CN113233411A - MEMS driving device and forming method thereof - Google Patents
MEMS driving device and forming method thereof Download PDFInfo
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- CN113233411A CN113233411A CN202110485548.XA CN202110485548A CN113233411A CN 113233411 A CN113233411 A CN 113233411A CN 202110485548 A CN202110485548 A CN 202110485548A CN 113233411 A CN113233411 A CN 113233411A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/033—Comb drives
Abstract
The invention provides an MEMS driving device and a forming method thereof. The fixing piece is arranged on the first substrate or the second substrate, so that the micro-mechanical structure is fixed and then each comb tooth in the movable comb tooth structure is limited to twist in the process of forming the movable comb tooth structure through etching, and the problem that the side wall of each comb tooth is damaged by etching is solved. And, there is a stop piece in the first substrate corresponding to the micromechanical structure, the stop piece can be used for limiting the maximum torsion angle of the micromechanical structure, in order to prevent the problem that the micromechanical structure breaks under the impact of external force.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to an MEMS micro-mirror surface driving device and a forming method thereof.
Background
MEMS devices manufactured based on MEMS (Micro-Electro-Mechanical systems) technology have many driving methods, such as an electrostatic driving method and a piezoelectric driving method. Among them, the MEMS device using the electrostatic driving method includes, for example, a MEMS device having a comb driving structure, and has attracted attention because of its advantages of simple structure, good compatibility with microelectronic fabrication processes, mass production, small volume, and the like.
In the prior art, a method for forming a MEMS driving device generally includes: firstly, forming a fixed comb tooth structure on a first substrate, and then bonding the first substrate and a second substrate with each other; and etching the second substrate to form a movable comb tooth structure, and suspending the movable comb tooth structure above the fixed comb tooth structure. However, the problem that the side walls of the comb teeth of the movable comb tooth structure are damaged often occurs in the conventional process of forming the movable comb tooth structure by etching.
Disclosure of Invention
The invention aims to provide an MEMS driving device and a forming method thereof, and aims to solve the problem that the comb tooth side wall of the existing MEMS driving device is easily damaged by etching.
In order to solve the above technical problem, the present invention provides a method for forming a MEMS driving device, including: providing a first substrate and a second substrate, wherein a fixed comb tooth structure is formed in a comb tooth area of the first substrate, a stop piece is formed in a mirror area of the first substrate, and a fixed piece is further formed in the mirror area of the first substrate or the mirror area of the second substrate; bonding the first substrate and the second substrate, and fixedly connecting the second substrate and the stopper in the mirror area by the fixing member; forming a mirror reflection layer on the mirror area of the second substrate to form a micro-mirror structure; etching the second substrate to form a movable comb tooth structure in a comb tooth area of the second substrate, wherein the movable comb tooth structure is positioned above the fixed comb tooth structure; and removing the fixing piece to release the micro mirror structure.
Optionally, the fixing member is formed in the mirror area of the second substrate, and the forming method of the fixing member includes: forming a groove in the mirror area of the second substrate; forming a thin film material layer on the second substrate, and performing a planarization process to align and fill the residual thin film material layer in the groove; and patterning the film material layer to form the fixing piece.
Optionally, the method for forming the fixed comb structure and the stopper includes: forming a first mask layer on the first conductive material layer of the first substrate, the first mask layer defining a pattern of fixed comb tooth structures in the comb tooth region and a pattern of stoppers in the mirror region; and etching the first conductive material layer by taking the first mask layer as a mask so as to form the fixed comb tooth structure in the comb tooth area, and forming the stop piece by using the remained first conductive material layer in the mirror area.
Optionally, the stopper extends from the center of the mirror area to the edge of the mirror area; alternatively, the stopper is disposed around the edge of the mirror area. Further, the fixing piece is arranged around the edge of the mirror surface area.
Optionally, after the movable comb tooth structure is formed by etching and before the fixing part is removed, removing etching residues by using a cleaning solution; and removing the fixing piece by utilizing a gas-phase hydrogen fluoride etching process after the etching residues are removed.
Optionally, the first substrate comprises a first layer of conductive material in which the fixed comb structures and the stops are formed; and the second substrate includes a second conductive material layer in which the movable comb-tooth structures are formed, and a portion of the second material layer located in the mirror area constitutes a movable portion on which the specular reflection layer is formed.
Optionally, the method further includes, when preparing the fixed comb tooth structure: lowering the first layer of conductive material on the top surface of the comb tooth region to lower the top surface of the formed fixed comb tooth structure; and the method of bonding the first substrate and the second substrate includes: directly bonding the first conductive material layer and the second conductive material layer.
