CN113226642B - Polishing pad - Google Patents

Polishing pad Download PDF

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Publication number
CN113226642B
CN113226642B CN201980085424.3A CN201980085424A CN113226642B CN 113226642 B CN113226642 B CN 113226642B CN 201980085424 A CN201980085424 A CN 201980085424A CN 113226642 B CN113226642 B CN 113226642B
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Prior art keywords
polymer elastomer
polishing pad
polishing
porous polymer
porous
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CN201980085424.3A
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CN113226642A (en
Inventor
服部和正
加藤晋哉
冈本知大
高冈信夫
林浩一
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Kuraray Co Ltd
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Kuraray Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Abstract

The invention provides a polishing pad with high polishing rate in a non-woven fabric type polishing pad which has excellent polishing performance of polishing stability and smoothness of a polishing object and has the characteristics of small change of polishing performance even if polishing is continuously performed for a long time. The polishing pad is obtained by impregnating a nonwoven fabric with a non-porous polymer elastomer and a porous polymer elastomer, wherein the porous polymer elastomer comprises thermoplastic polyurethane, and the ratio of the mass of the non-porous polymer elastomer to the mass of the porous polymer elastomer is 0.49 or less.

Description

Polishing pad
Technical Field
The present invention relates to a polishing pad useful for polishing semiconductor wafers, silicon wafers, semiconductor devices, liquid crystal displays, hard disks, glass lenses, metals, and the like.
Background
For mirror finishing of a semiconductor wafer used as a substrate for forming an integrated circuit, chemical mechanical polishing (Chemical Mechanical Polishing; CMP) is known. As polishing pads used in CMP, the following polishing pads were used: impregnating and imparting polyurethane after wet coagulation to a nonwoven fabric-type sheet or film in a nonwoven fabric; a wet Polyurethane (PU) sponge type sheet in which a wet-set polyurethane resin is disposed on the upper layer of the fiber structure; a molded sheet of a polymer elastomer such as polyurethane having a closed cell structure. The nonwoven fabric type sheet and the wet PU sponge type are soft because of easy compression deformation, and on the other hand, the molded sheet of the polymer elastomer has high rigidity.
In recent years, with the increase in integration and multilayer wiring, there has been an increasing demand for further improvement in quality such as high planarization of semiconductor wafers and semiconductor devices, and reduction in cost. Attempts to use copper alloys as wiring materials instead of the conventional aluminum alloys have been made, and as insulating materials instead of the conventional SiO 2 Attempts have been made to use low dielectric constant materials. With such material changes, polishing pads are required to have further higher functions, such as planarization at a level higher than the conventional level, reduction of scratches on the wafer surface, improvement of polishing rate, improvement of stability during polishing, and long-term use. Further, in order to promote higher integration and higher precision in silicon wafers, liquid crystal displays, hard disks, glass lenses, and the like, polishing pads are required to have higher functions than those of conventional polishing pads, such as planarization, surface scratches reduction, polishing rate improvement, stability during polishing, and long-term use.
The foamed polyurethane used for the polishing pad of the molded sheet is generally produced by casting, molding, foaming and curing using a two-component curable polyurethane (for example, refer to patent documents 1 to 4). However, in these methods, the uniformity of the reaction and foaming is difficult, and there is a limit in the high hardness of the resulting foamed polyurethane, so that polishing characteristics such as flatness and planarization efficiency of the polished surface are liable to vary; further, since the foam structure is closed-cell, there are problems such as a decrease in polishing rate (polishing speed) and a short pad life, because polishing slurry and polishing dust used in the polishing step enter the pores and are likely to be clogged. Based on such a situation, a polishing pad using a molded sheet made of foamed polyurethane which sufficiently satisfies the above-described required properties (further improvement of planarization efficiency, reduction of scratches on the wafer surface, improvement of polishing rate, improvement of stability at the time of polishing, life of the polishing pad, etc.) cannot be obtained.
Therefore, particularly in the case of materials such as copper wiring and low dielectric constant materials that are easily scratched and materials that have poor adhesion at the interface, it is more likely that scratches and interfacial peeling occur, and it is required to develop a novel polishing pad that can cope with these.
On the other hand, a nonwoven fabric-type polishing pad generally has a surface with a concave-convex structure due to fibers, pores due to the structure of the nonwoven fabric, and a communication pore structure. Therefore, the polishing composition has characteristics such as good liquid retention of slurry during polishing (hereinafter, also referred to as slurry retention), easy improvement of polishing rate, good cushioning property, softness, and good contact with wafers, and is used in various polishing fields. However, conventional nonwoven fabric-type polishing pads have a large number of voids and flexibility, and therefore have insufficient planarization ability, and also have insufficient stability during polishing, life of the polishing pad, and the like. Accordingly, various studies have been made on the improvement of performance (for example, refer to patent documents 6 to 14).
