CN113231750B - Pulse laser punching system and punching method - Google Patents

Pulse laser punching system and punching method Download PDF

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Publication number
CN113231750B
CN113231750B CN202110293209.1A CN202110293209A CN113231750B CN 113231750 B CN113231750 B CN 113231750B CN 202110293209 A CN202110293209 A CN 202110293209A CN 113231750 B CN113231750 B CN 113231750B
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pulse
stage
power
function
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CN113231750A (en
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李辉
申胜男
陈云
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Wuhan University WHU
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Wuhan University WHU
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Abstract

The invention discloses a pulse laser punching system and a punching method. The rotational speed of the rotatable laser generator is related to a pulse function parameter. The pulse laser drilling method comprises the following steps: setting pulse laser parameters; processing the pulse parameters to make the pulse parameters close to an ideal pulse waveform; setting the rotating speed of a rotating laser generator; and introducing compressed nitrogen for punching. The invention utilizes the rotary laser generator to ensure that the hole has better roundness, processes parameters to ensure that the shape of the hole is cylindrical, and introduces compressed nitrogen to reduce the sputtering material on the surface of the hole. The invention improves the shape precision of laser hole processing, ensures the processing quality of the laser hole and reduces the sputtering objects on the upper surface and the lower surface of the laser hole.

Description

Pulse laser punching system and punching method
Technical Field
The invention belongs to the field of machining, relates to a laser drilling technology, and particularly relates to a pulse laser drilling system and a drilling method.
Background
Pulsed laser drilling techniques have matured over twenty years and are increasingly recognized, accepted and employed. With the rapid development of science and technology and social production, on the one hand, various higher requirements are provided for laser drilling; on the other hand, the laser drilling machine with high power and high quality can be produced. The development trend of laser drilling has the following characteristics:
1. laser drilling will be developed towards high speed and high efficiency;
2. the depth of laser drilling is continuously increased;
3. the hole appearance is continuously perfect during laser drilling;
4. the laser drilling material is diversified;
5. the quality of laser drilling is continuously improved;
in summary, the development trend of the pulse laser processing technology is toward more perfection, wider application range and higher quality. With the continuous maturity of pulsed laser processing technology, the number of laser processing systems that perform laser drilling will increase.
However, due to the characteristics of the development trend of laser drilling, the existing pulse laser drilling technology has certain disadvantages, which can be specifically summarized as the following four points:
1. the punching repetition precision is poor;
2. the cross section of the hole is not circular;
3. the punching taper is large;
4. the hole edge is easy to generate cracks and recast layers;
in general, pulse laser drilling techniques suffer from these four disadvantages, and only one of them is usually targeted for improvement, so a new pulse laser drilling system and method are urgently needed to solve the above problems.
Disclosure of Invention
The invention aims to provide a pulse laser drilling system aiming at the defects of the prior art, and the system for drilling laser can improve the shape precision of laser drilling, ensure the processing quality of laser holes and effectively reduce sputtered objects on the upper and lower surfaces of the laser holes.
In order to achieve the purpose, the invention adopts the following technical scheme:
a pulsed laser drilling system, characterized by: the laser punching device comprises a control module, a laser generator, a rotating module, a light path adjusting assembly and a working platform for placing a workpiece to be punched, wherein the pulse laser generator is arranged on the rotating module, the rotating module drives the pulse laser generator to rotate around the axial lead of laser emitted by the pulse laser generator, and the light path adjusting assembly is used for guiding the laser emitted by the laser generator into the working platform to punch the workpiece; the laser generator is a pulse laser generator with adjustable power, the pulse laser generator sets pulse parameters through a control module and adjusts the power waveform of the pulse laser according to the punching requirement, and the rotating module sets the rotating speed through the control module.
