CN113281157A - Device and method for testing pin lead tension of electronic component - Google Patents
Device and method for testing pin lead tension of electronic component Download PDFInfo
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- 238000012360 testing method Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 98
- 238000004140 cleaning Methods 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims description 66
- 238000009864 tensile test Methods 0.000 claims description 26
- 238000007664 blowing Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 6
- 238000004458 analytical method Methods 0.000 claims description 3
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/0003—Steady
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0017—Tensile
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
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Abstract
The invention belongs to the technical field of avionics production, and discloses a device and a method for testing the pin lead tension of an electronic component, wherein the device comprises a rack, a tension testing mechanism, a control mechanism, a collecting mechanism and a cleaning mechanism are arranged on the rack; the tensile force testing mechanism is used for testing the tensile property of the pin lead of the electronic component. The device and the method for testing the tensile force of the pin lead of the electronic component can realize the purpose of testing the tensile property of the pin lead of the electronic component by one key, not only can effectively reduce the testing difficulty, but also can effectively improve the working efficiency, and particularly, the device and the method can greatly reduce the number of waste products generated by testing so as to reduce the testing cost, can collect the broken pin lead of the electronic component, can effectively avoid the influence on the testing work caused by the scattered parts of the broken pin lead of the electronic component, and are more convenient to clean the residual broken pin lead of the electronic component.
Description
Technical Field
The invention relates to the technical field of avionic production, in particular to a device and a method for testing the pin lead tension of an electronic component.
Background
Aviation refers to the navigational activity of manned or unmanned aircraft in the earth's atmosphere; space flight refers to the navigation of manned or unmanned spacecraft outside the earth's atmosphere, and is also known as space flight or cosmonautic. In order to expand social production, human beings inevitably develop new activity space. The process of expanding the range of motion of human beings from land to sea, from sea to the atmosphere, and to space.
The tensile property of a pin lead of an electronic component used by aerospace equipment needs to be tested in the production process so as to ensure that the use performance of the electronic component meets the process requirements, however, the conventional pin lead tensile testing device for the electronic component has more complicated testing steps, so that the testing difficulty is higher, the working efficiency is seriously influenced, and particularly, a large amount of waste products can be generated in the testing process, so that the testing cost is higher; secondly, the conventional electronic component pin lead tension testing device cannot collect the broken electronic component pin leads, so that the broken electronic component pin leads are scattered everywhere to influence the testing work; in addition, the existing electronic component pin lead tension testing device has the defect that the use is influenced because the residual broken pin leads of the electronic component are troublesome to clean.
Therefore, the device and the method for testing the pin lead tension of the electronic component are provided.
Disclosure of Invention
The invention aims to provide a device and a method for testing the tensile strength of a pin lead of an electronic component, which can realize the purpose of testing the tensile strength of the pin lead of the electronic component by one key, not only can effectively reduce the testing difficulty, but also can effectively improve the working efficiency, and particularly, can greatly reduce the number of waste products generated by testing so as to reduce the testing cost, can collect the broken pin lead of the electronic component, can effectively avoid the influence on the testing work caused by the scattering of the broken pin lead of the electronic component, and is more convenient to clean the residual broken pin lead of the electronic component, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a kind of electronic component pin lead wire pulling force testing device, including:
the device comprises a rack, wherein a tension testing mechanism, a control mechanism, a collecting mechanism and a cleaning mechanism are arranged on the rack;
the tensile testing mechanism is used for testing the tensile property of a pin lead of an electronic component;
the control mechanism is used for controlling the tensile force testing mechanism and the cleaning mechanism to work;
the collecting mechanism is used for collecting broken pin leads of the electronic components;
the cleaning mechanism is used for blowing the frame and pin leads of the broken electronic components left on the tensile testing mechanism into the collecting mechanism.
The tensile testing device for the pin lead of the electronic component comprises a rack, wherein the rack comprises a supporting plate, four supporting legs and a bottom plate, the supporting plate is horizontally arranged, the four supporting legs are vertically and fixedly arranged at the bottom of the supporting plate, and the bottom plate is horizontally and fixedly arranged between the four supporting legs.
