CN113249758A - Crystallizer copper plate electroplating device and electroplating method - Google Patents
Crystallizer copper plate electroplating device and electroplating method Download PDFInfo
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- CN113249758A CN113249758A CN202110563221.XA CN202110563221A CN113249758A CN 113249758 A CN113249758 A CN 113249758A CN 202110563221 A CN202110563221 A CN 202110563221A CN 113249758 A CN113249758 A CN 113249758A
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- plating
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- electroplating
- overflow port
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
Abstract
The invention discloses a crystallizer copper plate electroplating device and an electroplating method, which comprise an electroplating bath, an overflow groove, a first overflow port, a second overflow port and a circulating part, wherein plating baths are arranged in the electroplating bath and the overflow groove, the height of the plating bath in the overflow groove is lower than that of the plating bath in the electroplating bath, and two ends of the second overflow port are respectively communicated with the electroplating bath and the overflow groove; the height of the first overflow port is greater than that of the second overflow port, and two ends of the first overflow port are respectively communicated with the electroplating bath and the overflow groove; the circulation unit transports the plating solution in the overflow tank into the plating tank; the invention can ensure that the upper opening of the crystallizer copper plate does not need a nickel alloy layer and can be partially not electroplated during the layered electroplating, thereby improving the working efficiency and reducing unnecessary waste.
Description
Technical Field
The invention relates to the technical field of electroplating processing of crystallizer copper plates, in particular to a crystallizer copper plate electroplating device and an electroplating method.
Background
In order to adapt to the working condition of high drawing speed of a slab caster, the upper opening plating layer of a crystallizer copper plate needs to reduce high-temperature hot corrosion generated at the high drawing speed, the lower opening needs to reduce abrasion at the high drawing speed, the hot corrosion is avoided by adopting a pure nickel plating layer with low hardness and stable physical properties, the abrasion loss is reduced by adopting a nickel alloy plating layer with high hardness, and in order to meet the use requirements of the upper opening and the lower opening of the crystallizer copper plate, the crystallizer copper plate is processed by adopting a layered electroplating method of firstly electroplating a pure nickel layer, then electroplating a nickel alloy layer and finally removing the nickel alloy layer at the upper opening.
Specifically, when a layered electroplating method is adopted, firstly, a layer of pure nickel is electroplated on a matrix of a crystallizer copper plate, then a pure nickel coating is processed to a required thickness according to the use requirement, then a nickel alloy layer is electroplated on the surface of the pure nickel layer, finally, the whole nickel alloy layer is processed, the nickel alloy coating at the upper opening is removed, the pure nickel layer is reserved, and the thickness of the nickel alloy coating at the lower opening is ensured according to the process requirement. Therefore, the existing electroplating processing mode not only reduces the labor efficiency, but also causes waste.
In view of the above-mentioned drawbacks, the inventors of the present invention have finally obtained the present invention through a long period of research and practice.
Disclosure of Invention
In order to solve the technical defects, the technical scheme adopted by the invention is that the crystallizer copper plate electroplating device comprises an electroplating bath, an overflow groove, a first overflow port, a second overflow port and a circulating part, wherein plating solutions are respectively arranged in the electroplating bath and the overflow groove, the height of the plating solution in the overflow groove is lower than that of the plating solution in the electroplating bath, and two ends of the second overflow port are respectively communicated with the electroplating bath and the overflow groove; the height of the first overflow port is greater than that of the second overflow port, and two ends of the first overflow port are respectively communicated with the electroplating bath and the overflow groove; the circulation unit transports the plating solution in the overflow tank into the plating tank.
Preferably, the circulating part comprises a circulating pipe and a circulating braking part, the circulating braking part is arranged on the circulating pipe, two ends of the circulating pipe are respectively communicated with the electroplating bath and the overflow groove, the height of the circulating pipe is less than that of the second overflow port,
preferably, the first overflow port is provided with a first valve for controlling the opening and closing of the first overflow port, and the second overflow port is provided with a second valve for controlling the opening and closing of the second overflow port.
Preferably, the overflow groove is further internally provided with a heating part, and the temperature of the plating solution in the overflow groove is controlled by the heating part.
Preferably, the electroplating method for the crystallizer copper plate layer-by-layer electroplating by using the crystallizer copper plate electroplating device comprises the following steps of:
s1, placing the crystallizer copper plate in the electroplating bath, opening the first overflow port, closing the second overflow port, controlling the circulating part to enable the liquid level of the electroplating solution in the electroplating bath to be higher than the upper end surface of the crystallizer copper plate, and electroplating the whole crystallizer copper plate;
and S2, opening the second overflow port, closing the first overflow port, and controlling the circulating part to enable the liquid level of the plating solution in the plating tank and the separation line to be arranged on the same plane so as to plate the lower-port plating area.
Preferably, in step S1, the first overflow port is higher than the upper end surface of the copper plate of the crystallizer, so that the copper plate of the crystallizer is immersed in the plating solution in the plating tank, the level of the plating solution in the plating tank is maintained through the first overflow port, and the circulation braking member is controlled to transport the plating solution in the overflow port to the plating tank through the circulation pipe.