Furthermore, the optical path adjusting assembly sequentially comprises a beam expander, a reflecting plane mirror and a focusing system along the optical path direction, wherein the beam expander is used for shaping laser emitted by the laser generator and adjusting the diameter and the divergence angle of the laser; the reflecting plane mirror is used for changing the direction of the shaped laser; the focusing system is used for focusing the laser on the position of the required perforation on the workpiece.
Further, the rotating module comprises a rotating device and a rotating speed controller, the laser generator is installed on the rotating device or integrally arranged with the rotating device, the rotating speed controller is connected with the control module, and the rotating speed of the rotating device is controlled by receiving a control signal of the control module.
Furthermore, a clamp for clamping the workpiece is arranged on the working platform.
Furthermore, an inert gas supply system which enables the punching part on the workpiece to be in an inert gas atmosphere is arranged on the working platform.
A pulse laser drilling method using the pulse laser drilling system is characterized by comprising the following steps:
step S1, assembling and debugging the pulse laser drilling system;
step S2, setting pulse laser parameters;
step S3, processing the pulse parameters to approximate an ideal pulse waveform, the processing method is as follows:
dividing the laser pulse period T of the laser into four stages, and recording the time point of the end of each stage asT 1、T 2、T 3、T 4The starting time point of the first stage is marked as 0, the power waveform is adjusted by adopting a constant function in the first stage, the power waveform is adjusted by adopting a cubic function in the second stage, the power waveform is adjusted by adopting a square function in the third stage, the power waveform is adjusted by adopting a constant function in the fourth stage, and the adjacent two stages are connected through a step function to form a continuous pulse waveform of power;
step S4, setting the rotating speed of the rotating laser generator;
and step S5, starting the pulse laser punching system to punch the workpiece to be punched.
Further, in step S3, the two adjacent stages are connected by a step function and then smoothed to form an ideal pulse waveform.
Further, the smoothing process is a smoothing process using a continuous second derivative.
Further, the step S2 specifically includes: setting pulse laser parameters, specifically: setting laser power P, laser pulse period T, pulse wavelength lambda and laser duty ratioτ。
Before the smoothing process, the power functions of the first stage and the fourth stage pulse laser are the same constant function and are recorded as y =0, and the cubic function of the second stage is recorded as y =0y=t 3+b2Where t is time, b2Is a constant of a cubic function; the square function of the third stage is noted asy=-a 3 t 2+b3 t-c3Wherein, in the step (A),a 3is a coefficient of quadratic power, b3Is a first order coefficient, c3Is constant, and the square function of the third stage is symmetrical with the time midpoint of the third stage, at which the power of the pulsed laser reaches the maximum power set by the laser generatorP。
Further, the ratio of the time lengths of the four phases of the laser pulse period is 2:3:6: 2.
In the cubic function, b2= 2; in the square function, the square of the square function,a 3=21.922222，b3=26.306667，c3=3.892。
further, the rotation speed setting principle of the laser generator is specifically related to the following relevant parameters:
(1) pulse function period T: the shorter the period, the faster the rotation speed; the purpose is to uniformly heat the workpiece near the light spot and make the hole pattern close to a standard circle.
(2) Pulse function power P: the higher the power, the faster the rotation speed; the purpose is to stably raise the heating temperature of a workpiece, prevent the hole edge stress from being overlarge in the punching process caused by too fast temperature rise, and effectively reduce the generation of microcracks after machining.
(3) LaserDuty cycleτ: the larger the duty cycle, the faster the speed. The purpose is to stably raise the temperature of a workpiece processing area.
Still further, the specific control process of step S4 is: in the laser drilling process, the rotating speed controller is connected with the rotatable laser generator and used for controlling the rotating speed of the laser generator, so that the rotating speed of the laser generator is kept stable, and a circular hole is formed in the drilling process more easily.
Still further, the specific process of step S5 is: during the laser drilling process, compressed nitrogen gas is added. The reason is that: nitrogen belongs to inert gas, is stable, is not easy for other substances to generate chemical reaction at high temperature, has better stability than compressed air in laser drilling, and can effectively reduce sputtered materials on the surface of the drilled hole.