The tensile testing mechanism comprises a first assembling seat, a second assembling seat, two sliding rods, a first moving seat, a second moving seat, a first portal frame, a first pressing electric push rod, a first pressing block, a second portal frame, a second pressing electric push rod, a second pressing block, a first driving electric push rod and a second driving electric push rod, wherein the first assembling seat and the second assembling seat are fixedly arranged at the upper part of the supporting plate, the first assembling seat and the second assembling seat are arranged in parallel, the two sliding rods are horizontally and fixedly arranged between the first assembling seat and the second assembling seat, the two sliding rods are arranged in parallel, the first moving seat and the second moving seat are both slidably and horizontally arranged on the two sliding rods, the first moving seat and the second moving seat are arranged adjacently, a fixed groove is arranged at the edge of one side of the upper part of the first moving seat, which is aligned with the upper part of the first moving seat and is close to the second moving seat, the first portal frame is vertically and fixedly arranged at the upper part of the first moving seat, the first compaction electric push rod is vertically and fixedly arranged at the bottom of the inner top wall of the first portal frame, the first pressing block is fixedly arranged at the end part of the telescopic end of the first compaction electric push rod, the first pressing block is positioned right above the fixed groove, the second portal frame is vertically and fixedly arranged at the upper part of the second moving seat, the second compaction electric push rod is vertically and fixedly arranged at the bottom of the inner top wall of the second portal frame, the second pressing block is fixedly arranged at the end part of the telescopic end of the second compaction electric push rod, and the second pressing block is positioned above the second moving seat, first drive electric putter level and fixedly install first join in marriage the dress seat orientation on the side of seat is joined in marriage to the second, just first drive electric putter's flexible end pass through force sensor with first removal seat dorsad a side fixed connection of seat is removed to the second, second drive electric putter pass through the fixing base level and fixedly install the upper portion of backup pad, just second drive electric putter is located the second join in marriage the dress seat with between the seat is removed to the second, second drive electric putter's flexible end with the second remove the seat dorsad a side fixed connection of first removal seat.
In the device for testing the pin lead tension of the electronic component, the surface of the first movable seat, the surface of the second movable seat, the surface of the first pressing block, the surface of the second pressing block and the groove wall of the fixing groove are coated with a rubber layer with the thickness of 300-400 um.
The control mechanism comprises a control box, a rear cover, a touch display screen, an operating button and a controller, the control box is fixedly mounted on the upper portion of the supporting plate through a vertical rod, the rear cover is fixedly mounted on the rear portion of the control box, the touch display screen and the operating button are fixedly mounted on the front portion of the control box, the controller is fixedly mounted inside the control box, and the controller is respectively connected with the touch display screen, the operating button, the first pressing electric push rod, the second pressing electric push rod, the first driving electric push rod, the tension sensor and the second driving electric push rod in an electrically connected mode.
The tensile testing device for the pin lead of the electronic component is characterized in that the control mechanism further comprises a buzzer, the buzzer is fixedly mounted on the outer wall of the control box, and the buzzer is electrically connected with the controller.
The tensile testing device for the pin lead of the electronic component is characterized in that the control mechanism further comprises a status indicator lamp, the status indicator lamp is fixedly installed at the top of the control box, and the status indicator lamp is electrically connected with the controller.
The device for testing the pin lead tension of the electronic component comprises a collecting mechanism, wherein the collecting mechanism comprises a square enclosing plate, a collecting opening, a collecting hopper and a collecting box, the square enclosing plate is fixedly arranged on the upper portion of a supporting plate and surrounds the periphery of the tension testing mechanism, the collecting opening is formed in the supporting plate and is located on the inner side of the square enclosing plate, the collecting hopper is fixedly arranged at the bottom of the collecting opening, the collecting box is arranged on the upper portion of a bottom plate, and the box opening of the collecting box is located under the collecting hopper.
Foretell an electronic components pin lead wire pulling force testing arrangement, wherein, clearance mechanism includes fan, hose, cavity handle and blowing head, the fan fixed mounting be in on the lateral wall of square bounding wall, the one end of hose with the air outlet of fan is linked together, cavity handle fixed mounting be in the other end of hose, blowing head fixed mounting be in the cavity handle is kept away from the one end tip of hose, just blowing head passes through the cavity handle with the hose is linked together.
