CN113228423A - Connector for substrate and apparatus - Google Patents
Connector for substrate and apparatus Download PDFInfo
- Publication number
- CN113228423A CN113228423A CN201980085465.2A CN201980085465A CN113228423A CN 113228423 A CN113228423 A CN 113228423A CN 201980085465 A CN201980085465 A CN 201980085465A CN 113228423 A CN113228423 A CN 113228423A
- Authority
- CN
- China
- Prior art keywords
- connector
- outer conductor
- bottom wall
- substrate
- locking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
A connector (10) for a substrate, which is mounted on a circuit board (50), is provided with: a connector housing (11) having a hood (15) for fitting a mating connector (70) and a bottom wall (30) provided on the side opposite to the opening direction of the hood (15); an outer conductor (20) disposed in an outer conductor attachment hole (34) formed through the bottom wall (30); an insulating dielectric (19) disposed inside the outer conductor (20); and an inner conductor (18) disposed inside the dielectric body (19), wherein the outer conductor (20) has a closing portion (25), and the closing portion (25) closes a release hole (32) formed in the bottom wall (30) at a position different from the outer conductor attachment hole (34).
Description
Technical Field
The technology disclosed in the present specification relates to a technology of a substrate connector disposed on a circuit board.
Background
Conventionally, as a connector for a substrate, a connector described in japanese patent application laid-open No. 2008-59761 is known. The connector includes: an inner conductor connected to a conductive path formed on the circuit board; an insulating dielectric body surrounding the inner conductor; an outer conductor surrounding the dielectric body; and a connector housing that houses the inner conductor, the dielectric body, and the outer conductor.
By surrounding the inner conductor connected to the conductive path of the circuit board with the outer conductor, noise entering the inner conductor from the outside of the connector for a substrate can be suppressed, and noise leaking from the inner conductor to the outside of the connector for a substrate can be suppressed.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2008-59761
Disclosure of Invention
Problems to be solved by the invention
The connector has a cover portion to which the mating connector is fitted. A stopper portion is formed at an opening end portion of the cover portion so as to protrude inward of the cover portion, and the counterpart connector is locked to the stopper portion. A demoulding hole penetrates through the bottom wall of the cover part, which is arranged on the side opposite to the opening end part of the cover part, and the demoulding hole is used for forming a stopping part. Therefore, noise generated from the circuit board may leak from the mold release hole of the connector housing to the outside of the substrate connector.
The technology disclosed in the present specification has been completed based on the above-described situation, and an object of the technology is to provide a technology relating to a substrate connector with improved sealing performance.
Means for solving the problems
The technology disclosed in the present specification is a connector for a substrate mounted on a circuit board, the connector for a substrate including: a connector housing having a hood section to which a counterpart connector is fitted and a bottom wall provided on the side opposite to the opening direction of the hood section; the outer conductor is inserted into an outer conductor assembling hole penetrating through the bottom wall; an insulating dielectric body disposed inside the outer conductor; and an inner conductor disposed inside the dielectric body, wherein the outer conductor has a sealing portion that seals a through hole formed in the bottom wall at a position different from the outer conductor attachment hole.
According to the above configuration, since the through-hole formed in the connector housing is sealed by the sealing portion of the outer conductor, it is possible to suppress noise generated from the circuit board from leaking to the outside from the through-hole of the board connector. This improves the sealing performance of the substrate connector. The noise generated from the circuit substrate includes noise generated from a conductive path formed in the circuit substrate, and also includes noise generated from an electronic component mounted on the circuit substrate.
As an embodiment of the technology disclosed in the present specification, the following is preferable.
The outer conductor has a cylindrical portion that extends in the opening direction and that accommodates at least a part of the inner conductor, a flange that protrudes outward is provided on an outer periphery of the cylindrical portion, and the flange is provided with the closing portion.
According to the above configuration, the flange is brought into contact with the bottom wall of the connector housing, whereby the connector housing and the outer conductor can be easily aligned with respect to the opening direction.
Further, the bottom wall of the connector housing is brought into contact with the flange, whereby the through hole of the bottom wall can be reliably sealed.
The connector housing and the outer conductor are positioned by the engagement of the engaging convex portion provided on one of the bottom wall and the flange and the engaging concave portion provided on the other.