The invention has the advantages that:
1. by using the rotatable laser generator, the workpiece near the light spot is uniformly heated, so that the hole-shaped cross section is in a standard circular shape, and the hole-shaped standard precision can be effectively improved;
2. the pulse laser is processed by utilizing the piecewise function, and the ideal pulse laser waveform after processing is adopted, so that the taper of the hole can be effectively reduced, the laser hole is cylindrical, and the processing precision of the inner surface of the laser hole is improved;
3. the pulse laser is processed by utilizing the piecewise function, the ideal pulse laser waveform is adopted after processing, the purpose is to ensure that the heating temperature of a workpiece is stably raised, the overlarge hole edge stress in the punching process caused by the excessively fast temperature rise is prevented, the generation of micro cracks after processing is effectively reduced, and the processing quality of the holes is ensured;
4. use compressed nitrogen as auxiliary gas, because nitrogen gas belongs to inert gas, itself is comparatively stable, is difficult for other materials to take place chemical reaction under the high temperature, and is good than compressed air stability in laser drilling, and the sputter on surface about can effectual reduction laser hole.
Drawings
FIG. 1 is a schematic diagram of a pulsed laser drilling system according to an embodiment of the present invention.
Fig. 2 is a waveform diagram of a continuous pulse after a step function process.
Fig. 3 is a waveform diagram of the smoothed continuous pulse after the smoothing process.
FIG. 4 is a cross-sectional view of the hole pattern after laser drilling.
FIG. 5 is a longitudinal sectional view of the hole pattern after laser drilling.
Reference numerals: 1-a computer; 2-a rotational speed controller; 3-a power supply; 4-rotating the laser generator; 5-a beam expander; 6-a reflective plane mirror; 7-a focusing system; 8-compressed nitrogen gas ejection system; 9-nitrogen compressor; 10-a working platform; 11-a clamp; 12-workpiece.
Detailed Description
In order to facilitate an understanding of the invention, the invention will be described more fully and in detail below with reference to the accompanying drawings and preferred embodiments, but the scope of the invention is not limited to the specific embodiments below.
As shown in fig. 1, the present invention provides a pulse laser drilling system, which includes a control module, a laser generator, a rotation module, a light path adjusting assembly, and a working platform 10 for placing a workpiece 12 to be drilled, where the rotation module includes a rotation device and a rotation speed controller 2, the laser generator is installed on the rotation device (such as a rotation motor) or is integrally disposed with the rotation device, in this embodiment, the laser generator and the rotation device are integrally disposed and named as a rotation laser generator 4, the rotation speed controller 2 (which may be a frequency converter when the rotation motor is an ac motor) is connected with the control module, and the rotation speed of the rotation device is controlled by receiving a control signal of the control module.
The pulse laser generator is arranged on the rotating module, the rotating module drives the pulse laser generator to rotate around the axial lead of the laser emitted by the pulse laser generator, and the light path adjusting component is used for guiding the laser emitted by the laser generator into the working platform 10 to punch the workpiece 12; the laser generator is a pulse laser generator with adjustable power, the control module is a computer 1 in the embodiment, the computer 1 is used for setting pulse parameters of the pulse laser generator, adjusting the power waveform of the pulse laser according to the drilling requirement and setting the rotating speed of the rotating module.
The light path adjusting component sequentially comprises a beam expander 5, a reflecting plane mirror 6 and a focusing system 7 along the light path direction, wherein the beam expander 5 is used for shaping laser emitted by a laser generator and adjusting the diameter and the divergence angle of the laser; the reflecting plane mirror 6 is used for changing the direction of the shaped laser; the focusing system 7 is used to focus the laser light at the desired location of the hole in the workpiece 12.
