CN113231964B - Double-vacuum-pump-body polishing solution recovery device and method - Google Patents
Double-vacuum-pump-body polishing solution recovery device and method Download PDFInfo
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- CN113231964B CN113231964B CN202110563181.9A CN202110563181A CN113231964B CN 113231964 B CN113231964 B CN 113231964B CN 202110563181 A CN202110563181 A CN 202110563181A CN 113231964 B CN113231964 B CN 113231964B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention is suitable for the technical field of optical element processing, and provides a double-vacuum-pump-body polishing solution recovery device which comprises a vacuum cavity, a first vacuum pump body, a second vacuum pump body and a polishing solution storage device, wherein the first vacuum pump body is connected with the vacuum cavity; the vacuum cavity comprises an input interface, a first vacuum interface and a second vacuum interface; polishing liquid enters the vacuum cavity through the input interface, the first vacuum pump body is communicated with the vacuum cavity through the first vacuum interface, the second vacuum pump body is communicated with the vacuum cavity through the second vacuum interface, and the polishing liquid storage device is communicated with the first vacuum pump body. The device can realize that polishing solution does not have remaining high-efficient the recovery, improves polishing solution's steady operation state.
Description
Technical Field
The invention relates to the technical field of optical element processing, in particular to a device and a method for recovering polishing solution of a double vacuum pump body.
Background
The magneto-rheological polishing technology is a high-precision optical element precision processing technology, and is characterized in that a magnetic field generated in a polishing wheel is utilized to adsorb magnetic polishing liquid, the magnetic polishing liquid and the element processing surface generate relative motion through the autorotation of the polishing wheel, and the element surface is processed through a shearing removal mode.
The magnetic polishing solution is recycled, and is mainly circulated by a polishing solution supply system and a recovery device, as shown in fig. 4. The magnetic polishing solution has two characteristics, one is that the magnetic polishing solution contains iron powder with the mass ratio of more than 80%, so the specific gravity of the liquid is high, and a vacuum pump body with high adsorption force is required for recycling; the other is to ensure that the magnetic polishing solution is not polluted in the transmission process, and the processing effect is not influenced, so that the magnetic polishing solution can only be transmitted in a closed pipeline.
At present, the adopted magnetic polishing solution recovery device mainly utilizes a peristaltic pump to recover polishing solution, particularly generates vacuum by continuously extruding a rubber tube in the peristaltic pump, and has the advantage of no pollution because fluid only contacts the pump tube and does not contact a pump body; meanwhile, the valve has strong sealing performance and good self-sucking capacity, can idle and can prevent backflow. However, the vacuum strength is not enough, so that the residual polishing solution is adsorbed on the polishing wheel, and the effect of the magnetorheological processing element is influenced.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a dual vacuum pump polishing solution recycling device, which includes a vacuum cavity, a first vacuum pump, a second vacuum pump, and a polishing solution storage device; the vacuum cavity comprises an input interface, a first vacuum interface and a second vacuum interface; polishing liquid enters the vacuum cavity through the input interface, the first vacuum pump body is communicated with the vacuum cavity through the first vacuum interface, the second vacuum pump body is communicated with the vacuum cavity through the second vacuum interface, and the polishing liquid storage device is communicated with the first vacuum pump body.
The first vacuum pump body realizes the transmission of the polishing solution in a closed pipeline and can provide certain vacuum suction force, and the second vacuum pump body can generate vacuum with high suction force and provide the recovery force for the polishing solution.
By adopting the scheme of the invention, the polishing solution is brought into the vacuum cavity by the vacuum suction force jointly generated by the first vacuum pump body and the second vacuum pump body, and then the polishing solution is brought into the polishing solution storage barrel by the second vacuum pump body, so that the polishing solution with high vacuum degree is recovered while the polishing solution is hermetically transmitted, and the polishing solution is prevented from remaining on the polishing wheel body due to insufficient vacuum degree.
Further, the second vacuum port is located higher than the first vacuum port. In the above scheme, the first vacuum pump body mainly functions to realize the transmission of the polishing solution in the closed pipeline and simultaneously provide a certain vacuum suction force, and the second vacuum pump body functions to provide a recovery force for the polishing solution to enter the vacuum cavity, so that the position of the second vacuum interface is higher than that of the first vacuum interface, and the polishing solution can be prevented from entering the second vacuum pump body.
Further, the first vacuum interface is located on the bottom wall of the vacuum cavity, and the second vacuum interface is located on the side wall of the vacuum cavity. In the above scheme, the first vacuum interface is located on the bottom wall of the vacuum cavity, so that polishing liquid in the vacuum cavity can flow into the polishing liquid storage device through the first vacuum pump body.