However, in any case, the following problems exist. That is, (1) the diameter of the fiber is about several tens μm, and the height difference between the surface of the polishing pad and the wafer due to the fiber is relatively large, so that there is a limit in improvement of flatness, and scratches are likely to occur when abrasive grains are gathered in the fiber. In addition, when the ultrafine fibers are used, the sheet made of the ultrafine fibers has very soft characteristics, and therefore, the hardness is insufficient, or when the hardness is increased by using a very hard polymer elastomer, the wafer is easily scratched due to the hardness and brittleness of the polymer elastomer. (2) Since the nonwoven fabric has a low fiber density, the surface formed of the fibers has a small number of raised hairs (density of the uneven structure), and the effect of compositing the fibers with the polymer elastomer is insufficient. (3) Because of the low density and the large number of voids, it is difficult to obtain a sheet with high hardness; and there is a limit in improvement of flatness because of the presence of large nonwoven fabric voids of several hundred μm order of surface unevenness; further, the properties such as hardness tend to change with time during polishing, and there are problems in terms of polishing stability and polishing pad life. (4) When the polymer elastomer is completely filled to eliminate voids in the nonwoven fabric, the formation of surface irregularities due to fibers, voids in the nonwoven fabric structure, and features due to the communication hole structure are eliminated.
Based on such a circumstance, a nonwoven fabric type polishing pad which sufficiently satisfies the performance required in the market (further improvement of planarization efficiency, reduction of scratches on the wafer surface, improvement of polishing rate, improvement of stability at the time of polishing, life of the polishing pad, etc.) has not been found.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2000-178374
Patent document 2: japanese patent laid-open No. 2000-248034
Patent document 3: japanese patent laid-open No. 2001-89548
Patent document 4: japanese patent laid-open No. 11-322878
Patent document 5: japanese patent laid-open No. 2002-9026
Patent document 6: japanese patent laid-open No. 11-99479
Patent document 7: japanese patent laid-open publication No. 2005-212055
Patent document 8: japanese patent laid-open No. 3-234475
Patent document 9: japanese patent laid-open No. 10-128797
Patent document 10: japanese patent application laid-open No. 2004-311731
Patent document 11: japanese patent laid-open No. 10-225864
Patent document 12: japanese patent application laid-open No. 2005-518286
Patent document 13: japanese patent laid-open publication No. 2003-201667
Patent document 14: japanese patent laid-open publication No. 2005-334997
Disclosure of Invention
Problems to be solved by the invention
The purpose of the present invention is to provide a polishing pad having high polishing rate in a nonwoven fabric type polishing pad which has excellent polishing performance in polishing stability and smoothness of a polishing object, and which has characteristics of continuous polishing for a long period of time and small variation in polishing performance.
Means for solving the problems
One aspect of the present invention is a polishing pad obtained by impregnating a nonwoven fabric with a non-porous polymer elastomer and a porous polymer elastomer, wherein the porous polymer elastomer comprises a thermoplastic polyurethane, and the ratio of the mass of the non-porous polymer elastomer to the mass of the porous polymer elastomer is 0.49 or less.
The porous polymer elastomer preferably has an average pore area of 10 to 100. Mu.m 2 Is a porous polishing pad. Further, a polishing pad having a solidification rate of 0.1 to 1.5mol of a polymer diol forming the thermoplastic polyurethane contained in the porous polymer elastomer is preferable. The polishing pad preferably has a D hardness of 35 to 85, which is a thermoplastic polyurethane contained in the porous polymer elastomer.
Further, it is preferable that the fibers constituting the nonwoven fabric are polyester fibers and have an average filament diameter of 1 to 10 μm.
With this configuration, a polishing pad having high polishing rate in a nonwoven fabric type polishing pad having polishing performance excellent in polishing stability and smoothness of a polishing object, and having characteristics of continuous polishing for a long period of time and small variation in polishing performance can be obtained.
The porous thermoplastic polyurethane comprises a thermoplastic polyurethane obtained by reacting a polymer diol comprising at least 1 selected from the group consisting of polyethylene glycol adipate, polybutylene glycol adipate, polycaprolactone diol, poly (3-methyl-1, 5-pentanediol adipate), poly (hexanediol adipate), poly (3-methyl-1, 5-pentanediol terephthalate), poly (diethylene glycol adipate), poly (nonanediol adipate), poly (2-methyl-1, 8-octanediol-nonanediol adipate), polyethylene glycol, poly (diethylene glycol), polytetramethylene glycol, and polypropylene glycol), and a chain extender comprising at least 1 selected from the group consisting of 4,4' -diphenylmethane diisocyanate, 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, and isophorone diisocyanate, and the chain extender preferably comprises at least 1 selected from the group consisting of ethylene glycol, 1, 3-propanediol, 1, 4-butanediol, neopentyl glycol, 1, 5-pentanediol, 1, 6-hexanediol, and cyclohexanedimethanol.
The apparent density of the polishing pad is preferably 0.50 to 0.90g/cm 3 。
The polishing pad preferably has a C hardness of 80 or more.