The working platform 10 is provided with a clamp 11 for clamping a workpiece 12, and an inert gas supply system for making a punching part on the workpiece 12 in an inert gas atmosphere, in the embodiment, the inert gas supply system comprises a nitrogen nozzle and a nitrogen compressor 9, nitrogen is provided by the nitrogen compressor 9 and is sprayed out from a compressed nitrogen spraying system 8 to provide a nitrogen protection atmosphere for the workpiece 12, and the working platform is certainly used as conventional equipment and also comprises a power supply 3 for supplying power.
In the embodiment, a copper sheet is taken out as an experimental sample and placed above a working platform 10, a clamp 11 is used for clamping the copper sheet, compression auxiliary nitrogen is introduced above the copper sheet by using a nitrogen compressor 9, and the computer 1, the power supply 3, the rotating speed controller 2 and the rotatable laser generator 4 are started to punch. The specific implementation of the invention comprises the following steps:
s1, assembling and debugging the pulse laser drilling system;
s2 setting pulse laser parameters;
s3, processing the pulse parameters to make the pulse parameters close to the ideal pulse waveform;
s4 setting the rotation speed of the rotating laser generator 4;
s5, introducing compressed nitrogen for protection, and starting the pulse laser drilling system to drill.
In step S1, referring to fig. 1, a pulsed laser drilling system is assembled, the pulsed laser drilling system including a computer 1, a power supply 3, a rotational speed controller 2, a rotatable laser generator 4, a beam expander 5, a mirror 6, a focusing system 7, a compressed nitrogen gas ejection system 8, a nitrogen gas compressor 9, a work table 10, a jig 11, and a workpiece 12. The computer 1 is respectively connected with the rotating speed controller 2 and the rotating speed controller 2 of the rotatable laser generator 4, so that the rotating speed of the laser generator can be controlled, the rotating speed is kept stable, the workpiece 12 is uniformly heated, and the rotatable laser generator 4 can be controlled to emit required pulse laser according to set parameters. The power supply 3 provides electrical energy to the rotatable laser generator 4 and the nitrogen compressor 9. The beam expander 5 expands the diameter of the laser beam and reduces the divergence angle of the laser beam. The nitrogen compressor 9 and the compressed nitrogen ejection system 8 provide compressed nitrogen for the system, and the surface precision of the workpiece 12 is improved. The workpiece 12 is positioned on the jig 11, and the jig 11 is fixed to the work table 10. The remaining components are assembled in sequence. After the assembly of the belt is completed, pulse laser punching tests are respectively carried out under different environmental temperatures, different types of workpieces 12 and different laser frequencies and powers. So as to meet the use safety requirement of the device.
In step S2, setting the pulsed laser parameters means: the computer 1 is provided with a pulse laser power P, a laser pulse period T, and a pulse wavelength
Figure 777767DEST_PATH_IMAGE002
Laser duty cycleτEtc. using the computer 1 to control the shape of the pulsed laser light emitted by the laser generator.
In step S3, the specific process is:
dividing the laser pulse period T of the laser into four stages, and recording the time point of the end of each stage as the time point of the end of each stageT 1、T 2、T 3、T 4The method comprises the following steps that (1) the initial time point of a first stage is marked as 0, the power waveform is adjusted by adopting a constant function in the first stage, the power waveform is adjusted by adopting a cubic function in the second stage, the power waveform is adjusted by adopting a square function in the third stage, the power waveform is adjusted by adopting a constant function in the fourth stage, and the power waveforms between two adjacent stages are connected through a step function to form a continuous pulse waveform; and then smoothing the adjacent two stages of the continuous pulse waveform to obtain a smooth continuous pulse waveform, namely a smooth continuous ideal pulse waveform.
