thermal circuit is obtained by deduction by adopting a capacitance analytic model of an analog electrostatic field; the equivalent thermal resistance of a heat conduction path generated by the pretightening force between the conductors can be obtained according to a corresponding thermal contact resistance model.
FIG. 1 shows the positional relationship between the wires of each turn of the high-frequency transformer winding and the iron core/winding framework, including the arrangement relationship between the wires and the iron core/framework and the positional relationship between the conductors of the primary and secondary winding parts of the transformer, which are isolated by the insulating plate; fig. 2 shows a high-frequency transformer winding wire arrangement form including parallel arrangement type windings and staggered arrangement type windings; FIG. 3 illustrates a basic cell structure for calculating equivalent thermal resistance of an air gap between parallel arranged conductors; FIG. 4 illustrates a basic cell structure for calculating equivalent thermal resistance of an air gap between staggered conductors; FIG. 5 shows a bar-plate equivalent contact resistance model; fig. 6 shows a cylindrical equivalent contact resistance model.
Specific analytical expressions of two types of equivalent thermal resistance models are given below.
1) Equivalent thermal resistance of air gap thermal circuit between wires
For the conductors arranged in parallel, assuming that the temperature of the winding coil on the same layer is uniformly distributed, i.e. the temperature on the wires of each layer is the same, but the temperature of the wires of different layers is different, the heat flow direction is transferred from the coil layer with high temperature to the coil layer with low temperature. In order to obtain the capacitance between the conductors arranged in parallel, the equivalent thermal resistance R between the air gaps of the wires is obtained by deducing a unit cell consisting of two parallel conductors as shown in FIG. 4orth：
Figure RE-GDA0003133079860000041
Figure RE-GDA0003133079860000044
Figure RE-GDA0003133079860000042
Figure RE-GDA0003133079860000043
Figure RE-GDA0003133079860000051
Wherein λ isair-air thermal conductivity; lambda [ alpha ]iso-wire insulation thermal conductivity; i isw-a length of wire; delta conducting wire insulation layer thickness; r is0-a conductor radius; lambda [ alpha ]lay-inter-wire insulating spacer thermal conductivity; h-the thickness of the insulating partition between the leads;
similarly, the equivalent thermal resistance R between the air gaps of the wires derived from the elementary cells of the staggered conductorscyc，
Figure RE-GDA0003133079860000052
Figure RE-GDA0003133079860000053
Figure RE-GDA0003133079860000054
2) Equivalent contact thermal resistance considering action of pre-tightening force
(1) Rod-plate equivalent contact thermal resistance model
The geometry between the conductor and the core/bobbin, the wire and the insulator plate can be equivalent using the bar-plate geometry shown in fig. 3, then the equivalent thermal contact resistance Rc of the bar-plate geometry is,
the equivalent contact thermal resistance considering the action of the pre-tightening force is Rc：
Figure RE-GDA0003133079860000055
N*＝NΔ/2wD
Figure RE-GDA0003133079860000056
Wherein k isc-thermal conductivity of the wire, kF-plate thermal conductivity, N-normal load, i.e. normal pre-tension on the wire, E-young's modulus, V-poisson's ratio, w-1/2 wire length, D-wire diameter. Subscripts c, F denote conductor, plate, respectively.
(2) Cylindrical equivalent contact thermal resistance model
For the conductor of the arrangement of fig. 2, the cylinder geometry shown in fig. 4 can be used for equivalence, and according to the Hertz elasticity theory, the contact radius a under ideal conditions, i.e. in the case of completely smooth two contact surfaces, is obtained from the load and material propertiesHAnd maximum point pressure p0，HRespectively as follows:
Figure RE-GDA0003133079860000061
p0，H＝2P/πaH
Figure RE-GDA0003133079860000062
wherein a isHIs the Hertz contact radius, p0，HAt Hertz maximum contact pressure, E' is the equivalent modulus of elasticity, E1、E2Elastic modulus of the cylindrical surfaces 1 and 2, mu is Poisson's ratio, and D is the radius of the cylindrical surface; p is the uniform linear load, N/2w, N is the load, 2w cylinder length.
The equivalent contact thermal resistance of the cylindrical surface considering the action of the pre-tightening force is Rc：
Figure RE-GDA0003133079860000063
ks＝(k1+k2)/2k1k2
Wherein k issIs the coefficient of thermal conductivity, k1Is the thermal conductivity, k, of the contact surface 12Is the thermal conductivity of the contact surface 2, aLIs the actual contact radius.
And further obtaining the temperature rise of the transformer winding according to the equivalent contact thermal resistance obtained in the mode.
The method is further improved in that the pre-tightening force factor in the winding process of the transformer is considered, so that the accuracy of the temperature calculation of the high-frequency transformer is improved.
The invention has the further improvement that corresponding equivalent contact thermal resistance calculation models, such as a rod-plate model, a cylindrical equivalent thermal resistance model and the like, are selected according to different contact modes among conductors in different transformer windings. Compared with the prior art, the invention has the following beneficial technical effects: relevant factors in the calculation process of the high-frequency transformer winding temperature, particularly the influence of the pretightening force factor on the heat conduction of the high-frequency transformer winding can be fully considered. The pretightning force can effectively increase the area of contact between the conductor, improves the heat-sinking capability. The influence of the pretightening force on the thermal resistance is taken into consideration in the equivalent thermal resistance model, so that the accuracy of the temperature rise calculation of the transformer winding can be improved. However, the influence of factors such as pretightening force on winding heat dissipation is not considered in the calculation process of the temperature rise of the high-frequency transformer winding at present. Further, aiming at different contact types between conductors in the transformer winding, the equivalent contact thermal resistance model is finely divided into a rod-plate model and a cylindrical equivalent thermal resistance model, and the appropriate contact thermal resistance model is selected according to different contact types to improve the calculation precision and accuracy as much as possible.
Finally, it should be noted that the above-mentioned embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the same, and those skilled in the art who read the present application can make various modifications or alterations of the present invention by referring to the above-mentioned embodiments within the scope of the claims of the present application.