The invention also provides a method for testing the tensile force of the pin lead of the electronic component, which adopts the tensile force testing device for the pin lead of the electronic component to test the tensile force performance of the pin lead of the electronic component, and specifically comprises the following steps:
step S1: debugging test parameters of the electronic component pin lead tension test device according to process requirements;
step S2: placing an electronic component to be tested into the fixing groove, and ensuring that a lead of the electronic component extends to the outside of the fixing groove;
step S3: pressing an operation button, the controller controls the first compressing electric push rod to drive the first pressing block to compress the electronic component to be tested of the first pressing block, the controller controls the second driving electric push rod to drive the second moving seat to move towards the first moving seat until the second moving seat is contacted with the first moving seat, the controller controls the second compressing electric push rod to drive the second pressing block to compress the lead of the electronic component to be tested, the controller controls the first driving electric push rod to drive the first moving seat to move back to the second moving seat to apply tension to the lead of the electronic component to be tested to carry out testing, the tension sensor uploads tested tension data to the controller for analysis and processing, the controller controls the touch display screen to display the tension data for a tester to check, and when the tension data detected by the tension sensor reaches a set testing value, the controller controls the second compressing electric push rod to drive the second pressing electric push rod to compress the electronic component to be tested, The second driving electric push rod, the first driving electric push rod and the first pressing electric push rod are reset in sequence, and then the tested electronic component can be taken out of the fixed groove;
step S4: the electronic component pin lead tension testing device is cleaned, the fan is controlled to be started through the touch display screen, then the hollow handle is held by hand, impurities on the tension testing mechanism and on the upper portion of the supporting plate and the residual pin leads of the electronic components are blown into the collecting port through the blowing head, and the pins fall into the collecting box through the collecting hopper.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the tensile testing device for the pin lead of the electronic component, the tensile testing mechanism is used for testing the tensile property of the pin lead of the electronic component, and the tensile testing mechanism is matched with the control mechanism to realize the purpose of testing the tensile property of the pin lead of the electronic component by one key, so that the testing difficulty can be effectively reduced, the working efficiency can be effectively improved, and more importantly, the number of waste products generated by testing can be greatly reduced, so that the testing cost is reduced;
2. according to the pin lead tension testing device for the electronic component, the collection mechanism is arranged and used for collecting the broken pin leads of the electronic component and sundries on the supporting platform, so that the situation that the test work is influenced because the broken pin leads of the electronic component are scattered everywhere can be effectively avoided;
3. according to the tensile testing device for the pin lead of the electronic component, provided by the invention, the cleaning mechanism is used for blowing the residual broken pin lead of the electronic component on the rack and the tensile testing mechanism into the collecting mechanism, so that the tensile testing device for the pin lead of the electronic component is relatively convenient to clean.
Drawings
FIG. 1 is a schematic structural diagram of a pin lead tension testing device for electronic components according to the present invention;
FIG. 2 is a schematic structural diagram of another view angle of the pin lead tension testing device for electronic components according to the present invention;
FIG. 3 is a schematic view of a portion of the structure of FIG. 2;
FIG. 4 is an enlarged schematic view of a portion A of FIG. 3;
FIG. 5 is a schematic view of a partial structure of the pin lead tension testing device for electronic components according to the present invention;
FIG. 6 is a schematic structural diagram of a control mechanism of the pin lead tension testing device for electronic components according to the present invention;
FIG. 7 is a schematic view of an assembly structure of a tension testing mechanism and a supporting plate of the tension testing device for pin leads of electronic components according to the present invention;
FIG. 8 is a schematic view of an assembly structure of the tensile testing mechanism and the supporting plate of the device for testing the pin lead tensile of the electronic component according to another view angle;
FIG. 9 is a schematic structural diagram of a first movable base of a tension testing mechanism of the tension testing device for pin leads of electronic components according to the present invention;
fig. 10 is a schematic structural diagram of a second movable base of the tensile testing mechanism of the device for testing the pin lead tension of the electronic component according to the present invention.