Based on the above formation method, the present invention also provides a MEMS driving device, including: a first substrate having a fixed comb structure formed in a comb area thereof, and a stopper formed in a mirror area thereof; and the second substrate is bonded on the first substrate, movable comb tooth structures are formed in comb tooth areas of the second substrate and are arranged above the fixed comb tooth structures at intervals, micro mirror surface structures connected with the movable comb tooth structures are arranged in mirror surface areas of the second substrate, and the micro mirror surface structures are arranged right above the stop piece at intervals.
Optionally, the top surface of the stopper is higher than the top surface of the fixed comb structure.
Optionally, the stopper extends from the center of the mirror area to the edge of the mirror area; alternatively, the stopper is disposed around the edge of the mirror area.
In the MEMS driving device and the forming method thereof provided by the invention, the fixing piece for fixing the micro-mechanical structure is arranged on the first substrate or the second substrate, so that in the process of forming the movable comb tooth structure by etching, the micro-mechanical structure is fixed to correspondingly limit each comb tooth of the movable comb tooth structure from twisting, and further the problem that the side wall of each comb tooth is damaged by etching is solved. And a stopper is arranged on the first substrate corresponding to the micromechanical structure, and the stopper can be used for assisting the fixing member to realize the fixation of the micromechanical structure and limiting the maximum torsion angle of the micromechanical structure after releasing the micromechanical structure so as to prevent the fracture of the micromechanical structure under the impact of external force.
Drawings
Fig. 1 is a schematic flow chart of a method for forming a MEMS driving device according to an embodiment of the invention.
Fig. 2-10 are schematic structural diagrams illustrating a method for forming a MEMS driving device in a manufacturing process of the MEMS driving device according to a first embodiment of the invention.
Fig. 11 is a schematic structural diagram of a MEMS driving device in the second embodiment of the present invention during the manufacturing process thereof.
Fig. 12 is a schematic structural diagram of a MEMS driving device in a third embodiment of the present invention during a manufacturing process thereof.
Wherein the reference numbers are as follows:
100-a first substrate;
110-a first layer of conductive material;
111 a-a first fixed comb structure;
111 b-a second fixed comb structure;
112-a stop;
113-electrode tank;
120-a first insulating layer;
130-a first substrate;
140-a first mask layer;
200-a second substrate;
210-a second layer of conductive material;
211 a-a first movable comb-tooth structure;
211 b-a second movable comb-tooth structure;
210 a-a groove;
210 b-an isolation trench;
220-a second insulating layer;
230-a second substrate;
240-specular reflective layer;
300 a-a layer of thin film material;
300-a fixture;
400-a second mask layer;
510-a first electrode;
520-second electrode.
Detailed Description
As described in the background art, in the MEMS driving device formed by the conventional process, damage is easily generated on the side wall of each comb tooth of the movable comb tooth structure. In contrast, the inventors of the present invention have found, after investigation, that damage is likely to occur to the comb-tooth side walls of the movable comb-tooth structure, and that one of the important factors is: in the process of etching the second substrate to form the movable comb tooth structure, the twisting space of the movable comb tooth structure is released along with continuous etching, and based on the movable micro-mirror surface structure, the twisting amplitude of each comb tooth of the movable comb tooth structure in the etching process is large, so that the side wall of each comb tooth is easily damaged by etching.
In order to solve the technical problem, the invention provides a method for forming an MEMS driving device, which limits torsion of each comb tooth of a movable comb tooth structure through a fixed micro-mechanical structure in the process of forming the movable comb tooth structure through etching, and further solves the problem that the side wall of each comb tooth is damaged by etching. Referring specifically to fig. 1, the method for forming the MEMS driving device includes the following steps.
Step S100, providing a first substrate and a second substrate, wherein a fixed comb tooth structure is formed in a comb tooth area of the first substrate, a stop piece is formed in a mirror surface area of the first substrate, and a fixed piece is further formed in the mirror surface area of the first substrate or the mirror surface area of the second substrate.
Step S200, bonding the first substrate and the second substrate, and fixedly connecting the second substrate and the stopper in the mirror area by the fixing member.
Step S300, forming a mirror reflection layer on the mirror area of the second substrate to form a micro mirror structure.
And S400, etching the second substrate to form a movable comb tooth structure in the comb tooth area of the second substrate, wherein the movable comb tooth structure is positioned above the fixed comb tooth structure.
Step S500, removing the fixing member to release the micro mirror structure.
The MEMS micro mirror driving device and the method for forming the same according to the present invention will be described in detail with reference to the accompanying drawings and embodiments. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention. It will be understood that relative terms, such as "above," "below," "top," "bottom," "above," and "below," may be used in relation to various elements shown in the figures. These relative terms are intended to encompass different orientations of the elements in addition to the orientation depicted in the figures. For example, if the device were inverted relative to the view in the drawings, an element described as "above" another element, for example, would now be below that element.