According to the above configuration, the connector housing and the outer conductor can be reliably positioned.
The locking recess is provided in the flange, the locking recess has a small diameter portion on the bottom wall side and a large diameter portion provided on the opposite side of the bottom wall and having a diameter larger than that of the small diameter portion, and the locking protrusion is filled in the locking recess.
According to the above configuration, the connector housing and the flange are fixed by the boundary portion between the locking convex portion filled in the locking concave portion and the large diameter portion and the small diameter portion in the locking concave portion coming into contact from the side opposite to the bottom wall. This can suppress the misalignment between the connector housing and the outer conductor, and therefore can improve the sealing performance of the substrate connector.
The large diameter portion has a tapered surface that expands in diameter as the large diameter portion moves away from the bottom wall.
By forming the tapered surface in the large diameter portion, the locking convex portion filled in the locking concave portion is easily brought into close contact with the inner wall of the locking concave portion. Thereby, the connector housing and the outer conductor can be more firmly fixed.
Further, a technique disclosed in the present specification is a device including: the connector for a substrate; a circuit board on which the connector for a substrate is mounted; and a metal case that houses the circuit board and is electrically connected to the outer conductor.
According to the above configuration, since the metal case is electrically connected to the outer conductor, it is possible to reliably suppress leakage of noise generated from the circuit board housed in the case to the outside.
Effects of the invention
According to the technology disclosed in the present specification, the sealing performance of the substrate connector can be improved.
Drawings
Fig. 1 is an exploded perspective view showing a machine of embodiment 1.
Fig. 2 is a cross-sectional view showing a state where a mating connector is fitted to a substrate connector of a device.
Fig. 3 is a perspective view showing the connector housing.
Fig. 4 is a perspective view showing the outer conductor.
Fig. 5 is a perspective view showing a dielectric body.
Fig. 6 is a perspective view showing the dielectric body viewed from a different angle from that of fig. 5.
Fig. 7 is a perspective view showing the connector for a substrate.
Fig. 8 is a front view showing the connector for a substrate.
Fig. 9 is a sectional view taken along line IX-IX in fig. 8.
Fig. 10 is a perspective view showing a substrate connector according to embodiment 2.
Fig. 11 is a sectional view showing the connector for a substrate.
Fig. 12 is an exploded perspective view showing a substrate connector according to embodiment 3.
Fig. 13 is a perspective view showing the connector for a substrate.
Fig. 14 is a side view showing the substrate connector according to embodiment 3, and is a side view showing the cross-sectional shapes of the locking convex portion and the locking concave portion.
Fig. 15 is a side view showing the substrate connector according to embodiment 4, and is a side view showing the cross-sectional shapes of the locking convex portion and the locking concave portion.
Fig. 16 is a side view showing the substrate connector according to embodiment 5, and is a side view showing the cross-sectional shapes of the locking convex portion and the locking concave portion.
Detailed Description
< embodiment 1>
Embodiment 1 of the technique disclosed in the present specification will be described with reference to fig. 1 to 9. The board connector 10 of the present embodiment is mounted on a circuit board 50, and the circuit board 50 is housed inside a device 60. In the following description, the Z direction represents the upward direction, the Y direction represents the forward direction, and the X direction represents the left direction. In addition, in some cases, only some of the same members are denoted by reference numerals, and the reference numerals of other members are omitted.
Machine 60
As shown in fig. 1 and 2, the apparatus 60 includes: a lower case 61 in a box shape opened upward; and an upper case 62 assembled to lower case 61 from above and sealing the opening of lower case 61. The lower case 61 and the upper case 62 are made of conductive metal. Lower case 61 and upper case 62 are integrally assembled by a known method such as a fastening screw or a locking structure to form case 63. The case 63 has a rectangular parallelepiped shape as a whole.
A lower recess 64 recessed downward is formed in an upper end edge of the front wall of the lower case 61. An upper recess 65 is formed at a lower end edge of the front wall of upper case 62 and at a position corresponding to lower recess 64 of lower case 61 in a state of being assembled to lower case 61. In the state where lower case 61 and upper case 62 are assembled, board connector 10 is assembled in the space formed by lower recess 64 and upper recess 65.
