CN113280937A - Flexible array type integrated sensor, temperature measurement and signal transmission system - Google Patents
Flexible array type integrated sensor, temperature measurement and signal transmission system Download PDFInfo
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- CN113280937A CN113280937A CN202110546554.1A CN202110546554A CN113280937A CN 113280937 A CN113280937 A CN 113280937A CN 202110546554 A CN202110546554 A CN 202110546554A CN 113280937 A CN113280937 A CN 113280937A
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- thermocouple
- integrated sensor
- circuit
- temperature measurement
- flexible
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 26
- 230000008054 signal transmission Effects 0.000 title claims description 13
- 229910001006 Constantan Inorganic materials 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000011888 foil Substances 0.000 claims abstract description 17
- 239000011889 copper foil Substances 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims abstract description 13
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 238000005259 measurement Methods 0.000 description 7
- 230000008901 benefit Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/023—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples provided with specially adapted connectors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a flexible array type integrated sensor which comprises a T-shaped thermocouple with flexibility and a temperature measuring principle, wherein the anode and the cathode of the thermocouple are respectively composed of copper foil and constantan foil, the anode circuit and the cathode circuit of the thermocouple are respectively prepared on two sides of a flexible substrate, a plurality of temperature measuring nodes are distributed and designed on the flexible substrate in an array manner, and the designed temperature measuring nodes are connected and conducted through a via hole-plated through hole process. The flexible array type integrated sensor has flexibility, the temperature measurement principle is not influenced by deformation, and the flexible array type integrated sensor can be directly attached to the surface of a complex structure for temperature measurement.
Description
Technical Field
The invention relates to the technical field of temperature sensing measurement, in particular to a flexible array type integrated sensor and a temperature measurement and signal transmission system.
Background
The importance of temperature measurement in engineering is self-evident. When health monitoring and evaluation are performed on precise engineering systems (such as mechanical systems, weapon systems, aircrafts, etc.), distributed measurement of temperature fields is often required on the structures, which requires that the sensors have the characteristics of high precision, high reliability, miniaturization, easy implantation, etc. The thermocouple temperature measurement technology has the advantages of high precision, simple principle, convenience in use, low price, easiness in obtaining and the like after years of development, is one of the most common and widely used temperature sensors in various fields, is not influenced by deformation in thermocouple temperature measurement, does not need to be decoupled from strain of the surface of a structure, and is particularly suitable for being pasted on the structure to measure the surface temperature. However, when the traditional thermocouple is used for measuring the multipoint temperature of a complex structure, the problems that the sensor is complicated in pasting process, numerous in signal leading-out wires, difficult to arrange in a narrow space and the like exist.
Disclosure of Invention
The invention provides a flexible array type integrated sensor, a temperature measurement and signal transmission system, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the following technical scheme:
one aspect of the invention provides a flexible array type integrated sensor, which comprises a T-shaped thermocouple, wherein the positive electrode and the negative electrode of the thermocouple are respectively composed of copper foil and constantan foil, the positive electrode circuit and the negative electrode circuit of the thermocouple are respectively prepared on two sides of a flexible substrate, a plurality of temperature measuring nodes are distributed and designed on the flexible substrate in an array manner, and the temperature measuring nodes are connected and conducted by a via hole-plated through hole process; the thickness of the copper foil and the constantan foil is 5-15 mu m; the thermocouple is integrated with a part of extension lead, and the whole sensor part has no welding spot and the thickness is less than or equal to 100 mu m.
In some embodiments, the material of the flexible substrate is polyimide.
In some embodiments, the flexible substrate is no more than 20 μm thick.
In some embodiments, the positive and negative traces of the thermocouple each form separate standard gold finger prongs.
In some embodiments, the surface of the thermocouple is protected with PI film or solder resist ink in the area of the non-standard gold finger pins.
Another aspect of the present invention is to provide a temperature measurement and signal transmission system comprising any of the above flexible array-type integrated sensors, a switching fitting, and a compensation extension cord, the flexible array-type integrated sensors and the compensation extension cord being connected through the switching fitting.
In some embodiments, the adapter fitting is a double-layer PCB adapter plate, one surface of which is printed with a copper circuit, and the other surface of which is printed with a constantan circuit, and both ends of the copper circuit and the constantan circuit are welded with standard gold finger sockets.
In some embodiments, the compensation extension line is prepared by using an FFC process, and is divided into two FFCs made of copper foil wires and constantan foil wires, and the two ends of each FFC are standard gold finger pins.
Drawings
FIG. 1 is a schematic top view of the front and back sides of a sensor portion according to an embodiment of the present invention.