< example one >
Fig. 2-10 are schematic structural diagrams illustrating a method for forming a MEMS driving device in a manufacturing process of the MEMS driving device according to a first embodiment of the invention.
In step S100, as shown with reference to fig. 2 and 5, a first substrate 100 and a second substrate 200 are provided. Wherein a fixed comb structure is formed in the comb area of the first substrate 100 and a stopper 112 is formed in the mirror area of the first substrate 100, the stopper 112 corresponding to the movable portion in the mirror area of the second substrate 200 for limiting the maximum torsion angle of the movable portion.
Specifically, the first substrate 100 and the second substrate 200 each have a first comb-tooth area and a second comb-tooth area corresponding to each other, and the mirror area is located between the first comb-tooth area and the second comb-tooth area. Accordingly, the fixed comb-tooth structure includes a first fixed comb-tooth structure 111a formed in the first comb-tooth area and a second fixed comb-tooth structure 111b formed in the second comb-tooth area, and the stopper 112 is disposed in the mirror area between the first fixed comb-tooth structure 111a and the second fixed comb-tooth structure 111 b.
The forming method of the fixed comb tooth structure comprises the following steps: first, a first mask layer 140 is formed on the first substrate 100, the first mask layer 140 defining a pattern of fixed comb tooth structures in the comb tooth regions; next, the substrate portion in the comb-tooth region is patterned using the first mask layer 140 as a mask to form the first and second fixed comb- tooth structures 111a and 111 b.
With continued reference to FIG. 2, the first substrate 100 includes a first layer of conductive material 110, and the fixed comb tooth structure may be formed from the first layer of conductive material 110. That is, in the fabrication process of the fixed comb-tooth structure, the first mask layer 140 is formed on the first conductive material layer 110, and a patterning process is performed on the comb-tooth region of the first conductive material layer 110 to form the first and second fixed comb- tooth structures 111a and 111b in the first conductive material layer 110.
In a further version, the first mask layer is also used to define a pattern of stops in the mirror area, so that a portion of the substrate in the mirror area is retained to form the stops 112. Note that the first mask layer located in the mirror region is removed, and thus the first mask layer in the mirror region is not shown in fig. 2. In this embodiment, the stopper 112 may also be formed by the first conductive material layer 110, and based on this, the first mask layer may cover the portion of the first conductive material layer 110 located in the mirror region, so that the portion of the first conductive material layer 110 located in the mirror region is retained to form the stopper 112.
When the first mask layer is used to define the area of the stopper 112, the first mask layer extends from the center of the mirror area to the edge of the mirror area or extends to cover the edge of the mirror area, so that the formed stopper 112 also extends from the center of the mirror area to the edge of the mirror area.
With continued reference to fig. 2, in the present embodiment, the top surface of the fixed comb-tooth structure (including the first fixed comb-tooth structure 111a and the second fixed comb-tooth structure 111b) is not higher than the top surface of the stopper 112. At this time, the method further comprises the following steps of: the top of the first conductive material layer 110 in the comb tooth region is etched to lower the top surface of the first conductive material layer 110 in the comb tooth region, so that the top surface of the formed fixed comb tooth structure can be correspondingly lowered. In this way, the first conductive material layer 110 can be directly bonded to the second substrate 200. It should be appreciated that the step of lowering the top surface of the first layer of conductive material in the comb tooth regions can be performed either before or after patterning the comb tooth regions.
Fig. 2 schematically shows that, in the preparation of the fixed comb structure, the top surface of the first conductive material layer in the comb tooth region is preferentially lowered, and then a first mask layer 140 (only a part of which is schematically shown in fig. 2) is formed, wherein the first mask layer 140 defines the pattern of the fixed comb structure in the comb tooth region and covers the mirror region, and the top surface of the first mask layer 140 in the comb tooth region is lower than that in the mirror region (in this embodiment, the top surface of the first mask layer 140 in the comb tooth region can be further lower than that of the first conductive material layer 110 in other regions); and, after the first conductive material 110 is patterned, the first mask layer on the top surface of the first conductive material layer in other regions may be removed by a planarization process. At this time, the first mask layer 140 located in the comb tooth region may still be remained to facilitate protection of the fixed comb tooth structure, and the top surface of the remained first mask layer 140 is also correspondingly lower than the top surface of the stopper 112. Furthermore, by exposing the top surface of the first conductive material layer in other areas, the performance of a subsequent bonding process is also facilitated.
