CN113202848A - Sensor assembling equipment - Google Patents
Sensor assembling equipment Download PDFInfo
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- CN113202848A CN113202848A CN202110488772.4A CN202110488772A CN113202848A CN 113202848 A CN113202848 A CN 113202848A CN 202110488772 A CN202110488772 A CN 202110488772A CN 113202848 A CN113202848 A CN 113202848A
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- 230000007246 mechanism Effects 0.000 claims abstract description 111
- 238000012360 testing method Methods 0.000 claims abstract description 71
- 230000003750 conditioning effect Effects 0.000 claims abstract description 64
- 238000004806 packaging method and process Methods 0.000 claims abstract description 56
- 238000003754 machining Methods 0.000 claims abstract description 17
- 230000004913 activation Effects 0.000 claims description 40
- 239000003292 glue Substances 0.000 claims description 39
- 238000007599 discharging Methods 0.000 claims description 23
- 238000009434 installation Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 12
- 239000011265 semifinished product Substances 0.000 claims description 10
- 210000004907 gland Anatomy 0.000 claims description 7
- 239000000047 product Substances 0.000 claims description 7
- 238000012546 transfer Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012956 testing procedure Methods 0.000 abstract description 4
- 238000001994 activation Methods 0.000 description 32
- 238000000034 method Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 17
- 230000005540 biological transmission Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000000678 plasma activation Methods 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000003213 activating effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
Abstract
The invention discloses sensor assembling equipment which comprises a conveying mechanism, and a core packaging device, a first high-temperature curing device, an upper cover mounting device, a second high-temperature curing device and a conditioning testing device which are sequentially arranged along the machining direction. According to the technical scheme provided by the invention, the core body packaging device, the first high-temperature curing device, the upper cover mounting device, the second high-temperature curing device and the conditioning testing device are sequentially arranged along the processing direction by arranging the conveying mechanism, so that the core body mounting, the upper cover mounting and the conditioning testing procedures can be orderly and automatically carried out, the automatic continuous processing of sensor assembly is realized, and the production efficiency is improved.
Description
Technical Field
The invention relates to the technical field of sensor processing, in particular to sensor assembling equipment.
Background
The sensor is a detection device which can sense the measured information and convert the sensed information into an electric signal or other information in a required form according to a certain rule to output so as to meet the requirements of information transmission, processing, storage, display, recording, control and the like. The sensors include temperature sensors, pressure sensors, light sensitive sensors, etc. according to their basic sensing functions.
The sensor generally comprises four parts, namely a sensitive element, a conversion circuit and an auxiliary power supply, and when the sensor is processed, a plurality of assembling and detecting processes are required.
Disclosure of Invention
The invention mainly aims to provide sensor assembling equipment and aims to solve the problem that the traditional sensor is low in production efficiency.
In order to achieve the above object, the present invention provides a sensor assembling apparatus, which includes a conveying mechanism, and a core packaging device, a first high temperature curing device, an upper cover mounting device, a second high temperature curing device, and a conditioning and testing device, which are sequentially arranged along the processing direction, wherein:
the conveying mechanism is used for conveying a workpiece, so that the workpiece sequentially passes through the core body packaging device, the first high-temperature curing device, the upper cover mounting device, the second high-temperature curing device and the conditioning testing device;
the core packaging device is used for bonding a core in the lower shell of the sensor to form a first assembly;
the first high-temperature curing device is used for carrying out high-temperature curing treatment on the first assembly to obtain a second assembly;
the upper cover mounting device is used for bonding a connecting wire on the second assembly, then bonding and mounting the upper cover on the second assembly to obtain a sensor semi-finished product;
the second high-temperature curing device is used for carrying out high-temperature curing treatment on the semi-finished product of the sensor to obtain the sensor;
the conditioning test device is used for conditioning test on the sensor to obtain a sensor product.
Optionally, the first high-temperature curing device comprises a high-temperature tunnel furnace, and the second high-temperature curing device comprises a high-temperature tunnel furnace.
