CN113281861B

CN113281861B - Light emitting module and optical path coupling method

Info

Publication number: CN113281861B
Application number: CN202110792343.6A
Authority: CN
Inventors: 万仁; 李林科; 吴天书; 杨现文; 张健
Original assignee: Wuhan Linktel Technologies Co Ltd
Current assignee: Wuhan Linktel Technologies Co Ltd
Priority date: 2021-07-14
Filing date: 2021-07-14
Publication date: 2021-10-26
Anticipated expiration: 2041-07-14
Also published as: CN113281861A

Abstract

The application relates to a light emitting assembly and a method of coupling optical paths. The light emitting module includes: a tube shell (10); a first group of substrates arranged in the package (10) along a width direction of the package (10) and at a first height and comprising a plurality of substrates (50) on which laser chips are carried, wherein the laser chips are configured to emit optical signals in a direction opposite to a direction in which the light exit window (20) is located; a beam combiner (30) configured to beam combine the optical signals from the laser chips such that the combined beam is transmitted via the light exit window (20) and arranged in the package (10) at a second height different from the first height; and a first light collimating component located in the package (10) downstream of and adjacent to the laser chip in the optical path of the laser chip to collimate the optical signal and change the direction of the optical signal such that the collimated optical signal is coupled into the beam combiner (30).

Description

Light emitting module and optical path coupling method

Technical Field

Embodiments of the present application relate generally to the field of optical communications, and more particularly, to a compact light emitting assembly.

Background

With the development of 5G and the Internet of things, the construction and use amount of a communication network and a data center is increased, and the requirement of the network on the speed is gradually improved. The two methods for increasing the speed are available, one method is to directly adopt a single chip with high bandwidth, which has the advantages of small structure and low power consumption of an optical device, but the requirement of the current network on the speed is far higher than the development speed of the optical chip, and the single high-speed chip does not reach the commercial stage in the fields of high speed 100G, 200G and 400G.

The optical communication device adopts a multi-channel transmission scheme to meet the requirement of high-speed communication. The optical communication device includes a light emitting module and a light receiving module. Taking an optical transmit module as an example, the optical transmit module generally includes a package, a beam combiner, a substrate on chip (COC), and a laser chip disposed on the COC. However, the device layout of the conventional optical transmission assembly will result in a long signal link of the COC, resulting in degradation of the optical signal quality. In addition, the device arrangement of such a light emitting module occupies a large space, which makes it difficult to perform expansion of more channels.

Disclosure of Invention

The embodiment of the application provides a light emitting component and a light path coupling method, aiming at improving the signal quality and the space efficiency of the light emitting component.

According to a first aspect of the present application, a light emitting assembly is provided. The light emitting module includes: a tube housing including a light exit window disposed at one end of the tube housing in a length direction; a first set of substrates arranged in the package along a width direction of the package and at a first height and comprising a plurality of substrates carrying a laser chip thereon, wherein the laser chip is configured to emit an optical signal in a direction opposite to a direction in which the light exit window is located; a beam combiner configured to beam combine optical signals from the laser chips to cause the combined beams to be transmitted via the light exit window and disposed in the package at a second height different from the first height; and a first optical collimating component downstream in the optical path of the laser chip and disposed in the package adjacent to the laser chip to collimate the optical signal and change the optical signal direction such that the collimated optical signal is coupled into the beam combiner.

According to the light emitting assembly of the embodiment of the application, the layout of the optical devices in the light emitting assembly can be optimized to realize the miniaturization of the devices in the light emitting assembly, and the space efficiency of the light emitting assembly is improved. In addition, the light emitting assembly according to the embodiment of the present disclosure can shorten a signal link on a substrate and improve the quality of a signal.

In an embodiment according to the application, the optical port of the laser chip and the electrical signal bonding terminal for exciting the laser chip to emit light may be disposed on the same side of the substrate. Thus, the signal link on the substrate can be shortened, thereby reducing signal attenuation.

In an embodiment according to the application, the first light collimating assembly may comprise a mirror-collimating lens assembly configured to change the light signal from the laser chip from a horizontal direction to a height direction and to collimate, and a second mirror arranged at an angle of 45 ° with respect to the horizontal, the second mirror configured to change the changed direction and collimated light signal from the height direction to a horizontal direction to couple towards the beam combiner.

