CN113263417B - Diamond cutting method and diamond - Google Patents

Diamond cutting method and diamond Download PDF

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Publication number
CN113263417B
CN113263417B CN202110496928.3A CN202110496928A CN113263417B CN 113263417 B CN113263417 B CN 113263417B CN 202110496928 A CN202110496928 A CN 202110496928A CN 113263417 B CN113263417 B CN 113263417B
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diamond
waist
long side
processed
cutting
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CN202110496928.3A
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CN113263417A (en
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陈晓燕
何泽华
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Shanghai Yu Garden Jewelry Fashion Group Co ltd
Shenzhen Yichai Fangyuan Technology Co ltd
Original Assignee
Guangji Diamond Shanghai Co ltd
Shanghai Yu Garden Jewelry Fashion Group Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C17/00—Gems or the like
    • A44C17/007—Special types of gems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The invention discloses a diamond cutting method and a diamond, comprising the following steps: s1: providing a diamond to be processed, wherein the waist of the diamond to be processed is provided with four mutually connected rectangular long side surfaces, and a corner is defined between every two adjacent long side surfaces; s2: selecting a long side surface, and removing partial materials of the diamond close to the long side surface from the direction from the long side surface to the center of the diamond to be processed so as to form a rough cut waist surface near the original long side surface; s3: and finely cutting and trimming the rough cut waist surface to enable the rough cut waist surface to form a first waist surface and a second waist surface which are perpendicular to the crown surface of the diamond to be processed and are adjacent, wherein one end of the first waist surface is connected with one end of the second waist surface, the other end of the first waist surface forms a molded line of one corner, and the other end of the second waist surface forms a molded line of the other corner. The invention has the outline of the star-shaped diamond, reduces the weak side part of the princess square cut, and concentrates the refracted light to the middle part of the diamond to form the blazed star-shaped light.