In step S2, the height of the plating solution in the plating tank is the same as the height of the second overflow port, so as to ensure that the crystallizer copper plate is immersed in the plating solution in the plating tank, the level of the plating solution in the plating tank is maintained through the first overflow port, and the circulation braking member is controlled to transport the plating solution in the overflow tank to the plating tank through the circulation pipe.
Preferably, the thickness of the upper opening electroplating area is 0-350 mm.
Preferably, the upper opening plating area and the lower opening plating area are plated with a pure nickel plating layer through the step S1.
Preferably, the lower plating area is electroplated with a nickel alloy plating layer outside the pure nickel plating layer through the step S2.
Compared with the prior art, the invention has the beneficial effects that: the invention can ensure that the upper opening of the crystallizer copper plate does not need a nickel alloy layer and can be partially not electroplated during the layered electroplating, thereby improving the working efficiency and reducing unnecessary waste.
Drawings
FIG. 1 is a structural view of the crystallizer copper plate electroplating device.
The figures in the drawings represent:
1-electroplating bath; 2-an overflow trough; 3-a first overflow port; 4-a second overflow port; 5-a circulation part; 6-plating solution; 7-heating part; 8-crystallizer copper plate.
Detailed Description
The above and further features and advantages of the present invention are described in more detail below with reference to the accompanying drawings.
Example one
As shown in fig. 1, fig. 1 is a structural view of the crystallizer copper plate electroplating device. The crystallizer copper plate electroplating device comprises an electroplating bath 1, an overflow groove 2, a first overflow port 3, a second overflow port 4 and a circulating part 5, wherein plating solutions 6 are respectively arranged in the electroplating bath 1 and the overflow groove 2, the height of the plating solution 6 in the overflow groove 2 is lower than that of the plating solution 6 in the electroplating bath 1, and two ends of the second overflow port 4 are respectively communicated with the electroplating bath 1 and the overflow groove 2; the height of the first overflow port 3 is greater than that of the second overflow port 4, and two ends of the first overflow port 3 are respectively communicated with the electroplating bath 1 and the overflow tank 2; the circulating part 5 comprises a circulating pipe and a circulating braking part, the circulating braking part is arranged on the circulating pipe, two ends of the circulating pipe are respectively communicated with the electroplating bath 1 and the overflow groove 2, the height of the circulating pipe is smaller than that of the second overflow port 4, the circulating braking part provides power to enable the plating solution 6 in the overflow groove 2 to flow into the electroplating bath 1, and therefore the height of the plating solution 6 in the overflow groove 2 is lower than that of the plating solution 6 in the electroplating bath 1.
Preferably, valves are respectively arranged on the first overflow port 3 and the second overflow port 4, and the opening and closing of the first overflow port 3 and the second overflow port 4 are respectively controlled through the valves.
Preferably, the overflow vessel 2 is further provided with a heating part 7, and the heating part 7 is used for heating the plating solution 6 in the overflow vessel 2, so as to heat the plating solution 6 to a temperature required by the process, and ensure a constant temperature within a required range, so as to ensure that the temperatures in the plating bath 1 and the overflow vessel 2 are within a required plating temperature range after circulation.
Example two
The outer surface of the crystallizer copper plate 8 is divided into an upper opening electroplating area and a lower opening electroplating area through a separation line, in the embodiment, the upper opening electroplating area is only electroplated with a pure nickel coating, generally, the thickness of the upper opening electroplating area is 350mm, and the lower opening electroplating area is required to be electroplated with a nickel alloy coating outside the pure nickel coating after the pure nickel coating is electroplated.
The invention discloses an electroplating method for electroplating a crystallizer copper plate 8 in a layered manner by adopting the crystallizer copper plate electroplating device, which comprises the following steps:
s1, placing the lower electroplating area and the upper electroplating area of the crystallizer copper plate 8 in the electroplating bath 1, opening the first overflow port 3, closing the second overflow port 4, and controlling the circulating unit 5 to make the liquid level of the plating solution 6 in the electroplating bath 1 higher than the upper end surface of the crystallizer copper plate 8, so as to immerse the crystallizer copper plate 8 in the plating solution 6 in the electroplating bath 1, thereby electroplating the crystallizer copper plate 8 with an integral pure nickel plating layer;
s2, opening the second overflow port 4, closing the first overflow port 3, and controlling the circulating unit 5 to make the liquid level of the plating solution 6 in the plating tank 1 and the separation line be located on the same plane, so as to immerse the lower plating area in the plating solution 6 in the plating tank 1, thereby plating a nickel alloy plating layer on the lower plating area.
Generally, in the step S1, the height of the first overflow port 3 is higher than the height of the upper end surface of the crystallizer copper plate 8, so as to ensure the crystallizer copper plate 8 to be immersed in the plating solution 6 in the plating tank 1, the level of the plating solution 6 in the plating tank 1 is maintained through the first overflow port 3, and the circulation brake is controlled to transport the plating solution 6 in the overflow tank 2 to the plating tank 1 through the circulation pipe, so as to ensure that the plating solution 6 in the plating tank 1 is in a constant temperature working state.