Optionally, the first high-temperature curing device and the second high-temperature curing device are arranged in parallel in the front-rear direction and both extend in the left-right direction;
the upper cover mounting device is positioned at the left ends of the first high-temperature curing device and the second high-temperature curing device, the feeding end of the upper cover mounting device corresponds to the discharging end of the first high-temperature curing device, and the discharging end of the upper cover mounting device corresponds to the feeding end of the second high-temperature curing device;
the core packaging device and the conditioning testing device are both positioned at the right ends of the first high-temperature curing device and the second high-temperature curing device and are arranged in parallel in the front-rear direction, wherein the discharging end of the core packaging device corresponds to the feeding end of the first high-temperature curing device, and the feeding end of the conditioning testing device corresponds to the discharging end of the second high-temperature curing device.
Optionally, the transfer mechanism comprises:
the first lifting platform can be movably arranged along the up-down direction, is positioned between the blanking end of the core packaging device and the feeding end of the first high-temperature curing device, and is used for conveying the first assembly from the blanking end of the core packaging device to the feeding end of the first high-temperature curing device;
the second lifting platform can be movably arranged along the up-down direction, is positioned between the blanking end of the first high-temperature curing device and the feeding end of the upper cover mounting device, and is used for conveying the second assembly from the blanking end of the first high-temperature curing device to the feeding end of the upper cover mounting device;
the third lifting platform can be movably arranged along the up-down direction, is positioned between the blanking end of the upper cover mounting device and the feeding end of the second high-temperature curing device, and is used for conveying the sensor semi-finished product from the blanking end of the upper cover mounting device to the feeding end of the second high-temperature curing device; and the number of the first and second groups,
and the fourth lifting platform can be movably arranged in the vertical direction, is positioned between the blanking end of the second high-temperature curing device and the feeding end of the conditioning testing device, and is used for conveying the sensor from the blanking end of the second high-temperature curing device to the feeding end of the conditioning testing device.
Optionally, the core packaging device comprises:
the first frame is provided with a plurality of packaging stations, and the packaging stations comprise a first activation station, a core body dispensing station and a core body installation station which are sequentially arranged along the machining direction;
the first conveying structure is arranged on the first machine frame and used for conveying the workpieces to the plurality of packaging stations in sequence along the machining direction;
the first activation mechanism is arranged on the first rack corresponding to the first activation station and used for carrying out surface activation treatment on the dispensing position of the lower shell;
the core body glue dispensing mechanism is arranged on the first rack corresponding to the core body glue dispensing station and is used for dispensing glue at the glue dispensing position; and the number of the first and second groups,
and the core body mounting mechanism is arranged on the first rack corresponding to the core body mounting station and is used for mounting the core body on the dispensing position covered with glue.
Optionally, the dispensing positions are multiple, the core dispensing stations are multiple, the core dispensing mechanisms are multiple, each core dispensing mechanism comprises a dispensing head which can be movably arranged along the vertical direction, and the core dispensing mechanisms correspond to the core dispensing stations one by one so as to dispense glue at the dispensing positions correspondingly; and/or the presence of a gas in the gas,
at least some of the plurality of packaging stations are annularly distributed;
the first conveying structure comprises a first conveying part which is annularly arranged, the first conveying part is located at least part of the packaging stations which are annularly distributed, the first conveying part can rotate around the central shaft of the first conveying part, and the first conveying part is used for conveying the workpieces.
Optionally, the upper cover mounting device includes:
the second machine frame is provided with a plurality of mounting stations, and the mounting stations comprise a bonding station, a second activation station, an upper cover dispensing station and a gland station which are sequentially arranged along the machining direction;
the second conveying structure is arranged on the second rack and used for conveying the workpieces to the plurality of mounting stations in sequence along the machining direction;
the bonding mechanism is arranged on the second rack corresponding to the bonding station and used for bonding the connecting wire of the second assembly positioned at the bonding station;
the second activation mechanism is arranged on the second rack corresponding to the second activation station and used for carrying out surface activation treatment on the second assembly;
the upper cover glue dispensing mechanism is arranged on the second rack corresponding to the upper cover glue dispensing station and used for dispensing glue on the second component; and the number of the first and second groups,
and the gland mechanism is arranged on the second rack corresponding to the gland station and is used for pressing and assembling the upper cover onto the second assembly.