Furthermore, the input interface and the second vacuum interface are respectively positioned on two opposite side walls of the vacuum cavity, and the input interface is close to the first vacuum interface. In the above scheme, the polishing solution used for polishing the element enters the vacuum cavity through the input interface under the action of the recovery force generated by the first vacuum pump body and the second vacuum pump body. The input interface is close to the first vacuum interface, so that the risk of the polishing solution entering the second vacuum pump body by mistake can be reduced.
The input interface and the second vacuum interface are respectively positioned on two opposite side walls of the vacuum cavity, and the position of the input interface is not higher than that of the second vacuum interface.
Further, the bottom wall of the vacuum cavity is a concave surface, and the first vacuum port is located at the lowest position of the concave surface. In the above scheme, after the polishing solution enters the vacuum cavity, the polishing solution is gathered at the concave surface on the bottom wall of the vacuum cavity and enters the polishing solution storage device through the first vacuum interface.
Furthermore, a partition plate used for preventing the polishing solution from flowing into the second vacuum pump body is further arranged in the vacuum cavity. In the above scheme, the arrangement of the partition plate can further isolate the polishing solution from flowing towards the second vacuum pump body.
Further, a vacuum port is reserved between the partition plate and the upper wall of the vacuum cavity. In the above scheme, the second vacuum pump provides a recovery force for the polishing solution through the vacuum port between the partition plate and the upper wall of the vacuum chamber.
Of course, the vacuum port may be disposed at other positions, for example, the vacuum port may be disposed on a side of the partition plate away from the polishing solution.
Further, the vacuum degree adjusting device is further included and used for adjusting the size of the vacuum port.
In the scheme, the size of the vacuum port is adjusted by arranging the vacuum degree adjusting device. Specifically, the vacuum degree adjusting device may include a sliding partition plate, and the sliding partition plate may move relative to the partition plate to shield or partially shield the vacuum port, so as to adjust the size of the vacuum port. The vacuum port is large, the vacuum cavity has high vacuum degree, the vacuum port is small, and the vacuum cavity has low vacuum degree.
Furthermore, an adjusting knob can be arranged on the vacuum cavity and connected with the sliding partition plate, and the sliding partition plate is driven to move relative to the partition plate by rotating the adjusting knob, so that the size of the vacuum port is adjusted.
Of course, the vacuum adjusting device may also be in other forms as long as it can adjust the size of the vacuum port, and is not limited herein.
Furthermore, a vacuum meter can be arranged on the vacuum cavity to monitor the vacuum degree in the vacuum cavity in real time, and the vacuum degree adjusting device is adjusted according to actual process requirements.
Further, the first vacuum pump body is a peristaltic pump. In the scheme, the peristaltic pump can realize the transmission of the polishing solution in the closed pipeline and can provide certain vacuum suction force.
The invention also provides a polishing solution recovery method, which adopts the recovery device to recover the polishing solution and comprises the following steps: the polishing solution is brought into the vacuum cavity by the vacuum suction force generated by the first vacuum pump body and the second vacuum pump body; and the polishing liquid in the vacuum cavity is brought into the polishing liquid storage device by the first vacuum pump body.
Compared with the prior art, the double-vacuum-pump-body polishing solution recovery device provided by the invention adopts double vacuum pumps. The polishing solution is brought into the vacuum cavity under the action of vacuum suction force generated by the first vacuum pump body and the second vacuum pump body, and then the polishing solution is brought into the polishing solution storage barrel by the first vacuum pump body, so that liquid closed transmission is realized, high-vacuum-degree liquid recovery is also realized, and the magnetic polishing solution remained on the polishing wheel due to insufficient vacuum degree is avoided. The device can realize the high-efficient recovery of the magnetic polishing solution without residue, and improve the stable working state of the magnetic polishing solution.
The vacuum cavity is arranged, so that the vacuum recovery force of the two pumps can be generated in the vacuum cavity, the polishing solution is isolated from flowing towards the high-efficiency vacuum pump body, and the polishing solution can be guided to flow towards the polishing solution storage device by the aid of the first vacuum pump; the size of the vacuum port can be adjusted according to the process requirements by arranging the vacuum adjusting device.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention or in the description of the prior art will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of a recovery apparatus according to the present invention;
FIG. 2 is a schematic view of a vacuum level adjusting device according to the present invention;
FIG. 3 is a side view of the vacuum adjustment device of FIG. 2 according to the present invention;
FIG. 4 illustrates the principle of slurry recovery in the present invention;
in the figure: 1-a vacuum cavity, 11-an input interface, 12-a first vacuum interface, 13-a second vacuum interface, 2-a first vacuum pump body, 3-a second vacuum pump body, 4-a polishing solution storage device, 5-a partition plate, 6-a vacuum port, 7-a vacuum meter, 8-a vacuum degree adjusting device, 81-a knob and 82-a sliding partition plate.