The case 63 accommodates the circuit board 50 therein. The circuit board 50 is fixed to the case 63 by a known method such as a fastening screw. A signal conductive path 53 and a ground conductive path 54 for transmitting signals are formed on the circuit board 50 by a known printed wiring technique. A plurality of (four in the present embodiment) outer conductor through holes 51 and a plurality of (two in the present embodiment) inner conductor through holes 52 are formed in the circuit board 50 at positions near the distal end portion so as to penetrate the circuit board 50 in the vertical direction. Conductive paths (not shown) formed by plating or the like are formed on the inner surface of the outer conductor through hole 51 and the inner surface of the inner conductor through hole 52. The conductive path formed on the inner surface of the outer conductor through hole 51 is electrically connected to the ground conductive path 54. The conductive path formed on the inner surface of the inner conductor through hole 52 is electrically connected to the signal conductive path 53. On the circuit board 50, electronic components not shown are connected to the signal conductive path 53 and the ground conductive path 54 by a known method such as soldering.
As shown in fig. 2, the substrate connector 10 includes: a connector housing 11 mounted on the circuit board 50; an outer conductor 20 attached to the connector housing 11; a dielectric body 19 housed inside the outer conductor 20; and an inner conductor 18 housed inside the dielectric body 19.
As shown in fig. 3 and 9, the connector housing 11 is formed by injection molding an insulating synthetic resin. The connector housing 11 includes a cover portion 15, the cover portion 15 opens forward (in one example of the opening direction), and the mating connector 70 is fitted into the cover portion 15. A bottom wall 30 is provided in the connector housing 11 on the side opposite to the open end of the hood 15. A lock portion 31 projecting downward is formed at a front end edge (opening end portion) of the upper wall of the cover portion 15 so as to project downward. As shown in fig. 2, the locking portion 31 is engaged with the lock arm 72 of the mating connector 70 fitted in the hood 15, and the mating connector 70 is held in the hood 15.
A mold release hole 32 (an example of a through hole) is formed in the bottom wall 30 at a position rearward of the lock portion 31 so as to penetrate the bottom wall 30 in the front-rear direction, and the mold release hole 32 is used to form the lock portion 31 when the connector housing 11 is injection molded. Locking projections 33 projecting rearward are formed on the outer surface of the bottom wall 30 and on both left and right sides of the mold release hole 32. The locking protrusion 33 is formed in a cylindrical shape (see fig. 3).
An outer conductor attachment hole 34 through which the outer conductor 20 is inserted is formed in the bottom wall 30 below the mold release hole 32 so as to penetrate the bottom wall 30 in the front-rear direction. The cross-sectional shape of the outer conductor fitting hole 34 is a rectangular shape with rounded corners.
As shown in fig. 4, the outer conductor 20 is made of a conductive metal. As the metal constituting the outer conductor 20, any metal such as copper, a copper alloy, aluminum, and an aluminum alloy can be selected as appropriate. The outer conductor 20 is formed by a known method such as casting, die casting, or cutting. The outer conductor 20 is electrically contacted to a mating outer conductor 73 housed in a mating connector 70 (see fig. 2).
The outer conductor 20 has: a cylindrical portion 21 extending in the front-rear direction and having a cylindrical shape; a dielectric surrounding part 22 extending rearward from a rear end edge of the cylindrical part 21; and a flange 23 protruding in a direction intersecting the front-rear direction at a boundary portion between the cylindrical portion 21 and the dielectric surrounding portion 22.
The cross-sectional shape of the cylindrical portion 21 is a rectangular shape with smooth corners. The outer shape of the cylindrical portion 21 is set to be the same as or slightly smaller than the inner shape of the outer conductor fitting hole 34 of the bottom wall 30. Thereby, the barrel portion 21 is press-fitted into the outer conductor attachment hole 34.
The dielectric surrounding portion 22 has a gate shape that opens downward when viewed from the rear. The dielectric body 19 is housed inside the dielectric body surrounding portion 22 in a state surrounded by the dielectric body surrounding portion 22 in the upper, right, and left directions.
A plurality of (four in the present embodiment) substrate connection portions 24 in a cylindrical shape protruding downward are provided at the lower end portion of the dielectric enclosing portion 22. The board connection portion 24 penetrates through the outer conductor through hole 51 of the circuit board 50, and is connected to a conductive path formed on the inner surface of the outer conductor through hole 51 by a known method such as soldering. Thereby, the outer conductor 20 is electrically connected to the ground conductive path 54 formed on the circuit board 50.