In addition, an electrode groove 113 may be formed in the first conductive material layer 110, and the electrode groove 113 may be used to accommodate a first electrode electrically connected to the fixed comb tooth structure. Wherein the first electrode may be filled in the electrode groove 113 before the second substrate 200 is bonded; alternatively, the first electrode may be formed after the second substrate 200 is bonded.
Further, the first substrate 100 further includes a first insulating layer 120 and a first base 130, and the first insulating layer 120 is formed between the first conductive material layer 110 and the first base 130. The material of the first insulating layer 120 includes, for example, silicon oxide.
Referring next to fig. 5, the second substrate 200 has movable portions in the mirror areas, which are released to enable twisting after subsequent etching to form movable comb tooth structures. In the present embodiment, a fixing member 300 is formed in the mirror area of the second substrate 200, and the fixing member 300 is used for fixing the movable portion in at least a part of the process to prevent the movable portion from twisting in at least a part of the process.
Specifically, the method for forming the fixing member 300 can be combined with fig. 3-5, which specifically includes the following steps.
First, referring to fig. 3, the mirror area of the second substrate 200 is etched to form a groove 210a on the surface of the mirror area of the second substrate 200.
In a second step, with continued reference to fig. 3, a thin film material layer 300a may be formed on the second substrate 200 by a deposition process, wherein the thin film material layer 300a covers the comb-teeth area and the mirror area of the second substrate 200. Alternatively, the thickness of the thin film material layer 300a is greater than the depth of the groove 210a, so that the thin film material layer 300a completely fills the groove 210 a. That is, the top surface position of the thin-film material layer 300a is not lower than the top position of the groove, so that the top surface of the thin-film material layer 300a remaining in the groove 210a after the subsequent planarization process is used is flush with the top surface of the second substrate 200.
Third, referring to fig. 4, a planarization process is performed to remove the thin film material layer on the top surface of the second substrate, and the thin film material in the groove 210a is retained and aligned to fill in the groove 210a, where the top surface of the thin film material layer 300a retained in the groove 210a is flush with the top surface of the second substrate 200.
In a fourth step, referring to fig. 5, a patterning process is performed on the thin film material layer 300a remaining in the groove 210a to form the fixing member 300.
It is considered that, in the present embodiment, the height of the fixing member 300 is adjusted by controlling the depth of the groove 210a, and the height of the fixing member 300 is adjusted to meet the requirement of abutting against the stopper 112 in the first substrate 100 in the subsequent bonding process.
In this embodiment, the fixing member 300 is formed at the edge position of the groove 210a, so that the movable portion can be fixed at the edge position of the mirror surface area by the fixing member 300, or the movable portion can be fixed at the edge position of the movable portion by the fixing member 300. Further, by disposing the fixing member 300 at the edge of the mirror area, it is also advantageous to perform a subsequent fixing member removing process, which will be described in subsequent steps. The fixing member 300 is, for example, a ring structure surrounding the edge of the mirror area, and the ring structure may be a continuous ring structure or a discontinuous ring structure.
Further, the second substrate 200 includes a second conductive material layer 210, and the portion of the second conductive material layer 210 corresponding to the mirror region may constitute the movable portion, and the groove 210a is formed in the second conductive material layer 210.
In this embodiment, an isolation groove 210b is further formed on the surface of the second conductive material layer 210, and the isolation groove 210b corresponds to the electrode groove 113 of the first conductive material layer 110. In this way, the isolation layer 210b can be used to separate the first electrode in the electrode groove 113 from the second conductive material layer 210. Further, the opening size of the isolation groove 210b is larger than the opening size of the electrode groove 113. This part will be described in detail in the subsequent steps.
And, the second substrate 200 further includes a second insulating layer 220 and a second base 230, the second insulating layer 220 being located between the second base 230 and the second conductive material layer 210. The material of the second insulating layer 220 includes, for example, silicon oxide.
Wherein the material of the second conductive material layer 210 may be the same as the material of the first conductive material layer 110. In this embodiment, the first conductive material layer 110 and the second conductive material layer 210 are made of, for example, ion-doped silicon material, and the resistance of the ion-doped silicon material is, for example, between 0.01 Ω and 0.02 Ω. And, the first substrate 130 and the second substrate 230 have a larger resistance value than the first conductive material layer 110 and the second conductive material layer 210 with low resistance, for example, the resistance values of the first substrate 130 and the second substrate 230 are both between 8 Ω and 12 Ω.
In step S200, referring specifically to fig. 6, the first substrate 100 and the second substrate 200 are bonded, and the fixing member 300 fixedly connects the second substrate 200 and the stopper 112 in the mirror area.