Optionally, at least some of the plurality of mounting stations are distributed annularly;
the second conveying structure comprises a second conveying part which is annularly arranged, the second conveying part is positioned at the center of at least part of the mounting stations which are annularly distributed and can be rotationally arranged around the central shaft of the second conveying part, and the second conveying part is used for conveying the workpieces.
Optionally, the conditioning test device comprises:
the third machine frame is provided with a plurality of adjusting and testing stations, and the adjusting and testing stations comprise an adjusting station, a testing station and a marking station which are sequentially arranged along the machining direction;
the third conveying structure is arranged on the third rack and used for conveying the workpieces to the plurality of adjusting and measuring stations in sequence along the machining direction;
the conditioning mechanism is arranged on the third rack corresponding to the conditioning station and is used for conditioning the sensor;
the testing mechanism is arranged on the third rack corresponding to the testing station and used for performing functional testing on the sensor; and the number of the first and second groups,
and the marking mechanism corresponds to the marking station and is arranged on the third rack and used for marking the sensor.
Optionally, at least some of the plurality of the testing stations are distributed annularly;
the third conveying structure comprises a second conveying part which is annularly arranged, the third conveying part is positioned at least part of the adjusting and measuring station which is annularly distributed, and can rotate around the central shaft of the third conveying part, and the third conveying part is used for conveying the workpiece.
According to the technical scheme provided by the invention, the core body packaging device, the first high-temperature curing device, the upper cover mounting device, the second high-temperature curing device and the conditioning testing device are sequentially arranged along the processing direction by arranging the conveying mechanism, so that the core body mounting, the upper cover mounting and the conditioning testing procedures can be orderly and automatically carried out, the automatic continuous processing of sensor assembly is realized, and the production efficiency is improved.
Drawings
FIG. 1 is a top view of one embodiment of a sensor mounting apparatus in accordance with the present invention;
FIG. 2 is a schematic structural diagram of the first lifting platform in FIG. 1;
FIG. 3 is a schematic structural view of the first high-temperature curing device in FIG. 1;
FIG. 4 is a schematic diagram of the structure of the chip package device in FIG. 1;
FIG. 5 is a schematic structural view of the upper cover mounting device of FIG. 1;
fig. 6 is a schematic structural diagram of the conditioning test apparatus in fig. 1.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Sensor assembling |
25 | Core |
| 1 | |
3 | First high |
| 11 | First elevating |
4 | Upper |
| 111 | Conveying |
41 | |
| 112 | Conveying belt | 421 | A second conveying |
| 113 | |
43 | |
| 12 | |
44 | |
| 13 | Third |
45 | Upper cover |
| 14 | Fourth |
46 | |
| 15 | |
5 | Second high |
| 2 | Core packaging hardware | 6 | |
| 21 | |
61 | Third frame |
| 221 | A |
621 | |
| 23 | |
63 | |
| 241 | First |
64 | |
| 242 | Second |
65 | Marking mechanism |
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The sensor generally comprises four parts, namely a sensitive element, a conversion circuit and an auxiliary power supply, and when the sensor is processed, a plurality of assembling and detecting processes are required. In view of this, the present invention provides a sensor assembling apparatus, which includes a conveying mechanism, and a core packaging device, a first high temperature curing device, an upper cover mounting device, a second high temperature curing device, and a conditioning and testing device, which are sequentially arranged along the processing direction. Fig. 1 to 6 show an embodiment of a sensor assembling apparatus according to the present invention.
