CN113267838A - Integrated assembly of micro lens integrated micro light path reflector and manufacturing method thereof - Google Patents
Integrated assembly of micro lens integrated micro light path reflector and manufacturing method thereof Download PDFInfo
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- CN113267838A CN113267838A CN202110535194.5A CN202110535194A CN113267838A CN 113267838 A CN113267838 A CN 113267838A CN 202110535194 A CN202110535194 A CN 202110535194A CN 113267838 A CN113267838 A CN 113267838A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 230000003287 optical effect Effects 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000008569 process Effects 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000001312 dry etching Methods 0.000 claims description 5
- 229920002120 photoresistant polymer Polymers 0.000 claims description 5
- 239000005350 fused silica glass Substances 0.000 claims description 4
- 239000005304 optical glass Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000001039 wet etching Methods 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000010309 melting process Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 230000001154 acute effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0856—Catadioptric systems comprising a refractive element with a reflective surface, the reflection taking place inside the element, e.g. Mangin mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Lenses (AREA)
Abstract
The invention discloses an integrated component of a micro lens integrated micro light path reflector and a manufacturing method thereof. The integrated assembly includes: the optical element comprises an optical element main body, wherein the optical element main body is provided with a light incident surface, a reflecting mirror surface and a lens surface, incident light beams incident from the light incident surface can be reflected to the lens surface through the reflecting mirror surface, and the incident light beams are converged through the lens surface and then emitted. According to the integrated assembly of the micro lens integrated micro light path reflector provided by the embodiment of the invention, two discrete optical elements are integrated into a whole, so that the number of the elements is reduced, the size of the integrated assembly is smaller, the mounting and alignment are easier to realize, and meanwhile, the production material and process cost are also reduced; the manufacturing process of the integrated component of the micro lens integrated micro light path reflector provided by the embodiment of the invention is completed at a wafer level, so that the labor can be greatly reduced, the manufacturing efficiency is improved, and the yield is improved.
Description
Technical Field
The invention particularly relates to an integrated component of a micro lens integrated micro light path reflector and a manufacturing method thereof, belonging to the technical field of semiconductors.
Background
At present, a large number of discrete micro lenses and turning mirrors are used in an optical communication module, and the two are independent two elements, as shown in fig. 1a and 1b, a light beam horizontally incident from a preceding stage optical element first passes through one turning mirror to turn the light beam to the vertical direction, and then passes through one micro lens to converge the light beam to a detector below, so that the light beam is completely collected. However, at present, two independent optical elements are required for realizing the functions of folding and converging, and the two elements have strong alignment requirements, and two steps of mounting and alignment are required, so that the system is complex and the cost is high.
In addition, in the existing scheme, the light incident surface of the prism needs to be formed by grinding and polishing a single chip after cutting, and then the single chips are placed in a special jig one by one to be subjected to antireflection film evaporation. Therefore, the existing device structure makes the process for processing the single chip more complicated, and needs more labor, resulting in the problems of low manufacturing efficiency, high cost, low yield and the like.
Disclosure of Invention
The invention mainly aims to provide an integrated component of a micro lens integrated micro light path reflector and a manufacturing method thereof, so as to overcome the defects in the prior art.
In order to achieve the purpose, the technical scheme adopted by the invention comprises the following steps:
the embodiment of the invention provides an integrated component of a micro-lens integrated micro-optical path reflector, which comprises: the optical element comprises an optical element main body, wherein the optical element main body is provided with a light incident surface, a reflecting mirror surface and a lens surface, incident light beams incident from the light incident surface can be reflected to the lens surface through the reflecting mirror surface, and the incident light beams are converged through the lens surface and then emitted.
The embodiment of the invention also provides a manufacturing method of the integrated component of the micro lens integrated micro optical path reflector, which comprises the following steps:
a wafer is provided, wherein the wafer is provided,
processing a first surface of the wafer to form a lens surface;
processing a third surface of the wafer to form a light incident surface;
processing a groove in a region of the second surface of the wafer corresponding to the lens surface, and forming a reflecting mirror surface on the back of a groove surface of the groove corresponding to the light incident surface so that an incident light beam incident from the light incident surface can be reflected to the lens surface through the reflecting mirror surface;
the first surface and the second surface are oppositely arranged, and the third surface is adjacent to the first surface and the second surface.