In this embodiment, direct bonding is accomplished directly using the first conductive material layer 110 of the first substrate 100 and the second conductive material layer 210 in the second substrate 200 (i.e., silicon-silicon bonding). And, a top surface of the fixed comb tooth structure is not higher than a bonding face of the first conductive material layer 110 in the comb tooth region, and even a top surface of the first mask layer on the fixed comb tooth structure is not higher than the bonding face, thereby not being bonded to the second conductive material layer 210, and the stopper 112 and the fixed member 300 are bonded to each other in the mirror region. Specifically, the top surface of the stopper 112 is flush with the bonding surface of the first conductive material layer 110, and the top surface of the fixing member 300 is flush with the bonding surface of the second conductive material layer 210, so that the fixing member 300 and the stopper 112 may be bonded to each other when the first conductive material layer 110 and the second conductive material layer 210 are bonded to each other.
Further, after bonding the first substrate 100 and the second substrate 200, the method further includes: the second substrate 200 is thinned. In this embodiment, thinning the second substrate 200 includes sequentially removing the second base 230 and the second insulating layer 220.
With particular reference to fig. 6 and 7, the method for removing the second substrate 230 and the second insulating layer 220 may include: first, the second substrate 230 is ground to partially remove the second substrate 230, then the remaining second substrate 230 is etched by using an etching process, the etching is stopped on the second insulating layer 220, and then the second insulating layer 220 is removed to expose the second conductive material layer 210.
It should be noted that the fixing member 300 and the stopper 112 are sequentially disposed below the mirror area of the second substrate 200, so that the mirror area of the second substrate 200 can be supported with high strength, and therefore, the problem that the mirror area of the second substrate 200 is easily broken due to suspension can be avoided in the process of thinning the second substrate 200.
In step S300, referring specifically to fig. 8, a specular reflection layer 240 is formed on the mirror area of the second substrate 200 to form a micro mirror structure. The second conductive material layer 210 forms a movable portion in the mirror area, and the mirror reflection layer 240 is formed on the movable portion to form the micro mirror structure.
In this embodiment, the specular reflection layer 240 may be formed by a lift-off process. Specifically, the method for forming the specular reflection layer 240 includes the following steps, for example.
Step one, a photoresist layer is formed on the surface of the second substrate 200 away from the first substrate 100, and a window is formed in the photoresist layer, and the mirror surface region is exposed by the window.
And step two, forming a metal layer, wherein the metal layer is formed in the window, and the metal layer also covers the top surface of the photoresist layer. The metal layer may be formed by an electron beam evaporation process, and the material of the metal layer may include chromium platinum gold or titanium tungsten gold, for example.
And step three, stripping the photoresist layer to remove the metal layer covering the photoresist layer, and reserving the part in the window to form the mirror reflection layer 240. It should be appreciated that when a stripping solution is applied to the photoresist layer with a greater spray pressure to strip the photoresist layer, the risk of breaking the second substrate 200 (i.e., the second conductive material layer 210 in this embodiment) can be further reduced due to the effective support of the fixing member 300 and the stopper 112.
Further, before or after forming the specular reflection layer 240, the method further includes: a plurality of electrodes are formed, including a first electrode 510 and a second electrode 520, the first electrode 510 being for electrical connection with the fixed comb tooth structure, and the second electrode 520 being for electrical connection with the movable comb tooth structure. Specifically, the second electrode 520 may be directly formed on the second conductive material layer 210 to be connected to the movable comb tooth structure through the second conductive material layer 210; and, the first electrode 510 may be formed on the first conductive material layer 110 to be connected with the fixed comb tooth structure through the first conductive material layer 110.
In addition, for the first electrode 510, a specific forming method thereof includes: forming a through-hole in the second electrode material layer 210, the through-hole being above and communicating with the isolation groove; next, a first electrode 510 is formed in the electrode groove of the first conductive material layer 110, and a second electrode 520 is formed on the top surface of the second conductive material layer 520.
In step S400, referring specifically to fig. 8-9, the comb-tooth regions of the second substrate 200 are etched to form a movable comb-tooth structure, which is located above the fixed comb-tooth structure.
In the present embodiment, the movable comb-tooth structures include a first movable comb-tooth structure 211a and a second movable comb-tooth structure 211b, respectively, and the first movable comb-tooth structure 211a and the second movable comb-tooth structure 211b are respectively disposed above the first fixed comb-tooth structure 111a and the second fixed comb-tooth structure 111 b. And, the first movable comb-tooth structure 211a and the second movable comb-tooth structure 211b are respectively located at two sides of the movable part, and are used for driving the movable part to twist after the subsequent movable part is released.
Specifically, a second mask layer 400 may be used to define a pattern of the movable comb tooth structure, and the second conductive material layer 210 may be etched based on the second mask layer 400 to form the movable comb tooth structure.