Description

Diamond cutting method and diamond
Technical Field
The invention relates to the technical field of diamonds, in particular to a diamond cutting method and a diamond obtained by the diamond cutting method.
Background
With the development of the diamond processing industry, the requirements on the cutting precision of the diamond are higher and higher, and different cutting shapes and technologies of the diamond are sequentially developed. However, the modern common diamond cut types include round multi-facet cut types, princess Fang Zhuo cut types, elliptic cut types, loving cut types, lei Dien cut types and the like, and as the demand of people for the diamond is continuously increased, the diamond cannot be kept in the conventional form, so that nine-heart one-flower, ten-heart ten-arrow, plum blossom drill and other cut types are continuously generated in the last hundred years, but the cut types mainly change the cut surfaces inside the form, and do not change much with the whole body. Taking blue flame as an example, the flame has 89 cutting surfaces, 32 surfaces more than a standard round drill type flame, the bench width ratio is 50-65%, the full depth ratio is 65-72%, the crown height ratio is 12-14%, the pavilion depth ratio is 47-54%, and the waist thickness ratio is 2-6.5%. The round cut is changed into octagon by cutting, so that the light rays enter the waist edge and the refraction of the lower waist surface travel to form unique fire color integrally, but the shape of the integral diamond is still approximate to a round shape, and no great form breakthrough is made.
With the improvement of the living standard of people, diamond jewelry is increasingly widely used. The quality of diamond was evaluated mainly from four points: color (color), clarity (purity), weight (cart), cut (Cut), are not changeable because color, clarity, weight are properties of the diamond itself when formed. With the continuous development of cutting technology and the lack of satisfaction of consumers with traditional cutting of diamonds, new cutting tools can give diamonds better quality and value, and satisfy better design works.
Disclosure of Invention
Accordingly, the present invention is directed to a diamond cutting method.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a method of cutting a diamond, comprising:
s1: providing a rectangular cut diamond to be processed, wherein the waist of the diamond to be processed is provided with four mutually connected rectangular long side surfaces, and a corner is defined between every two adjacent long side surfaces;
s2: selecting one long side surface, roughly cutting the long side surface, and removing part of the material of the diamond to be processed, which is close to the long side surface, from the direction from the long side surface to the center of the diamond to be processed so as to form a roughly cut waist surface near the original position of the long side surface, wherein a first distance and a second distance are respectively arranged between two ends of the roughly cut waist surface and the angles of two ends of the one long side surface;
s3: finely cutting and trimming the rough cut waist surface to form a first waist surface and a second waist surface which are perpendicular to the crown surface of the diamond to be processed, wherein the first waist surface is adjacent to the second waist surface, one end of the first waist surface is connected with one end of the second waist surface, the other end of the first waist surface forms a molded line of one angle, and the other end of the second waist surface forms another molded line of the other angle;
s4: and repeating the steps S2 and S3 until four long side surfaces are formed, and obtaining the finished diamond.
In the diamond cutting method, in S2, the removed part of the material has an obtuse triangle structure from the crown of the diamond to be processed toward the bottom tip of the diamond to be processed, an obtuse angle part of the obtuse triangle structure faces the center of the crown of the diamond to be processed, and two acute angle parts of the obtuse triangle structure respectively form the first distance and the second distance with the angles at two ends of the long side.
In the diamond cutting method, in S3, two inclined planes adjacent to the obtuse angle portion of the obtuse triangle structure are polished, so that the first distance and/or the second distance are reduced.
In the diamond cutting method, in the step S3, two inclined planes of the obtuse triangle structure adjacent to the obtuse angle portion are polished, so that the first distance and/or the second distance are reduced to zero, and the two inclined planes form the first waist surface and the second waist surface.
In the diamond cutting method, in the step S3, two inclined planes of the obtuse triangle structure adjacent to the obtuse angle portion are polished, so that the first distance and/or the second distance is reduced to zero, and the obtuse angle portion of the obtuse triangle extends toward the center of the diamond to be cut, so that the two inclined planes form the first waist surface and the second waist surface.
The diamond cutting method further comprises the following steps between the step S3 and the step S4:
s3.1: polishing one of the first waist face and the second waist face;
s3.2: and polishing the other of the first waist face and the second waist face.
In the diamond cutting method, in S2, rough cutting is performed by laser; in S3, fine cutting and trimming are performed by the grinding disc.
According to the diamond cutting method, the diamond to be processed is princess square diamond.
In the diamond cutting method, the crown of the diamond to be processed is provided with a trapezoid surface near each long side surface, the long side of each trapezoid surface and one long side surface share a molded line, the short side of each trapezoid surface faces the center of the diamond to be processed, and the base angle of each trapezoid surface forms a part of the angle;