Referring to fig. 1, the sensor assembling apparatus 100 includes a conveying mechanism 1, and a core packaging device 2, a first high temperature curing device 3, an upper cover mounting device 4, a second high temperature curing device 5, and a conditioning and testing device 6, which are sequentially arranged along the processing direction. Wherein: the conveying mechanism 1 is used for conveying a workpiece, so that the workpiece sequentially passes through the core body packaging device 2, the first high-temperature curing device 3, the upper cover mounting device 4, the second high-temperature curing device 5 and the conditioning testing device 6; the core packaging device 2 is used for bonding a core in the lower shell of the sensor; the first high-temperature curing device 3 is used for carrying out high-temperature curing treatment on the lower shell after the core body is bonded so as to cure glue for bonding the core body; the upper cover mounting device 4 is used for bonding a connecting wire between the circuit board and the contact pin and then bonding the upper cover to the lower shell, wherein the connecting wire can be an aluminum wire; the second high-temperature curing device 5 is used for carrying out high-temperature curing treatment on the lower shell bonded with the upper cover so as to cure the glue bonded with the upper cover and obtain the sensor; the conditioning test device 6 is used for conditioning test of the sensor to obtain a sensor product.
According to the technical scheme provided by the invention, the core body packaging device 2, the first high-temperature curing device 3, the upper cover mounting device 4, the second high-temperature curing device 5 and the conditioning testing device 6 are sequentially arranged along the processing direction by arranging the conveying mechanism 1, so that the core body mounting, the upper cover mounting and the conditioning testing procedures can be orderly and automatically carried out, the automatic continuous processing of sensor assembly is realized, and the production efficiency is improved.
It should be noted that the core, the lower shell, the first component, the second component, the connecting wire (aluminum wire), the upper cover, the sensor semi-finished product, the sensor product, and the like mentioned herein all belong to the category of workpieces, and the conveying mechanism 1 is used for conveying the workpieces, for example, conveying the first component from the core packaging device 2 to the first high-temperature curing device 3, conveying the second component from the first high-temperature curing device 3 to the upper cover mounting device 4, conveying the sensor semi-finished product from the upper cover mounting device 4 to the second high-temperature curing device 5, conveying the sensor from the second high-temperature curing device 5 to the conditioning testing device 6, and the like.
The specific implementation form of the conveying mechanism 1 is various, and can be a lifting platform, a conveying belt, a conveying roller group and the like. The conveying direction of the conveying mechanism 1 is the processing direction of the workpiece, and taking the conveying between the core packaging device 2 and the first high-temperature curing device 3 as an example, the conveying direction of the conveying mechanism 1 is from the discharging end of the core packaging device 2 to the feeding end of the first high-temperature curing device 3. In specific implementation, the conveying direction depends on the position relationship between two adjacent devices, and the conveying direction may include displacement in the vertical direction and also may include displacement in the horizontal direction, specifically, referring to fig. 1, in this embodiment, because there is a height difference between the first high temperature curing device 3, the second high temperature curing device 5 and the adjacent devices, the conveying mechanism 1 includes a first lifting table 11, a second lifting table 12, a third lifting table 13 and a fourth lifting table 14. The first lifting table 11 is movably disposed in the up-down direction and located between the feeding end of the core packaging device 2 and the feeding end of the first high-temperature curing device 3, so that the first component can be lowered from the higher feeding end of the core packaging device 2 to a height equal to that of the feeding end of the first high-temperature curing device 3, and further conveyed to the feeding end of the first high-temperature curing device 3, so that a workpiece subjected to the core packaging process can be cured at high temperature, and the core can be mounted more firmly. The second lifting platform 12 is movably disposed in the up-down direction and located between the discharging end of the first high-temperature curing device 3 and the feeding end of the upper cover mounting device 4, so that the second component can be lifted from the discharging end of the first high-temperature curing device 3 with a lower height to a height equal to the feeding end of the upper cover mounting device 4, and further conveyed to the feeding end of the upper cover mounting device 4, so that the cured second component enters the upper cover mounting process to complete the upper cover mounting process to form a complete sensor. The third lifting platform 13 is movably disposed in the vertical direction and is located between the discharging end of the upper cover mounting device 4 and the feeding end of the second high-temperature curing device 5, so that the sensor semi-finished product can be lowered from the discharging end of the upper cover mounting device 4 with a higher height to the same height as the feeding end of the second high-temperature curing device 5 and conveyed to the feeding end of the second high-temperature curing device 5, and the sensor semi-finished product after the upper cover mounting process is completed can enter the second high-temperature curing device 5 to be subjected to high-temperature curing treatment, so that the connection between the upper cover and the lower shell is firmer. The fourth lifting platform 14 is movably arranged in the vertical direction and is located between the discharging end of the second high-temperature curing device 5 and the feeding end of the conditioning testing device 6, so that the sensor can be lifted from the discharging end of the second high-temperature curing device 5 with a lower height to a position with the same height as the feeding end of the conditioning testing device 6 and conveyed to the feeding end of the conditioning testing device 6, the sensor after being cured can be subjected to conditioning and testing procedures, and qualified sensor products can be obtained.