First, referring to fig. 8, a second mask layer 400 is formed on the second conductive material layer 230, and the second mask layer 400 defines a pattern of movable comb tooth structures in the comb tooth regions.
In a second step, referring to fig. 9, the second conductive material layer 210 is etched using the second mask layer 400 as a mask to form a movable comb structure. Specifically, the method for etching the second conductive material layer 210 is, for example, to etch the second conductive material layer 210 by using a plasma etching process, so as to improve the etching precision.
Generally speaking, as the etching process of the second conductive material layer 210 proceeds, the twisting space of the movable comb-tooth structure is released, and at this time, if the movable portion (corresponding to the micro mirror structure) of the second conductive material layer 210 is also in a movable state, the movable comb-tooth structure is likely to generate a larger amount of twisting. However, in the present embodiment, the movable portion is fixed by the fixing member 300, so that the movable comb structure is prevented from being twisted to a large extent, and the side walls of the comb teeth are prevented from being damaged due to the twisting of the comb teeth during the etching process.
And, in the process of patterning the second conductive material layer 210, a separation opening (not shown in the figure) communicating up and down may be further formed in the second conductive material layer 210 and the first conductive material layer 110, so that the second electrode 520 is electrically connected to the movable comb tooth structure only.
Further, in an optional scheme, after the movable comb tooth structure is formed, the method further includes: the substrate is cleaned of etching residues (i.e., polysilicon etching residues in this embodiment) using a cleaning agent. In particular, the etching residues can be removed by using a cleaning solution.
It should be noted here that, since the inventors of the present invention found out after a great deal of research that the etching residue is not only difficult to be removed in the subsequent process, but also easily reacts with the gas phase etchant (e.g., VHF) used subsequently to form a polymer which is difficult to be removed, the presence of the polymer will directly affect the performance of the device (e.g., the polymer attached to the sidewall of the comb teeth is easy to generate point discharge). In the existing MEMS driving device, after the movable comb tooth structure is formed by etching, the twisting space of each comb tooth and the movable part of the movable comb tooth structure is released at the same time, and then when etching residues are removed by using a cleaning solution, the adhesion of the cleaning solution and the twisting of the adjacent comb teeth are easy to occur.
However, in this embodiment, after the movable comb tooth structure is formed by etching, the movable portion (corresponding to the micro mirror structure) can still be under the fixing member of the fixing member 300 without twisting, and at this time, when the etching residue is removed by using a cleaning solution, the problem that the adjacent comb teeth are twisted together and adhered to each other is not caused.
In step S500, referring to fig. 9 and 10 in combination, the fixing member 300 is removed to release the micro mirror structure (including the movable portion and the specular reflection layer 240).
Specifically, the fixing member 300 may be removed using a vapor phase hydrogen fluoride etching process (VHF). Compared with a wet etching process, the problem that the adjacent comb teeth are easily adhered by corrosive liquid and twisted due to torsion of the comb teeth in the wet etching process can be effectively solved by utilizing the gas phase etching process. In this embodiment, the fixing member 300 is disposed at the edge of the mirror area, so that the removing process of the fixing member 300 is more facilitated.
In this embodiment, the materials of the fixing member 300, the first mask layer 140 and the second mask layer 400 may be the same (for example, all include silicon oxide), so that the fixing member 300 may be removed while the first mask layer 140 and the second mask layer 400 may be removed simultaneously.
Wherein the micro mirror structure is released to be in a movable state, and two sides of the micro mirror structure are respectively connected with a first movable comb-tooth structure 211a and a second movable comb-tooth structure 211 b. Therefore, when the first movable comb-tooth structure 211a and the second movable comb-tooth structure 211b are driven to twist under the action of the electric field between the fixed comb-tooth structure and the movable comb-tooth structure, the micro-mirror structure can be correspondingly driven to twist.
It should be noted that, for the MEMS driving device, the torsion range of the micro mirror structure during its operation is basically determined by the movable comb structure and the fixed comb structure. That is, for the MEMS driving device, the torsion range of the micro mirror structure is within the safe range, and the torsion force generated by the movable comb structure is not enough to excessively torsion the micro mirror structure, so that the micro mirror structure is not broken beyond the bearing range. Therefore, in the existing MEMS driving device, a stopper is not generally provided for the micro mirror structure.
However, in the MEMS driving device of the present embodiment, the stopper 112 under the micro mirror structure is still retained for limiting the torsion angle of the micro mirror structure. In this way, the reliability of the MEMS driving device is improved in consideration of the problem that the MEMS driving device is easily twisted at a large angle and broken when being subjected to external force impact. The gap between the micro mirror structure and the stop 112 determines the maximum torsion angle of the micro mirror structure to some extent.