Compared with the prior art, the invention has the advantages that:
1) according to the integrated assembly of the micro lens integrated micro light path reflector provided by the embodiment of the invention, two discrete optical elements are integrated into a whole, so that the number of the elements is reduced, the size of the integrated assembly is smaller, the mounting and alignment are easier to realize, and meanwhile, the production material and process cost are also reduced;
2) the manufacturing process of the integrated component of the micro lens integrated micro light path reflector provided by the embodiment of the invention is completed at a wafer level, so that the labor can be greatly reduced, the manufacturing efficiency is improved, and the yield is improved.
Drawings
FIGS. 1a and 1b are schematic structural diagrams of a microlens and a turning mirror which are separately arranged in the prior art;
FIG. 2 is a schematic diagram of an integrated microlens-integrated micro optical circuit mirror assembly according to an exemplary embodiment of the present invention;
FIGS. 3 a-3 f are schematic diagrams illustrating a process for fabricating an integrated microlens-integrated micro optical circuit mirror assembly according to an exemplary embodiment of the present invention;
fig. 4 is a schematic structural diagram of an integrated assembly of a microlens-integrated micro optical circuit mirror provided in an exemplary embodiment of the present invention.
Detailed Description
In view of the deficiencies in the prior art, the inventors of the present invention have made extensive studies and extensive practices to provide technical solutions of the present invention. The technical solution, its implementation and principles, etc. will be further explained as follows.
The embodiment of the invention provides an integrated component of a micro-lens integrated micro-light path reflector and a manufacturing method thereof, the component integrates a common discrete micro-lens and a turning reflector in an optical communication module, thereby reducing the number of elements, further realizing smaller volume, saving one-step mounting and aligning process, and realizing wafer-level processing of all chip processes by using dry etching and inclined coating, further greatly reducing the cost.
The embodiment of the invention provides an integrated component of a micro-lens integrated micro-optical path reflector, which comprises: the optical element comprises an optical element main body, wherein the optical element main body is provided with a light incident surface, a reflecting mirror surface and a lens surface, incident light beams incident from the light incident surface can be reflected to the lens surface through the reflecting mirror surface, and the incident light beams are converged through the lens surface and then emitted.
Furthermore, the optical element main body is provided with a first surface and a second surface which are arranged oppositely, the lens surface is formed on the first surface of the optical element main body, a groove is formed in the second surface of the optical element main body, and the reflecting mirror surface is formed on the back surface of one groove surface of the groove corresponding to the light incident surface.
Furthermore, the reflecting mirror surface is obliquely arranged, and an acute included angle formed between the reflecting mirror surface and the second surface is 20-80 degrees.
Furthermore, a high-reflection film is covered on the groove surface of the back surface of the reflector surface.
Furthermore, one side of the optical element main body is also provided with a third surface, the third surface is adjacent to the first surface or the second surface, and the light incident surface is formed on the third surface.
Further, the reflecting mirror surface is arranged corresponding to the lens surface.
Furthermore, antireflection films are covered on the lens surface and the light incident surface.
Further, the lens surface is a plane convex lens surface.
The embodiment of the invention also provides a manufacturing method of the integrated component of the micro lens integrated micro optical path reflector, which comprises the following steps:
a wafer is provided, wherein the wafer is provided,
processing a first surface of the wafer to form a lens surface;
processing a third surface of the wafer to form a light incident surface;
processing a groove in a region of the second surface of the wafer corresponding to the lens surface, and forming a reflecting mirror surface on the back of a groove surface of the groove corresponding to the light incident surface so that an incident light beam incident from the light incident surface can be reflected to the lens surface through the reflecting mirror surface;
the first surface and the second surface are oppositely arranged, and the third surface is adjacent to the first surface and the second surface.
Further, the manufacturing method specifically comprises the following steps:
processing the lens surface by adopting a photoresist hot melting process or a mode of combining a gray level exposure process and a dry etching process;
processing by adopting a dry deep etching mode to form a smooth light incident surface;
and processing by adopting a mechanical chemical polishing mode or a mode of combining back photoetching and wet etching to form a reflecting mirror surface, and enabling the reflecting mirror surface to be obliquely arranged.
Further, the included angle between the reflecting mirror surface and the second surface is 20-80 degrees.
Further, the manufacturing method further comprises the following steps: and a high-reflection film is covered on the back surface of the reflecting mirror surface.
Further, the manufacturing method further comprises the following steps: antireflection films are covered on the lens surface and the light incident surface.