Specifically, the four lifting tables have the same structure, and taking the first lifting table 11 as an example, referring to fig. 2, the first lifting table 11 includes a conveying frame 111, a conveying belt 112 disposed on the conveying frame 111, and a lifting table cylinder 113 for driving the conveying frame 111 to move up and down, the first lifting table 11 has a rising position and a falling position, when the first lifting table 11 is at the rising position, the carrying surface of the conveying belt 112 is equal to the height of the core packaging device 2, and then the first lifting table 11 is lowered to the falling position, at this time, the carrying surface of the conveying belt 112 is equal to the height of the feeding end of the first high temperature curing device 3, and during this time, the conveying belt 112 runs, and the workpiece can be conveyed to the first high temperature curing device 3.
Further, the conveying mechanism 1 may further include a plurality of manipulators 15, at least one manipulator 15 is disposed at each of the feeding end and the discharging end of the core packaging device 2, the feeding end and the discharging end of the upper cover mounting device 4, and the feeding end and the discharging end of the conditioning testing device 6, taking the manipulator 15 at the discharging end of the core packaging device 2 as an example, the manipulator 15 may be used to transfer the first component subjected to core packaging onto the carrying surface of the conveying belt 112, and the setting accuracy of the rising position of the first lifting table 11 may not be too high by adopting the transferring manner of the manipulator 15, so that the first component may be transferred even if there is a certain difference between the rising position and the core packaging device 2.
After the glue is cured, the bonding strength can be enhanced, the surface of the glue layer can become smooth and the glue layer does not have the bonding capacity any more, so that after the two elements are glued by the bonding glue, curing treatment is needed, the curing mode is various, and the method adopting high-temperature curing in the embodiment is higher in cost performance compared with other modes. Specifically, referring to fig. 1 and 3, the first high-temperature curing device 3 includes a high-temperature tunnel furnace, and the second high-temperature curing device 5 includes a high-temperature tunnel furnace, which is a tunnel heating apparatus commercially available and the specific structure of which is not described in detail herein. In this embodiment, the high-temperature tunnel furnace is adopted, so that not only can continuous production be realized, and the production efficiency is high, but also a part of conveying parts can be replaced due to the conveying function of the high-temperature tunnel furnace, and the high-temperature tunnel furnace is well connected between the upper process equipment and the lower process equipment, so that the structure of the sensor assembling equipment 100 is more simplified, and the occupied area is smaller.