In an embodiment according to the present application, the mirror-collimating lens assembly may include a first mirror arranged at a 45 ° angle with respect to horizontal and a collimating lens mounted adjacent to the first mirror.

In embodiments according to the application, the mirror-collimating lens assembly may comprise a C-sphere collimating concave mirror.

In an embodiment according to the application, the package may comprise a first platform configured to support the first set of substrates and a second platform configured to support the mirror-collimating lens assembly, wherein the second platform has a height that is higher than a height of the first platform and is configured such that optical signals emitted from the laser chips on the substrates are substantially coupled to the mirror-collimating lens assembly placed on the second platform.

In an embodiment according to the application, one said mirror-collimating lens assembly may be provided for each substrate and one second mirror may be provided for said first group of substrates.

In an embodiment according to the present application, the light emitting assembly may further include a pair of support bodies disposed at outer sides of the first group of substrates in a width direction, wherein the support bodies include an inclined surface inclined at an angle of 45 °, and the second mirror is attached to the inclined surface.

In an embodiment according to the present application, the light emitting assembly may further include a support stage or pad having a predetermined height disposed at a predetermined position of the package, configured to support the beam combiner.

In an embodiment according to the present application, the light emitting assembly may further include: a second group of substrates arranged side by side with the first group of substrates in a width direction of the package and adjacent to the beam combiner than the first group of substrates, and including a plurality of substrates carrying thereon a laser chip configured to emit an optical signal in a direction opposite to a direction in which the light exit window is located; and a second optical collimating component positioned in the package downstream of and adjacent to the laser chips of the second group of substrates to collimate the optical signal and change the optical signal direction such that the collimated optical signal is coupled into the beam combiner; wherein the second light collimating assembly includes a mirror-collimating lens assembly configured to change and collimate optical signals from the laser chips of the second group of substrates from a horizontal direction to a height direction, and a filter disposed at a 45 ° angle with respect to the horizontal, the filter configured to change the changed and collimated optical signals from the height direction to the horizontal direction for coupling toward the beam combiner, and to allow optical signals from the first light collimating assembly to transmit to couple into the beam combiner. Thus, the number of channels of the optical communication device can be increased without changing the size of the package.

According to a second aspect of the present application, there is provided an optical path coupling method. The optical path coupling method comprises the following steps: providing a first set of substrates comprising a plurality of substrates on which laser chips are carried; causing the laser chip to emit an optical signal in a horizontal direction opposite to a direction in which a light exit window of the light emitting assembly is located; providing a first light collimating component to collimate the light signal from the laser chip and change the light signal from a horizontal direction to a vertical direction and change the light signal in a vertical direction to a horizontal direction towards the light exit window; and providing a beam combiner to beam combine the optical signals from the first light collimating component such that the combined optical beam is transmitted via the light exit window.

In an embodiment according to the application, the method may further comprise: providing a second set of substrates arranged side-by-side with the first set of substrates and adjacent the beam combiner than the first set of substrates and comprising a plurality of substrates on which laser chips are carried; causing the laser chips of the second set of substrates to emit optical signals in a horizontal direction opposite to the direction in which the light exit window of the light emitting assembly is located; and providing a second light collimating assembly to collimate the optical signals from the laser chips of the second set of substrates and change the optical signals from a horizontal direction to a vertical direction, wherein the second light collimating assembly includes a filter configured to change the optical signals in the vertical direction to a horizontal direction to propagate toward the beam combiner and to allow optical signals from the first light collimating assembly to transmit to couple into the beam combiner.

Drawings

The above and other objects, features and advantages of the embodiments of the present application will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. In the drawings, several embodiments of the present application are illustrated by way of example and not by way of limitation.

Fig. 1 shows a schematic top view of the overall structure of a light emitting assembly according to an embodiment of the present application.

FIG. 2 shows a schematic cross-sectional view of the light emitting assembly shown in FIG. 1 along line A-A.

FIG. 3 shows a schematic cross-sectional view of the light emitting assembly shown in FIG. 1 along line B-B.