In the figure:
1. a frame; 101. a support plate; 102. a support leg; 103. a base plate;
2. a tension testing mechanism; 201. a first fitting seat; 202. a second fitting seat; 203. a slide bar; 204. a first movable base; 205. a second movable base; 206. a tension sensor; 207. a first drive electric push rod; 208. a second drive electric push rod; 209. a fixed seat; 210. a first gantry; 211. a second gantry; 212. fixing grooves; 213. a first pressing block; 214. a first hold-down electric push rod; 215. a second pressing block; 216. a second hold-down electric push rod;
3. a control mechanism; 301. a control box; 302. a buzzer; 303. a touch display screen; 304. an operation button; 305. erecting a rod; 306. a controller; 307. a status indicator light; 308. a rear cover;
4. a collection mechanism; 401. a square coaming; 402. a collecting hopper; 403. a collection box; 404. a collection port;
5. a cleaning mechanism; 501. a fan; 502. a hose; 503. a limiting block; 504. a support bar; 505. a card holder; 506. a hollow handle; 507. and a blowing head.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-10, the present invention provides a technical solution:
an electronic component pin lead tension testing device, as shown in fig. 1, includes: the device comprises a rack 1, a tension testing mechanism 2, a control mechanism 3, a collecting mechanism 4 and a cleaning mechanism 5.
Specifically, as shown in fig. 1-2, in order to enable the frame 1 to meet the requirement of simultaneously installing the tension testing mechanism 2, the control mechanism 3, the collecting mechanism 4 and the cleaning mechanism 5, the frame 1 is composed of a support plate 101, four legs 102 and a bottom plate 103, wherein the support plate 101 is horizontally arranged, the four legs 102 are vertically and fixedly installed at the bottom of the support plate 101, and the bottom plate 103 is horizontally and fixedly installed between the four legs 102.
Specifically, as shown in fig. 1-2 and 7-10, the tensile testing mechanism 2 is used for testing the tensile property of the pin lead of the electronic component, and in order to realize the function of the tensile testing mechanism 2, the tensile testing mechanism 2 is arranged to be composed of a first assembling base 201, a second assembling base 202, two sliding rods 203, a first moving base 204, a second moving base 205, a first portal frame 210, a first pressing electric push rod 214, a first pressing block 213, a second portal frame 211, a second pressing electric push rod 216, a second pressing block 215, a first driving electric push rod 207 and a second driving electric push rod 208, wherein the first assembling base 201 and the second assembling base 202 are both fixedly installed on the upper portion of the supporting plate 101, the first assembling base 201 and the second assembling base 202 are installed in parallel to each other, the two sliding rods 203 are both horizontally and fixedly installed between the first assembling base 201 and the second assembling base 202, the two sliding rods 203 are arranged in parallel, the first moving seat 204 and the second moving seat 205 are both slidably and horizontally mounted on the two sliding rods 203, the first moving seat 204 and the second moving seat 205 are arranged adjacent to each other, a fixing groove 212 is formed in the upper portion of the first moving seat 204 aligned with the edge of one side of the first moving seat 204 close to the second moving seat 205, the first portal frame 210 is vertically and fixedly mounted on the upper portion of the first moving seat 204, the first pressing electric push rod 214 is vertically and fixedly mounted at the bottom of the inner top wall of the first portal frame 210, the first pressing block 213 is fixedly mounted at the end of the telescopic end of the first pressing electric push rod 214, the first pressing block 213 is positioned right above the fixing groove 212, the second portal frame 211 is vertically and fixedly mounted on the upper portion of the second moving seat 205, the second pressing electric push rod 216 is vertically and fixedly mounted at the bottom of the inner top wall of the second portal frame 211, the second pressing block 215 is fixedly mounted at the end of the telescopic end of the second pressing electric push rod 216, the second pressing block 215 is located above the second moving seat 205, the first driving electric push rod 207 is horizontally and fixedly installed on one side surface of the first assembling seat 201 facing the second assembling seat 202, the telescopic end of the first driving electric push rod 207 is fixedly connected with one side surface of the first moving seat 204 back to the second moving seat 205 through the tension sensor 206, the second driving electric push rod 208 is horizontally and fixedly installed on the upper portion of the supporting plate 101 through the fixing seat 209, the second driving electric push rod 208 is located between the second assembling seat 202 and the second moving seat 205, and the telescopic end of the second driving electric push rod 208 is fixedly connected with one side surface of the second moving seat 205 back to the first moving seat 204;
specifically, in order to prevent the electronic component to be tested from being damaged, a rubber layer with a thickness of 300-.