Further, the manufacturing method specifically comprises the following steps:
providing a wafer;
processing and forming a lens surface array comprising a plurality of lens surfaces on a first surface of a wafer;
processing and forming a plurality of grooves in the second surface of the wafer and the corresponding areas of the plurality of lens surfaces, forming a reflecting mirror surface on the back surface of one groove surface of the groove,
cutting the wafer into a plurality of integrated components, wherein a lens surface and a reflecting mirror surface are respectively formed on the first surface and the second surface of each integrated component; and the number of the first and second groups,
processing a third surface of the integrated assembly to form a light incident surface;
preferably, the material of the wafer includes any one or a combination of two or more of silicon, fused silica, optical glass, and resin.
As will be described in further detail with reference to the accompanying drawings, unless otherwise specified, the etching process and the like used in the embodiments of the present invention are known to those skilled in the art, and the high reflection film and the antireflection film used in the embodiments of the present invention are also known to those skilled in the art.
Example 1
Referring to fig. 2, an integrated assembly of a microlens-integrated micro optical path reflector includes: the optical element body 10 includes a light incident surface 11, a mirror surface 12, and a lens surface 13, and an incident light flux incident from the light incident surface 11 can be reflected to the lens surface 13 by the mirror surface 12, and can be converged by the lens surface 13 and emitted.
Specifically, the optical element body 10 has a first surface and a second surface which are oppositely arranged, and a third surface which is adjacent to the first surface and the second surface, the first surface of the optical element body 10 is formed with the lens surface 13, the second surface of the optical element body is provided with a groove 14, the back surface of a groove surface corresponding to the light incident surface 11 of the groove forms the reflecting mirror surface 12, wherein the reflecting mirror surface 12 is obliquely arranged, the back surface of the reflecting mirror surface 12 (i.e. the surface of the groove surface corresponding to the light incident surface 11) is further covered with a high-reflection film 30, and if incident light beams can realize total reflection on the reflecting mirror surface 12, the high-reflection film 30 is not arranged; the surfaces of the lens surface 13 and the light incident surface 11 are also covered with antireflection films 20.
Specifically, the reflecting mirror surface 12 and the lens surface 13 are arranged correspondingly, the lens surface 13 may be a plane convex lens surface, and an acute included angle formed between the reflecting mirror surface 12 and the second surface is 20-80 °.
Referring to fig. 3a to 3f, a method for manufacturing an integrated assembly of a microlens-integrated micro optical path reflector includes:
1) providing a wafer, wherein the wafer can be made of various materials such as silicon, fused quartz, optical glass, resin and the like;
2) as shown in fig. 3a, a lens mask is formed on the first surface of the wafer by using photolithography and thermal melting, gray scale exposure, electron beam direct writing, nano imprinting, and other methods, and then the lens mask is transferred to the first surface of the wafer by using a dry ICP etching method, so as to form a lens surface array including a plurality of lens surfaces on the first surface of the wafer by processing, as shown in fig. 3b, wherein ICP power of the dry ICP etching is 500-;
3) as shown in fig. 3c, a mask layer is formed on the first and second surfaces of the wafer by LPCVD/PECVD/thermal oxidation, a plurality of photoresist windows are formed in the designated area of the second surface of the wafer by photolithography and overlay, the photoresist windows correspond to the lens surfaces one by one, the mask layer is removed by dry etching or wet etching, and then a reflective mirror surface is formed by wet etching in the photoresist window, the acute angle between the reflective mirror surface and the second surface of the wafer can be controlled to 20-80 °, for example, 54.74 ° or 45 ° according to the selection of the crystal orientation and the reticle angle of the wafer, wherein the epitaxial temperature of LPCVD is 700-2Cl2The gas is introduced at a flow rate of 10-50sccm, NH3The flow rate of the gas is 50-200sccm, the epitaxial temperature of PECVD is 200-350 ℃, the flow rate of the gas of SiH4 is 10-50sccm, and NH3The gas inlet flow rate is 10-100sccm, the oxidation temperature adopted by the thermal oxidation mode is 900-1200 ℃, and O2The flow rate is 100 and 500 sccm;
4) as shown in fig. 3d, a high reflection film is coated on the back of the mirror surface;
5) as shown in fig. 3e, a light incident surface is formed by processing through a photoetching and dry etching method, the wafer is cut into a plurality of integrated components, and a lens surface and a reflector surface are respectively formed on the first surface and the second surface of each integrated component;
6) as shown in fig. 3f, antireflection films are coated on the light incident surface and the lens surface of the integrated component.