the molded line at the connecting position of one end of the first waist surface and one end of the second waist surface is positioned on the short side of the trapezoid surface.
A diamond obtained by the method of cutting a diamond according to any one of the above.
The invention adopts the technology, so that compared with the prior art, the invention has the positive effects that:
(1) Compared with the traditional princess square cut cutting process, the cutting process provided by the invention has the advantages that the cutting facets are more, the times of light transmitted, reflected and refracted by the diamond are increased, the brightness and fire color are improved to a certain extent, and the process value of the diamond is increased.
(2) The invention has the outline of the star-shaped diamond, reduces the weak side part of the princess square cut, and concentrates the refracted light to the middle part of the diamond to form the blazed star-shaped light.
Drawings
FIG. 1 is a schematic diagram of a diamond to be cut according to the diamond cutting method of the present invention.
FIG. 2 is a schematic diagram of S2 of the diamond cutting method of the present invention.
FIG. 3 is a schematic diagram of S3 of the diamond cutting method of the present invention.
FIG. 4 is a schematic representation of the crown of the finished diamond at S4 of the diamond cutting method of the present invention.
FIG. 5 is a schematic bottom view of a finished diamond of the diamond cutting method of the present invention.
Fig. 6 is a schematic side view of a finished diamond of the diamond cutting method of the present invention.
Fig. 7 is a schematic perspective view of a finished diamond of the diamond cutting method of the present invention.
In the accompanying drawings: 1. a long side surface; 11. rough cutting waist surface; 12. a first waist surface; 13. a second waist surface; 2. a corner; 3. an obtuse triangle structure; 31. an inclined plane; 4. a trapezoidal surface; 5. triangular surfaces; 6. triangular surfaces; a. a first distance; b. a second distance.
Detailed Description
The invention is further described below with reference to the drawings and specific examples, which are not intended to be limiting.
Fig. 1 is a schematic view of a diamond to be cut according to the cutting method of the present invention, fig. 2 is a schematic view of S2 according to the cutting method of the present invention, fig. 3 is a schematic view of S3 according to the cutting method of the present invention, fig. 4 is a schematic view of S4, the crown of a finished diamond, fig. 5 is a schematic view of the bottom of a finished diamond according to the cutting method of the present invention, fig. 6 is a schematic side view of a finished diamond according to the cutting method of the present invention, fig. 7 is a schematic perspective view of a finished diamond according to the cutting method of the present invention, please refer to fig. 1 to 7, showing a cutting method of a diamond according to a preferred embodiment, comprising:
s1: providing a rectangular cut diamond to be processed, wherein the waist of the diamond to be processed is provided with four mutually connected rectangular long side surfaces 1, and a corner 2 is defined between every two adjacent long side surfaces 1;
s2: selecting a long side surface 1, rough cutting the long side surface 1, and removing partial materials of the diamond close to the long side surface 1 from the direction from the long side surface 1 to the center of the diamond to be processed to form a rough cut waist surface 11 near the original long side surface, wherein a first distance a and a second distance b are respectively arranged between two ends of the rough cut waist surface 11 and corners 2 at two ends of the long side surface 1;
s3: finely cutting and trimming the rough cut waist surface 11 to enable the rough cut waist surface 11 to form a first waist surface 12 and a second waist surface 13 which are perpendicular to the crown surface 3 of the diamond to be processed, wherein the first waist surface 12 is adjacent to the second waist surface 13, one end of the first waist surface 12 is connected with one end of the second waist surface 13, the other end of the first waist surface 12 forms a molded line of one corner 2, and the other end of the second waist surface 13 forms a molded line of the other corner 2;
preferably, the first waist surface 12 and the second waist surface 13 are each trapezoidal, the upper bases (i.e., the shorter bases) of which form the corners 2, and the lower bases (i.e., the longer bases) of which are connected to each other.
S4: repeating the steps S2 and S3 until the four long sides 1 are formed, and obtaining the finished diamond.
Further, in a preferred embodiment, in S2, the removed part of the material forms an obtuse triangle structure 3 from the crown of the diamond to be processed toward the bottom tip of the diamond to be processed, the obtuse angle portion of the obtuse triangle structure 3 faces the center of the crown of the diamond to be processed, and the two acute angle portions of the obtuse triangle structure 3 form a first distance a and a second distance b with the corners of the two ends of the long side 1.
Preferably, the angle of the obtuse angle portion of the obtuse triangular structure 3 is preferably 150-170 °.
Further, in a preferred embodiment, in S3, two inclined surfaces 31 of the obtuse triangle structure 3 adjacent to the obtuse angle portion are ground such that the first distance a and/or the second distance b are reduced.
Specifically, the two inclined surfaces 31 are rough cut waist surfaces 11, and the first waist surface 12 and the second waist surface 13 can be obtained by further processing the two inclined surfaces 31.
Further, in a preferred embodiment, in S3, two inclined surfaces 31 of the obtuse triangle structure 3 adjacent to the obtuse angle portion are ground, so that the first distance a and/or the second distance b are reduced to zero, so that the two inclined surfaces 31 form the first waist surface 12 and the second waist surface 13.