Further, referring to fig. 1, in the present embodiment, the first high temperature curing device 3 and the second high temperature curing device 5 are arranged in parallel in the front-rear direction and both extend in the left-right direction; the upper cover mounting device 4 is positioned at the left ends of the first high-temperature curing device 3 and the second high-temperature curing device 5, the feeding end of the upper cover mounting device 4 corresponds to the discharging end of the first high-temperature curing device 3, and the discharging end of the upper cover mounting device 4 corresponds to the feeding end of the second high-temperature curing device 5; the core packaging device 2 and the conditioning testing device 6 are both located at the right ends of the first high-temperature curing device 3 and the second high-temperature curing device 5 and are arranged in parallel in the front-rear direction, wherein the discharging end of the core packaging device 2 corresponds to the feeding end of the first high-temperature curing device 3, and the feeding end of the conditioning testing device 6 corresponds to the discharging end of the second high-temperature curing device 5. It should be noted that the front-back and left-right directions described herein are not narrowly defined, and specifically, the front-back direction and the left-right direction may be understood as a first direction and a second direction perpendicular to each other, and are defined herein mainly for the convenience of understanding the relative positional relationship among the core packaging device 2, the first high-temperature curing device 3, the upper cover mounting device 4, the second high-temperature curing device 5, and the conditioning test device 6. In this embodiment, through arranging first high temperature curing device 3 and second high temperature curing device 5 side by side, and with core packaging hardware 2, upper cover installation device 4 and take care of testing arrangement 6 branch and locate in curing device's both ends, make this sensor rigging equipment 100 can satisfy the order requirement of manufacturing procedure, can practice thrift occupation space again furthest, make this sensor rigging equipment 100 lower to the demand of factory building, the suitability is wider, in addition, because each process device is comparatively concentrated, make personnel's configuration can correspondingly cut down, manpower waste has been reduced.
Referring to fig. 4, the core packaging apparatus 2 includes a first frame 21, a first conveying mechanism, a first activating mechanism 23, a core dispensing mechanism, and a core mounting mechanism 25. The first frame 21 is provided with a plurality of packaging stations, and the plurality of packaging stations comprise a first activation station, a core body dispensing station and a core body installation station which are sequentially arranged along the processing direction; specifically, the first frame 21 may be a long-strip single-line structure, or may be a closed ring-shaped structure, in this embodiment, the first frame 21 is a substantially square frame, and has a simple structure and a small floor area. The first conveying structure is arranged on the first rack 21 and used for conveying the workpieces to the plurality of packaging stations in sequence along the processing direction; in particular, the first conveying structure is used for conveying the workpiece in a sequential machine direction of process steps within the core packaging process, for example, passing the workpiece through a first activation station, a core dispensing station, and a core mounting station in sequence. The first activation mechanism 23 is arranged on the first frame 21 corresponding to the first activation station, and is used for performing surface activation processing on the dispensing position of the lower shell; specifically, the first activation mechanism 23 may be a plasma activation device, and the first activation mechanism 23 has an activation head disposed toward the first activation station, and is capable of performing a plasma activation process on the workpiece conveyed to the first activation station, so that the dispensing position to be dispensed on the lower case is surface-activated, thereby enhancing the adhesive force of the dispensing surface. The core body dispensing mechanism is arranged on the first rack 21 corresponding to the core body dispensing station and used for dispensing at the dispensing position; specifically, the core dispensing mechanism comprises a common glue injection device in the market, the glue injection device is provided with a movable dispensing head, and when dispensing is carried out, the dispensing head moves to the position above the core dispensing station and faces the core dispensing station, so that dispensing can be carried out on the dispensing position of a workpiece conveyed to the core dispensing station. The core body mounting mechanism 25 is arranged on the first machine frame 21 corresponding to the core body mounting station and is used for mounting the core body on the dispensing position covered with glue; specifically, the core body installation mechanism 25 includes a core body storage, a material taking mechanism and a core body pressing mechanism, wherein the material taking mechanism may be a mechanism capable of transferring a workpiece such as a manipulator 15 and a suction cup, the suction cup has a vertical and horizontal moving stroke, the suction cup is located above the core body storage, when the glued lower shell is sent to the core body installation station, the suction cup moves downward above the core body, the core body is sucked and then moved upward, and then the suction cup moves upward above the core body installation station, at this time, the suction cup drives the core body to move downward until the core body is located above the glue dispensing position of the lower shell body, the suction cup releases the core body, and the core body is placed at the glue dispensing position covered with glue. The core body pressing mechanism is provided with a pressing movable stroke which is movable up and down between the upper part of the core body installation station and the core body installation station; specifically, the core pressing mechanism can move up and down, and when the core is placed on the lower shell, the core pressing mechanism moves down until the core is abutted against the lower shell, so that the core can be pressed on the lower shell, and the core and the lower shell are bonded more tightly.