Fig. 4 shows a signal link schematic of a laser chip on a substrate according to an embodiment of the application.

FIG. 5 illustrates a partial optical path schematic of the light emitting assembly of the embodiment shown in FIG. 1.

Fig. 6 shows a schematic light path diagram of a first light collimating assembly according to another embodiment of the present application.

FIG. 7 illustrates a schematic top view of the overall structure of a light emitting assembly according to another embodiment of the present application.

FIG. 8 shows a schematic cross-sectional view of the light emitting assembly shown in FIG. 7 along line C-C.

FIG. 9 illustrates a partial optical path schematic of the light emitting assembly of the embodiment shown in FIG. 7.

Fig. 10 shows a flow diagram of an optical path coupling method of a light emitting assembly according to an embodiment of the present application.

Fig. 11 shows a flow diagram of a method of optical path coupling of a light emitting assembly according to another embodiment of the present application.

Like or corresponding reference characters designate like or corresponding parts throughout the several views.

Detailed Description

Preferred embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

The term "include" and variations thereof as used herein is meant to be inclusive in an open-ended manner, i.e., "including but not limited to". Unless specifically stated otherwise, the term "or" means "and/or". The term "based on" means "based at least in part on". The terms "one example embodiment" and "one embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "upper," "lower," "front," "rear," "left," "right," and the like, refer to placement or positional relationships based on the orientation or positional relationship as shown in the drawings, merely for convenience in describing the principles of the application, and do not indicate or imply that the referenced elements must be in a particular orientation, be constructed or operated in a particular orientation, and therefore should not be considered limiting of the application.

The following describes in detail a light emitting assembly according to an embodiment of the present application with reference to the drawings. It is to be noted that although the embodiments of the present application are described taking the light emitting module as an example, the inventive concept of the present application can be similarly applied to the light receiving module.

Fig. 1-3 show schematic structural views of a light emitting assembly 100 according to an embodiment of the present application. As shown in fig. 1-3, light emitting assembly 100 includes a package 10 and a first set of substrates disposed within package 10, a beam combiner 30, and a first light collimating assembly. The envelope 10 may comprise a length, a width and a height and comprises a light exit window 20 arranged at one end of the envelope 10 in the length direction (in the embodiment shown in fig. 1, on the left). The light exit window 20 may be integrated with the envelope 10. The beam combiner 30 is arranged in the package 10 at a predetermined height, e.g. a second height, and is configured to combine the optical signals of different wavelengths from the different laser chips and to transmit the combined beam via the light exit window 20.

The light emitting assembly 100 may further include a first group of substrates arranged in the width direction of the package 10 and arranged in the package 10 at a first height. The first set of substrates may include a plurality of substrates 50, each substrate 50 having laser chips respectively carried thereon that are adapted to emit different wavelengths. The number of substrates 50 may correspond to the number of light channels of the light emitting assembly 100. In the illustrated embodiment, the light emitting assembly 100 includes four light channels. It should be understood that this is merely exemplary and that the light emitting assembly 100 may include other numbers of light channels, such as eight light channels, twelve light channels, etc.

In the illustrated embodiment, the first set of substrates is disposed in the package 10 at a first height, wherein the first height is lower than the second height. Thus, the light emitting surface of the laser light emitted from the laser chip and the operation surface of the beam combiner 30 for coupling light are on different levels. By such an arrangement, the vertical space utilization within the envelope is increased.

In an embodiment according to the application, as shown in fig. 1-3, the laser chip is configured to emit the optical signal towards a direction opposite to the direction in which the light exit window 20 is located (to the right in the embodiment shown in fig. 1 and 3). The light emitting assembly 100 may also include a first light collimating assembly. A first light collimating component is located in the optical path downstream of the laser chip and is arranged in the package 10 adjacent to the laser chip. The first optical collimating component is configured to collimate the optical signal and change the direction of the optical signal such that the collimated optical signal is coupled into the optical beam combiner 30. With this arrangement, the optical port of the laser chip of the optical transmission assembly 100 and the electrical signal bonding terminal for exciting the laser chip to emit light are disposed on the same side of the substrate 50, thereby shortening the link length of the signal link of the substrate.