Further, in a preferred embodiment, in S3, two inclined surfaces 31 of the obtuse triangle structure 3 adjacent to the obtuse angle portion are polished to reduce the first distance a and/or the second distance b to zero, and the obtuse angle portion of the obtuse triangle 3 extends toward the center of the diamond to be cut, so that the two inclined surfaces 31 form the first waist surface 12 and the second waist surface 13.
It should be noted that the above-mentioned obtuse triangle structure 3 is mainly used to refer to the general shape of the portion, not the exact obtuse triangle, and since diamond is usually very small in size, the inclined surface 31 of the obtuse triangle structure 3 may not necessarily be directly formed into a plane, which is often an irregular rough surface, and even microscopically may be a saw tooth surface, a curved surface, or the like, depending on the polishing accuracy.
Furthermore, in other preferred embodiments, the obtuse triangular structure 3 may be replaced by other similar shaped structures, such as trapezoids, bows, etc.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the embodiments and the protection scope of the present invention.
The present invention has the following embodiments based on the above description:
in a further embodiment of the present invention, a method of cutting a diamond comprises:
s1: providing a rectangular cut diamond to be processed, wherein the waist of the diamond to be processed is provided with four mutually connected rectangular long side surfaces 1, and a corner 2 is defined between every two adjacent long side surfaces 1;
s2: selecting a long side surface 1, rough cutting the long side surface 1, and removing partial materials of the diamond to be processed, which are close to the long side surface 1, from the direction from the long side surface 1 to the center of the diamond to be processed to form rough cut waist surfaces 11 near the original long side surface, wherein a first distance a and a second distance b are respectively arranged between two ends of the rough cut waist surfaces 11 and corners 2 at two ends of the long side surface 1;
s3: finely cutting and trimming the rough cut waist surface 11 to enable the rough cut waist surface 11 to form a first waist surface 12 and a second waist surface 13 which are perpendicular to the crown surface 3 of the diamond to be processed, wherein the first waist surface 12 is adjacent to the second waist surface 13, one end of the first waist surface 12 is connected with one end of the second waist surface 13, the other end of the first waist surface 12 forms a molded line of one corner 2, and the other end of the second waist surface 13 forms a molded line of the other corner 2;
s3.1: polishing one of the first waist face 12 and the second waist face 13;
s3.2: polishing the other of the first waist face 12 and the second waist face 13;
s4: and (3) sequentially repeating the steps S2 to S3.2 until the four long side surfaces 1 are formed, and obtaining the finished diamond.
In a further embodiment of the invention, in S2, rough cutting is performed by a laser; in S3, fine cutting and trimming are performed by the grinding disc.
In a further embodiment of the invention, the diamond to be processed is a princess square diamond.
In a further embodiment of the present invention, the crown of the diamond to be processed has a trapezoid surface 4 near each long side surface 1, the long side of each trapezoid surface 4 shares a molded line with one long side surface 1, the short side of each trapezoid surface 4 faces the center of the diamond to be processed, and the bottom corner of each trapezoid surface 4 forms a part of a corner 2; wherein the line connecting the end of the first waist surface 12 and the end of the second waist surface 13 is located on the short side of the trapezoid surface 4.
In other words, after cutting, the first waist surface 12 and the second waist surface 13 divide the entire trapezoidal surface 4 into the triangular surface 5 and the triangular surface 6, the two corners of which are in contact.
Thus, the original princess square 61-sided cut ultimately forms the 65-sided cut of the present invention, with the crown of the present invention having 25 facets and the pavilion having 40 facets.
Of course, when the molded line connecting the end of the first waist surface 12 and the end of the second waist surface 13 does not reach the state of being located on the short side of the trapezoid surface 4, the crown portion still maintains 21 cut surfaces, and the pavilion portion has 40 cut surfaces. In such an embodiment, a certain starburst effect can also be created.
In the original princess square cut, the trapezoidal surface 4 is closest to the edge, and the middle of the lower base (i.e., longer base) of the trapezoidal surface 4 is farther from the corner 2, so that the refracted light and reflected light are weaker. After the cutting, the area of the trapezoid surface 4 is firstly reduced, and the trapezoid surface 4 is divided into two triangular surfaces 5 and 6, so that the reflected light and the refracted light are enhanced and are concentrated to the center part of the diamond.
Therefore, the diamond obtained by the cutting method of the invention has the star-shaped outer contour, and also has the star-shaped reflected light and refractive light, namely, the center and four corners of the diamond have better brightness and fire color.
In a further embodiment of the present invention, there is also provided a finished diamond obtained by the diamond cutting method described above.
In a further embodiment of the invention, the four corners of the star burst of the finished diamond are angled in the range of 60-80 °. The star-shaped integral form is satisfied, and meanwhile, the structure required by embedding can be satisfied.
The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the description and illustrations of the present invention, and are intended to be included within the scope of the present invention.