Example 2
Referring to fig. 4, an integrated assembly of a microlens-integrated micro optical path reflector includes: the optical element body 10 includes a light incident surface 11, a mirror surface 12, and a lens surface 13, and an incident light flux incident from the light incident surface 11 can be reflected to the lens surface 13 by the mirror surface 12, and can be converged by the lens surface 13 and emitted.
Specifically, the optical element body 10 has a first surface and a second surface which are oppositely arranged, and a third surface which is adjacent to the first surface and the second surface, the first surface of the optical element body 10 is formed with the lens surface 13, the third surface of the optical element body 10 is formed with the light incident surface 11, the second surface of the optical element body 10 is formed with an inclined reflecting mirror surface 12, the back surface of the reflecting mirror surface 12 is further covered with the high reflection film 30, and if the incident light beam can realize total reflection on the reflecting mirror surface 12, the high reflection film 30 is not arranged; the surfaces of the lens surface 13 and the light incident surface 11 are also covered with antireflection films 20.
Specifically, the reflecting mirror surface 12 and the lens surface 13 are arranged correspondingly, the lens surface 13 may be a plane convex lens surface, and an acute included angle formed between the reflecting mirror surface 12 and the second surface is 20-80 °.
A method for manufacturing an integrated assembly of a micro lens integrated micro optical path reflector comprises the following steps:
1) providing a wafer, wherein the wafer can be made of various materials such as silicon, fused quartz, optical glass, resin and the like;
2) as shown in fig. 3a, a lens mask is formed on the first surface of the wafer by using photolithography and thermal melting, gray scale exposure, electron beam direct writing, nano imprinting, and other methods, and then the lens mask is transferred to the first surface of the wafer by using a dry ICP etching method, so as to form a lens surface array including a plurality of lens surfaces on the first surface of the wafer by processing, as shown in fig. 3b, wherein ICP power of the dry ICP etching is 500-;
3) fixing the wafer processed in the step 2) by using a clamp, and processing a second surface of the wafer by using a grinding and polishing process to form a reflecting mirror surface, wherein an acute included angle between the reflecting mirror surface and the second surface of the wafer is controlled to be 20-80 degrees, and can be common angles such as 54.74 degrees, 45 degrees and the like;
4) a high reflection film is covered on the back of the reflecting mirror surface;
5) cutting the wafer processed in the step 4) by a cutting machine to form a light incident surface, and simultaneously cutting the wafer to form a plurality of integrated assemblies, wherein each integrated assembly is provided with a lens surface, a reflector surface and a light incident surface;
6) placing the integrated assembly obtained in the step 5) in a reaction chamber, adjusting the temperature in the reaction chamber to 900-1000 ℃, and introducing O into the reaction chamber at a flow rate of 10-100sccm2、H2And N2Carrying out surface oxidation treatment on the integrated assembly, then rinsing the integrated assembly for 30min by using HF acid with the concentration of 40-42%, and removing silicon oxide on the surface of the integrated assembly, thereby optimizing the surface roughness of the integrated assembly;
7) antireflection films are coated on the light incident surface and the lens surface of the integrated component, and the finally formed device structure is shown in fig. 4.
According to the integrated assembly of the micro lens integrated micro light path reflector provided by the embodiment of the invention, two discrete optical elements are integrated into a whole, so that the number of the elements is reduced, the size of the integrated assembly is smaller, the mounting and alignment are easier to realize, and meanwhile, the production material and process cost are also reduced; the manufacturing process of the integrated component of the micro lens integrated micro light path reflector provided by the embodiment of the invention is completed at a wafer level, so that the labor can be greatly reduced, the manufacturing efficiency is improved, and the yield is improved.
It should be understood that the above-mentioned embodiments are merely illustrative of the technical concepts and features of the present invention, which are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and therefore, the protection scope of the present invention is not limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. An integrated assembly of a microlens-integrated micro optical path reflector, comprising: the optical element comprises an optical element main body, wherein the optical element main body is provided with a light incident surface, a reflecting mirror surface and a lens surface, incident light beams incident from the light incident surface can be reflected to the lens surface through the reflecting mirror surface, and the incident light beams are converged through the lens surface and then emitted.
2. An integrated assembly of a microlens-integrated micro optical circuit reflector as claimed in claim 1, wherein: the optical element main body is provided with a first surface and a second surface which are arranged oppositely, the first surface of the optical element main body is provided with the lens surface, the second surface of the optical element main body is provided with a groove, and the back surface of one groove surface of the groove corresponding to the light incident surface forms the reflecting mirror surface.