Fig. 4 shows a signal link schematic of a laser chip on a substrate 50 according to an embodiment of the present application. As shown in fig. 4, the optical port of the laser chip 52 is disposed on the left side of the drawing sheet, and the flexible circuit board that makes electrical connection with the substrate 50 is also located on the left side (see fig. 1). As marked in fig. 4, the length L of the signal link on the package is greatly reduced, so that the attenuation of the radio frequency signal on the signal link can be reduced, and the signal quality is further improved.

FIG. 5 illustrates a partial optical path schematic of the light emitting assembly of the embodiment shown in FIG. 1. As shown, the first light collimating assembly may include a mirror-collimating lens assembly and a second mirror 40. The mirror-collimating lens assembly is configured to change the optical signal from the laser chip from a horizontal direction (i.e., a direction to the right in the figure) to a height direction (i.e., a direction to the top in the figure) and to collimate. The second mirror 40 is arranged at an angle of 45 deg. with respect to the horizontal. Second mirror 40 is configured to change the redirected and collimated optical signal from a height direction to a horizontal direction for coupling toward beam combiner 30 (i.e., in a leftward direction in the figure). Thus, it is possible to easily configure to realize the optical path coupling from the laser chip to the beam combiner 30.

In the embodiment shown in FIG. 5, the mirror-collimating lens assembly of the light emitting assembly 100 may include a first mirror 80 disposed at a 45 angle relative to horizontal and a collimating lens 70 mounted adjacent to the first mirror 80. As shown in fig. 5, the laser chip emits a light signal to the right, the emitted light signal is first reflected vertically upward by the first reflector 80, then is collimated by the collimating lens 70, and the collimated light is then incident vertically to the second reflector 40, and is horizontally coupled into the beam combiner 30 after being reflected by the second reflector 40. It should be noted that although in the illustrated embodiment the signal from the laser chip is first reflected and then collimated, it should be understood that this is merely exemplary, and in other embodiments the collimating lens and the first mirror are reversed, i.e., the collimating lens is used to collimate the diverging light from the laser chip and the first mirror is used to reflect the diverging light.

Fig. 6 shows a schematic light path diagram of a first light collimating assembly according to another embodiment of the present application. As shown in fig. 6, instead of the mirror-collimating lens assembly shown in fig. 5, the mirror-collimating lens assembly of the light emitting assembly 100 may include a C-sphere collimating concave mirror 190. The C-sphere collimating concave mirror 190 may be configured to reflect and collimate the optical signal from the laser chip. The reflected and collimated light is coupled into the beam combiner via a second mirror 40.

Continuing back to fig. 1-3, in the illustrated embodiment, one mirror-collimating lens assembly is provided for each substrate 50 and one second mirror 40 is provided for the first group of substrates. One second reflecting mirror 40 is provided for the first group of substrates, thereby reducing the number of parts and complexity of the optical path coupling work. As shown in fig. 1-3, the second mirror 40 may be disposed opposite the beam combiner 30 and extend across the width of the light emitting assembly 100. Thus, collimated light from the mirror-collimating lens assembly may be reflected to the beam combiner 30 via the second mirror 40.

As shown in fig. 2-3, the light emitting assembly 100 may further include one or more supports 90 disposed on the widthwise outer sides of the first group of substrates. The support 90 is disposed outside the first group substrate, and thus does not affect the optical path. In some embodiments, the supports 90 may be arranged in pairs, thereby further enhancing the supporting strength of the second mirror 40. In some embodiments, the support 90 may include an inclined surface inclined at an angle of 45 °, the second mirror 40 being attached to the inclined surface.

In some embodiments, as shown in fig. 3, the package 10 of the light emitting assembly 100 may include a first platform 12 configured to support a first set of substrates and a second platform 14 configured to support a mirror-collimating lens assembly. By providing the first stage 12 and the second stage 14, the positions of the substrate and the optical device can be easily positioned. The heights of the first and second stages 12 and 14 may be appropriately set according to the height of the package 10. In some embodiments, the height of the second stage 14 is greater than the height of the first stage 12 and is configured such that optical signals emitted from the laser chips on the substrate 50 are substantially coupled to a mirror-collimating lens assembly disposed on the second stage 14. Although in the illustrated embodiment, the first platform 12 and the second platform 14 are arranged as a unitary structure of the enclosure 10; it should be understood that this is merely exemplary, and in other embodiments, one or both of the first platform 12 and the second platform 14 may be replaced with a gasket.

