CN113276018B - Retaining ring for chemical mechanical polishing - Google Patents
Retaining ring for chemical mechanical polishing Download PDFInfo
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- CN113276018B CN113276018B CN202110663547.XA CN202110663547A CN113276018B CN 113276018 B CN113276018 B CN 113276018B CN 202110663547 A CN202110663547 A CN 202110663547A CN 113276018 B CN113276018 B CN 113276018B
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- retaining ring
- ring body
- groove
- chip
- grooves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Abstract
The invention provides a retaining ring for chemical mechanical polishing, which belongs to the technical field of chemical mechanical polishing equipment and comprises: the retaining ring comprises a retaining ring body, a fixing ring and a fixing ring, wherein the retaining ring body is annular, a plurality of groups of grooves penetrating through the outer circumference and the inner circumference of the retaining ring body are formed in the bottom surface of the retaining ring body, and the grooves are arranged at intervals; each group of grooves is provided with a liquid guide groove and a chip groove which are opposite in inclination direction, and the liquid guide groove and the chip groove are mutually independent; along the rotation direction of the retaining ring body, the outlet of the liquid guide groove inclines towards the rear of the rotation direction. According to the retaining ring for chemical mechanical polishing, the annular retaining ring body is provided with the plurality of groups of grooves, each group of grooves comprises the liquid guide groove and the chip discharge groove which are opposite in inclination direction, the liquid guide grooves and the chip discharge grooves are arranged independently, the suction of polishing liquid and the discharge of grinding chips are realized, meanwhile, the polishing liquid and the grinding chips are prevented from being mixed in the grooves, and the grinding effect of a wafer is ensured.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing equipment, in particular to a retaining ring for chemical mechanical polishing.
Background
Integrated circuit fabrication processes generally refer to the deposition of conductor, semiconductor, and insulator layers on a particular substrate (e.g., a silicon wafer) in a process sequence. In the manufacturing process, a Chemical Mechanical Planarization (CMP) apparatus is mainly used to perform global Planarization on a micro rough surface of a wafer after a film deposition process. Such planarization methods typically require mounting the wafer on a polishing head of a CMP apparatus and pressing the wafer on the side to be polished against a rotating polishing pad. The retaining ring clamps the wafer on the polishing head to prevent the wafer from being thrown out during polishing, and grooves are arranged on the surface of the retaining ring, which is in contact with the polishing pad, so that the grooves on the retaining ring, which are in contact with the polishing pad, facilitate the suction of polishing liquid and the discharge of abrasive dust.
As shown in fig. 1, intersecting grooves are formed in the retaining ring, and the inclination directions of each group of intersecting grooves are opposite, so that although the suction of the polishing liquid and the discharge of the abrasive dust can be realized, each group of grooves has an intersection point where the polishing liquid is mixed with the abrasive dust, the entering polishing liquid may be discharged at the intersection point, and the abrasive dust to be discharged is sucked into the retaining ring again at the intersection point, which affects the grinding effect of the wafer.
Disclosure of Invention
Therefore, the present invention is directed to overcome the problem of the prior art that the intersecting grooves of the retainer ring have intersecting points, which easily mix polishing slurry and polishing debris, thereby providing a retainer ring for chemical mechanical polishing.
To solve the above technical problems, the present invention provides a retainer ring for chemical mechanical polishing, having a top surface adapted to be mounted on a polishing head and a bottom surface adapted to be disposed in contact with a polishing pad, comprising:
the retaining ring comprises a retaining ring body, a plurality of groups of grooves and a plurality of clamping pieces, wherein the retaining ring body is annular, the bottom surface of the retaining ring body is provided with a plurality of groups of grooves which penetrate through the outer circumference and the inner circumference of the retaining ring body, and the grooves are arranged at intervals;
each group of grooves is provided with a liquid guide groove and a chip groove which are opposite in inclination direction, and the liquid guide groove and the chip groove are mutually and independently arranged;
along the rotation direction of the retaining ring body, the outlet of the liquid guiding groove inclines towards the rear of the rotation direction.