3. An integrated assembly of a microlens-integrated micro optical circuit reflector as claimed in claim 2, wherein: and the groove surface of the back surface of the reflector surface is also covered with a high-reflection film.
4. An integrated assembly of a microlens-integrated micro optical circuit reflector as claimed in claim 2, wherein: the optical element body is provided with a first surface and a second surface, wherein the first surface is adjacent to the second surface;
and/or the reflecting mirror surface is arranged corresponding to the lens surface.
5. An integrated assembly of a microlens-integrated micro optical circuit reflector as claimed in claim 2, wherein: antireflection films are covered on the lens surface and the light incident surface;
preferably, the lens surface is a plano-convex lens surface.
6. A method of fabricating an integral assembly of a microlens-integrated micro optical circuit reflector as claimed in any one of claims 1 to 5, comprising:
a wafer is provided, wherein the wafer is provided,
processing a first surface of the wafer to form a lens surface;
processing a third surface of the wafer to form a light incident surface;
processing a groove in a region of the second surface of the wafer corresponding to the lens surface, and forming a reflecting mirror surface on the back of a groove surface of the groove corresponding to the light incident surface so that an incident light beam incident from the light incident surface can be reflected to the lens surface through the reflecting mirror surface;
the first surface and the second surface are oppositely arranged, and the third surface is adjacent to the first surface and the second surface.
7. The manufacturing method according to claim 6, characterized by specifically comprising:
processing the lens surface by adopting a photoresist hot melting process or a mode of combining a gray level exposure process and a dry etching process;
processing by adopting a dry deep etching mode to form a smooth light incident surface;
and processing by adopting a mechanical chemical polishing mode or a mode of combining back photoetching and wet etching to form a reflecting mirror surface, and enabling the reflecting mirror surface to be obliquely arranged.
8. The method of manufacturing according to claim 6, further comprising: covering a high-reflection film on the back of the reflecting mirror surface;
preferably, the manufacturing method further comprises: antireflection films are covered on the lens surface and the light incident surface.
9. The manufacturing method according to claim 6, characterized by specifically comprising:
providing a wafer;
processing and forming a lens surface array comprising a plurality of lens surfaces on a first surface of a wafer;
processing and forming a plurality of grooves in the second surface of the wafer and the corresponding areas of the plurality of lens surfaces, forming a reflecting mirror surface on the back surface of one groove surface of the groove,
cutting the wafer into a plurality of integrated components, wherein a lens surface and a reflecting mirror surface are respectively formed on the first surface and the second surface of each integrated component; and the number of the first and second groups,
and processing a third surface of the integrated assembly to form a light incident surface.
10. The method according to claim 6, wherein the wafer is made of any one or a combination of two or more of silicon, fused silica, optical glass, and resin.
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| CN202110535194.5A CN113267838A (en) | 2021-05-17 | 2021-05-17 | Integrated assembly of micro lens integrated micro light path reflector and manufacturing method thereof |
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| CN202110535194.5A CN113267838A (en) | 2021-05-17 | 2021-05-17 | Integrated assembly of micro lens integrated micro light path reflector and manufacturing method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09281302A (en) * | 1996-04-17 | 1997-10-31 | Nippon Sheet Glass Co Ltd | Flat plate microlens array with reflection surface and its production |
| CN101813806A (en) * | 2010-04-16 | 2010-08-25 | 中国人民解放军国防科学技术大学 | Miniature steering and coupling element between optical interconnected chips |
| CN105204097A (en) * | 2015-09-02 | 2015-12-30 | 河南仕佳光子科技有限公司 | Silicon dioxide micro-lens and production method thereof |
-
2021
- 2021-05-17 CN CN202110535194.5A patent/CN113267838A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09281302A (en) * | 1996-04-17 | 1997-10-31 | Nippon Sheet Glass Co Ltd | Flat plate microlens array with reflection surface and its production |
| CN101813806A (en) * | 2010-04-16 | 2010-08-25 | 中国人民解放军国防科学技术大学 | Miniature steering and coupling element between optical interconnected chips |
| CN105204097A (en) * | 2015-09-02 | 2015-12-30 | 河南仕佳光子科技有限公司 | Silicon dioxide micro-lens and production method thereof |
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Application publication date: 20210817 |