In some embodiments, as shown in fig. 3, the light emitting assembly 100 may further include a spacer 60 having a predetermined height disposed at a predetermined position of the package 10. The height of the beam combiner 30 may be conveniently set by the spacer 60. In other embodiments, instead of shims, it may be formed in the form of a support table. In addition, the position of beam combiner 30 in package 10 may be readily determined.

Fig. 7-9 illustrate schematic structural views of a light emitting assembly 700 according to another embodiment of the present application. The embodiment shown in fig. 7-9 is similar to the embodiment shown in fig. 1, except that the number of channels in the embodiment of fig. 7-9 is doubled relative to the embodiment shown in fig. 1. This is mainly due to the spatial layout of the optics of the

light emitting assembly

100, 700 according to embodiments of the present application.

As described in the foregoing embodiments, in the optical transmission module 100 according to the embodiment of the present application, by making the light emitted from the laser chip and the light beam coupled into the beam combiner 30 on different levels of the space of the package, the vertical space of the package is effectively utilized to reduce the length of the package occupied by the optical device. In this case, the device can be made compact and the space in the longitudinal direction of the package can be saved. While the saved space may be used to arrange additional one or more sets of substrates and associated optics. Thus, multiplication of the number of optical channels can be achieved without changing the size of the optical communication module. In the illustrated embodiment, the optical communication module is upgraded from 4 channels to 8 channels. In the case where the original communication component was an 8-channel, it could be increased to 16-channel by implementing the scheme according to an embodiment of the present application.

FIG. 7 illustrates a schematic top view of the overall structure of a light emitting assembly according to another embodiment of the present application. FIG. 8 shows a schematic cross-sectional view of the light emitting assembly shown in FIG. 7 along line C-C. FIG. 9 illustrates a partial optical path schematic of the light emitting assembly of the embodiment shown in FIG. 7. As shown in fig. 7-9, light emitting assembly 700 includes a package 710 and a first set of substrates disposed within package 710, a second set of substrates disposed side-by-side with the first set of substrates, a beam combiner 730, a first light collimating assembly for the first set of substrates, a second light collimating assembly for the second set of substrates. The first set of substrates may include a plurality of substrates 750a, each substrate 750a carrying a respective laser chip 752a adapted to emit a different wavelength. In the illustrated embodiment, the number of the substrates 750a is four to form four optical channels. The light emitting assembly 700 further includes a spacer 760 having a predetermined height disposed at a predetermined position of the package 710, the spacer 760 being configured to support the beam combiner 730. In other embodiments, instead of shims, it may be formed in the form of a support table. The first light collimating assembly may include a first mirror 780a arranged at a 45 ° angle with respect to the horizontal, a collimating lens 770a mounted adjacent to the first mirror 780a, and a second mirror 740 a. Second mirror 740a is configured to change the redirected and collimated optical signal from a height direction to a horizontal direction for coupling toward beam combiner 730 (i.e., in a leftward direction in the drawing). Thus, it is possible to conveniently configure to realize the optical path coupling from the laser chip to the beam combiner 730. Second mirror 740a may be supported via first support 790a to ensure secure mounting of second mirror 740 a. The second set of substrates is arranged alongside the first set of substrates in the width direction of the envelope 710 and is adjacent the beam combiner 730 than the first set of substrates. The second group of substrates includes a plurality of substrates 750b on which laser chips 752b are carried. The laser chip 752b is configured to emit an optical signal in a direction opposite to the direction in which the light exit window is located. The second group of substrates may adopt a structure similar to that of the first group of substrates in the foregoing embodiments, and detailed description thereof is omitted.