As shown in fig. 9, in a state where the cylindrical portion 21 is press-fitted into the outer conductor attachment hole 34, the flange 23 contacts the rear surface of the bottom wall 30 from behind. The flange 23 is formed as a closed portion 25 at a position corresponding to the mold release hole 32 of the bottom wall 30, and the mold release hole 32 is closed from the rear.
As shown in fig. 7, the flange 23 is formed with locking recesses 26 at positions corresponding to the locking protrusions 33 of the bottom wall 30 on both right and left sides of the closing portion 25, respectively, and the locking recesses 26 penetrate the flange 23 in the front-rear direction. The cross-sectional shape of the locking recess 26 is circular. The inner shape of the locking concave portion 26 is set to be substantially the same as the outer shape of the locking convex portion 33. The substantially the same includes the same case, and also includes the case where the substantially same case can be considered even if the cases are different.
As shown in fig. 5 and 6, the dielectric body 19 is formed by injection molding of a synthetic resin having insulating properties. The dielectric body 19 is formed in a substantially L-shaped cross section. The dielectric body 19 includes an inner conductor accommodating chamber 27 in which the inner conductor 18 can be accommodated. The inner conductor accommodating chamber 27 penetrates the dielectric body 19 in the front and rear directions, and is formed to be open on the lower surface side.
As shown in fig. 9, the inner conductor 18 is formed by bending a tab-like metal plate in the middle, and includes: a straight portion 28 extending in the front-rear direction (direction along the plate surface of the circuit board 50); and a bent portion 29 bent with respect to the straight portion 28 and extending in the vertical direction (the direction orthogonal to the plate surface of the circuit board 50).
As shown in fig. 2, the mating inner conductor 71 accommodated in the mating connector 70 can contact the straight portion 28. Straight portion 28 protrudes forward of dielectric body 19. On the other hand, the bent portion 29 is bent downward substantially perpendicularly to the straight portion 28, and further protrudes downward from the lower surface of the connector housing 11. The protruding portion of the bent portion 29 protruding from the lower surface of the connector housing 11 is inserted into the inner conductor through hole 52 formed in the circuit board 50 and soldered, thereby being electrically connected to the signal conductive path 53 formed in the circuit board 50.
Next, an example of an assembly process of the board connector 10 and the device 60 according to the present embodiment will be described. The assembly process of the board connector 10 and the device 60 is not limited to the following description.
The inner conductor 18 is inserted from the rear into the inner conductor accommodating chamber 27 of the dielectric body 19. Next, the inner conductor 18 is assembled to the outer conductor 20 from the rear. Thus, the portion of the dielectric body 19 extending in the front-rear direction is press-fitted into the cylindrical portion 21 of the outer conductor 20.
Next, the cylindrical portion 21 of the outer conductor 20 is press-fitted into the outer conductor fitting hole 34 of the connector housing 11 from behind. At this time, the locking convex portion 33 is inserted into the locking concave portion 26 of the flange 23. Through the above steps, the substrate connector 10 is completed.
Next, the board connector 10 is assembled to the circuit board 50 from above. The substrate connection portion 24 is inserted from above into the outer conductor through hole 51 of the circuit substrate 50, and the lower end portion of the bent portion 29 is inserted from above into the inner conductor through hole 52 of the circuit substrate 50. Then, the lower ends of the board connection portion 24 and the bent portion 29 are fixed by soldering to the conductive path formed on the inner surface of the outer conductor through hole 51 and the conductive path formed on the inner surface of the inner conductor through hole 52, respectively.
The circuit board 50 is fixed to the lower case 61. Upper case 62 is assembled from above lower case 61, and lower case 61 and upper case 62 are fixed to form case 63. At this time, the hole edge of the lower recess 64 provided in the lower case 61 is brought into contact with the outer surface of the outer conductor 20, and the hole edge of the upper recess 65 provided in the upper case 62 is brought into contact with the outer surface of the outer conductor 20. Thereby, the outer conductor 20 and the case 63 are electrically connected. Through the above, the machine 60 completes.