Further, the present invention is a method for producing a polishing pad, comprising the steps of, in order: a step of imparting an aqueous nonporous polymer elastomer to a nonwoven fabric formed of ultrafine fiber-generating fibers; a step of forming a ultrafine fiber nonwoven fabric by ultrafinely shattering ultrafine fiber-generating fibers; and a step of wet-solidifying the polymer elastomer containing the solvent, and applying the porous polymer elastomer so that the ratio of the mass of the non-porous polymer elastomer to the mass of the obtained porous polymer elastomer is 0.49 or less.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, a polishing pad having a high polishing rate in a nonwoven fabric type polishing pad can be obtained.
Detailed Description
Hereinafter, an embodiment of the polishing pad of the present invention will be described in detail.
The polishing pad of the present embodiment is a polishing pad obtained by impregnating a nonwoven fabric with a nonporous polymer elastomer and a porous polymer elastomer, wherein the porous polymer elastomer comprises a thermoplastic polyurethane, and the ratio of the mass of the nonporous polymer elastomer to the mass of the porous polymer elastomer is 0.49 or less.
In the present invention, the nonporous polymer elastomer and the porous polymer elastomer are impregnated in the nonwoven fabric, and the mass ratio of the nonporous polymer elastomer to the mass of the porous polymer elastomer is further adjusted to 0.49 or less, so that even if polishing is continued for a long period of time, the polishing performance is less changed, and the polishing rate can be improved.
In the present invention, the nonporous polymer elastomer means an elastomer having substantially no pores, specifically, an elastomer having an average pore area of less than 10 μm in the measurement of the average pore area described later 2 The porous polymer elastomer means an elastomer having an average pore area of 10. Mu.m in the measurement of the average pore area described later 2 The above elastomer.
The nonwoven fabric is not particularly limited as long as it is a nonwoven fabric of fibers containing a polyester resin such as nylon, polybutylene terephthalate (PBT) and polyethylene terephthalate (PET) as a main component. In particular, when a nonwoven fabric is formed from polyester fibers, since water is not easily absorbed during polishing, the storage modulus E' is not easily changed, and the polishing efficiency is stable. For example, in the case of a fiber having high water absorption such as nylon fiber, since the water absorption rate is high during polishing, the storage modulus E' fluctuates, the polishing pad is easily deformed, and the polishing efficiency is easily lowered.
The average filament diameter of the polyester fibers is preferably 1 to 10. Mu.m, more preferably 1.5 to 8.5. Mu.m. When the average filament diameter is 1 μm or more, the fibers are preferably not easily cut during trimming. In addition, when the average filament diameter is 10 μm or less, the load on the object to be polished can be suppressed low, and therefore occurrence of scratches can be reduced.
As a method for obtaining the ultrafine fibers having the average filament diameter, a known method for forming ultrafine fibers from ultrafine fiber-forming fibers can be used. From the viewpoint of environmental protection, the ultrafine fiber-generating fiber is particularly preferably composed of a water-soluble polymer component and a poorly water-soluble polymer component. The water-soluble polymer component represents a component of the component extracted and removed from the aqueous solution, and the water-insoluble polymer component represents a component of the component not easily extracted and removed from the aqueous solution, that is, a polyamide resin represented by the nylon and a polyester resin represented by the polyethylene terephthalate. In addition, as for the ultrafine fiber-generating fiber composed of a water-soluble polymer component and a water-insoluble polymer component, at least 1 component may be a component which can be extracted and removed by an extraction treatment with an aqueous solution, and any of multicomponent composite fibers such as sea-island type composite fibers and hybrid spinning type fibers may be used.
The water-soluble polymer component used in the present invention may be any polymer that can be extracted with an aqueous solution, and a known polymer may be used, and a polyvinyl alcohol copolymer (hereinafter, also simply referred to as "PVA") that can be dissolved in an aqueous solution is preferably used. PVA may be suitably used in view of the following: PVA can be easily dissolved and removed by hot water, and structural curl occurs in the ultrafine fiber generating fibers of the ultrafine fiber component due to shrinkage behavior upon removal by extraction with an aqueous solvent, and the nonwoven fabric becomes fluffy and dense; and that substantially no decomposition reaction of the ultrafine fiber component and the polymer elastomer component occurs during the extraction treatment, the thermoplastic resin and the polymer elastomer component used in the ultrafine fiber component are not limited; and in view of the environment, etc.
The polishing pad of the present embodiment preferably comprises a non-porous polymer elastomer impregnated into a nonwoven fabric of polyester fibers and a porous thermoplastic polyurethane having a D hardness of 35 to 85.
The nonporous polymer elastomer is mainly used for maintaining the form stability in the process of producing nonwoven fabric. Further, the porous thermoplastic polyurethane having a D hardness of 35 to 85 is useful for improving the retention of the polishing slurry during CMP polishing by adjusting the hardness of the polishing pad and imparting fine bubbles to the surface layer. The nonporous polymer elastomer can be provided by, for example, impregnating a nonwoven fabric with an emulsion of a nonporous polymer elastomer and drying the same. The porous thermoplastic polyurethane may be imparted by impregnating a nonwoven fabric with a solution of a thermoplastic polyurethane forming the porous thermoplastic polyurethane and wet-setting the same.
Specific examples of the nonporous polymer elastomer include nonporous polymer elastomers such as polyurethane, acrylonitrile elastomer, olefin elastomer, polyester elastomer, polyamide elastomer, and acrylic elastomer. Among them, polyurethane is preferable.
As the nonporous polymer elastomer, an aqueous nonporous polymer elastomer is preferably used. For example, nonporous polyurethane is preferably formed using an aqueous emulsion. Specific examples of the aqueous emulsion of the polyurethane include aqueous emulsions of polycarbonate-based polyurethane, polyester-based polyurethane, polyether-based polyurethane, and polycarbonate/ether-based polyurethane.
The nonporous polymer elastomer is preferably a glass transition temperature below-10 ℃, 23 ℃ and 50 ℃ storage modulus is preferably 1-40 MPa, more preferably 1-35 MPa, and at 50 ℃ saturated water absorption rate of 0.2-5 mass% polyurethane. When the storage modulus at 23℃and 50℃is not less than the above lower limit, the polishing pad is preferably not easily deformed. In addition, when the storage modulus is equal to or less than the upper limit, the scratch is prevented from being generated because the storage modulus does not become excessively hard. In addition, when the water absorption is too low, the slurry holding amount at the time of polishing tends to decrease, and polishing uniformity tends to decrease. In addition, when the water absorption is too high, the properties such as hardness tend to change during polishing, and the polishing stability tends to be lowered.
In the case where the porous polymer elastomer contained in the polishing pad is a thermoplastic polyurethane, the thermoplastic polyurethane preferably uses a polymer diol having a setting rate of preferably 0.1 to 1.5mol, more preferably 0.3 to 1.2mol, still more preferably 0.4 to 1.0mol, and still more preferably 0.5 to 0.9 mol. The average pore area of the porous polyurethane can be controlled to 10-100 mu m by controlling the solidification speed of the polymer diol 2 The holding property of the polishing slurry can be improved, and a polishing pad excellent in polishing stability can be obtained.
In the present invention, the solidification rate of the polymer diol can be measured by the method described in examples.
The porous thermoplastic polyurethane is preferably a porous thermoplastic polyurethane having a D hardness of preferably 35 to 90, more preferably 35 to 85, still more preferably 35 to 80, still more preferably 40 to 80.
In the present invention, the D hardness of the cellular thermoplastic polyurethane can be measured by the method described in examples.
The D hardness of the cellular thermoplastic polyurethane is preferably 35 to 90. This makes it possible to maintain high durability and moderate pad following performance. Further, the porous thermoplastic polyurethane containing the polymer diol having a solidification rate of preferably 0.1 to 1.5mol, more preferably 0.6 to 1.0mol and a D hardness of preferably 35 to 80 contributes to improving the retention of the polishing slurry by adjusting the hardness of the polishing pad and imparting fine bubbles to the surface layer. Thus, pores formed during polishing are less likely to disappear, and as a result, slurry holding ability of the polishing pad is improved, and polishing rate is increased. When the D hardness of the thermoplastic polyurethane is 35 or more, the durability is improved, and the formation of bubbles that melt and disappear during polishing can be suppressed. Thereby, slurry holding ability of the polishing pad is improved, and polishing rate is increased. Further, when the D hardness is 90 or less, the storage modulus during polishing does not become excessively high, the pad following property becomes good, and the polishing rate increases.
The average pore area of the porous structure formed using the porous thermoplastic polyurethane is preferably 10 to 100 μm in view of improving slurry holding ability and maintaining a high polishing rate 2 . From this viewpoint, the average pore area of the porous structure is preferably 15 to 90. Mu.m 2 More preferably 20 to 90. Mu.m 2 More preferably 25 to 70. Mu.m 2 More preferably 25 to 50. Mu.m 2 . Average pore area of 10 μm 2 In the above manner, the porous structure of the surface layer of the polishing pad is not easily damaged during dressing, and the slurry holding amount during polishing can be maintained, so that the polishing rate is not lowered, and the polishing uniformity is easily maintained. On the other hand, 100 μm 2 In the following cases, the polishing scraps are less likely to remain, and thus the scratch property is improved.
In the present invention, the average pore area can be measured by the method described in examples.
A thermoplastic polyurethane (hereinafter, may be abbreviated as "polyurethane") that forms a cellular thermoplastic polyurethane will be described in detail. The method for producing polyurethane is not particularly limited, and for example, the following methods are used: a method in which a polymer diol, an organic diisocyanate, and a chain extender are reacted in a good solvent at a predetermined ratio; a method of melt polymerization in the substantial absence of a solvent; the prepolymer method or the one-step method, which is known as the urethanization reaction, is used. Among them, a method of solution polymerization is particularly suitable for producing a polishing pad by impregnating a nonwoven fabric. The solution polymerization is a method in which a polymer diol, an organic diisocyanate, and a chain extender are mixed in a predetermined ratio, and if necessary, additives are mixed, and a predetermined amount of reaction is performed using a reaction tank.
The polymer diol, the organic diisocyanate and the chain extender, which are the raw materials for polymerization of polyurethane, will be described in detail.
Specific examples of the polymer diol include at least 1 selected from the group consisting of poly (ethylene adipate), poly (butylene adipate), polycaprolactone diol, poly (3-methyl-1, 5-pentanediol adipate), poly (hexanediol adipate), poly (3-methyl-1, 5-pentanediol terephthalate), poly (diethylene glycol adipate), poly (nonanediol adipate), poly (2-methyl-1, 8-octanediol-nonanediol adipate), polyethylene glycol, poly (diethylene glycol), polytetramethylene glycol, and polypropylene glycol, and among these, poly (butylene adipate), polycaprolactone diol, polyethylene glycol, and polytetramethylene glycol are preferable, and poly (caprolactone diol) and poly (hexanediol) are more preferable from the viewpoint of forming a porous structure.
The organic diisocyanate may be any of organic diisocyanates conventionally used in the production of usual thermoplastic polyurethane, and at least 1 selected from 4,4' -diphenylmethane diisocyanate, 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate and isophorone diisocyanate may be used, or 2 or more may be used in combination. Among them, 4' -diphenylmethane diisocyanate is preferable in terms of abrasion resistance and the like of the obtained polishing pad.
As the chain extender, any of the chain extenders conventionally used in the production of usual polyurethanes can be used. The chain extender is preferably a low molecular compound having 2 or more active hydrogen atoms capable of reacting with isocyanate groups in the molecule and having a molecular weight of 300 or less, and at least 1 chain extender selected from ethylene glycol, 1, 3-propanediol, 1, 4-butanediol, neopentyl glycol, 1, 5-pentanediol, 1, 6-hexanediol, and cyclohexanedimethanol may be used alone or 2 or more may be used in combination.
The polishing pad of the present embodiment preferably comprises a non-porous polymer elastomer impregnated into a nonwoven fabric and a porous thermoplastic polyurethane having a D hardness of 35 to 90. From the viewpoints of slurry retention and clogging inhibition, the porous thermoplastic polyurethane preferably has a porous structure in its pore shape.
In the polishing pad of the present embodiment, the ratio of the mass of the nonporous polymer elastomer to the mass of the porous polymer elastomer (mass of the porous thermoplastic polyurethane) is 0.49 or less. When the ratio of the mass of the nonporous polymer elastomer to the mass of the porous polymer elastomer (mass of the porous thermoplastic polyurethane) exceeds 0.49, the porous thermoplastic polyurethane in the polishing pad decreases, the slurry retention during polishing decreases, and the polishing rate decreases. In addition, the hardness of the polishing pad also decreases, and polishing uniformity tends to decrease. In addition, from the polishing pad of high hardness aspect, preferably, the nonporous polymer elastomer content relative to porous thermoplastic polyurethane content of the lower limit of 0.30.
From these viewpoints, the ratio of the mass of the nonporous polymer elastomer to the mass of the porous polymer elastomer is preferably 0.35 or more, more preferably 0.38 or more, and further preferably 0.47 or less, more preferably 0.46 or less.
The apparent density of the polishing pad of the present embodiment is preferably 0.50 to 0.90g/cm 3 . Watch (watch)When the density is within the above range, the rigidity and the volume of the communication holes become moderate, and thus it is preferable in view of suppressing scratches and obtaining a high polishing rate. From this viewpoint, it is more preferably 0.55 to 0.85g/cm 3 More preferably 0.58 to 0.80g/cm 3 More preferably 0.60 to 0.75g/cm 3 . When the apparent density is too low, the rigidity tends to be low, and when the apparent density is too high, the porous volume tends to be small, so that the polishing dust and abrasive grains of the polishing slurry are hard to be discharged, and the effect of suppressing scratches on the polished surface tends to be low.
In the present invention, the apparent density of the polishing pad can be measured by the method described in examples.
The polishing pad of the present embodiment preferably has a C hardness of 80 or more, more preferably 85 or more. When the pad hardness is too low, the polishing pad becomes too soft, and the polishing rate and planarization performance are reduced. In addition, if the pad hardness is too high, the pad becomes too hard, and the following property to the surface to be polished is lowered, so that the polishing rate is lowered, and scratches tend to be easily generated on the surface to be polished, so that the upper limit of the C hardness of the polishing pad is preferably 95 or less.
In the present invention, the C hardness of the polishing pad can be measured by the method described in examples.
The method for manufacturing a polishing pad according to the present embodiment includes the steps of: a step of imparting an aqueous nonporous polymer elastomer to a nonwoven fabric formed of ultrafine fiber-generating fibers; a step of forming a ultrafine fiber nonwoven fabric by ultrafinely shattering ultrafine fiber-generating fibers; and a step of wet-solidifying the polymer elastomer containing the solvent, and applying the porous polymer elastomer so that the ratio of the mass of the non-porous polymer elastomer to the mass of the porous polymer elastomer is 0.49 or less. By initially providing a nonwoven fabric formed of ultrafine fiber-generating fibers with a smaller amount of a nonporous polymer elastomer than a porous polymer elastomer, the shape retention after the next step is performed at a low density is facilitated, the impregnation of the porous thermoplastic polyurethane is improved, and the formation of a porous structure is facilitated.
In the polishing pad of the present embodiment, in order to impart cushioning properties to the surface opposite to the polishing surface even when the polishing pad is formed as a single layer, a polishing pad having a multilayer structure in which a known cushioning layer formed of an elastomer sheet having a foam structure or a non-foam structure, a nonwoven fabric impregnated with an elastomer, or the like is laminated can be manufactured. The buffer layer may be laminated into a sheet using an adhesive or an adhesive.
The thickness of the polishing pad is not particularly limited, but is preferably 0.8 to 3.5mm, more preferably 1.0 to 3.0mm. From the viewpoints of polishing performance and pad life, it is preferably 1.2 to 2.5mm.
When the mass of the nonwoven fabric constituting the polishing pad is Wa, the mass of the nonporous polymer elastomer is Wb, and the mass of the porous polymer elastomer is Wc, the ratio of the mass of the nonwoven fabric constituting the polishing pad (Wa) to the mass of the entire polishing pad (wa+wb+wc) is preferably 0.600 or more. When the mass ratio is 0.600 or more, the hardness of the polishing pad can be improved. From this viewpoint, the mass ratio is preferably 0.630 or more, more preferably 0.640 or more, and preferably 0.700 or less.
In addition, it is preferable that grooves and holes for holding an aqueous slurry are formed on the polishing surface of the polishing pad by grinding, laser processing, embossing, or the like, as necessary.
The polishing object of the polishing pad is not particularly limited, and examples thereof include a semiconductor substrate such as a silicon wafer, a glass substrate, a semiconductor device, a liquid crystal display, and the like. As the polishing method, a chemical mechanical polishing method (CMP) using a chemical mechanical polishing apparatus (CMP apparatus) and an aqueous slurry can be preferably used. Examples of CMP include: a method of polishing a surface of an object to be polished by adhering a polishing pad to a polishing platen of a CMP apparatus, pressing the object to be polished against the polishing pad while supplying an aqueous slurry to the polishing surface, and rotating the polishing platen together with the object to be polished. Before and during polishing, the polishing surface is preferably adjusted to be polished by using a diamond polishing tool, a nylon brush, or other polishing tool as needed.
Examples
Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.
First, the evaluation method used in this example will be described below.
[ mass ratio of nonwoven fabrics of polyester fibers and mass ratio of nonporous Polymer elastomer ]
Based on the mass change in the production process of the polishing pad, the mass (Wa) of the nonwoven fabric of the polyester fiber, the mass (Wb) of the impregnated nonporous polymer elastomer (nonporous polyurethane), and the mass (Wc) of the impregnated porous thermoplastic polyurethane were obtained, and the mass ratio of the nonwoven fabric of the polyester fiber in the polishing pad was obtained from the equation Wa/(wa+wb+wc). The ratio of the mass of the nonporous polymer elastomer to the mass of the porous polymer elastomer (mass of the porous thermoplastic polyurethane) was determined from Wb/Wc.
[ measurement of the coagulation Rate of Polymer diol ]
The polymer diol was dissolved in Dimethylformamide (DMF) to prepare a 10 mass% DMF solution, which was heated to 30 ℃. A DMF 10 mass% aqueous solution was added dropwise to the heated DMF solution to make it cloudy. The solidification rate was determined from an average value (average value obtained by performing 3 times of the same operation) obtained by adding dropwise the DMF 10 mass% aqueous solution at the start point and the end point, with the start point of cloudiness and the end point of complete cloudiness.
[ average cell area of cellular thermoplastic polyurethane ]
An arbitrary cross section in the thickness direction of the obtained polishing pad was photographed at 500 times using a scanning microscope (SEM). Then, the porous cross-sectional area of the thermoplastic polyurethane was binarized by image processing based on the obtained SEM photograph, and the average pore area was calculated.
[ hardness measurement ]
Hardness was measured in accordance with JIS K7311:1995. Specifically, a thermoplastic polyurethane sheet obtained by hot press molding was laminated to a thickness of 6mm or more, D hardness was obtained from an average value of 10 points measured, and C hardness was obtained from an average value of 10 points measured by laminating a polishing pad to a thickness of 6mm or more.
[ diameter of Single fiber ]
The cross section of the polishing pad perpendicular to the thickness direction containing the fibers was observed at 1000 times using a scanning electron microscope, and the measurement result was taken as a single fiber diameter.
[ apparent Density ]
The apparent density of the polishing pad was determined in accordance with JIS K7311:1995.
[ polishing Rate (polishing Rate) ]
The polishing rate of the resulting polishing pad was evaluated by the following method.
The resulting polishing pad was set on a CMP polishing apparatus (MAT-BC 15 manufactured by MAT Co.). Then, a bare silicon wafer having a diameter of 4 inches was polished for 10 minutes while supplying the polishing slurry at a rate of 200 mL/min under conditions of a platen rotation speed of 100rpm, a head rotation speed of 99rpm and a polishing pressure of 57 kPa. As the polishing slurry, a slurry prepared by diluting "Glanzox1302" manufactured by Fujimi Incorporated corporation by 20 times was used. Then, the bare silicon wafer was replaced and polishing was repeated similarly, for a total of 5 bare silicon wafers. Then, the polishing rate was calculated from the difference in quality before and after polishing of the polished 5 bare silicon wafers. The average value of the polishing rates of 5 bare silicon wafers was then calculated.
Example 1
The sea-island type composite fiber comprising polyethylene terephthalate (PET) as an island component, water-soluble thermoplastic polyvinyl alcohol (PVA) as a sea component, a mass ratio of sea component/island component of 25/75, and an island number of 25 islands was spun by discharging a strand of the sea-island type composite fiber from a melt composite spinning tube head at 265 ℃ and stretching, refining, and cooling. Then, the long fiber web was obtained by continuous capturing and pressing. Next, 2 long webs were overlapped, and the two sides were alternately needle punched to bind the long webs to each other, thereby obtaining a three-dimensional bound body.
Next, an aqueous emulsion of a polycarbonate-based polyurethane (Tg: -27 ℃ C., storage modulus (23 ℃ C.): 32.6MPa, storage modulus (50 ℃ C.): 19.5 MPa) as a nonporous polymer elastomer was padded to a three-dimensional cohesive body, and impregnation was applied thereto and then dried. This treatment corresponds to "a step of imparting an aqueous nonporous polymer elastomer to a nonwoven fabric formed of ultrafine fiber-forming fibers" in the production method of the present invention.
Then, the three-dimensional cohesive body was padded in hot water to dissolve and remove the water-soluble thermoplastic PVA of the island component from the sea-island type composite fiber, and dried, thereby obtaining a nonwoven fabric formed of 25 bundles of PET fibers having an average single fiber fineness of 0.05dtex and a sheet having a thickness of 1.8mm to which nonporous polyurethane was added. This treatment corresponds to "the step of forming the ultrafine fiber nonwoven fabric by ultrafinely fiberizing ultrafine fiber-generating fibers" in the production method of the present invention. The average filament diameter of the nonwoven fabric obtained was 3.0. Mu.m.
[ Synthesis of cellular thermoplastic polyurethane ]
Polycaprolactone diol (PLACCEL 210 manufactured by Cellonite Co., ltd.) was charged into a 2L glass flask, and deaeration was performed at 80 ℃. After degassing, 1, 4-butanediol (manufactured by Tokyo chemical industries Co., ltd.) was charged as a chain extender, and dimethylformamide (manufactured by FUJIFILM Wako Pure Chemical Co.) was further charged and stirred. After stirring, diphenylmethane diisocyanate (MILLIONATE MT manufactured by Tosoh corporation) was added as isocyanate, and the reaction was performed while heating and stirring were performed, while confirming an increase in viscosity. Diphenylmethane diisocyanate was gradually added and stirred so that the liquid viscosity became 1500 mPas from 500 mPas. After measuring the viscosity of the liquid, the liquid was cooled at room temperature to obtain thermoplastic polyurethane. Table 1 shows the composition and hardness of the thermoplastic polyurethane.
[ impregnation imparting of cellular thermoplastic polyurethane ]
The sheet comprising the resulting PET nonwoven fabric and nonporous polyurethane was cut into 380mm by 380mm pieces. Then, the cut sheet was impregnated with a cellular thermoplastic polyurethane having a D hardness of 80. Table 1 shows the composition and hardness of the cellular thermoplastic polyurethane.
Impregnation was applied as follows. The thermoplastic polyurethane 25% strength dmf solution was heated to 30 ℃. The above sheet was allowed to stand thereon for 10 minutes to allow DMF solution to permeate. Further, the mixture was immersed in DMF solution for 5 minutes. Next, the sheet was removed, placed on a glass plate, and the adhered DMF solution was removed by lightly scratching the surface of the sheet with a doctor blade. The same is done for the back side.
Next, the raw material impregnated with the DMF solution was immersed in a DMF concentration 10% aqueous solution maintained at 30 ℃ and left for 30 minutes, thereby solidifying the cellular thermoplastic polyurethane. Then, the sheet obtained by solidifying and impregnating the porous thermoplastic polyurethane is immersed in hot water at 70 to 95 ℃, held by a metal roll, squeezed to obtain water, and then washed with water so as to be immersed in the hot water again. The water-washed raw material was then placed in a hot air dryer (apparatus name: safety Ovens SPH-202/ESPEC Co.) and dried at 100℃for 40 minutes. Thus, a raw material of the polishing pad (referred to as a pad raw material intermediate) was obtained. The treatment corresponds to "the polymer elastomer having a solvent property in the production method of the present invention is wet-coagulated, and the porous polymer elastomer is provided such that the ratio of the mass of the non-porous polymer elastomer to the mass of the porous polymer elastomer is 0.49 or less.
[ planarization and groove processing of pad Material intermediate ]
The surface of the pad raw material intermediate was polished with sandpaper (model # 180) to eliminate thickness unevenness and to make it flat, thereby producing a polishing pad. Then, an adhesive tape is attached to the polished surface. Then, grid grooves having a groove width of 2.0mm, a groove depth of 0.5mm and a pitch of 15mm were formed on the polishing surface of the polishing pad by a flattening groove processor. Then, a grooved polishing pad was obtained by cutting the polishing pad having the lattice grooves into a circular shape having a diameter of 370 mm. Then, the evaluation was performed by the above-described evaluation method. The results are shown in Table 1.
Example 2
A grooved polishing pad was produced in the same manner as in example 1 except that the polycaprolactone diol was changed to polycaprolactone diol in [ synthesis of cellular thermoplastic polyurethane ] of example 1, and the same evaluation was performed in the same manner as in example 1. The results are shown in Table 1.
TABLE 1
Comparative example 1
A thermoplastic polyurethane produced using polycaprolactone diol (PLACCEL 210 manufactured by Cellonite Co., ltd.), 1, 4-butanediol (manufactured by Tokyo chemical industry Co., ltd.) as a chain extender, and diphenylmethane diisocyanate (MILLIONATE MT manufactured by Tosoh Co., ltd.) as an isocyanate as a polymer diol was obtained in the same manner as the thermoplastic polyurethane described in example 1, and a 25% DMF solution was used for impregnating to obtain a polishing pad with grooves. Then, the evaluation was performed by the above-described evaluation method. The results are shown in Table 1.
As shown in table 1, the polishing pad of example 1 was improved in polishing rate by controlling the mass ratio of the components of the nonporous polymer elastomer and the porous polymer elastomer, that is, by increasing the mass ratio of the porous polymer elastomer. On the other hand, in the case of comparative example 1, since the porous polymer elastomer of the polishing pad is small, damage to the groove shape occurs during polishing, and the polishing rate decreases.
Industrial applicability
The polishing pad of the present invention can be applied to polishing of various semiconductor devices, bare silicon, micro-electro-mechanical systems (MEMS: micro Electro Mechanical Systems), siC semiconductors, and other manufacturing processes, for example.

Claims (9)

1. A polishing pad obtained by impregnating a nonwoven fabric with a nonporous polymer elastomer and a porous polymer elastomer, wherein,
the porous polymer elastomer comprises thermoplastic polyurethane, the ratio of the mass of the non-porous polymer elastomer to the mass of the porous polymer elastomer is 0.49 or less,
the nonporous high polymer elastomer is polyurethane with storage modulus of 1-40 MPa at 23 ℃ and 50 ℃.
2. The polishing pad according to claim 1, wherein the porous polymer elastomer has an average pore area of 10 to 100 μm 2 Is a porous structure of (a).
3. The polishing pad according to claim 1 or 2, wherein a solidification rate of a polymer diol forming the thermoplastic polyurethane contained in the porous polymer elastomer is 0.1 to 1.5mol.
4. The polishing pad according to claim 1 or 2, wherein the thermoplastic polyurethane contained in the porous polymer elastomer has a D hardness of 35 to 85.
5. The polishing pad according to claim 1 or 2, wherein the fibers constituting the nonwoven fabric are polyester fibers having an average single fiber diameter of 1 to 10 μm.
6. The polishing pad according to claim 1 or 2, wherein the thermoplastic polyurethane contained in the porous polymer elastomer comprises a thermoplastic polyurethane obtained by reacting a polymer diol, an organic diisocyanate, and a chain extender,
the polymer glycol comprises at least 1 selected from polyethylene glycol adipate, polybutylene glycol adipate, polycaprolactone glycol, poly (3-methyl-1, 5-pentanediol adipate), poly (hexanediol adipate), poly (3-methyl-1, 5-pentanediol terephthalate), poly (diethylene glycol adipate), poly (nonanediol adipate), poly (2-methyl-1, 8-octanediol-nonanediol adipate), polyethylene glycol, poly (diethylene glycol), polytetramethylene glycol, polypropylene glycol,
the organic diisocyanate comprises at least 1 selected from 4,4' -diphenylmethane diisocyanate, 2, 4-toluene diisocyanate, 2, 6-toluene diisocyanate, isophorone diisocyanate,
the chain extender comprises at least 1 selected from ethylene glycol, 1, 3-propylene glycol, 1, 4-butanediol, neopentyl glycol, 1, 5-pentanediol, 1, 6-hexanediol, and cyclohexanedimethanol.
7. The polishing pad according to claim 1 or 2, wherein the apparent density of the polishing pad is 0.50 to 0.90g/cm 3 。
8. The polishing pad according to claim 1 or 2, wherein the polishing pad has a C hardness of 80 or more.
9. A method of manufacturing a polishing pad, the method comprising sequentially performing the steps of:
a step of imparting an aqueous nonporous polymer elastomer to a nonwoven fabric formed of ultrafine fiber-generating fibers;
a step of forming a ultrafine fiber nonwoven fabric by ultrafinely shattering ultrafine fiber-generating fibers;
a step of wet-solidifying a polymer elastomer having a leaching agent property, and applying a porous polymer elastomer so that the ratio of the mass of the non-porous polymer elastomer to the mass of the obtained porous polymer elastomer is 0.49 or less,
the nonporous high polymer elastomer is polyurethane with storage modulus of 1-40 MPa at 23 ℃ and 50 ℃.
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