A second optical collimating assembly is positioned in the package 710 optically downstream of the laser chips 752b of the second group of substrates and adjacent to the laser chips 752b of the second group of substrates to collimate and redirect the optical signals such that the collimated optical signals are coupled into the optical beam combiner 730. The second light collimating assembly may take a similar structure as the second light collimating assembly in the previous embodiments. The difference is that instead of a mirror, the second light collimating assembly may comprise a filter 740b arranged at an angle of 45 ° with respect to the horizontal. Filter 740b is configured to change the redirected and collimated optical signal from a height direction to a horizontal direction for coupling toward beam combiner 730 and to allow the optical signal from the first optical collimating component to transmit for coupling into beam combiner 730. Thus, even if the second group of light tunnel devices is provided, there is no influence on the first group of light tunnel devices.

In the illustrated embodiment, the second light collimating assembly may comprise a mirror-collimating lens assembly and a filter segment 740b arranged at a 45 ° angle with respect to the horizontal. The mirror-collimating lens assembly may include a first mirror 780b arranged at a 45 ° angle with respect to horizontal and a collimating lens 770b mounted adjacent to the first mirror 780 b. In some embodiments, the mirror-collimating lens assembly may comprise a C-sphere collimating concave mirror. In the illustrated embodiment, the filter 740b may be supported via a second support 790b to ensure a secure mounting of the filter.

Therefore, by arranging the second group substrate and the corresponding optical module, the multiplication of the number of optical channels can be realized under the condition of not changing the size of the optical communication assembly. In the illustrated embodiment, only the second group substrate and the corresponding light module, which are additionally provided, are shown; in other embodiments, more sets of substrates and corresponding optical modules may be provided to achieve a greater number of channels.

Fig. 10 illustrates an optical path coupling method 100 according to an embodiment of the present application. As shown in fig. 10, the method may include: step 1002 provides a first set of substrates comprising a plurality of substrates having laser chips supported thereon. At 1004, the laser chip is caused to emit an optical signal in a horizontal direction opposite to a direction in which the light exit window of the light emitting assembly is located. Step 1006, providing a first light collimating component to collimate and change the light signal from the laser chip from a horizontal direction to a vertical direction and to change the light signal in the vertical direction to a horizontal direction towards the light exit window. A beam combiner is provided 1008 to beam combine the optical signals from the first optical collimating assembly such that the combined beam is transmitted through the light exit window.

In some embodiments, as shown in fig. 11, the method 1100 may further include: a second set of substrates is provided, arranged side-by-side with and adjacent to the beam combiner than the first set of substrates, and comprising a plurality of substrates on which the laser chips are carried, step 1102. The laser chips of the second group of substrates are caused to emit optical signals in a horizontal direction opposite to the direction in which the light exit window of the light emitting assembly is located, step 1104. And step 1106, providing a second light collimating component to collimate the optical signals from the laser chips of the second group of substrates and change the optical signals from a horizontal direction to a vertical direction, wherein the second light collimating component comprises a filter configured to change the optical signals in the vertical direction to the horizontal direction to propagate towards the beam combiner and to allow the optical signals from the first light collimating component to transmit to be coupled into the beam combiner.

Having described embodiments of the present application, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A light emitting assembly, comprising:

a tube housing (10) comprising a light exit window (20) arranged at one end of the tube housing (10) in a length direction;

a first set of substrates arranged in the package (10) along a width direction of the package (10) and at a first height and comprising a plurality of substrates (50) carrying laser chips thereon, wherein the laser chips are configured to emit optical signals in a direction opposite to a direction in which the light exit window (20) is located;

a beam combiner (30) configured to beam combine optical signals from the laser chips to cause the combined beam to be transmitted via the light exit window (20) and arranged in the package (10) at a second height different from the first height; and

a first light collimating component positioned in the package (10) downstream of and adjacent to the laser chip in the optical path to collimate the optical signal and change the optical signal direction such that the collimated optical signal is coupled into the beam combiner (30);

wherein the first light collimating assembly comprises a mirror-collimating lens assembly configured to change the light signal from the laser chip from a horizontal direction to a height direction and collimate, and a second mirror (40) arranged at an angle of 45 ° with respect to the horizontal, the second mirror (40) configured to change the changed direction and collimated light signal from the height direction to a horizontal direction to couple towards the beam combiner (30).

2. The optical transmit assembly of claim 1, wherein the optical port of the laser chip and the electrical signal bonding terminal for exciting the laser chip to emit light are disposed on the same side of the substrate (50).