< example two >
The difference from the first embodiment is that in this embodiment, the fixing member is provided on the first substrate. Reference is now made to fig. 11, where fig. 11 is a schematic structural diagram of a MEMS driving device in a second embodiment of the present invention during a manufacturing process thereof.
Referring to fig. 11, the fixing member 300 is directly disposed on the stopper 112 at an edge position of the stopper 112. Wherein the fixing member 300 may be formed of the first mask layer 140. And, the first mask layer 140 may also be used to implement a subsequent bonding process, so the first mask layer 140 on the first conductive material layer 110 is retained. Specifically, when the first substrate 100 and the second substrate 200 are bonded, the first mask layer 140 and the second conductive material layer 210 are bonded to each other (for example, silicon-silicon oxide bonding).
Further, the first mask layer 140 on the fixed comb structure is also bonded to the second conductive material layer 210, thereby enhancing the bonding strength between the first substrate 100 and the second substrate 200. And, in the subsequent process, by removing the first mask layer 140, the gap between the movable comb tooth structure and the fixed comb tooth structure can be released.
< example three >
The difference from the second embodiment is that the stopper in this embodiment is provided only at the edge position of the mirror area. Reference is now made to fig. 12, where fig. 12 is a schematic structural diagram of a MEMS driving device in a third embodiment of the present invention during a manufacturing process of the MEMS driving device.
Referring to fig. 12, the stoppers 112 are disposed only at the edges of the mirror areas, so that the torsion angle of the micro mirror structure can be limited at the edge positions after releasing the micro mirror structure. The stopper 112 is, for example, disposed around the edge of the mirror area, and specifically, may be continuously surrounded around the edge of the mirror area, or may be discontinuously surrounded around the edge of the mirror area.
In this embodiment, the fixing member 300 may be disposed on the stopper 112, and the fixing member 300 may be formed of the first mask layer 140. And, the stopper 112 may be formed simultaneously with the fixed comb structure.
Specifically, the method of forming the stopper 112 and the fixed comb structure includes: forming a first mask layer 140 on the first conductive material layer 110, the first mask layer 140 defining a pattern of fixed comb structures in the comb-tooth region and a pattern of the stopper (also corresponding to the pattern of the fixing member) in the mirror region; thereafter, the first conductive material layer 110 is etched using the first mask layer 140 to form the fixed comb structure and the stopper 112, and at this time, a portion of the first mask layer located on the stopper 112 constitutes the fixed member 300.
Based on the formation method described above, the MEMS driving device prepared will be described below. The MEMS device comprises a first substrate 100 and a second substrate 200, respectively, bonded to each other.
Wherein a fixed comb-tooth structure (including a first fixed comb-tooth structure 111a and a second fixed comb-tooth structure 111b) is formed in the comb-tooth region of the first substrate 100. And a stopper 112 is formed in the mirror area of the first substrate 100.
And, movable comb-tooth structures (including a first movable comb-tooth structure 211a and a second movable comb-tooth structure 211b) are formed in the comb-tooth area of the second substrate 200, the movable comb-tooth structures being disposed above the fixed comb-tooth structures at intervals. The mirror surface area of the second substrate 200 has a micro-mirror structure (including a mirror reflection layer 240 and a movable portion below the mirror reflection layer) connected to the movable comb-tooth structure, and specifically, the first movable comb-tooth structure 211a and the second movable comb-tooth structure 211b are connected to two sides of the micro-mirror structure.
Further, the micro mirror structure is disposed over the stopper 112 at an interval, so that the stopper 112 is utilized to limit the maximum torsion angle of the micro mirror structure, thereby avoiding the problem of breakage when being impacted by external force. Wherein the stopper 112 may extend from the center of the mirror area to the edge of the mirror area. Alternatively, the stopper 112 may be disposed around the edge of the mirror area.
In summary, in the forming method of the MEMS driving device provided in the above embodiment, the stop member is formed in the first substrate, so that on one hand, the stop member can be used to assist the fixing member to fix the micro-mechanical structure corresponding to the movable portion in the second substrate, and prevent the micro-mechanical structure from twisting during the etching process of the movable comb structure and correspondingly driving the movable comb structure to deflect to a larger extent, thereby effectively improving the problem that the side wall of the comb is damaged by etching; on the other hand, after releasing the micromechanical structure, the stopper can still be used to limit the maximum torsion angle of the micromechanical structure, so as to prevent the fracture of the micromechanical structure under the impact of external force.
It should be noted that, in the present specification, the embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other. Also, while the present invention has been described with reference to the preferred embodiments, the embodiments are not intended to be limiting. It will be apparent to those skilled in the art from this disclosure that many changes and modifications can be made, or equivalents modified, in the embodiments of the invention without departing from the scope of the invention. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the protection scope of the technical solution of the present invention, unless the content of the technical solution of the present invention is departed from.