Detailed Description
The following description provides many different embodiments, or examples, for implementing different features of the invention. The particular examples set forth below are illustrative only and are not intended to be limiting.
Referring to the attached drawing 1, the embodiment of the invention discloses a double-vacuum-pump polishing solution recovery device, which comprises a vacuum cavity 1, a first vacuum pump 2, a second vacuum pump 3 and a polishing solution storage device 4;
the vacuum cavity comprises an input interface 11, a first vacuum interface 12 and a second vacuum interface 13;
polishing liquid enters the vacuum cavity 1 through the input interface 11, the first vacuum pump body 2 is communicated with the vacuum cavity 1 through the first vacuum interface 12, the second vacuum pump body 3 is communicated with the vacuum cavity 1 through the second vacuum interface 13, and the polishing liquid storage device 4 is communicated with the first vacuum pump body 2.
The first vacuum pump body 2 realizes the transmission of polishing solution in a closed pipeline and can provide certain vacuum suction force, the second vacuum pump body 3 can generate vacuum with high suction force and provide recovery force for the polishing solution, and the second vacuum pump body 3 is connected with the second vacuum interface 13 through the vacuum tube 7.
By adopting the scheme of the invention, the polishing solution is brought into the vacuum cavity 1 by the vacuum suction force generated by the first vacuum pump body 2 and the second vacuum pump body 3 together, and then the polishing solution is brought into the polishing solution storage device 4 by the second vacuum pump body 3, so that the polishing solution can be hermetically transmitted, the high-vacuum-degree polishing solution can be recycled, and the polishing solution is prevented from being remained on the polishing wheel body due to insufficient vacuum degree.
In one embodiment, the second vacuum port 13 is located higher than the first vacuum port 12. In the above scheme, the first vacuum pump body 2 mainly functions to transmit the polishing liquid in the closed pipeline and provide a certain vacuum suction force, and the second vacuum pump body 3 functions to provide a recovery force for the polishing liquid entering the vacuum cavity 1, so that the position of the second vacuum port 13 is higher than the position of the first vacuum port 12, and the polishing liquid can be prevented from entering the second vacuum pump body 3.
In one embodiment, the first vacuum port 12 is located on the bottom wall of the vacuum chamber 1, and the second vacuum port 13 is located on the side wall of the vacuum chamber 1. In the above solution, the first vacuum port 12 is located on the bottom wall of the vacuum chamber 1, so that the polishing liquid in the vacuum chamber 1 flows into the polishing liquid storage device 4 through the first vacuum pump 2.
In one embodiment, the input port 11 and the second vacuum port 13 are respectively located on two opposite sidewalls of the vacuum chamber 1, and the input port 11 is close to the first vacuum port 12. In the above scheme, the polishing solution used for polishing the element enters the vacuum cavity 1 through the input interface 11 under the effect of the recovery force generated by the first vacuum pump body 2 and the second vacuum pump body 3. The input port 11 is close to the first vacuum port 12, so that the risk of polishing liquid entering the second vacuum pump body 3 by mistake can be reduced.
The input port 11 and the second vacuum port 13 are respectively located on two opposite side walls of the vacuum chamber 1, and the position of the input port 11 is not higher than the second vacuum port 13.
In one embodiment, the bottom wall of the vacuum chamber 1 is concave, and the first vacuum port 12 is located at the lowest position of the concave. In the above scheme, after the polishing solution enters the vacuum chamber 1, the polishing solution is collected at the concave surface on the bottom wall of the vacuum chamber 1 and enters the polishing solution storage device 4 through the first vacuum interface 12.
In one embodiment, a partition plate 5 for preventing the polishing liquid from flowing into the second vacuum pump body 3 is further disposed in the vacuum chamber 1. In the above embodiment, the partition plate 5 is configured to further isolate the polishing liquid from flowing toward the second vacuum pump 3. Preferably, the baffle 5 is obliquely arranged in the vacuum chamber 1.
In one embodiment, a vacuum port 6 is left between the partition 5 and the upper wall of the vacuum chamber 1. In the above scheme, the second vacuum pump 3 provides a recovery force for the polishing solution through the vacuum port 6 between the partition plate 5 and the upper wall of the vacuum chamber 1.
Of course, the vacuum port 6 may be disposed at other positions, for example, the vacuum port 6 may be disposed at a side of the partition 5 away from the polishing liquid, which is not limited herein.
As shown in fig. 2 to 3, in one embodiment, the polishing liquid recovery device further includes a vacuum degree adjusting device 8, and the vacuum degree adjusting device 8 is used for adjusting the size of the vacuum port 6.