Optionally, the liquid guiding groove has a first suction section, an inlet of the liquid guiding groove is arranged on the first suction section, positions of the inlet of the liquid guiding groove can form a first extension line and a first tangent line respectively, and an included angle between the first extension line and the first tangent line is less than 10 degrees, wherein,
the first extension line is collinear with the first suction section and extends towards the outer side of the retaining ring body, and the first tangent line is formed at the inlet position of the liquid guide groove on the outer circumference of the retaining ring body;
the chip groove is provided with a second suction section, the inlet of the chip groove is arranged on the first suction section, the inlet of the chip groove can form a second extension line and a second tangent line respectively, the included angle between the second extension line and the second tangent line is less than 10 degrees,
the second extension line is collinear with the second suction section and extends toward the inner side of the retaining ring body, and the second tangent line is formed by the inner circumference of the retaining ring body at the inlet part of the chip groove.
Optionally, the liquid guiding groove further has a first discharging section, an inlet of the liquid guiding groove is arranged on the first discharging section, a third extension line and a third tangent line can be respectively formed at an outlet of the liquid guiding groove, an included angle between the first extension line and the third tangent line is greater than 170 degrees, wherein,
the third extension line is collinear with the first discharge section and extends towards the inner side of the retaining ring body, and the third tangent line is a tangent line formed by the inner circumference of the retaining ring body at the outlet of the liquid guide groove.
Optionally, the liquid guiding groove further includes a first middle section disposed between the first suction section and the first discharge section, and an extension line of the first middle section in a direction toward a circle center of the retaining ring body passes through the circle center of the retaining ring body.
Optionally, the chip groove further has a second discharging section, an outlet of the chip groove is arranged on the second discharging section, a fourth extension line and a fourth tangent line can be respectively formed at the outlet position of the chip groove, an included angle between the fourth extension line and the fourth tangent line is greater than 170 degrees, wherein,
the fourth extension line and the second discharge section are collinear and extend towards the outer side of the retaining ring body, and the fourth tangent line is a tangent line formed by the outer circumference of the retaining ring body at the outlet of the chip groove.
Optionally, the chip discharge groove further includes a second middle section disposed between the second suction section and the second discharge section, and an extension line of the second middle section facing the direction of the circle center of the retaining ring body passes through the circle center of the retaining ring body.
Optionally, the top surface of the retaining ring body is provided with an annular isolation groove.
Optionally, the top surface of the retaining ring body is provided with at least two groups of mounting holes, each group of mounting holes is circumferentially arranged on the retaining ring body, and the diameters of the circumferences formed by each group of mounting holes are different.
Optionally, the two sets of mounting holes are respectively arranged on the first circumference and the second circumference, and the mounting holes in the first circumference and the mounting holes in the second circumference are arranged in a staggered manner along the circumferential direction.
Optionally, the top surface of the retaining ring body is provided with an annular isolation groove, and the annular isolation groove is located between the two sets of mounting holes.
The technical scheme of the invention has the following advantages:
1. according to the retaining ring for chemical mechanical polishing, the annular retaining ring body is provided with the plurality of groups of grooves, each group of grooves comprises the liquid guide groove and the chip discharge groove which are opposite in inclination direction, the liquid guide grooves and the chip discharge grooves are arranged independently, the suction of polishing liquid and the discharge of grinding chips are realized, meanwhile, the polishing liquid and the grinding chips are prevented from being mixed in the grooves, and the grinding effect of a wafer is ensured.
2. According to the retaining ring for chemical mechanical polishing, the first extension line and the first tangent line are formed at the inlet position in the liquid guide groove, the included angle between the first extension line and the first tangent line is smaller than 10 degrees, so that the first suction section of the liquid guide groove is approximately tangent to the outer circumference of the retaining ring body, and the capability of the retaining ring body for sucking polishing liquid can be enhanced; the entrance position department of chip groove forms second extension line and second tangent line, and the contained angle between its two extension lines and the second tangent line is less than 10, makes the second suction segment of chip groove and the interior circumference of retaining ring body be approximate tangent, can make the grinding bits enter into first suction segment through the entry of chip groove more easily, reinforcing chip removal ability.