The counterpart connector 70 is fitted into the hood 15 from the front. The lock arm 72 elastically deforms and elastically engages with the lock portion 31. Thereby, the counterpart connector 70 is held in the connector housing 11 in a disconnection-proof state. In this state, the inner conductor 18 of the board connector 10 is electrically connected to the mating inner conductor 71 of the mating connector 70. The outer conductor 20 of the board connector 10 is electrically connected to the mating outer conductor 73 of the mating connector 70.
Next, the operation and effect of the present embodiment will be described. The substrate connector 10 according to the present embodiment is a substrate connector 10 mounted on a circuit board 50, and includes: a connector housing 11 having a hood 15 to which the mating connector 70 is fitted and having a bottom wall 30 provided on the opposite side of the opening direction (the direction indicated by arrow line a) in which the hood 15 opens; an outer conductor 20 disposed in an outer conductor mounting hole 34 formed through the bottom wall 30; an insulating dielectric body 19 disposed inside the outer conductor 20; and an inner conductor 18 disposed inside the dielectric body 19, the outer conductor 20 having a closing portion 25, the closing portion 25 closing a mold opening 32 formed in the bottom wall 30 at a position different from the outer conductor fitting hole 34.
According to the above configuration, the mold release hole 32 formed in the connector housing 11 is closed by the closing portion 25 of the outer conductor 20. This can suppress leakage of noise generated from the signal conductive path 53 and the ground conductive path 54 of the circuit board 50, and from the mold release hole 32 of the board connector 10 to the outside, and from electronic components and the like mounted on the circuit board 50. This can improve the sealing performance of the substrate connector 10.
Further, according to the present embodiment, the outer conductor 20 has the cylindrical portion 21, the cylindrical portion 21 extends in the front-rear direction, and at least a part of the inner conductor 18 is housed, the flange 23 protruding outward is provided on the outer periphery of the cylindrical portion 21, and the closing portion 25 is provided on the flange 23.
According to the above configuration, the flange 23 is brought into contact with the bottom wall 30 of the connector housing 11, whereby the connector housing 11 and the outer conductor 20 can be easily positioned in the front-rear direction with respect to the hood 15.
Further, the bottom wall 30 of the connector housing 11 is brought into contact with the flange 23, whereby the mold release hole 32 of the bottom wall 30 can be reliably closed.
In addition, according to the present embodiment, the connector housing 11 and the outer conductor 20 are positioned by the concave-convex fitting of the locking convex portion 33 provided on the bottom wall 30 and the locking concave portion 26 provided on the flange 23.
According to the above configuration, the connector housing 11 and the outer conductor 20 can be reliably positioned.
Further, the apparatus 60 of the present embodiment includes: a substrate connector 10; a circuit board 50 on which the connector for substrate 10 is mounted; and a metal case 63 that houses the circuit board 50 and is electrically connected to the outer conductor 20.
According to the above configuration, since the metal case 63 is electrically connected to the outer conductor 20, it is possible to reliably suppress leakage of noise generated from the circuit board 50 housed in the case 63 to the outside.
< embodiment 2>
Embodiment 2 of the technique disclosed in the present specification will be described with reference to fig. 10 to 11. In the board connector 80 according to embodiment 2, the locking recess 83 formed in the flange 82 of the outer conductor 81 is a bottomed hole and does not penetrate the flange 82. Thus, the bottom wall 30 is not exposed rearward with respect to the portion of the rear surface of the bottom wall 30 of the connector housing 11 where the flange 82 contacts from behind.
Since the configurations other than the above are substantially the same as those of embodiment 1, the same members are denoted by the same reference numerals, and redundant description thereof is omitted.
According to the present embodiment, the noise generated from the circuit board 50 is electromagnetically shielded by the flange 82 of the outer conductor 81, and is suppressed from leaking to the outside from the bottom wall 30 of the connector housing 11.
< embodiment 3>
Embodiment 3 of the technique disclosed in the present specification will be described with reference to fig. 12 to 14. As shown in fig. 12, in a connector 90 for a substrate according to embodiment 3, a locking recess 91 provided in a flange 23 includes a small diameter portion 92 located on a front side and a large diameter portion 93 located on a rear side and having a diameter larger than that of the small diameter portion 92.