In the above embodiment, the size of the vacuum port 6 is adjusted by providing the vacuum degree adjusting device 8. Specifically, the vacuum degree adjusting device 8 may include a sliding partition 82, and the sliding partition 82 may move relative to the partition 5 to block or partially block the vacuum port 6, so as to adjust the size of the vacuum port 6. The vacuum port 6 is larger than the vacuum chamber 1, the vacuum degree is high, the vacuum port 6 is smaller, and the vacuum degree of the vacuum chamber 1 is lower.
Furthermore, an adjusting knob 81 can be further disposed on the vacuum chamber 1, the adjusting knob 81 is connected to the sliding partition 82, and by rotating the adjusting knob 81, the sliding partition 82 is driven to move relative to the partition 5, so as to adjust the size of the vacuum port 6.
Of course, the vacuum adjusting device 8 may be implemented in other forms as long as the size of the vacuum port 6 can be adjusted, and is not limited herein.
Further, a vacuum meter 7 can be arranged on the vacuum cavity to monitor the vacuum degree in the vacuum cavity 1 in real time, and then the vacuum degree adjusting device 8 is adjusted according to actual process requirements.
In one embodiment, the first vacuum pump body 2 is a peristaltic pump. In the scheme, the peristaltic pump can realize the transmission of the polishing solution in the closed pipeline and can provide certain vacuum suction force.
Preferably, the second vacuum pump body is a high efficiency vacuum pump.
The invention also provides a polishing solution recovery method, which adopts the polishing solution recovery device to recover the polishing solution, and comprises the following steps:
the polishing solution is brought into the vacuum cavity 1 by the vacuum suction force generated by the first vacuum pump body 2 and the second vacuum pump body 3;
the polishing liquid in the vacuum chamber 1 is brought into the polishing liquid storage device 4 by the first vacuum pump body 2.
Compared with the prior art, the polishing solution recovery device provided by the invention adopts the double vacuum pump bodies. The polishing solution is brought into the vacuum cavity 1 under the action of vacuum suction generated by the first vacuum pump body 2 and the second vacuum pump body 3, and then the polishing solution is brought into the polishing solution storage barrel 4 by the first vacuum pump body 2, so that liquid closed transmission and high-vacuum-degree liquid recovery are realized, and the phenomenon that the polishing solution is remained on the polishing wheel due to insufficient vacuum degree is avoided. The device can realize the high-efficient recovery of the magnetic polishing solution without residue, and improve the stable working state of the magnetic polishing solution.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. A double-vacuum-pump-body polishing solution recovery device comprises a vacuum cavity, a first vacuum pump body, a second vacuum pump body and a polishing solution storage device; the vacuum cavity comprises an input interface, a first vacuum interface and a second vacuum interface;
polishing liquid enters the vacuum cavity through the input interface, the first vacuum pump body is communicated with the vacuum cavity through the first vacuum interface, the second vacuum pump body is communicated with the vacuum cavity through the second vacuum interface, and the polishing liquid storage device is communicated with the first vacuum pump body;
the position of the second vacuum interface is higher than that of the first vacuum interface;
the first vacuum interface is positioned on the bottom wall of the vacuum cavity, and the second vacuum interface is positioned on the side wall of the vacuum cavity;
the input interface and the second vacuum interface are respectively positioned on two opposite side walls of the vacuum cavity body, and the input interface is close to the first vacuum interface;
the bottom wall of the vacuum cavity is a concave surface, and the first vacuum interface is located at the lowest position of the concave surface;
and a partition plate used for preventing the polishing solution from flowing into the second vacuum pump body is also arranged in the vacuum cavity.
2. The apparatus according to claim 1, wherein a vacuum port is formed between the partition and the upper wall of the vacuum chamber.
3. The apparatus for recovering polishing slurry on a dual vacuum pump according to claim 2, further comprising a vacuum degree adjusting means for adjusting the size of said vacuum port.
4. The apparatus according to claim 3, wherein the first vacuum pump is a peristaltic pump.
5. A method for recovering a polishing liquid by using the recovery apparatus according to any one of claims 1 to 4, comprising the steps of:
the polishing solution is brought into the vacuum cavity by the vacuum suction force generated by the first vacuum pump body and the second vacuum pump body; and the polishing liquid in the vacuum cavity is brought into the polishing liquid storage device by the first vacuum pump body.
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| CN202110563181.9A CN113231964B (en) | 2021-05-21 | 2021-05-21 | Double-vacuum-pump-body polishing solution recovery device and method |
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| CN202110563181.9A CN113231964B (en) | 2021-05-21 | 2021-05-21 | Double-vacuum-pump-body polishing solution recovery device and method |
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| CN113231964B true CN113231964B (en) | 2022-05-20 |
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