3. According to the retaining ring for chemical mechanical polishing, the first middle section is arranged in the liquid guiding groove and is arranged between the first suction section and the first discharge section, the first suction section and the first discharge section are approximately tangent to the retaining ring body, so that the inclination degree of the first suction section and the first discharge section is larger, and the first middle section is arranged in the middle of the retaining ring, so that the whole length of the liquid guiding groove can be shortened; be equipped with the second middle section in the chip groove, the second middle section sets up between second suction section and second discharge section, because second suction section and second discharge section are all approximate and are tangent with the retaining ring body for the second suction section is great with the degree of inclination of second discharge section, sets up the second middle section in the centre, can shorten the holistic length of chip groove, makes and can set up more multiunit slot on the retaining ring body.
3. According to the retaining ring for chemical mechanical polishing, the annular isolation groove is formed in the top surface of the retaining ring body, so that the contact area between the retaining ring body and the polishing head is reduced, and the installation error between the retaining ring body and the polishing head caused by plane errors can be avoided to a certain extent.
4. According to the retaining ring for chemical mechanical polishing, two groups of mounting holes are formed in a retaining ring body, and are respectively arranged on a first circumference and a second circumference; generally, the mounting holes are arranged on the same circumference, but the pressing force of the screws on the same circumference to the retaining ring body is linear, after the mounting holes are respectively arranged on the two circumferences, the pressing force of the screws on the retaining ring is changed into surface application by the screws on the two groups of mounting holes, the uniformity of the pressure distribution of the contact surface is improved, and the mounting holes in the first circumference and the mounting holes in the second circumference are arranged in a staggered mode along the circumferential direction, so that the pressing force of the screws can be further dispersed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic diagram of a cross trench on a retaining ring in the prior art;
FIG. 2 is a schematic view of a retaining ring according to the present invention;
FIG. 3 is an enlarged view taken at A in FIG. 2;
FIG. 4 is a schematic view of a tangent to the circumference of the liquid-introducing groove and the retaining ring body;
FIG. 5 is a schematic drawing of a tangent to the flute and retaining ring body circumference;
fig. 6 is a top view of a retaining ring body provided by the present invention.
Description of reference numerals:
1. a retaining ring body; 2. a liquid drainage tank; 21. a first suction stage; 22. a first middle section; 23. a first discharge section; 3. a chip groove; 31. a second suction stage; 32. a second middle section; 33. a second discharge section; 4. mounting holes; 5. an annular isolation groove; 6. a first extension line; 7. a first tangent line; 8. a third extension line; 9. a third tangent line; 10. a second extension line; 11. a second tangent line; 12. a fourth extension line; 13. the fourth tangent line.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The present embodiment provides a specific implementation manner of a retaining ring for chemical mechanical polishing, as shown in fig. 2 and 3, the top surface is suitable for being mounted on a polishing head, the bottom surface is suitable for being disposed in contact with a polishing pad, a plurality of sets of grooves are disposed on the bottom surface of an annular retaining ring body 1, each set of grooves includes a liquid guiding groove 2 and a chip discharging groove 3 with opposite inclination directions, the liquid guiding groove 2 and the chip discharging groove 3 are disposed independently, and the liquid guiding groove 2 and the chip discharging groove 3 are symmetrically disposed. The suction of the polishing solution and the discharge of the grinding chips are realized, and meanwhile, the polishing solution and the grinding chips are prevented from being mixed in the groove, and the grinding effect of the wafer is ensured.
Specifically, all be provided with the interval between every group slot, can equally spaced setting between two sets of adjacent slots, also can unequally spaced setting.
In the present embodiment, the rotational direction of the retainer ring body 1 is not limited, but in the present embodiment, the retainer ring body 1 is limited to rotate counterclockwise as shown in fig. 2, and in this case, as shown in fig. 3, the liquid guide groove 2 is inclined to the right downward, and the chip discharge groove 3 is inclined to the left downward.