Fig. 2 is a cross-sectional view of the sensor of fig. 1 taken along the direction a-a.
Fig. 3 is a schematic top view of the front and back surfaces of the adaptor fitting according to the embodiment of the present invention, wherein fig. 3a corresponds to the front surface, and fig. 3b corresponds to the back surface.
Fig. 4 is a real object photograph of the sensor, the adapter fitting and the compensation extension line in the embodiment of the present invention, in which fig. 4a corresponds to the sensor, fig. 4b corresponds to the adapter fitting, and fig. 4c corresponds to the compensation extension line.
FIG. 5 is a photograph of a measurement and signal transmission system in accordance with an embodiment of the present invention.
The labels in the figure are: 1-copper circuit printed on one side of flexible substrate; 2-constantan circuit printed on the other side of the flexible substrate; 3-the end of the sensor; 4-PI film; 5-an adhesive; 6-temperature measuring node; 7-solder resist oil film; 8-a copper circuit printed on one surface of the PCB adapter plate; 9-constantan circuit printed on the other side of the PCB adapter plate; 10-gold finger socket.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
On the contrary, this application is intended to cover any alternatives, modifications, equivalents, and alternatives that may be included within the spirit and scope of the application as defined by the appended claims. Furthermore, in the following detailed description of the present application, certain specific details are set forth in order to provide a better understanding of the present application. It will be apparent to one skilled in the art that the present application may be practiced without these specific details.
FIG. 1 is a schematic diagram of a flexible array integrated sensor according to some embodiments of the present application. The flexible array type integrated sensor according to the embodiment of the present application will be described in detail with reference to fig. 1. It should be noted that the following examples are only for explaining the present application and do not constitute a limitation to the present application.
In the embodiment of the present application, as shown in fig. 1, the flexible array integrated sensor includes a T-type thermocouple having flexibility and a temperature measuring principle, wherein a positive electrode and a negative electrode of the thermocouple are respectively composed of a copper foil and a constantan foil, and the preferred thickness of the copper foil and the constantan foil is 5-15 μm. The thermocouple is preferably prepared by adopting an FPC (flexible printed circuit) double-layer board process, the positive circuit and the negative circuit of the thermocouple are respectively prepared on two sides of the flexible substrate, a plurality of temperature measuring nodes are distributed and designed on the flexible substrate in an array manner, and the temperature measuring nodes are connected and conducted by a via hole-plated through hole process.
In some embodiments, the sensor part integrates the temperature measuring nodes and part of the extended leads, the whole sensor part is free of any welding points and has the thickness less than or equal to 100 μm, and a plurality of temperature measuring nodes can be distributed and designed on the flexible substrate in an array mode.
The preferred material of the flexible substrate is polyimide, and in order to make the sensor part light and thin and flexible, the substrate thickness is recommended to be not more than 20 μm.
The tail end of the integrated sensor part is designed into a standard golden finger pin, so that signal switching and leading-out are facilitated, and the positive circuit and the negative circuit form independent golden finger pins respectively.
The surface of the integrated sensor part is protected by PI film or solder resist ink, but the gold finger pins must be exposed.
The adapter part is a double-layer PCB (printed circuit board) adapter plate, one surface of the adapter plate is printed with a copper circuit, the other surface of the adapter plate is printed with a constantan circuit, and both ends of the copper circuit and the constantan circuit are welded with standard golden finger sockets.
The compensation extension line part is prepared by adopting an FFC process and is divided into two FFCs made of copper foil wires and constantan foil wires, and the two ends of each FFC are standard gold finger pins.
The thermoelectric property and the tolerance of the constantan foil used in the sensor, the switching fitting and the compensation extension line of the invention need to meet the regulation of a precise TX type compensation line in GB/T4989 and 2013.
In order to enable the sensor, the switching accessory and the compensation extension line to be matched for use, the golden finger pins of the sensor, the switching accessory and the compensation extension line and the golden finger sockets of the switching board need to adopt the same specification (pin number and spacing). When the sensor system is connected, the positive circuit end of the sensor and the copper foil FFC are respectively inserted into the sockets at the two ends of the copper foil circuit of the adapter plate; correspondingly, the sensor negative electrode circuit end and the constantan foil FFC are respectively plugged into the sockets at the two ends of the constantan foil circuit of the adapter plate.
The whole connecting line of the flexible array type integrated sensor system meets the regulation of a TX type compensation lead in GB/T4989-2013, and the tolerance of the sensor system meets the regulation of a T type thermocouple 1-level standard in GB 168391Y 2018.