In the step S2, the height of the plating solution 6 in the plating tank 1 is the same as the height of the second overflow port 4, so as to ensure that the crystallizer copper plate 8 is immersed in the plating solution 6 in the plating tank 1, the liquid level of the plating solution 6 in the plating tank 1 is maintained through the first overflow port 3, and the circulation braking member is controlled to transport the plating solution 6 in the overflow tank 2 to the plating tank 1 through the circulation pipe, so as to ensure that the plating solution 6 in the plating tank 1 is in a constant temperature working state.
Because the thickness of the electroplated layer is increased and the plating solution 6 is consumed in the electroplating process, and the liquid level height of the plating solution 6 is easy to change in the processing process, the invention can ensure that the liquid level of the plating solution 6 in the electroplating tank 1 is always kept at the same height through the arrangement of the first overflow port 3 and the second overflow port 4, thereby improving the precision requirement of the layered electroplating of the crystallizer copper plate 8 and reducing unnecessary waste while improving the working efficiency.
The foregoing is merely a preferred embodiment of the invention, which is intended to be illustrative and not limiting. It will be understood by those skilled in the art that various changes, modifications and equivalents may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (10)
1. A crystallizer copper plate electroplating device is characterized by comprising an electroplating bath, an overflow groove, a first overflow port, a second overflow port and a circulating part, wherein plating baths are arranged in the electroplating bath and the overflow groove, the height of the plating bath in the overflow groove is lower than that of the plating bath in the electroplating bath, and two ends of the second overflow port are respectively communicated with the electroplating bath and the overflow groove; the height of the first overflow port is greater than that of the second overflow port, and two ends of the first overflow port are respectively communicated with the electroplating bath and the overflow groove; the circulation unit transports the plating solution in the overflow tank into the plating tank.
2. The crystallizer copper plate electroplating apparatus according to claim 1, wherein the circulating part comprises a circulating pipe and a circulating brake, the circulating brake is disposed on the circulating pipe, and both ends of the circulating pipe are respectively communicated with the electroplating bath and the overflow tank, and the height of the circulating pipe is less than the height of the second overflow port.
3. The crystallizer copper plate electroplating device as claimed in claim 2, wherein said first overflow port is provided with a first valve for controlling the opening and closing of said first overflow port, and said second overflow port is provided with a second valve for controlling the opening and closing of said second overflow port.
4. The crystallizer copper plate electroplating apparatus according to claim 3, wherein said overflow bath is further provided with a heating portion inside thereof, and said bath inside said overflow bath is temperature-controlled by said heating portion.
5. A plating method for performing the stratified plating of a crystallizer copper plate using the plating apparatus for a crystallizer copper plate as recited in claim 3 or 4, wherein an outer surface of the crystallizer copper plate is divided into an upper port plating zone and a lower port plating zone by a dividing line, said plating method comprising the steps of:
s1, placing the crystallizer copper plate in the electroplating bath, opening the first overflow port, closing the second overflow port, controlling the circulating part to enable the liquid level of the electroplating solution in the electroplating bath to be higher than the upper end surface of the crystallizer copper plate, and electroplating the whole crystallizer copper plate;
and S2, opening the second overflow port, closing the first overflow port, and controlling the circulating part to enable the liquid level of the plating solution in the plating tank and the separation line to be arranged on the same plane so as to plate the lower-port plating area.
6. The plating method as recited in claim 5, wherein in said step S1, the height of said first overflow port is higher than the height of the upper end surface of said crystallizer copper plate, so that said crystallizer copper plate is immersed in said plating bath in said plating tank, the level of said plating bath in said plating tank is maintained through said first overflow port, and said circulation stopper is controlled so that said plating bath in said overflow tank is transported to said plating tank through said circulation pipe.
7. The plating method as recited in claim 5, wherein the height of said plating solution in said plating tank is the same as the height of said second overflow port, thereby ensuring the immersion of said crystallizer copper plate in said plating solution in said plating tank, the level of said plating solution in said plating tank is maintained through said first overflow port, and said circulation stopper is controlled to effect the transportation of said plating solution in said overflow tank to said plating tank through said circulation pipe.
8. The plating method according to claim 5, wherein the thickness of the upper opening plating section is 0 to 350 mm.
9. The plating method as recited in claim 5, wherein said upper opening plating section and said lower opening plating section are plated with a pure nickel plating layer by said step S1.
10. The plating method of claim 9, wherein said lower mouth plating section is further plated with a nickel alloy plating layer outside said pure nickel plating layer by said step S2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110563221.XA CN113249758A (en) | 2021-05-21 | 2021-05-21 | Crystallizer copper plate electroplating device and electroplating method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110563221.XA CN113249758A (en) | 2021-05-21 | 2021-05-21 | Crystallizer copper plate electroplating device and electroplating method |
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| CN113249758A true CN113249758A (en) | 2021-08-13 |
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| CN202110563221.XA Pending CN113249758A (en) | 2021-05-21 | 2021-05-21 | Crystallizer copper plate electroplating device and electroplating method |
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