3. The light emitting assembly of claim 1, wherein the mirror-collimating lens assembly includes a first mirror (80) arranged at a 45 ° angle with respect to horizontal and a collimating lens (70) mounted adjacent to the first mirror (80).

4. The light emitting assembly of claim 1, wherein the mirror-collimating lens assembly comprises a C-sphere collimating concave mirror (190).

5. The light emitting assembly of claim 3, wherein the package (10) comprises a first platform (12) configured to support the first set of substrates and a second platform (14) configured to support the mirror-collimating lens assembly, wherein the second platform (14) has a height greater than a height of the first platform (12) and is configured such that optical signals emitted from the laser chips on the substrates (50) are substantially coupled to the mirror-collimating lens assembly disposed on the second platform (14).

6. Light emitting assembly according to any of claims 1-5, wherein one mirror-collimating lens assembly is provided for each substrate (50) and one second mirror (40) is provided for the first group of substrates.

7. The light emitting assembly of claim 6, further comprising a pair of support bodies (90) arranged outside the first set of substrates in the width direction, wherein the support bodies comprise inclined surfaces inclined at an angle of 45 °, the second mirror (40) being attached to the inclined surfaces.

8. Light emitting assembly according to any of claims 1-5 and 7, further comprising a support table or pad having a predetermined height arranged at a predetermined position of the envelope (10) configured to support the beam combiner (30).

9. The light emitting assembly of any one of claims 1-5 and 7, further comprising:

a second group of substrates arranged side by side with the first group of substrates in a width direction of the package (10) and adjacent to the beam combiner (30) than the first group of substrates, and comprising a plurality of substrates carrying a laser chip thereon, wherein the laser chip is configured to emit an optical signal in a direction opposite to a direction in which the light exit window (20) is located; and

a second light collimating component positioned in the package (10) downstream of and adjacent to the laser chips of the second group of substrates to collimate the optical signal and redirect the optical signal such that the collimated optical signal is coupled into the beam combiner (30);

wherein the second light collimating assembly comprises a mirror-collimating lens assembly configured to change and collimate light signals from the laser chips of the second set of substrates from a horizontal direction to a height direction and a filter disposed at a 45 ° angle relative to horizontal, the filter configured to change the changed direction and collimated light signals from the height direction to the horizontal direction for coupling toward the beam combiner (30) and to allow light signals from the first light collimating assembly to transmit for coupling into the beam combiner (30).

10. An optical path coupling method, comprising:

providing a first set of substrates comprising a plurality of substrates (50) on which laser chips are carried;

-causing the laser chip to emit an optical signal in a horizontal direction opposite to a direction in which a light exit window (20) of a light emitting assembly is located;

providing a first light collimating component to collimate the light signal from the laser chip and to change the light signal from a horizontal direction to a vertical direction and to change the light signal in a vertical direction to a horizontal direction towards the light exit window (20), wherein the first light collimating component comprises a mirror-collimating lens component and a second mirror (40) arranged at an angle of 45 ° with respect to the horizontal, wherein the mirror-collimating lens component is configured to change the light signal from the laser chip from a horizontal direction to a height direction and to collimate, the second mirror (40) is configured to change the redirected and collimated light signal from the height direction to a horizontal direction to couple towards a beam combiner (30); and

a beam combiner (30) is provided for beam combining the optical signals from the first light collimating assembly such that a combined beam is transmitted via the light exit window (20).

11. The method of claim 10, further comprising:

providing a second set of substrates arranged side-by-side with and adjacent to the beam combiner (30) than the first set of substrates and comprising a plurality of substrates carrying laser chips thereon;

-causing the laser chips of the second set of substrates to emit optical signals in a horizontal direction opposite to the direction in which the light exit window (20) of the light emitting assembly is located; and

providing a second light collimating assembly to collimate the optical signals from laser chips of the second set of substrates and change the optical signals from a horizontal direction to a vertical direction, wherein the second light collimating assembly comprises a filter configured to change the optical signals in a vertical direction to a horizontal direction to propagate toward the beam combiner (30) and to allow optical signals from the first light collimating assembly to transmit to couple into the beam combiner (30).