It should be further understood that the terms "first," "second," "third," and the like in the description are used for distinguishing between various components, elements, steps, and the like, and are not intended to imply a logical or sequential relationship between various components, elements, steps, or the like, unless otherwise indicated or indicated.
It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to limit the scope of the present invention. It must be noted that, as used herein and in the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. For example, reference to "a step" or "an apparatus" means a reference to one or more steps or apparatuses and may include sub-steps as well as sub-apparatuses. All conjunctions used should be understood in the broadest sense. And, the word "or" should be understood to have the definition of a logical "or" rather than the definition of a logical "exclusive or" unless the context clearly dictates otherwise. Further, implementation of the methods and/or apparatus of embodiments of the present invention may include performing the selected task manually, automatically, or in combination.
Claims (11)
1. A method for forming a MEMS driving device, comprising:
providing a first substrate and a second substrate, wherein a fixed comb tooth structure is formed in a comb tooth area of the first substrate, a stop piece is formed in a mirror area of the first substrate, and a fixed piece is further formed in the mirror area of the first substrate or the mirror area of the second substrate;
bonding the first substrate and the second substrate, and fixedly connecting the second substrate and the stopper in the mirror area by the fixing member;
forming a mirror reflection layer on the mirror area of the second substrate to form a micro-mirror structure;
etching the second substrate to form a movable comb tooth structure in a comb tooth area of the second substrate, wherein the movable comb tooth structure is positioned above the fixed comb tooth structure; and the number of the first and second groups,
and removing the fixing piece to release the micro mirror structure.
2. The method of forming a MEMS driving device according to claim 1, wherein the anchor is formed in a mirror region of the second substrate, the method of forming the anchor comprising:
forming a groove in the mirror area of the second substrate;
forming a thin film material layer on the second substrate, and performing a planarization process to align and fill the residual thin film material layer in the groove; and the number of the first and second groups,
and patterning the film material layer to form the fixing piece.
3. The method of forming a MEMS-driven device as defined by claim 1 wherein the anchor is circumferentially disposed around the edge of the mirror area.
4. The method of forming a MEMS actuator device as claimed in claim 1, wherein the method of forming the fixed comb structure and the stopper includes:
forming a first mask layer on the first conductive material layer of the first substrate, the first mask layer defining a pattern of fixed comb tooth structures in the comb tooth region and a pattern of stoppers in the mirror region; and the number of the first and second groups,
and etching the first conductive material layer by taking the first mask layer as a mask so as to form the fixed comb tooth structure in the comb tooth area, and forming the stop piece by using the remained first conductive material layer in the mirror area.
5. The method of forming a MEMS driving device according to claim 1 wherein the stopper extends from a center of the mirror area to an edge of the mirror area; alternatively, the stopper is disposed around the edge of the mirror area.
6. The method for forming a MEMS actuator device according to claim 1, further comprising, after the etching to form the movable comb tooth structure and before the removing the fixing member: removing etching residues by using a cleaning solution;
and removing the fixing piece by utilizing a gas-phase hydrogen fluoride etching process after the etching residues are removed.
7. The method of forming a MEMS driving device according to claim 1 wherein the first substrate includes a first conductive material layer, the fixed comb structure and the stopper being formed in the first conductive material layer;
and the second substrate includes a second conductive material layer in which the movable comb-tooth structure is formed, a portion of the second material layer located in the mirror area constituting a movable portion, and the specular reflection layer is formed on the movable portion.
8. The method for forming a MEMS driving device according to claim 7, further comprising, in preparing the fixed comb-tooth structure: lowering the first layer of conductive material on the top surface of the comb tooth region to lower the top surface of the formed fixed comb tooth structure;
and the method of bonding the first substrate and the second substrate includes: directly bonding the first conductive material layer and the second conductive material layer.
9. A MEMS actuation device, comprising:
a first substrate having a fixed comb structure formed in a comb area thereof, and a stopper formed in a mirror area thereof; and the number of the first and second groups,
and the second substrate is bonded on the first substrate, movable comb tooth structures are formed in comb tooth areas of the second substrate and are arranged above the fixed comb tooth structures at intervals, micro mirror surface structures connected with the movable comb tooth structures are arranged in mirror surface areas of the second substrate, and the micro mirror surface structures are arranged right above the stop piece at intervals.
10. The MEMS drive device of claim 9 wherein a top surface of the stop is higher than a top surface of the fixed comb structure.
11. The MEMS drive device of claim 9 wherein the stop extends from a center of the mirror area to an edge of the mirror area; alternatively, the stopper is disposed around the edge of the mirror area.
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