Specifically, as shown in fig. 1-2 and 5-10, the control mechanism 3 is used for controlling the tensile testing mechanism 2 and the cleaning mechanism 5 to work, in order to realize the control function of the control mechanism 3, the control mechanism 3 is composed of a control box 301, a back cover 308, a touch display screen 303, an operation button 304 and a controller 306, wherein, the control box 301 is fixedly arranged at the upper part of the supporting plate 101 through the vertical rod 305, the rear cover 308 is fixedly arranged at the rear part of the control box 301, the touch display screen 303 and the operating button 304 are both fixedly arranged at the front part of the control box 301, the controller 306 is fixedly arranged in the control box 301, the controller 306 is electrically connected to the touch display screen 303, the operation button 304, the first pressing electric push rod 214, the second pressing electric push rod 216, the first driving electric push rod 207, the tension sensor 206, and the second driving electric push rod 208.
It is noted that the controller 306 may be a PLC controller.
Specifically, as shown in fig. 1 and 6, in order to enable the control mechanism 3 to have an alarm function, the control mechanism 3 further includes a buzzer 302, wherein the buzzer 302 is fixedly mounted on an outer wall of the control box 301, and the buzzer 302 is electrically connected to the controller 306, when the pin lead tension test device for the electronic component is abnormal, or when the pin lead tension performance of the tested electronic component does not reach a set value, the controller 306 controls the buzzer 302 to send an alarm to notify a tester, so as to timely handle the above conditions.
Specifically, as shown in fig. 1 and 6, in order to facilitate understanding of the working state of the pin lead tension testing device for the electronic component, the control mechanism 3 further includes a status indicator lamp 307, the status indicator lamp 307 is fixedly mounted on the top of the control box 301, and the status indicator lamp 307 is electrically connected to the controller 306, when the status indicator lamp 307 is turned on green, it indicates that the pin lead tension testing device for the electronic component is working normally, and when the status indicator lamp 307 is turned on red, it indicates that the pin lead tension testing device for the electronic component is working abnormally, and it needs to be handled in time.
Specifically, as shown in fig. 1-2 and 8, the collecting mechanism 4 is used for collecting a pin lead of a snapped electronic component, and in order to realize the collecting function of the collecting mechanism 4, the collecting mechanism 4 is provided and composed of a square surrounding plate 401, a collecting port 404, a collecting bucket 402 and a collecting box 403, wherein the square surrounding plate 401 is fixedly installed on the upper portion of the supporting plate 101, the square surrounding plate 401 surrounds the periphery of the tension testing mechanism 2, the collecting port 404 is opened on the supporting plate 101, the collecting port 404 is located on the inner side of the square surrounding plate 401, the collecting bucket 402 is fixedly installed at the bottom of the collecting port 404, the collecting box 403 is placed on the upper portion of the bottom plate 103, and the box port of the collecting box 403 is located right below the collecting bucket 402.
Specifically, as shown in fig. 1 to 4 and 6, the cleaning mechanism 5 is used for blowing the pin leads of the broken electronic components remaining on the rack 1 and the tensile testing mechanism 2 down to the collecting mechanism 4, in order to realize the cleaning function of the cleaning mechanism 5, the cleaning mechanism 5 is composed of a fan 501, a hose 502, a hollow handle 506 and a blowing head 507, wherein, the fan 501 is fixedly arranged on the outer side wall of the square surrounding plate 401, one end of the hose 502 is communicated with the air outlet of the fan 501, the hollow handle 506 is fixedly arranged at the other end of the hose 502, the blowing head 507 is fixedly arranged at the end part of the hollow handle 506 far away from the hose 502, and the blowhead 507 is communicated with the hose 502 through the hollow handle 506, the blowhead 507 is a cylindrical structure, and the blowhead 507 is made of plastic, the blowhead 507 can be prevented from scratching the upper portions of the tensile testing mechanism 2 and the support plate 101.