Before the smoothing process, the first stage and the fourth stage pulse impulseThe power function of the light is the same constant function, and is recorded as y =0, and the cubic function of the second stage is recorded asy=t 3+b2Wherein t is time, b2Is a constant of a cubic function; the square function of the third stage is noted asy=- a 3 t 2+ b3 t-c3Wherein, in the step (A),a 3is a coefficient of quadratic power, b3Is a first order coefficient, c3Is constant, and the square function of the third stage is symmetrical with the time midpoint of the third stage, at which the power of the pulsed laser reaches the maximum power set by the laser generatorP。
In this embodiment, specifically, as shown in fig. 2 and fig. 3, an abscissa x represents time, an ordinate y represents laser power, a set maximum laser power P =4 (a unit is set as required, in this embodiment, dimensionless data is used for explaining a proportional relationship), a time length ratio of four phases of the laser pulse period is 2:3:6:2, a pulse period T is from-0.2 to 1.1 (a unit is set as required, in this embodiment, dimensionless data is used for explaining a proportional relationship), a first phase is from-0.2 to 0, and a power waveform is adjusted by y = 0; the second stage is 0 to 0.3 seconds, and y =is adoptedt 3+2 adjusting the power waveform; the third stage is 0.3-0.9, usingy=-21.922222t 2+26.306667t-3.892 adjusting the power waveform to a power of maximum 4 at time 0.6, P = 4; the fourth stage is 0.9-1.1, and the power waveform is adjusted by adopting y = 0; the continuous processing is performed by using a step function between the adjacent stages, namely, at the points of time 0, 0.3 and 0.9, to obtain a continuous pulse waveform diagram (as shown in fig. 2), the power of the second stage of the continuous pulse waveform diagram is 0.5P at the point of 0, the power is 0.5067P at the point of time 0.3, and the power of the third stage is symmetric about the midpoint 0.6, so that the power is 0.5067P at the actual point of 0.9. And then smoothing the obtained continuous waveform to obtain a final smooth continuous pulse waveform, as shown in fig. 3, the taper of the hole can be effectively reduced by using the waveform to modulate the power of the laser generator to punch, so that the laser hole is cylindrical, and the processing precision of the inner surface of the laser hole is improved.
In step S4, the rotational speed of the rotating laser generator 4 is set in the computer 1, and the rotational speed of the laser generator is controlled by the computer 1. For the setting of the rotation speed of the laser generator, the following three parameters are mainly set:
1. pulse function period T: the shorter the period, the faster the rotation speed;
2. pulse function power P: the higher the power, the faster the rotation speed;
3. laser duty cycleτ: the larger the duty ratio, the faster the rotation speed;
when setting the rotation speed of the laser generator in the computer 1, the influence of other factors, such as the ambient temperature, the laser wavelength, etc., should also be taken into account. Other factors affecting the speed should be considered comprehensively.
In step S5, the punching is performed by introducing compressed nitrogen gas, and after the preparation for punching has been completed in the above steps S1 to S4, the workpiece 12 (copper sheet) is taken out and placed on the top of the work table 10, the copper sheet is clamped by the clamp 11, the nitrogen gas is pressed into the compressed nitrogen gas ejection system 8 by the nitrogen gas compressor 9 on the top of the copper sheet, the compressed nitrogen gas is supplied to the upper surface of the copper sheet, and the computer 1 and the power supply 3 are sequentially turned on. The power supply 3 supplies power to the whole device, so when the power supply 3 is turned on, the nitrogen compressor 9 is simultaneously turned on, and compressed nitrogen is supplied to the copper sheets through the compressed nitrogen ejection system 8. Then the rotating speed controller 2 and the rotatable laser generator 4 are opened, and the pulse laser drilling is started. Because nitrogen belongs to inert gas, it is comparatively stable itself, be difficult for other material to take place chemical reaction under high temperature, sputter that can effectual reduction laser hole upper and lower surface department. The cross section of the hole pattern after laser drilling is shown in FIG. 4, and the longitudinal section of the hole pattern after laser drilling is shown in FIG. 5.
The pulse laser drilling device and the pulse laser drilling method can be used for miniature holes and deep holes, improve the shape precision of hole machining, ensure the machining quality of the holes and reduce sputtered objects on the upper surface and the lower surface of the laser holes.