FIG. 1 is a schematic diagram of the front and back sides of the integrated pyroelectric sensor in the embodiment, wherein a sample of the sensor is prepared by FPC process, the total length is 500mm, the width of the main body is 7mm, and the thickness is about 80 μm. The flexible substrate is made of a PI film, copper foils and constantan foils are respectively pressed on two sides of the flexible substrate, a copper circuit 1 is printed on one side of the flexible substrate, and a constantan wire 2 is printed on the other side of the flexible substrate; then, lines of the positive electrode and the negative electrode of the thermocouple are formed by wet etching. 4 temperature measuring nodes which are longitudinally distributed in an array mode are designed on the flexible substrate. The tail end 3 of the sensor is designed into a forked type, the positive electrode circuit and the negative electrode circuit of the thermocouple form independent standard golden finger pins respectively, and the specifications of the golden fingers are as follows: the number of pins is 4 pins, and the distance is 1 mm.
Fig. 2 is a cross-sectional view of the sensor of fig. 1 taken along the direction a-a. As shown in fig. 2, the positive electrode (copper foil) and the negative electrode (constantan foil) of the thermocouple are respectively positioned at two sides of the flexible substrate, the positive electrode and the negative electrode are connected and conducted by adopting a via hole/plated through hole process to form a temperature measuring node, the surface of the sensor is protected by using a solder resist film, and the sensor is fixed by an adhesive 5.
Fig. 3 is a schematic top view of the front and back surfaces of the adapter fitting in the embodiment of the present invention, wherein fig. 3a corresponds to the front surface, fig. 3b corresponds to the back surface, the adapter fitting is prepared by a PCB double-layer board process, one surface of the PCB adapter board is printed with a copper circuit 8, the other surface is printed with a constantan circuit 9, both ends of the copper circuit and the constantan circuit are welded with a standard gold finger socket 10, and the socket specification is matched with a gold finger pin of a sensor: the number of pins is 4 pins, and the distance is 1 mm.
The compensation extension line described in this embodiment is prepared by using an FFC process, and is divided into two FFC extension lines of a copper foil and a constantan foil. The standard golden finger pins are prepared at two ends of the compensation extension line, and the specifications are as follows: the number of pins is 4 pins, and the distance is 1 mm.
Fig. 4 is a photograph showing a sensor, an adapter fitting, and a compensation extension line in an embodiment of the present invention, where fig. 4a corresponds to the sensor, fig. 4b corresponds to the adapter fitting, and fig. 4c corresponds to the compensation extension line, and all of the three types of samples can be mass-produced at low cost.
FIG. 5 is a photograph of a measurement and signal transmission system in accordance with an embodiment of the present invention. The sensor system is assembled in a plug-in mode, wherein a positive pin and a copper foil FFC of the sensor are plugged into a copper wire end socket of the adapter plate, a negative pin and a constantan foil FFC of the sensor are plugged into a constantan wire end socket of the adapter plate, and the connection mode can enable the whole thermocouple temperature measurement circuit to meet the regulation of a T-shaped thermocouple compensation wire in GB/T4989 and 2013, so that the temperature measurement precision can be guaranteed. Compared with the traditional thermocouple temperature measurement mode, the temperature measurement and signal transmission system is more convenient and faster to connect and assemble, the test efficiency can be greatly improved, and the thermocouple temperature measurement device is particularly suitable for distributed measurement of a temperature field in a narrow space.
The beneficial effects that the flexible array type integrated sensor, temperature measurement and signal transmission system disclosed in the present application may bring include but are not limited to: (1) the flexible array type integrated sensor has flexibility, the temperature measurement principle is not influenced by deformation, and the flexible array type integrated sensor can be directly attached to the surface of a complex structure for temperature measurement;
(2) the temperature measurement nodes can be designed in a distributed mode, the temperature measurement nodes and the lead wires are integrated on the flexible substrate in an integrated mode, the whole test end has no welding point, and the temperature measurement device is particularly suitable for distributed monitoring of a temperature field in a narrow space;
(3) the measurement, assembly and signal transmission functions are integrated by designing and preparing the adapter fittings, so that the integration of a sensor test and signal transmission system is realized, the whole connecting circuit of the sensor system meets the regulation of GB/T4989-2013 on a TX type compensation lead, and the temperature measurement precision can reach the standard of a 1-grade T type thermocouple;
(4) compared with the traditional single thermocouple, the method has the advantages that the measurement and the insertion of the signal transmission system line and the signal extraction are very convenient and fast, and the system test efficiency can be greatly improved;
(5) the flexible array type integrated sensor, the double-layer PCB adapter plate and the FFC extension line can realize mass production with low cost, and can be expected to generate larger social value and economic benefit.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A flexible array type integrated sensor is characterized by comprising a T-shaped thermocouple which has flexibility and adopts a temperature measurement principle, wherein the anode and the cathode of the thermocouple are respectively composed of copper foil and constantan foil, the anode circuit and the cathode circuit of the thermocouple are respectively prepared on two sides of a flexible substrate, a plurality of temperature measurement nodes are distributed and designed on the flexible substrate in an array manner, and the temperature measurement nodes are connected and conducted by a via hole-plated through hole process; the thickness of the copper foil and the constantan foil is 5-15 mu m; the thermocouple is integrated with a part of extension lead, and the whole sensor part has no welding spot and the thickness is less than or equal to 100 mu m.