As shown in fig. 13, the rear end portion of the locking convex portion 33 of the connector housing 11 is heated and pressurized and is crushed in a state of being inserted into the locking concave portion 91 from the front to the rear.
As shown in fig. 14, the pressed locking protrusion 33 is filled in a small-diameter portion 92 formed on the bottom wall 30 side of the connector housing 11 and a large-diameter portion 93 provided on the opposite side from the bottom wall 30. The engagement convex portion 33 filled in the large diameter portion 93 is brought into contact with the boundary portion between the small diameter portion 92 and the large diameter portion 93 of the flange 82 from the rear, whereby the connector housing 11 and the flange 23 are fixed in a state of being positioned in the front-rear direction.
Since the configurations other than the above are substantially the same as those of embodiment 1, the same members are denoted by the same reference numerals, and redundant description thereof is omitted.
According to the above configuration, the connector housing 11 and the flange 23 are fixed by pressing the locking convex portion 33 to contact the boundary portion between the large diameter portion 93 and the small diameter portion 92 in the locking concave portion 91 from behind. Thus, the connector housing 11 and the outer conductor 20 can be fixed by a simple method of thermal welding, and therefore, the manufacturing operation of the board connector 90 can be made efficient. In addition, since the misalignment between the connector housing 11 and the outer conductor 20 can be suppressed, the sealing performance of the substrate connector 90 can be improved.
< embodiment 4>
Embodiment 4 of the technology disclosed in the present specification will be described with reference to fig. 15. In the board connector 94 of the present embodiment, a tapered surface 96 whose diameter increases from the front to the rear is formed on the front side portion of the large diameter portion 93 formed in the locking recess 95. In other words, the tapered surface 96 is formed so as to be expanded in diameter as it goes away from the bottom wall 30 of the connector housing 11.
The locking convex portion 33 of the connector housing 11 is pressed by being heated and pressurized after penetrating into the locking concave portion 95, and is filled into the locking concave portion 95.
Since the configurations other than the above are substantially the same as those of embodiment 1, the same members are denoted by the same reference numerals, and redundant description thereof is omitted.
In the present embodiment, the tapered surface 96 is formed in the large diameter portion 93, so that the melted and crushed locking convex portion 33 easily comes into close contact with the inner wall of the locking concave portion 95. This enables the connector housing 11 and the outer conductor 20 to be fixed more firmly.
< embodiment 5>
Embodiment 5 of the technology disclosed in the present specification will be described with reference to fig. 16. In the substrate connector 97 of the present embodiment, all of the inner surfaces of the large diameter portion 99 formed in the locking recess 98 are formed as tapered surfaces 100 whose diameters increase from the front to the rear. The tapered surface 100 of the present embodiment is also formed in a shape having an enlarged diameter as it is separated from the bottom wall 30 of the connector housing 11.
Since the configurations other than the above are substantially the same as those of embodiment 1, the same members are denoted by the same reference numerals, and redundant description thereof is omitted.
According to the present embodiment, since all the inner surfaces of the large diameter portion 99 are formed as the tapered surfaces 100, the melted and crushed locking convex portion 33 is more likely to be in close contact with the inner wall of the locking concave portion 98. This enables the connector housing 11 and the outer conductor 20 to be further firmly fixed.
< other embodiment >
The technology disclosed in the present specification is not limited to the embodiments described above and illustrated in the drawings, and for example, the following embodiments are also included in the technical scope of the technology disclosed in the present specification.
(1) The bottom wall 30 may be provided with the locking concave portion 26, and the flange 23 may be provided with the locking convex portion 33. The locking convex portion 33 and the locking concave portion 26 may be omitted.
(2) The case 63 may be made of synthetic resin.
(3) The outer conductor 20 may be formed by press working a metal plate material.
(4) The number of the inner conductors 18 may be one, or may be three or more.
(5) The through-hole formed in the bottom wall 30 is not limited to the release hole 32 for injection molding of the locking portion 31, and may include a through-hole formed for any purpose, such as a drain hole or a vent hole.
(6) The closing portion 25 may be provided at a different position from the flange 23 in the connector housing 11.
(7) The number of the locking projections 33 may be one, or three or more. The outer conductor is provided with the same number of locking recesses as the locking protrusions 33.