In this embodiment, the shape of the liquid guiding groove itself is not limited as long as the liquid guiding operation can be performed. In one embodiment, the liquid introducing groove itself may be arranged linearly, may be arranged arcuately, or may be arranged in a broken line.
In this embodiment, as shown in fig. 4 and 5, the liquid introducing tank 2 includes a first suction section 21, a first middle section 22, and a first discharge section 23. The axis of the first suction section 21 extends towards the outer side of the retaining ring body 1 to form a first extension line 6, and a first tangent line 7 is formed at the intersection point position of the axis of the first suction section 21 and the outer circumference of the retaining ring body 1; the axis of the first discharging section 23 extends toward the inner side of the retaining ring body 1 to form a third extension line 8, and a third tangent line 9 is formed at the intersection point of the axis of the first discharging section 23 and the inner circumference of the retaining ring body 1. The axis of the first intermediate section 22 is arranged to coincide with a certain radius of the retaining ring body 1.
The included angle alpha between the first extension line 6 and the first tangent line 7 formed at the inlet position in the liquid guide groove 2 is smaller than 10 degrees, so that the first suction section 21 of the liquid guide groove 2 is approximately tangent to the outer circumference of the retaining ring body 1, and the capability of the retaining ring body 1 for sucking polishing liquid can be enhanced; the angle of an included angle beta between a third extension line 8 and a third tangent 9 formed at the outlet position in the liquid guiding groove 2 is larger than 170 degrees, so that the first discharge section 23 of the liquid guiding groove 2 is approximately tangent to the inner circumference of the retaining ring body 1, and the liquid in the liquid guiding groove 2 can flow into the retaining ring body 1 more quickly to be contacted with the wafer. The first middle section 22 is arranged between the first suction section 21 and the first discharge section 23, and the first suction section 21 and the first discharge section 23 are both approximately tangent to the retaining ring body 1, so that the inclination degree of the first suction section 21 and the first discharge section 23 is larger, and the first middle section 22 is arranged in the middle, so that the whole length of the liquid guide groove 2 can be shortened.
In this embodiment, the shape of the chip discharge groove 3 itself is not limited as long as the operation of draining the liquid can be achieved. As an alternative embodiment, the chip grooves 3 may be arranged linearly, arcuately, or in a zigzag manner.
In the present embodiment, as shown in fig. 4 and 5, the flute 3 includes a second suction section 31, a second middle section 32, and a second discharge section 33. The axis of the second suction section 31 extends towards the inner side of the retaining ring body 1 to form a second extension line 10, and a second tangent line 11 is formed at the intersection point of the axis of the second suction section 31 and the inner circumference of the retaining ring body 1; the axial direction of the second discharging section 33 extends to the outside of the retaining ring body 1 to form a fourth extension line 12, and a fourth tangent 13 is formed at the intersection point of the axis of the second discharging section 33 and the outer circumference of the retaining ring body 1. The axis of the second mid-section 32 is arranged to coincide with a certain radius of the retaining ring body 1.
The angle gamma between a second extension line 10 formed at the position of the inlet of the chip discharge groove 3 and a second tangent line 11 is smaller than 10 degrees, so that the second suction section 31 of the chip discharge groove 3 is approximately tangent to the inner circumference of the retaining ring body 1, grinding chips can enter the first suction section 21 through the inlet of the chip discharge groove 3 more easily, and the chip discharge capacity is enhanced; the angle theta of an included angle formed between a fourth extension line 12 and a fourth tangent line 13 formed at the position of the outlet of the chip groove 3 is larger than 170 degrees, so that the second discharging section 33 of the chip groove 3 is approximately tangent to the outer circumference of the retaining ring body 1, and waste chips in the chip groove 3 can be discharged more quickly. Be equipped with second middle section 32 in chip groove 3, second middle section 32 sets up between second suction section 31 and second discharge section 33, because second suction section 31 and second discharge section 33 are all approximate tangent with retaining ring body 1 for the degree of inclination of second suction section 31 and second discharge section 33 is great, sets up second middle section 32 in the centre, can shorten the holistic length of chip groove 3, makes and to set up more multiunit slots on retaining ring body 1.