2. The flexible array integrated sensor of claim 1, wherein the flexible substrate is made of polyimide.
3. The flexible array integrated sensor of claim 1, wherein the flexible substrate is no more than 20 μm thick.
4. The flexible array integrated sensor according to claim 1, wherein the positive trace and the negative trace of the thermocouple are formed as separate standard gold finger pins.
5. The flexible array integrated sensor according to claim 4, wherein the surface of the thermocouple is protected by PI film or solder resist ink in the area of the non-standard gold finger pins.
6. A temperature measurement and signal transmission system, comprising a switching fitting, a compensation extension line and the flexible array integrated sensor of any one of the claims 1-5, wherein the flexible array integrated sensor and the compensation extension line are connected through the switching fitting.
7. The system of claim 6, wherein the adapter fitting is a double-layer PCB adapter plate, one surface of the double-layer PCB adapter plate is printed with a copper circuit, the other surface of the double-layer PCB adapter plate is printed with a constantan circuit, and both ends of the copper circuit and the constantan circuit are welded with standard gold finger sockets.
8. The system of claim 6, wherein the compensation extension is manufactured by FFC process, and is divided into two types of FFC made of copper foil wire and constantan foil wire, and the two ends of the FFC are standard golden finger pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110546554.1A CN113280937A (en) | 2021-05-19 | 2021-05-19 | Flexible array type integrated sensor, temperature measurement and signal transmission system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110546554.1A CN113280937A (en) | 2021-05-19 | 2021-05-19 | Flexible array type integrated sensor, temperature measurement and signal transmission system |
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| CN113280937A true CN113280937A (en) | 2021-08-20 |
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| CN202110546554.1A Pending CN113280937A (en) | 2021-05-19 | 2021-05-19 | Flexible array type integrated sensor, temperature measurement and signal transmission system |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202548165U (en) * | 2012-02-27 | 2012-11-21 | 深圳市三德冠精密电路科技有限公司 | Switching device for testing flexible circuit board circuit |
| CN108844566A (en) * | 2018-07-19 | 2018-11-20 | 深圳乐测物联网科技有限公司 | The treatment process and temperature sensor mould group of temperature sensor mould group |
| CN109798995A (en) * | 2019-01-17 | 2019-05-24 | 上海交通大学 | A kind of flexibility high sensitivity thin-film thermocouple type heat flow transducer and preparation method |
| CN109855687A (en) * | 2019-02-27 | 2019-06-07 | 中国工程物理研究院化工材料研究所 | A kind of flexibility temperature-strain integrated sensors array and preparation method |
| CN111816753A (en) * | 2019-06-18 | 2020-10-23 | 桂林电子科技大学 | Preparation method of paper substrate bismuth telluride-based nanowire flexible thermocouple type temperature sensor |
-
2021
- 2021-05-19 CN CN202110546554.1A patent/CN113280937A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202548165U (en) * | 2012-02-27 | 2012-11-21 | 深圳市三德冠精密电路科技有限公司 | Switching device for testing flexible circuit board circuit |
| CN108844566A (en) * | 2018-07-19 | 2018-11-20 | 深圳乐测物联网科技有限公司 | The treatment process and temperature sensor mould group of temperature sensor mould group |
| CN109798995A (en) * | 2019-01-17 | 2019-05-24 | 上海交通大学 | A kind of flexibility high sensitivity thin-film thermocouple type heat flow transducer and preparation method |
| CN109855687A (en) * | 2019-02-27 | 2019-06-07 | 中国工程物理研究院化工材料研究所 | A kind of flexibility temperature-strain integrated sensors array and preparation method |
| CN111816753A (en) * | 2019-06-18 | 2020-10-23 | 桂林电子科技大学 | Preparation method of paper substrate bismuth telluride-based nanowire flexible thermocouple type temperature sensor |
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