Specifically, as shown in fig. 1 to 4, in order to facilitate the placement of the hollow handle 506 and the blowing head 507, the cleaning mechanism 5 further includes a support rod 504, a clamping seat 505 and a limit block 503, wherein the support rod 504 is vertically and fixedly installed on the upper portion of the support plate 101, the clamping seat 505 is fixedly installed on the upper end of the support rod 504, a bayonet for placing the hose 502 is opened on the clamping seat 505, the limit block 503 is fixedly installed on the hose 502, and the limit block 503 is disposed adjacent to the hollow handle 506, when in use, the hose 502 can be clamped on the bayonet, and the set limit block 503 and the hollow handle 506 are matched to prevent the hose 502 from falling off from the bayonet on the clamping seat 505.
To sum up:
referring to fig. 1-10, the method for testing the pin lead tension of the electronic component provided by the invention comprises the following steps:
step S1: debugging test parameters of the pin lead tension test device of the electronic component according to process requirements;
step S2: placing an electronic component to be tested into the fixing groove 212, and ensuring that leads of the electronic component extend to the outside of the fixing groove 212;
step S3: pressing the operation button 304, the controller 306 controls the first pressing electric push rod 214 to drive the first pressing block 213 to press the electronic component to be tested of the first pressing block 213, the controller 306 controls the second driving electric push rod 208 to drive the second moving seat 205 to move towards the first moving seat 204 until the second moving seat 205 contacts with the first moving seat 204, the controller 306 controls the second pressing electric push rod 216 to drive the second pressing block 215 to press the lead of the electronic component to be tested, the controller 306 controls the first driving electric push rod 207 to drive the first moving seat 204 to move away from the second moving seat 205 to apply a pulling force to the lead of the electronic component to be tested, the tension sensor 206 uploads the tested tension data to the controller 306 for analysis and processing, the controller 306 controls the touch display screen 303 to display the tension data for a tester to check, and when the tension data detected by the tension sensor 206 reaches a set test value, the controller 306 controls the second pressing electric push rod 213 to press The rod 216, the second driving electric push rod 208, the first driving electric push rod 207 and the first pressing electric push rod 214 are reset in sequence, so that the situation that the first driving electric push rod 207 continuously pulls the first moving seat 204 to break pin leads of the electronic component to generate a large amount of waste reports additionally can be avoided, and then the tested electronic component can be taken out of the fixed groove 212;
step S4: the electronic component pin lead tension testing device is cleaned, the fan 501 is controlled to be started through the touch display screen 303, then the hollow handle 506 is held by hand, impurities on the tension testing mechanism 2 and on the upper portion of the supporting plate 101 and residual electronic component pin leads are blown into the collecting port 404 through the blowing head 507 and fall into the collecting box 403 through the collecting hopper 402.
Step S5: and powering off and shutting down in time.
Therefore, the electronic component pin lead tension testing device provided by the invention has the following advantages:
the tensile testing mechanism 2 is used for testing the tensile property of the pin lead of the electronic component, and the tensile testing mechanism can be matched with the control mechanism 3 to realize the purpose of testing the tensile property of the pin lead of the electronic component by one key, so that the testing difficulty can be effectively reduced, the working efficiency can be effectively improved, and more importantly, the number of waste products generated by testing can be greatly reduced, thereby reducing the testing cost;
the collection mechanism 4 is used for collecting broken pin leads of the electronic components and sundries on the supporting table, so that the influence on the test work caused by the scattered pin leads of the electronic components which are tested and broken can be effectively avoided;
the cleaning mechanism 5 is used for blowing the pin lead of the residual stretch-broken electronic component on the rack 1 and the tension testing mechanism 2 to the collecting mechanism 4, so that the cleaning of the tension testing device for the pin lead of the electronic component is more convenient.
The parts not involved in the present invention are the same as or can be implemented by the prior art. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides an electronic components pin lead wire tensile test device which characterized in that includes:
the device comprises a rack (1), wherein a tension testing mechanism (2), a control mechanism (3), a collecting mechanism (4) and a cleaning mechanism (5) are arranged on the rack (1);
the tensile testing mechanism (2) is used for testing the tensile property of a pin lead of an electronic component;
the control mechanism (3) is used for controlling the tensile force testing mechanism (2) and the cleaning mechanism (5) to work;
the collecting mechanism (4) is used for collecting pin leads of the broken electronic components;
the cleaning mechanism (5) is used for blowing pin leads of the broken electronic components left on the rack (1) and the tensile testing mechanism (2) into the collecting mechanism (4).