It should be noted that the core invention of the present invention lies in the laser being rotatable around its axis and the modulation of the laser power waveform, and in other techniques for implementing laser drilling, the present invention may adopt the common general knowledge in the prior art, and the above examples should not be taken as limiting the scope of the present invention.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (6)

1. A pulse laser drilling method adopts a pulse laser drilling system which comprises a control module, a laser generator, a rotating module, a light path adjusting assembly and a working platform for placing a workpiece to be drilled, wherein the laser generator is arranged on the rotating module, the rotating module drives the pulse laser generator to rotate around the axial lead of laser emitted by the rotating module, and the light path adjusting assembly is used for guiding the laser emitted by the laser generator into the working platform to drill the workpiece; the laser generator is a pulse laser generator with adjustable power, the pulse laser generator sets pulse parameters through a control module and adjusts the power waveform of pulse laser according to the punching requirement, and the rotation module sets the rotation speed through the control module;
the light path adjusting component sequentially comprises a beam expander, a reflecting plane mirror and a focusing system along the light path direction, wherein the beam expander is used for shaping laser emitted by the laser generator and adjusting the diameter and the divergence angle of the laser; the reflecting plane mirror is used for changing the direction of the shaped laser; the focusing system is used for focusing the laser at the position of the required hole on the workpiece;
the method is characterized by comprising the following steps:
step S1, assembling and debugging the pulse laser drilling system;
step S2, setting pulse laser parameters;
step S3, processing the pulse parameters to approximate an ideal pulse waveform, the processing method is as follows:
dividing the laser pulse period T of the laser into fourThe time point of the end of each stage is recorded asT 1、T 2、T 3、T 4The starting time point of the first stage is marked as 0, the power waveform is adjusted by adopting a constant function in the first stage, the power waveform is adjusted by adopting a cubic function in the second stage, the power waveform is adjusted by adopting a square function in the third stage, the power waveform is adjusted by adopting a constant function in the fourth stage, and the adjacent two stages are connected through a step function to form a continuous pulse waveform of power;
step S4, setting the rotating speed of the rotating laser generator;
step S5, starting a pulse laser punching system to punch holes on the workpiece to be punched;
in step S3, two adjacent stages are connected by a step function and then smoothed to form an ideal pulse waveform;
before the smoothing treatment, the power functions of the first stage and the fourth stage pulse laser are the same constant function and are recorded as y =0, and the cubic function of the second stage is recorded asy=t 3+b2Wherein t is time, b2Is a constant of a cubic function; the square function of the third stage is noted asy=-a 3 t 2+b 3 t-c3Wherein, in the process,a 3is a coefficient of quadratic power, b3Is a first order coefficient, c3Is constant, and the square function of the third stage is symmetrical with the time midpoint of the third stage, at which the power of the pulsed laser reaches the maximum power set by the laser generatorP。
2. The pulsed laser drilling method of claim 1, wherein: the rotating module comprises a rotating device and a rotating speed controller, the laser generator is installed on the rotating device or is integrally arranged with the rotating device, the rotating speed controller is connected with the control module, and the rotating speed of the rotating device is controlled by receiving a control signal of the control module.
3. The pulsed laser drilling method according to claim 1, wherein: and the working platform is provided with a clamp for clamping a workpiece.
4. The pulsed laser drilling method of claim 1, wherein: and the working platform is provided with an inert gas supply system which enables the punching part on the workpiece to be in an inert gas atmosphere.
5. The pulsed laser drilling method according to claim 1, wherein: the ratio of the time lengths of the four phases of the laser pulse period is 2:3:6: 2.
6. The pulsed laser drilling method according to claim 1, wherein: the rotating speed setting principle of the laser generator is as follows:
(1) pulse function period T: the shorter the period is, the faster the rotation speed is;
(2) pulse function power P: the higher the power, the faster the rotation speed;
(3) laser duty cycleτ: the larger the duty cycle, the faster the speed.
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