Claims (9)

1. A method of cutting a diamond, comprising:
s1: providing a rectangular cut diamond to be processed, wherein the waist of the diamond to be processed is provided with four mutually connected rectangular long side surfaces, and a corner is defined between every two adjacent long side surfaces;
s2: selecting one long side surface, roughly cutting the long side surface, and removing part of the material of the diamond to be processed, which is close to the long side surface, from the direction from the long side surface to the center of the diamond to be processed so as to form a roughly cut waist surface near the original position of the long side surface, wherein a first distance and a second distance are respectively arranged between two ends of the roughly cut waist surface and the angles of two ends of the one long side surface;
s3: finely cutting and trimming the rough cut waist surface to form a first waist surface and a second waist surface which are perpendicular to the crown surface of the diamond to be processed, wherein the first waist surface is adjacent to the second waist surface, one end of the first waist surface is connected with one end of the second waist surface, the other end of the first waist surface forms a molded line of one angle, and the other end of the second waist surface forms another molded line of the other angle;
s4: repeating the steps S2 and S3 until four long side surfaces are formed, and obtaining a finished diamond;
the crown of the diamond to be processed is provided with a trapezoid surface close to each long side surface, the long side of each trapezoid surface and one long side surface share a molded line, the short side of each trapezoid surface faces to the center of the diamond to be processed, and the base angle of each trapezoid surface forms a part of the angle;
the molded line at the joint of one end of the first waist surface and one end of the second waist surface is positioned on the short side of the trapezoid surface;
the diamond had 25 cuts in the crown.
2. The method according to claim 1, wherein in S2, the removed part of the material has an obtuse triangle structure at a view angle from the crown of the diamond to be processed toward the base tip of the diamond to be processed, an obtuse angle portion of the obtuse triangle structure is toward the center of the crown of the diamond to be processed, and two acute angle portions of the obtuse triangle structure form the first distance and the second distance with the angles of both ends of the one long side surface, respectively.
3. The method of diamond cutting according to claim 2, wherein in S3, two inclined surfaces of the obtuse triangle structure adjacent to the obtuse angle portion are polished to reduce the first distance and/or the second distance.
4. The method of diamond cutting according to claim 2, wherein in S3, two inclined surfaces of the obtuse triangle structure adjacent to the obtuse angle portion are polished to reduce the first distance and/or the second distance to zero, so that the two inclined surfaces form the first waist surface and the second waist surface.
5. The diamond cutting method according to claim 2, wherein in S3, two inclined surfaces of the obtuse triangle structure adjacent to the obtuse angle portion are polished to reduce the first distance and/or the second distance to zero, and simultaneously the obtuse angle portion of the obtuse triangle extends toward the center of the diamond to be cut to form the first waist surface and the second waist surface by the two inclined surfaces.
6. The method of cutting diamond according to claim 1, further comprising, between S3 and S4:
s3.1: polishing one of the first waist face and the second waist face;
s3.2: and polishing the other of the first waist face and the second waist face.
7. The method of diamond cutting according to claim 1, wherein in S2, rough cutting is performed by laser; in S3, fine cutting and trimming are performed by the grinding disc.
8. The method of claim 1, wherein the diamond to be processed is a princess square diamond.
9. A diamond obtained by the diamond cutting method of any one of claims 1 to 8.
CN202110496928.3A 2021-05-07 2021-05-07 Diamond cutting method and diamond Active CN113263417B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH693938A5 (en) * 1999-12-23 2004-05-14 Montblanc Simplo Gmbh Gem cut, especially cut diamond.
US20030192347A1 (en) * 2002-04-15 2003-10-16 Hadar Yaskil Gemstone
WO2009094432A1 (en) * 2008-01-22 2009-07-30 Hasenfeld-Stein, Inc. Cut gemstone exhibiting excellent optical brilliance
FR3028725B1 (en) * 2014-11-24 2017-01-13 Vuitton Louis Sa SIZED GEM AND ARTICLE COMPRISING SUCH A GEM
EP3378346B1 (en) * 2017-03-21 2023-01-18 Omega SA Stone and method for manufacturing same
CN208048189U (en) * 2018-01-16 2018-11-06 王松光 A kind of fancy of heronsbill equity section cuts diamond

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Effective date of registration: 20240206

Address after: Top floor attic, 58 Ninghui Road, Huangpu District, Shanghai, 200010

Patentee after: Shanghai Yu Garden jewelry Fashion Group Co.,Ltd.

Country or region after: China

Patentee after: Shenzhen Yichai Fangyuan Technology Co.,Ltd.

Address before: 200001 attic, top floor, 58 Ninghui Road, Huangpu District, Shanghai

Patentee before: Shanghai Yu Garden jewelry Fashion Group Co.,Ltd.

Country or region before: China

Patentee before: Guangji diamond (Shanghai) Co.,Ltd.