2. The pin lead tension test device for electronic components according to claim 1, wherein: the rack (1) comprises a supporting plate (101), four supporting legs (102) and a bottom plate (103), wherein the supporting plate (101) is horizontally arranged, the four supporting legs (102) are vertically and fixedly arranged at the bottom of the supporting plate (101), and the bottom plate (103) is horizontally and fixedly arranged between the four supporting legs (102).
3. The pin lead tension test device for electronic components according to claim 2, wherein: the tension testing mechanism (2) comprises a first assembling seat (201), a second assembling seat (202), two sliding rods (203), a first moving seat (204), a second moving seat (205), a first portal frame (210), a first pressing electric push rod (214), a first pressing block (213), a second portal frame (211), a second pressing electric push rod (216), a second pressing block (215), a first driving electric push rod (207) and a second driving electric push rod (208), wherein the first assembling seat (201) and the second assembling seat (202) are fixedly arranged on the upper portion of the supporting plate (101), the first assembling seat (201) and the second assembling seat (202) are arranged in parallel, the two sliding rods (203) are horizontally and fixedly arranged between the first assembling seat (201) and the second assembling seat (202), and the two sliding rods (203) are arranged in parallel, the first moving seat (204) and the second moving seat (205) are both slidably and horizontally mounted on the two sliding rods (203), the first moving seat (204) and the second moving seat (205) are arranged adjacent to each other, a fixing groove (212) is formed in the upper portion of the first moving seat (204) and aligned to one side edge of the first moving seat (205) close to the second moving seat, the first portal frame (210) is vertically and fixedly mounted on the upper portion of the first moving seat (204), the first pressing electric push rod (214) is vertically and fixedly mounted at the bottom of the inner top wall of the first portal frame (210), the first pressing block (213) is fixedly mounted at the telescopic end portion of the first pressing electric push rod (214), the first pressing block (213) is located right above the fixing groove (212), and the second portal frame (211) is vertically and fixedly mounted on the upper portion of the second moving seat (205), the second pressing electric push rod (216) is vertically and fixedly installed at the bottom of the inner top wall of the second portal frame (211), the second pressing block (215) is fixedly installed at the end part of the telescopic end of the second pressing electric push rod (216), the second pressing block (215) is located above the second moving seat (205), the first driving electric push rod (207) is horizontally and fixedly installed on one side surface, facing the second assembling seat (202), of the first assembling seat (201), the telescopic end of the first driving electric push rod (207) is fixedly connected with one side surface, facing away from the second moving seat (205), of the first moving seat (204) through a tension sensor (206), the second driving electric push rod (208) is horizontally and fixedly installed on the upper portion of the supporting plate (101) through a fixing seat (209), and the second driving electric push rod (208) is located between the second assembling seat (202) and the second moving seat (205) And the telescopic end of the second driving electric push rod (208) is fixedly connected with one side surface of the second movable seat (205) back to the first movable seat (204).
4. The pin lead tension test device for electronic components according to claim 3, wherein: the surface of the first moving seat (204), the surface of the second moving seat (205), the surface of the first pressing block (213), the surface of the second pressing block (215) and the groove wall of the fixing groove (212) are coated with a rubber layer with the thickness of 300-.
5. The pin lead tension test device for electronic components according to claim 3, wherein: the control mechanism (3) comprises a control box (301), a rear cover (308), a touch display screen (303), an operating button (304) and a controller (306), the control box (301) is fixedly arranged at the upper part of the supporting plate (101) through a vertical rod (305), the rear cover (308) is fixedly arranged at the rear part of the control box (301), the touch display screen (303) and the operation buttons (304) are fixedly arranged at the front part of the control box (301), the controller (306) is fixedly arranged inside the control box (301), and the controller (306) is electrically connected with the touch display screen (303), the operation button (304), the first pressing electric push rod (214), the second pressing electric push rod (216), the first driving electric push rod (207), the tension sensor (206) and the second driving electric push rod (208) respectively.