Description of the symbols
10. 80, 90, 94, 97: connector for substrate
11: connector housing
15: cover part
18: inner conductor
19: dielectric body
20. 81: outer conductor
21: barrel part
22: dielectric body surrounding part
23. 82: flange
24: substrate connecting part
25: closure part
26. 83, 91, 95, 98: locking concave part
27: inner conductor storage chamber
28: straight part
29: bent part
30: bottom wall
31: locking part
32: demoulding hole (one example of a through hole)
33: locking convex part
34: outer conductor assembly hole
50: circuit board
51: through hole for outer conductor
52: through hole for inner conductor
53: conductive path for signal
54: conductive path for grounding
60: machine with a rotatable shaft
61: lower box
62: upper box
63: box body
64: lower concave part
65: upper concave part
70: opposite side connector
71: inner conductor of each other
72: locking arm
73: external conductor of opposite side
92: small diameter part
93. 99: large diameter part
96. 100, and (2) a step of: conical surface
Claims (6)
1. A connector for a substrate mounted on a circuit board, the connector for a substrate comprising:
a connector housing having a hood portion fitted to a mating connector and having a bottom wall provided on a side opposite to an opening direction of an opening of the hood portion;
the outer conductor is inserted into an outer conductor assembling hole penetrating through the bottom wall;
an insulating dielectric body disposed inside the outer conductor; and
an inner conductor disposed inside the dielectric body,
the outer conductor has a closing portion that closes a through hole formed in the bottom wall at a position different from the outer conductor fitting hole.
2. The connector for a substrate according to claim 1, wherein the outer conductor has a cylindrical portion that extends in the opening direction and that receives at least a part of the inner conductor,
a flange protruding outward is provided on the outer periphery of the cylindrical portion, and the sealing portion is provided on the flange.
3. The connector for a substrate according to claim 2, wherein the connector housing and the outer conductor are positioned by engaging a locking protrusion provided on one of the bottom wall and the flange with a locking recess provided on the other of the bottom wall and the flange.
4. The connector for a substrate according to claim 3, wherein the latching recess is provided in the flange,
the locking recess has a small diameter portion on the bottom wall side and a large diameter portion provided on the opposite side of the bottom wall and having a diameter larger than that of the small diameter portion,
the locking convex part is filled in the locking concave part.
5. The connector for a substrate according to claim 4, wherein the large diameter portion has a tapered surface whose diameter increases with distance from the bottom wall.
6. A machine is provided with:
the connector for a substrate according to any one of claim 1 to claim 5;
a circuit board on which the connector for a substrate is mounted; and
and a metal case that houses the circuit board and is electrically connected to the outer conductor.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-247604 | 2018-12-28 | ||
| JP2018247604 | 2018-12-28 | ||
| JP2019-143489 | 2019-08-05 | ||
| JP2019143489A JP7228117B2 (en) | 2018-12-28 | 2019-08-05 | PCB connectors and equipment |
| PCT/JP2019/050875 WO2020138191A1 (en) | 2018-12-28 | 2019-12-25 | Substrate connector, and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113228423A true CN113228423A (en) | 2021-08-06 |
| CN113228423B CN113228423B (en) | 2023-05-16 |
Family
ID=71570107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980085465.2A Active CN113228423B (en) | 2018-12-28 | 2019-12-25 | Connector for substrate and machine |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7228117B2 (en) |
| CN (1) | CN113228423B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7420009B2 (en) * | 2020-08-20 | 2024-01-23 | 住友電装株式会社 | connector |