In this embodiment, the top surface of the retaining ring body is provided with at least two groups of mounting holes, each group of mounting holes is circumferentially arranged on the retaining ring body, and the diameters of the circumferences formed by each group of mounting holes are different.
Specifically, the mounting holes are provided with a plurality of groups, which can be odd-numbered groups or even-numbered groups. The circle that uses the retaining ring body between the multiunit mounting hole sets up as the center, simultaneously, can the equidistant setting between the multiunit mounting hole, also can the unequal interval setting.
In this embodiment, as shown in fig. 6, two sets of mounting holes 4 are provided on the top surface of the retaining ring body 1, the two sets of mounting holes 4 are respectively provided on a first circumference and a second circumference, specifically, the first circumference is provided on the inner side of the second circumference; in general, the mounting holes 4 are all arranged on the same circumference, but the pressing force of the screws on the same circumference to the retaining ring body 1 is linear, after the mounting holes 4 are respectively arranged on two circumferences, the two sets of screws on the mounting holes 4 change the pressing force of the screws on the retaining ring into a planar application, so that the uniformity of the pressure distribution of the contact surface is improved, and the mounting holes 4 in the first circumference and the mounting holes 4 in the second circumference are arranged in a staggered manner along the circumferential direction, so that the pressing force of the screws can be further dispersed.
As shown in fig. 6, the top surface of the retaining ring body 1 is provided with an annular isolation groove 5, and the annular isolation groove 5 is arranged between the two sets of mounting holes 4, so that the contact area between the retaining ring body 1 and the polishing head can be reduced, and the mounting error between the retaining ring body 1 and the polishing head caused by the plane error can be avoided to a certain extent.
Specifically, the shape of the annular isolation groove 5 itself is not limited, and the annular isolation groove may be a complete annular circular groove, or may be a multi-segment circular groove arranged at intervals, or a groove body of other shapes, as long as the contact area between the top surface of the retaining ring body 1 and the polishing head can be reduced.
As an alternative embodiment, when the rotation direction of the retaining ring body 1 is changed, the liquid guide groove 2 and the chip discharge groove 3 can be used alternatively to realize the functions and functions of each other.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (9)
1. A retaining ring for chemical mechanical polishing having a top surface adapted to be mounted on a polishing head and a bottom surface adapted to be placed in contact with a polishing pad, comprising:
the retaining ring comprises a retaining ring body, a plurality of groups of grooves and a plurality of clamping pieces, wherein the retaining ring body is annular, the bottom surface of the retaining ring body is provided with a plurality of groups of grooves which penetrate through the outer circumference and the inner circumference of the retaining ring body, and the grooves are arranged at intervals;
each group of grooves is provided with a liquid guide groove and a chip groove which are opposite in inclination direction, and the liquid guide groove and the chip groove are mutually independent;
along the rotation direction of the retaining ring body, the outlet of the liquid guiding groove inclines towards the rear of the rotation direction;
the liquid guide groove is provided with a first suction section, an inlet of the liquid guide groove is formed in the first suction section, the liquid guide groove is further provided with a first discharge section, an outlet of the liquid guide groove is formed in the first discharge section, the liquid guide groove further comprises a first middle section arranged between the first suction section and the first discharge section, and an extension line on the first middle section, facing the direction of the circle center of the retaining ring body, passes through the circle center of the retaining ring body.
2. The retainer ring for chemical mechanical polishing according to claim 1, wherein the inlet of the liquid guide groove is positioned so as to form a first extension line and a first tangent line, respectively, and an angle between the first extension line and the first tangent line is less than 10 °, wherein,
the first extension line is collinear with the first suction section and extends towards the outer side of the retaining ring body, and the first tangent line is formed at the inlet position of the liquid guide groove on the outer circumference of the retaining ring body;
the chip groove is provided with a second suction section, the inlet of the chip groove is arranged on the first suction section, the inlet of the chip groove can form a second extension line and a second tangent line respectively, the included angle between the second extension line and the second tangent line is less than 10 degrees,
the second extension line is collinear with the second suction section and extends toward the inner side of the retaining ring body, and the second tangent line is a tangent line formed by the inner circumference of the retaining ring body at the inlet of the chip discharge groove.
