CN113225908A

CN113225908A - Novel radio frequency circuit pad of 5G module, circuit board and communication equipment

Info

Publication number: CN113225908A
Application number: CN202110481765.1A
Authority: CN
Inventors: 何超
Original assignee: Shenzhen Yixuan Communication Co ltd
Current assignee: Shenzhen Yixuan Communication Co ltd
Priority date: 2021-04-30
Filing date: 2021-04-30
Publication date: 2021-08-06

Abstract

The invention relates to a novel radio frequency circuit pad of a 5G module, which comprises an annular grounding protection layer and a pad feed point connected with an antenna; the pad feed point is positioned in the annular inner area of the grounding protection layer, and the pad feed point is not in contact with the grounding protection layer; the novel radio frequency circuit bonding pad of the 5G module is simple in design, can be manufactured during PCB production, greatly saves cost, effectively protects signal circulation from interference, can reduce debugging complexity during radio frequency debugging, and improves radio frequency index consistency.

Description

Novel radio frequency circuit pad of 5G module, circuit board and communication equipment

Technical Field

The invention relates to the technical field of 5G modules, in particular to a novel radio frequency circuit bonding pad, a novel radio frequency circuit board and novel radio frequency circuit communication equipment of a 5G module.

Background

With the increasing demand of each industry on the 5G module and the increasing abundance of application scenes, the performance stability and the high reliability of operation of the 5G module become key; most 2G 3G 4G wireless communication modules in the industry adopt a simple radio frequency base design scheme or adopt independent welding spots, although contact surfaces are increased, the periphery has no ground protection, the reliability of the designed wireless communication module is poor, the wireless communication module is inconvenient to debug, and a novel radio frequency circuit pad design of a 5G module capable of solving the problem is needed.

Disclosure of Invention

The invention aims to solve the technical problem of providing a novel radio frequency circuit bonding pad of a 5G module, a circuit board and communication equipment aiming at the defects in the prior art.

The technical scheme adopted by the invention for solving the technical problems is as follows:

constructing a novel radio frequency circuit pad of a 5G module, wherein the novel radio frequency circuit pad comprises an annular grounding protection layer and a pad feed point connected with an antenna; the pad feed point is located in the annular inner area of the grounding protection layer, and the pad feed point is not in contact with the grounding protection layer.

According to the novel radio frequency circuit bonding pad of the 5G module, the feeding point of the bonding pad is circular.

According to the novel radio frequency circuit bonding pad of the 5G module, the grounding protection layer is annular.

According to the novel radio frequency circuit bonding pad of the 5G module, the bonding pad feed point is located at the center of the grounding protection layer, or the center of the bonding pad feed point is superposed with the center of the grounding protection layer.

According to the novel radio frequency circuit bonding pad of the 5G module, the bonding pad feed point is directly processed on a PCB or processed during PCB production.

The novel radio frequency circuit bonding pad of the 5G module is characterized in that the grounding protection layer is directly processed on a PCB (printed Circuit Board) or processed during production of the PCB

According to the novel radio frequency circuit bonding pad of the 5G module, the grounding protection layer is made of copper.

A circuit board is provided with the novel radio frequency circuit bonding pad of the 5G module.

According to the circuit board, the novel radio frequency circuit bonding pad of the 5G module is processed on the circuit board or is processed during production of the circuit board.

A circuit board of the communication equipment is provided with the novel radio frequency circuit bonding pad of the 5G module.

The invention has the beneficial effects that: the novel radio frequency circuit bonding pad of the 5G module is simple in design, can be manufactured during PCB production, greatly saves cost, effectively protects signal circulation from interference, can reduce debugging complexity during radio frequency debugging, and improves radio frequency index consistency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:

FIG. 1 is a diagram illustrating a pad structure of a novel RF circuit of a 5G module according to a preferred embodiment of the present invention;

fig. 2 is a schematic diagram of a pad circuit of a novel radio frequency circuit of a 5G module according to a preferred embodiment of the invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.