Claims (5)

1. A method for obtaining a temperature rise of a winding of a high frequency transformer, the method comprising the steps of:
step 1: selecting corresponding equivalent thermal resistance models according to contact modes between conductors in different transformer windings;
step 2: obtaining the equivalent contact thermal resistance of the equivalent thermal resistance model under the action of a pre-tightening force;
and step 3: and obtaining the temperature rise of the transformer winding according to the equivalent contact thermal resistance considering the influence of the pretightening force.
2. The method according to claim 1, wherein the step 1 is: the equivalent thermal resistance model comprises a rod-plate equivalent contact thermal resistance model and a cylindrical equivalent contact thermal resistance model.
3. The method according to claim 2, wherein the step 3 is: in the rod-plate equivalent contact thermal resistance model, the equivalent contact thermal resistance considering the action of the pre-tightening force is Rc：
Figure FDA0003075862390000011
N*＝NΔ/2wD
Figure FDA0003075862390000012
Wherein k iscThermal conductivity of the wire, kF-plate thermal conductivity, N-normal load, i.e. normal pre-tension acting on the wire, E-young's modulus, v-poisson's ratio.
4. The method according to claim 2, wherein the step 3 is: in the cylindrical equivalent contact thermal resistance model, according to the Hertz elastic theory, the contact radius a is obtained under the condition that two contact surfaces are completely smoothHAnd maximum point pressure p0,HComprises the following steps:
Figure FDA0003075862390000013
p0，H＝2P/π·aH
Figure FDA0003075862390000021
wherein a isHIs the Hertz contact radius, p0,HAt Hertz maximum contact pressure, E' is the equivalent modulus of elasticity, E1、E2Respectively the elastic modulus of the cylindrical surface 1 and the elastic modulus of the cylindrical surface 2, mu is the Poisson's ratio, and rho is the curvature radius of the cylindrical surface;
the equivalent contact thermal resistance of the cylindrical surface considering the action of the pre-tightening force is Rc：
Figure FDA0003075862390000022
ks＝(k1+k2)/2k1k2
Wherein k isSIs the coefficient of thermal conductivity, k1Is the thermal conductivity, k, of the contact surface 12Is the thermal conductivity of the contact surface 2, aLIs the actual contact radius.
5. An electronic device having a non-volatile storage medium, wherein an application file of the method according to any one of claims 1-4 is stored in the non-volatile storage medium.
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CN112540629A (en) * 2020-11-18 2021-03-23 河南卓正电子科技有限公司 Intelligent valve flow calibration method and device
CN112417727A (en) * 2020-11-20 2021-02-26 三峡大学 High-frequency transformer leakage inductance parameter calculation method considering end effect

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