3. The retainer ring for chemical mechanical polishing according to claim 2, wherein a third extension line and a third tangent line are formed at an exit position of the liquid guide groove, respectively, and an angle between the first extension line and the third tangent line is larger than 170 °, wherein,
the third extension line is collinear with the first discharge section and extends towards the inner side of the retaining ring body, and the third tangent line is a tangent line formed by the inner circumference of the retaining ring body at the outlet of the liquid guide groove.
4. The retainer ring for chemical mechanical polishing according to claim 2, wherein the chip grooves further have a second discharge section, outlets of the chip grooves are provided at the second discharge section, a fourth extension line and a fourth tangent line may be formed at positions of the outlets of the chip grooves, respectively, and an angle between the fourth extension line and the fourth tangent line is greater than 170 °, wherein,
the fourth extension line and the second discharge section are collinear and extend towards the outer side of the retaining ring body, and the fourth tangent line is a tangent line formed by the outer circumference of the retaining ring body at the outlet of the chip groove.
5. The retainer ring for chemical mechanical polishing according to claim 4, wherein the chip discharge groove further includes a second middle section disposed between the second suction section and the second discharge section, and an extension of the second middle section in a direction toward the center of the retainer ring body passes through the center of the retainer ring body.
6. The retainer ring for chemical mechanical polishing according to any one of claims 1 to 5, wherein an annular isolation groove is formed in a top surface of the retainer ring body.
7. The retainer ring for chemical mechanical polishing according to any one of claims 1 to 5, wherein the top surface of the retainer ring body is provided with at least two sets of mounting holes, each set of the mounting holes is arranged circumferentially on the retainer ring body, and the diameters of the circumferences formed by the mounting holes of each set are different.
8. The retainer ring for chemical mechanical polishing according to claim 7, wherein the mounting holes are provided in two sets, respectively, on a first circumference and a second circumference, the mounting holes in the first circumference being staggered in a circumferential direction with respect to the mounting holes in the second circumference.
9. The retainer ring for chemical mechanical polishing according to claim 8, wherein the top surface of the retainer ring body is formed with an annular isolation groove, and the annular isolation groove is located between the two sets of mounting holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110663547.XA CN113276018B (en) | 2021-06-15 | 2021-06-15 | Retaining ring for chemical mechanical polishing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110663547.XA CN113276018B (en) | 2021-06-15 | 2021-06-15 | Retaining ring for chemical mechanical polishing |
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| CN113276018A CN113276018A (en) | 2021-08-20 |
| CN113276018B true CN113276018B (en) | 2022-10-04 |
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| CN114505784A (en) * | 2022-03-11 | 2022-05-17 | 北京烁科精微电子装备有限公司 | Wafer fixing ring and CMP equipment with same |
| CN117484381B (en) * | 2023-12-29 | 2024-04-16 | 江苏中科智芯集成科技有限公司 | Wafer grinding device and grinding process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3077586B2 (en) * | 1996-04-30 | 2000-08-14 | 住友金属工業株式会社 | Polishing equipment |
| JP3006568B2 (en) * | 1997-12-04 | 2000-02-07 | 日本電気株式会社 | Wafer polishing apparatus and polishing method |
| WO2003061904A1 (en) * | 2002-01-22 | 2003-07-31 | Multi Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution |
| US20050126708A1 (en) * | 2003-12-10 | 2005-06-16 | Applied Materials, Inc. | Retaining ring with slurry transport grooves |
| US7520795B2 (en) * | 2005-08-30 | 2009-04-21 | Applied Materials, Inc. | Grooved retaining ring |
| CN111496670A (en) * | 2020-04-20 | 2020-08-07 | 宁波赢伟泰科新材料有限公司 | Grooved chemical mechanical polishing retaining ring and manufacturing method thereof |
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