6. The pin lead tension test device for electronic components according to claim 5, wherein: the control mechanism (3) further comprises a buzzer (302), the buzzer (302) is fixedly mounted on the outer wall of the control box (301), and the buzzer (302) is electrically connected with the controller (306).
7. The pin lead tension test device for electronic components according to claim 5, wherein: the control mechanism (3) further comprises a status indicator lamp (307), the status indicator lamp (307) is fixedly installed at the top of the control box (301), and the status indicator lamp (307) is electrically connected with the controller (306).
8. The pin lead tension test device for electronic components according to claim 2, wherein: the collecting mechanism (4) comprises a square enclosing plate (401), a collecting port (404), a collecting hopper (402) and a collecting box (403), wherein the square enclosing plate (401) is fixedly installed on the upper portion of the supporting plate (101), the square enclosing plate (401) surrounds the periphery of the tension testing mechanism (2), the collecting port (404) is formed in the supporting plate (101), the collecting port (404) is located on the inner side of the square enclosing plate (401), the collecting hopper (402) is fixedly installed at the bottom of the collecting port (404), the collecting box (403) is placed on the upper portion of the bottom plate (103), and the box port of the collecting box (403) is located under the collecting hopper (402).
9. The pin lead tension test device for electronic components according to claim 8, wherein: clearance mechanism (5) are including fan (501), hose (502), hollow handle (506) and blowing head (507), fan (501) fixed mounting be in on the lateral wall of square bounding wall (401), the one end of hose (502) with the air outlet of fan (501) is linked together, hollow handle (506) fixed mounting be in the other end of hose (502), blowing head (507) fixed mounting be in hollow handle (506) are kept away from the one end tip of hose (502), just blowing head (507) pass through hollow handle (506) with hose (502) are linked together.
10. A method for testing the lead tension of a pin of an electronic component is characterized by comprising the following steps: the device for testing the tensile force performance of the pin lead of the electronic component, which is used for testing the tensile force performance of the pin lead of the electronic component, according to any one of claims 1 to 9, comprises the following steps:
step S1: debugging test parameters of the electronic component pin lead tension test device according to process requirements;
step S2: placing an electronic component to be tested into the fixing groove (212), and ensuring that leads of the electronic component extend to the outside of the fixing groove (212);
step S3: pressing an operation button (304), a controller (306) controls a first pressing electric push rod (214) to drive a first pressing block (213) to press an electronic component to be tested of a first pressing block (213), the controller (306) controls a second driving electric push rod (208) to drive a second moving seat (205) to move towards a first moving seat (204) until the second moving seat (205) is contacted with the first moving seat (204), the controller (306) controls a second pressing electric push rod (216) to drive a second pressing block (215) to press a lead of the electronic component to be tested, the controller (306) controls a first driving electric push rod (207) to drive the first moving seat (204) to move back to the second moving seat (205) to apply a pulling force to the lead of the electronic component to be tested for testing, a pulling force sensor (206) uploads tested pulling force data to the controller (306) for analysis processing, the controller (306) controls the touch display screen (303) to display the tension data for a tester to check, when the tension data detected by the tension sensor (206) reaches a set test value, the controller (306) controls the second pressing electric push rod (216), the second driving electric push rod (208), the first driving electric push rod (207) and the first pressing electric push rod (214) to reset in sequence, and then the tested electronic component can be taken out of the fixing groove (212);
step S4: the electronic component pin lead tension testing device is cleaned, a fan (501) is controlled to be started through a touch display screen (303), then a hollow handle (506) is held by hand, impurities on a tension testing mechanism (2) and on the upper portion of a supporting plate (101) and residual electronic component pin leads are blown into the inside of a collecting port (404) through a blowing head (507) and fall into the inside of a collecting box (403) through a collecting hopper (402).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110735831.3A CN113281157A (en) | 2021-06-30 | 2021-06-30 | Device and method for testing pin lead tension of electronic component |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110735831.3A CN113281157A (en) | 2021-06-30 | 2021-06-30 | Device and method for testing pin lead tension of electronic component |
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