The novel pad of the 5G module rf circuit according to the preferred embodiment of the present invention is shown in fig. 1, and also shown in fig. 2, and includes an annular ground protection layer 1 and a pad feed point 2 connected to an antenna; the pad feed point 2 is positioned in the annular inner area of the grounding protection layer 1, and the pad feed point 2 is not in contact with the grounding protection layer 1; the novel radio frequency circuit bonding pad of the 5G module is simple in design, can be manufactured during PCB production, greatly saves cost, effectively protects signal circulation from interference, can reduce debugging complexity during radio frequency debugging, and improves radio frequency index consistency;

the innovative design scheme of the radio frequency circuit pad greatly improves the production process and the high reliability of a radio frequency communication design circuit, is suitable for various wireless communication module products, comprises the communication module design of a local area network (GPS/WIFI/UWB and the like) and a wide area network (NBIOT/LTE/5G and the like), and brings wide benefits to the application of various industries of vehicle-mounted/CPE/electric power.

Preferably, the pad feed point 2 is circular; the circular pad feed point 2 can ensure a larger contact area during welding;

of course, it will be understood that equivalents may be substituted for other shapes as may be desired: such as oval, square, star, etc., and simple shape changes based on the principles of the present application are within the scope of the present application.

Preferably, the grounding protection layer 1 is annular; the grounding protection layer 1 is designed into a ring shape, so that a better and more uniform protection effect is achieved;

of course, it will be understood that other shapes may be substituted with equivalents thereof according to actual needs: such as oval, square, star, etc., and simple shape changes based on the principles of the present application are within the scope of the present application.

Preferably, the pad feed point 2 is located at the center of the grounding protection layer 1, or the center of the pad feed point 2 coincides with the center of the grounding protection layer 1; the reliability of protection is convenient to promote.

Preferably, the pad feed point 2 is directly processed on the PCB or processed during PCB production; through two modes, the processing technology of the pad feed point can be optimized;

during production, the PCB can be directly processed and manufactured on a finished product or a semi-finished product through etching, laser or cutter cutting and other technological means, so that the purposes of simplifying the production technology and reducing the cost are achieved.

Preferably, the grounding protection layer 1 is directly processed on the PCB or processed during the production of the PCB;

Preferably, the ground protection layer 1 is made of copper; the protection reliability is guaranteed;

of course, it is understood that other metal materials, such as aluminum, silver, etc., may be substituted according to actual needs, and that simple shape changes based on the principles of the present application are within the scope of the present application.

The circuit board of the novel radio frequency circuit bonding pad of the 5G module can protect signal circulation from interference, greatly improve production efficiency during production and simultaneously improve high reliability of the wireless module in the operation process;

preferably, the novel radio frequency circuit bonding pad of the 5G module is processed on the circuit board or is processed during the production of the circuit board; is convenient for optimizing the production process.

A communication device is provided, wherein a circuit board of the communication device is provided with the novel radio frequency circuit pad of the 5G module; the communication equipment comprises all existing equipment types.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

Claims

1. A novel radio frequency circuit pad of a 5G module is characterized by comprising an annular grounding protection layer and a pad feed point connected with an antenna; the pad feed point is located in the annular inner area of the grounding protection layer, and the pad feed point is not in contact with the grounding protection layer.

2. The pad of claim 1, wherein the pad feed point is circular.

3. The novel RF circuit pad of claim 2, wherein the ground shield has a ring shape.

4. The novel RF circuit pad of 5G module as claimed in any one of claims 1-3, wherein the pad feed point is located at the center of the ground shield, or the center of the pad feed point coincides with the center of the ground shield.

5. A novel pad for a 5G module radio frequency circuit according to any one of claims 1 to 3, wherein the pad feed point is machined directly on the PCB or during PCB production.

6. The novel RF circuit pad of 5G module according to any one of claims 1-3, wherein the grounding protection layer is processed directly on the PCB or during PCB production.

7. The pad of claim 1-3, wherein the ground shield is made of copper.

8. A circuit board, characterized in that the circuit board is provided with a novel 5G module radio frequency circuit pad according to any one of claims 1-7.

9. The circuit board of claim 8, wherein the 5G module new rf circuit pads are machined on the circuit board or during the circuit board production.

10. A communication device, characterized in that a circuit board of the communication device is provided with a novel 5G module radio frequency circuit pad according to any one of claims 1-7.