| JP2023007717A (en) * | 2021-07-02 | 2023-01-19 | 株式会社オートネットワーク技術研究所 | Connector for substrate |
| JP2023008100A (en) * | 2021-07-05 | 2023-01-19 | 株式会社オートネットワーク技術研究所 | Board connector and device |
| JP7563323B2 (en) * | 2021-07-27 | 2024-10-08 | 株式会社オートネットワーク技術研究所 | connector |
| JP7552523B2 (en) | 2021-07-27 | 2024-09-18 | 株式会社オートネットワーク技術研究所 | Connector System |
| JP7563325B2 (en) | 2021-08-02 | 2024-10-08 | 住友電装株式会社 | connector |
| JP7486536B2 (en) * | 2022-01-31 | 2024-05-17 | 住友電装株式会社 | Shielded Connectors |
| JP2024038633A (en) * | 2022-09-08 | 2024-03-21 | 住友電装株式会社 | connector |
| JP2024128233A (en) * | 2023-03-10 | 2024-09-24 | 株式会社オートネットワーク技術研究所 | connector |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0523461U (en) * | 1991-09-03 | 1993-03-26 | 富士通テン株式会社 | Jack mounting structure |
| CN1238583A (en) * | 1998-04-01 | 1999-12-15 | 富士康(昆山)电脑接插件有限公司 | Method for making electric connectors and its products |
| JP2009277544A (en) * | 2008-05-15 | 2009-11-26 | Sumitomo Wiring Syst Ltd | Shield connector for base board |
| JP2013008618A (en) * | 2011-06-27 | 2013-01-10 | Sumitomo Wiring Syst Ltd | Substrate connector |
| JP2016005413A (en) * | 2014-06-19 | 2016-01-12 | 株式会社オートネットワーク技術研究所 | Electric connection box and connector housing |
| JP3205392U (en) * | 2016-05-11 | 2016-07-21 | 正▲わい▼精密工業股▲ふん▼有限公司 | Receptacle connector |
| WO2016125668A1 (en) * | 2015-02-05 | 2016-08-11 | 株式会社オートネットワーク技術研究所 | Shield connector |
-
2019
- 2019-08-05 JP JP2019143489A patent/JP7228117B2/en active Active
- 2019-12-25 CN CN201980085465.2A patent/CN113228423B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0523461U (en) * | 1991-09-03 | 1993-03-26 | 富士通テン株式会社 | Jack mounting structure |
| CN1238583A (en) * | 1998-04-01 | 1999-12-15 | 富士康(昆山)电脑接插件有限公司 | Method for making electric connectors and its products |
| JP2009277544A (en) * | 2008-05-15 | 2009-11-26 | Sumitomo Wiring Syst Ltd | Shield connector for base board |
| JP2013008618A (en) * | 2011-06-27 | 2013-01-10 | Sumitomo Wiring Syst Ltd | Substrate connector |
| JP2016005413A (en) * | 2014-06-19 | 2016-01-12 | 株式会社オートネットワーク技術研究所 | Electric connection box and connector housing |
| WO2016125668A1 (en) * | 2015-02-05 | 2016-08-11 | 株式会社オートネットワーク技術研究所 | Shield connector |
| JP3205392U (en) * | 2016-05-11 | 2016-07-21 | 正▲わい▼精密工業股▲ふん▼有限公司 | Receptacle connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113228423B (en) | 2023-05-16 |
| JP2020109738A (en) | 2020-07-16 |
| JP7228117B2 (en) | 2023-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113228423B (en) | Connector for substrate and machine | |
| CN105409056B (en) | The trailer-mounted radar module and method of compact shielding | |
| US9559469B2 (en) | Connector | |
| JP5696698B2 (en) | Receptacle connector | |
| JP5525227B2 (en) | Board module | |
| JP5708424B2 (en) | Electronic circuit unit with external connection | |
| CN111628325B (en) | Outer conductor terminal and shielded connector | |
| US9570836B2 (en) | Connector, electrical connection box and connector manufacturing method | |
| US20240322463A1 (en) | Board connector and device | |
| WO2007100056A1 (en) | Case provided with connector and method for manufacturing such case | |
| CN110800093A (en) | Circuit device, method for manufacturing circuit device, and connector | |
| EP3271972B1 (en) | Electronic module | |
| US11837808B2 (en) | Board connector and device | |
| KR102655460B1 (en) | Connecting device for camera module, camera module and method of contacting the camera module | |
| US9742119B2 (en) | Plug connector assembly with shielding shell | |
| US20240339787A1 (en) | Board connector and device | |
| US20140291012A1 (en) | Electronic Device | |
| US20230033745A1 (en) | Connector | |
| US20240291209A1 (en) | Board connector | |
| WO2024062982A1 (en) | Connector | |
| US11081831B2 (en) | Waterproof connector | |
| JP5384817B2 (en) | Electrical junction box | |
| KR20210040782A (en) | Connector and electronic device | |
| JP2013080674A (en) | Electronic circuit unit capable of making external connection | |
| JP2017041312A (en) | Electric connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |