CN113225911A - Welding fastener and assembling method thereof - Google Patents
Welding fastener and assembling method thereof Download PDFInfo
- Publication number
- CN113225911A CN113225911A CN202010071928.4A CN202010071928A CN113225911A CN 113225911 A CN113225911 A CN 113225911A CN 202010071928 A CN202010071928 A CN 202010071928A CN 113225911 A CN113225911 A CN 113225911A
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- CN
- China
- Prior art keywords
- welding
- circuit board
- soldering
- fastener
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Connection Of Plates (AREA)
Abstract
The invention provides a welding fastener and an assembling method thereof. The welding fastener comprises a body part, a head part and a neck part, wherein the body part is used for being welded on the first circuit board, the head part is used for buckling the second plate, and the neck part is connected with the body part and the head part. When the automatic soldering buckle is applied, the soldering buckle is accommodated in the carrier, the automatic tool is taken out of the carrier and then is transferred and mounted on the first circuit board, and the body of the soldering buckle is soldered on the first circuit board to form a module component by heating the soldering tin layer on the first circuit board, so that the head and the neck can be used for buckling the second plate.
Description
Technical Field
The present invention relates to a welding fastener and an assembling method thereof, and more particularly, to a welding fastener and an assembling method thereof, which can make the welding fastener and a first circuit board constitute a module member and fasten a second plate by using the welding fastener.
Background
The existing technology for combining two circuit boards with each other usually adopts screw locking, for example, a plurality of screw holes are processed on a first circuit board, a connecting column with an external screw thread column at one end and an internal screw thread hole at the other end is locked on the screw hole of the first circuit board, a plurality of corresponding unthreaded holes are processed on a second plate for combination, the second plate is placed on the connecting column, a plurality of screws penetrate through the unthreaded holes of the second plate and are locked on the screw holes of the connecting column, and therefore the two circuit boards are combined with each other.
However, the above-mentioned connecting posts are locked in the combined structure of the first circuit board, and the connecting posts must be locked into the screw holes of the first circuit board one by one, which results in too slow process efficiency. Moreover, if the two circuit boards need to be frequently disassembled and assembled, the requirement of convenience in disassembly and assembly cannot be met by adopting the screw locking technology.
Disclosure of Invention
Based on at least one embodiment of the invention, the welding fastener and the assembling method thereof can enable the welding fastener and the first circuit board to form a module component, and the welding fastener is utilized to buckle the second plate, so as to achieve the purposes of simplifying a combined structure, improving the production efficiency and the like.
The invention provides a welding fastener, which is used for welding on a first circuit board and further buckling a second plate, and comprises: the body part is used for being welded on the first welding layer of the first circuit board, the head part is used for buckling the second plate, and the neck part is connected with the body part and the head part.
By the structure, the welding fastener and the first circuit board can form a module component, and the welding fastener is utilized to buckle the second plate, so that the aims of simplifying a combined structure, improving production efficiency and the like can be fulfilled.
The invention provides a structure for welding a welding fastener on a circuit board, which comprises: a first circuit board having a first solder layer; a second plate having a buckling part; and the welding fastener is welded on the first welding layer of the first circuit board, the head of the welding fastener is buckled with the buckling part of the second plate, and the neck of the welding fastener is arranged in a penetrating way in the buckling part.
The invention provides a method for welding a welding fastener on a circuit board, which comprises the following steps: the welding fastener is arranged in the accommodating space of the carrier, the welding fastener is taken out from the accommodating space of the carrier by contacting the head part through a tool, and is moved to be placed on the first welding layer of the first circuit board, then the first welding layer is heated to melt a soldering tin layer on the first welding layer into liquid soldering tin, and after the liquid soldering tin is cooled, a solid welding structure for welding the welding fastener and the first circuit board is formed.
The invention also provides an assembling method of the welding fastener, which is used for welding the welding fastener on a first circuit board so as to buckle a second plate, and the welding fastener comprises the following steps: the welding fastener can be placed on a carrier firstly, then taken out of the carrier by a tool, compared by a comparison device, and then placed on a welding position of the first circuit board for welding.
Optionally, the body portion has a mating surface correspondingly bonded to the surface of the first circuit board, and a second solder layer for providing solder adhesion.
Optionally, the body has a protrusion for penetrating an opening of the first circuit board, and a second solder layer for providing solder adhesion.
Optionally, the body portion has a shoulder for abutting against the first circuit board surface, and a second solder layer for providing solder adhesion.
Optionally, the second solder layer is an electroplated layer, and the electroplated layer is made of tin, copper, nickel or zinc.
Optionally, the body, the head and the neck are integrally formed or assembled.
Optionally, the body part and the neck part are connected into a straight column shape.
Optionally, the welding device comprises a carrier, the carrier is provided with an accommodating space and an opening of the accommodating space, and the welding fastener is arranged in the accommodating space from the opening.
Optionally, the carrier has a lid that covers the opening and can be opened.
Optionally, the welding fastener may be placed on a carrier, and the welding fastener is taken out of the carrier by a tool, and after being compared by a comparison device, the welding fastener is accurately placed at a welding position of the first circuit board for welding.
Optionally, the tool is a vacuum suction tool, a clamp, a buckle, or a magnetic suction tool.
Optionally, the comparison device is a visual comparison device, an image comparison device, a distance comparison device or a CCD comparison device.
Optionally, the first solder layer of the first circuit board has a solder layer, and the solder layer is soldered and attached to the second solder layer of the soldering fastener.
Optionally, the first solder layer of the first circuit board has a surface copper layer, and the second solder layer of the soldering fastener is soldered to the surface copper layer.
Optionally, the first solder layer of the first circuit board has a surface copper layer, and the solder layer is attached to the second solder layer of the soldering clip and the surface copper layer by soldering.
Optionally, the soldering clip and the first circuit board constitute a module member.
Optionally, the buckling part of the second plate has a through hole with a diameter larger than that of the head part, and a buckling groove communicated with the through hole and with a width smaller than that of the head part; and the neck part is arranged in the buckling groove in a penetrating way after the head part passes through the through hole.
Optionally, the buckling part of the second plate has a through hole with a diameter larger than that of the head part, a buckling hole with a diameter smaller than that of the head part, and a buckling groove which communicates the through hole with the buckling hole and has a width smaller than that of the head part; and after the head passes through the through hole, the neck is arranged in the buckling groove or the buckling hole in a penetrating mode.
Optionally, the first circuit board has a welding groove, the first welding layer is disposed in the welding groove, and the body of the welding fastener is welded to the first welding layer in the welding groove.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a perspective view of an embodiment of the integrally formed weld fastener of the present invention;
FIG. 2 is a front view of an embodiment of the integrally formed weld fastener of the present invention;
FIG. 3 is a cross-sectional view of an embodiment of the head and neck combination of the welding fastener of the present invention;
FIG. 4 is a cross-sectional view of an embodiment of the body and neck combination of the welding fastener of the present invention;
FIG. 5 is a cross-sectional view of an embodiment of the body and neck combination of the head of the welding fastener of the present invention;
FIG. 6 is a cross-sectional view of a body-head to neck threaded embodiment of the welding fastener of the present invention;
FIG. 7 is a cross-sectional view of an embodiment of the present invention with the weld fastener disposed on the carrier;
FIG. 8A is a schematic view of the removal of the welding fastener of the present invention from a carrier by a tool;
FIG. 8B is a schematic diagram of the operation of the soldering clip of the present invention being displaced by a tool over the surface of a circuit board;
FIG. 8C is a schematic view of the soldering clip of the present invention being soldered to a surface of a first circuit board by heating;
FIG. 9A is a schematic view of the operation of the soldering clip of the present invention being moved to the opening of the first circuit board by a tool;
FIG. 9B is a schematic view of the soldering clip of the present invention being soldered to an opening of a first circuit board by heating;
FIG. 10 is a cross-sectional view of a first circuit board solder socket of the present invention;
FIG. 11 is a cross-sectional view of a first circuit board solder socket of the present invention;
FIG. 12 is a perspective view of the soldering clip of the present invention soldered to a first circuit board and engaging with a second board;
FIG. 13 is a cross-sectional view of the soldering clip of the present invention soldered to a first circuit board and engaging a second board;
FIG. 14 is a perspective view of another embodiment of a fastening portion of a second plate member according to the present invention;
FIG. 15 is a cross-sectional view of another embodiment of a fastening portion of a second plate member according to the present invention;
FIG. 16 is a perspective view of an embodiment of the carrier of the present invention embodied in the form of a disk;
FIG. 17 is a schematic view of an embodiment of the present invention in which the carrier is implemented as a wound strip;
FIG. 18 is a first schematic view illustrating the soldering of the soldering clip of the present invention to a first circuit board;
fig. 19 is a second schematic view illustrating the soldering of the soldering clip and the first circuit board according to the present invention.
Reference numerals
1 welding fastener
11 body part
111 butt joint surface
112 second solder layer
113 convex part
114 shoulder portion
12 head
13 neck part
2 first circuit board
21 first welding layer
211 solder layer
212 surface copper layer
22 open pores
23 welding groove
3 second plate
31 buckling part
311 perforation
312 fastening groove
313 fastening hole
4 vectors
41 accommodating space
42 opening
43 cover body
5 tools
6 compare the device
Detailed Description
The welding fastener and the assembling method thereof according to the embodiments of the present invention will be further described with reference to the accompanying drawings.
Referring to fig. 1 and 2, which are a perspective view and a front view of an embodiment of the integrally formed welding fastener of the present invention, the welding fastener 1 is used for welding on a first circuit board 2 (as shown in fig. 8C, 11 and 13) and further can be fastened to a second board 3 (as shown in fig. 11 and 13), the preferred embodiment of the welding fastener 1 can adopt an integrally forming technology, and further forms a body 11 for welding on a first welding layer 21 of the first circuit board 2, a head 12 for fastening the second board 3, and a neck 13 connected between the body 11 and the head 12, wherein: the body 11 and the head 12 may be circular, polygonal or other geometric shapes or shapes, and the neck 13 is a cylinder or polygonal column with a diameter smaller than that of the body 11 and the head 12.
The welding fastener 1 of the present invention is not limited to the above-mentioned integrally formed structure, and the welding fastener 1 may also be implemented as a combined structure; as shown in fig. 3, the welding fastener 1 integrally forms the body portion 11 and the neck portion 13, and then combines the other end of the neck portion 13 with the head portion 12; or as shown in fig. 4, the welding fastener 1 integrally forms the head portion 12 and the neck portion 13, and then combines the other end of the neck portion 13 with the body portion 11; or as shown in fig. 5, the welding fastener 1 makes the body 11, the head 12 and the neck 13 as independent components, and makes one end of the neck 13 combined with the body 11 and the other end combined with the head 12; the above-mentioned combination is not limited in structure and manner, and can be riveted, pressed, screwed (as shown in fig. 6) or any other combination structure and method. In addition, as shown in fig. 11, the body portion 11 and the neck portion 13 of the welding fastener 1 of the present invention may be connected to each other to form a straight column shape or integrally formed to form a straight column shape.
As shown in fig. 1 and fig. 2, the body 11 of the soldering clip 1 of the present invention may be implemented with a butting surface 111 correspondingly connected to the surface of the first circuit board 2, and a second solder layer 112 for providing solder adhesion may be implemented around the body 11 or on the butting surface 111. As shown in fig. 3, 4, 5 and 6, the body 11 of the present invention may be implemented with a protrusion 113 for being inserted into the opening 22 of the first circuit board 2, the body 11 may also be implemented with a shoulder 114 for being abutted against the surface of the first circuit board 2, and thus a second solder layer 112 for providing solder adhesion may be implemented around the protrusion 113 and/or around the shoulder 114, and the second solder layer 112 may be implemented as a plating layer of tin, copper, nickel or zinc, so that the soldering clip 1 is more suitable for soldering combination with the first circuit board 2.
As shown in fig. 7, after the welding fastener according to the present invention is manufactured or combined according to the above features, the welding fastener may be further packed in a carrier 4, the carrier 4 may be made of plastic, such that a plurality of accommodating spaces 41 and openings 42 on each accommodating space 41 are formed in the carrier 4, and a cover 43 or a film covering the openings 42 and being openable may be implemented (or no cover 43 or film is needed); therefore, the welding fasteners 1 are placed in the accommodating space 41 through the opening 42, the body 11 faces the accommodating space 41, the head 12 faces the opening 42, and the welding fasteners 1 are orderly arranged and accommodated in the carrier 4, so as to be convenient for storage, transportation, and taking by using the tool 5 (as shown in fig. 8A). As shown in fig. 14, the carrier 4 may be implemented as a hard disc body, and an accommodating space 41 is formed in the disc body for accommodating the welding fastener 1; alternatively, as shown in fig. 15, the carrier 4 may be implemented as a windable strip, and a receiving space 41 is formed in the strip for receiving the welding fastener 1.
Through the technical characteristics of the welding fastener 1 and the carrier 4, the invention further provides a structure and a method for welding the welding fastener on a circuit board, as shown in fig. 8A, the structure and the method for welding the welding fastener 1 on the circuit board can contact the head 12 of the welding fastener 1 through a tool 5, and then the welding fastener 1 is taken out of the accommodating space 41 of the carrier 4; then, as shown in fig. 8B, after the soldering clip 1 is taken out by the tool 5, the soldering clip can be transferred and placed on the first solder layer 21 of the first circuit board 2, so that the body 11 is attached to the first solder layer 21, then the soldering tin layer 211 on the first solder layer 21 is melted into liquid soldering tin by hot return air soldering heating or other heating techniques, and then the liquid soldering tin is cooled at normal temperature to form a solid soldering structure for soldering the soldering clip 1 and the first circuit board 2, so that the soldering clip 1 and the first circuit board 2 form a module component, and then the soldering clip 1 can be used to clip the second board 3. The tool 5 is preferably a vacuum suction device, which can be sucked when contacting the top end of the head 12 of the soldering clip 1 again, so as to take the soldering clip 1 out of the accommodating space 41 of the carrier 4 for transferring to the first circuit board 2 for soldering.
As shown in fig. 9A and 9B, the first circuit board 2 of the present invention may be provided with an opening 22, and a first solder layer 21 is applied around the opening 22, so that the soldering clip 1 can be transferred to the first circuit board 2 by the above method, such that the protrusion 113 of the soldering clip 1 penetrates into the opening 22, and the shoulder 114 abuts against the periphery of the opening 22, such that the solder layer 211 on the first solder layer 21 is melted into a liquid solder by hot return welding heating or other heating techniques, and then a solid soldering structure for soldering the soldering clip 1 and the first circuit board 2 is formed after the liquid solder is cooled at normal temperature, such that the soldering clip 1 and the first circuit board 2 form a module component, and then the soldering clip 1 can be used to fasten the second board 3.
As shown in fig. 8B or 9A, the first solder layer 21 of the first circuit board 2 according to the present invention is preferably pre-coated with a solder layer 211, so that the solder layer 211 is melted and re-solidified by hot return air soldering heating or other heating techniques, and then soldered to the second solder layer 112 of the solder clip 1. The first solder layer 21 of the first circuit board 2 is specifically provided with a surface copper layer 212, and the solder layer 112 is melted and then solidified, and then soldered to the second solder layer 112 of the soldering clip 1 and the surface copper layer 212. The Solder layer 211 is soft Solder such as Solder paste (Solder paste), and is pre-disposed in the surface copper layer 212 or the opening 22 to be soldered to the soldering clip 1. As shown in fig. 10 and 11, the first circuit board 2 of the present invention may further include a solder socket 23, the first solder layer 21 may be recessed in the solder socket 23 according to the shape of the solder socket 23, and then the abutting surface 111 and the second solder layer 112 of the body 11 of the solder clip 1 may be soldered to the solder layer 211 of the first solder layer 21 in the solder socket 23, so that the solder clip 1 of the present invention may be more stably connected to the first circuit board 2.
By using the structure and method for welding the welding fastener on the circuit board, after the welding fastener 1 and the first circuit board 2 form a module member, a second plate 3 can be fastened by using the welding fastener 1, as shown in fig. 10 and 11, the second plate 3 can be provided with a fastening portion 31 for matching the head 12 and the neck of the welding fastener 1, so that the neck 13 of the welding fastener 1 is inserted into the fastening portion 31, and the head 12 is fastened to the fastening portion 31. As shown in fig. 10 and 11, the fastening portion 31 may be formed with a through hole 311 having a diameter larger than that of the head portion 12 and a fastening groove 312 communicating with the through hole 311 and having a width smaller than that of the head portion 12, so that after the head portion 12 of the welding fastener 1 passes through the through hole 311, the second plate 3 is moved to pass the neck portion 13 through the fastening groove 312, thereby forming a structure for fastening the second plate 3. Or as shown in fig. 12 and 13, the fastening portion 31 may also be implemented with a through hole 311 having a diameter larger than the head portion 12, a fastening hole 313 having a diameter smaller than the head portion 12, and a fastening groove 312 communicating the through hole 311 and the fastening hole 313 and having a width smaller than the head portion 12, so that after the head portion 12 of the welding fastener 1 passes through the through hole 311, the second plate 3 is moved to allow the neck portion 13 to pass through the fastening groove 312 or the fastening hole 313, so as to form a structure for fastening the second plate 3, and conversely, the second plate 3 can be reversely separated from the welding fastener 1.
As shown in fig. 18, the soldering clip 1 of the present invention can be placed on a carrier 4, and the soldering clip 1 is taken out from the carrier 4 by a tool 5, and after being compared by a comparison device 6, the soldering clip 1 is precisely transferred and placed on the first circuit board 2, such that the protrusion 113 of the soldering clip 1 penetrates into the opening 22, and the shoulder 114 abuts against the periphery of the opening 22, such that the soldering layer 211 on the first solder layer 21 is melted into a liquid soldering tin by hot return air soldering heating or other heating techniques, and then the liquid soldering tin is cooled at room temperature to form a solid soldering structure for soldering the soldering clip 1 and the first circuit board 2, such that the soldering clip 1 and the first circuit board 2 form a module component, and then the soldering clip 1 can be used to fasten the second board 3.
In addition, in the embodiment of the present invention, the tool 5 is a vacuum suction tool, a clamp, a buckle, or a magnetic suction tool, and the comparison device 6 is a visual comparison device, an image comparison device, a distance comparison device, or a CCD comparison device.
As shown in fig. 19, the welding fastener 1 of the present invention can be placed on a carrier 4, the welding fastener 1 is taken out from the carrier 4 by a tool 5, and after being compared by a comparison device 6, the welding fastener 1 is precisely transferred and placed on the first solder layer 21 of the first circuit board 2, such that the body 11 is attached to the first solder layer 21, and then the soldering layer 211 on the first solder layer 21 is melted into liquid soldering tin by hot return air welding heating or other heating techniques, and then a solid welding structure for welding the welding fastener 1 and the first circuit board 2 is formed at normal temperature after the liquid soldering tin is cooled, such that the welding fastener 1 and the first circuit board 2 form a module component, and then the welding fastener 1 can be used to fasten the second board 3.
In summary, the welding fastener and the assembling method thereof according to the embodiments of the present invention can make the welding fastener and the first circuit board form a module member, and the welding fastener is used to fasten the second plate, so as to achieve the purposes of simplifying the assembly structure and improving the production efficiency.
The above description is only an example of the present invention, and is not intended to limit the scope of the present invention.
Claims (6)
1. The utility model provides a welding fastener, its characterized in that for the welding is on first circuit board, and then lock second plate, welding fastener includes: the welding fastener is used for welding the body part of the first welding layer of the first circuit board and is used for buckling the head part of the second plate and connecting the body part with the neck part of the head part, the welding fastener can be placed on the carrier and can be used as a tool to place the welding fastener on the carrier, and after the comparison of the comparison device, the welding fastener is placed on the welding position of the first circuit board for welding.
2. The soldering clip assembly of claim 1, wherein the first circuit board has a first solder layer, the soldering clip assembly can be transferred to the first solder layer of the first circuit board to be placed on the first solder layer, and the body of the soldering clip assembly can be attached to the first solder layer, and the first solder layer can be formed into a solid-state soldering structure for soldering the soldering clip assembly and the first circuit board by hot-return soldering heating or other heating techniques, so that the soldering clip assembly and the first circuit board form a module component.
3. The soldering clip assembly of claim 1, wherein the first circuit board has a first solder layer, the body portion has a protrusion for passing through the opening of the first circuit board, the soldering clip assembly can be transferred to the first solder layer of the first circuit board, and the first solder layer is formed into a solid-state soldering structure for soldering the soldering clip assembly and the first circuit board by hot-return soldering heating or other heating techniques, such that the soldering clip assembly and the first circuit board form a module component.
4. The welding fastener of claim 1, wherein the tool is a vacuum suction tool, a clamp, a clasp, or a magnetic suction tool.
5. The welding fastener of claim 1, wherein the comparison device is a visual comparison device, an image comparison device, a distance comparison device, or a CCD comparison device.
6. An assembling method of a welding fastener, which is used for welding the welding fastener on a first circuit board to further fasten a second plate, the welding fastener comprises: the welding fastener can be placed on a carrier firstly, then taken out of the carrier by a tool, compared by a comparison device, and then placed on a welding position of the first circuit board for welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010071928.4A CN113225911A (en) | 2020-01-21 | 2020-01-21 | Welding fastener and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010071928.4A CN113225911A (en) | 2020-01-21 | 2020-01-21 | Welding fastener and assembling method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113225911A true CN113225911A (en) | 2021-08-06 |
Family
ID=77085354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010071928.4A Withdrawn CN113225911A (en) | 2020-01-21 | 2020-01-21 | Welding fastener and assembling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113225911A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040231878A1 (en) * | 2003-05-19 | 2004-11-25 | Takaaki Higashida | Electronic circuit connecting structure, and its connecting method |
| CN102917553A (en) * | 2012-10-22 | 2013-02-06 | 友达光电（苏州）有限公司 | Welding positioning structure |
| US20140254094A1 (en) * | 2013-03-06 | 2014-09-11 | U. D. Electronic Corp. | Assembly Structure with Filter Device and Printed Circuit Board and Welding Method for Making the Same |
| CN105792515A (en) * | 2014-12-25 | 2016-07-20 | 台达电子工业股份有限公司 | Circuit board combination and assembly method thereof |
| CN106257972A (en) * | 2015-06-18 | 2016-12-28 | 达霆精密工业有限公司 | Welding fastener and structure and method for welding same on circuit board |
| TWM578335U (en) * | 2019-01-18 | 2019-05-21 | 達霆精密工業有限公司 | Structure capable of retaining fastener solder |
-
2020
- 2020-01-21 CN CN202010071928.4A patent/CN113225911A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040231878A1 (en) * | 2003-05-19 | 2004-11-25 | Takaaki Higashida | Electronic circuit connecting structure, and its connecting method |
| CN102917553A (en) * | 2012-10-22 | 2013-02-06 | 友达光电（苏州）有限公司 | Welding positioning structure |
| US20140254094A1 (en) * | 2013-03-06 | 2014-09-11 | U. D. Electronic Corp. | Assembly Structure with Filter Device and Printed Circuit Board and Welding Method for Making the Same |
| CN105792515A (en) * | 2014-12-25 | 2016-07-20 | 台达电子工业股份有限公司 | Circuit board combination and assembly method thereof |
| CN106257972A (en) * | 2015-06-18 | 2016-12-28 | 达霆精密工业有限公司 | Welding fastener and structure and method for welding same on circuit board |
| TWM578335U (en) * | 2019-01-18 | 2019-05-21 | 達霆精密工業有限公司 | Structure capable of retaining fastener solder |
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Application publication date: 20210806 |