This embodiment establishes ties a plurality of stations in with core encapsulation process in proper order through first transport structure, has realized the transfer in proper order of work piece between a plurality of stations for core encapsulation process can be gone on continuously, automatically, has improved the efficiency of core encapsulation.
When the core body is installed, more than one dispensing position is needed, so that a plurality of dispensing positions are provided. In this embodiment, a plurality of core dispensing stations are provided, a plurality of core dispensing mechanisms are provided, each of the core dispensing mechanisms includes a dispensing head that can be movably disposed in an up-down direction, and the plurality of core dispensing mechanisms correspond to the plurality of core dispensing stations one by one so as to dispense glue at the plurality of dispensing positions; specifically, referring to fig. 4, in the present embodiment, there are two dispensing positions, and accordingly, two dispensing stations and two dispensing mechanisms are provided, wherein the first dispensing mechanism 241 and the first dispensing station correspond to the first dispensing position, and the second dispensing mechanism 242 and the second dispensing station correspond to the second dispensing position, when the lower shell is located at the first dispensing station, the dispensing head of the first dispensing mechanism 241 faces the first dispensing position thereon, and when the lower shell is located at the second dispensing station, the dispensing head of the second dispensing mechanism 242 faces the second dispensing position thereon, so that two dispensing positions can be respectively dispensed. Because in this embodiment, the dispensing head reciprocates, compare the condition that two dispensing stations share a dispensing head, this has just avoided because of the glue solution wire drawing that the translation of dispensing head probably leads to, has avoided because of the performance of glue solution wire drawing interference sensor, has improved the product yield.
In addition, in the embodiment, at least part of the packaging stations in the plurality of packaging stations are distributed in a ring shape; the first conveying structure comprises a first conveying part 221 which is annularly arranged, the first conveying part 221 is located at the center of at least part of the packaging stations which are annularly distributed, the first conveying part 221 can be rotationally arranged around the central axis of the first conveying part 221, and the first conveying part 221 is used for conveying the workpieces. Specifically, in this embodiment, first transfer portion 221 is the carousel, and first activation station, core point glue station and core installation station are arranged along the circumference of carousel, so, along with the rotation of carousel, can convey the work piece on the carousel in proper order between a plurality of stations, and this kind of setting mode, simple structure, area occupied is less, and the station is concentrated, practices thrift the manpower, the management of being convenient for.
Referring to fig. 5, the upper cap mounting apparatus 4 includes a second frame 41, a second conveying structure, a bonding mechanism 43, a second activating mechanism 44, an upper cap dispensing mechanism 45, and a capping mechanism 46. The second frame 41 is provided with a plurality of mounting stations, and the plurality of mounting stations comprise a bonding station, a second activation station, an upper cover dispensing station and a gland station which are sequentially arranged along the processing direction; specifically, the second frame 41 may be a long-strip single-line structure, or may be a closed ring-shaped structure, in this embodiment, the second frame 41 is a substantially square frame, and has a simple structure and a small floor area. The second conveying structure is arranged on the second rack 41 and is used for conveying the workpieces to the plurality of mounting stations in sequence along the machining direction; specifically, the second conveying structure is used for conveying the workpiece in the sequential machining direction of the process steps in the upper cover mounting process, for example, the workpiece sequentially passes through the bonding station, the second activation station, the upper cover dispensing station and the capping station. The bonding mechanism 43 is disposed on the second frame 41 corresponding to the bonding station, and is configured to perform bonding with a connecting wire on the second component located at the bonding station (in this embodiment, the bonding with the connecting wire is aluminum wire bonding, and the core and the contact pin are subjected to aluminum wire bonding to achieve electrical connection). The second activation mechanism 44 is arranged on the second frame 41 corresponding to the second activation station, and is used for performing surface activation treatment on the second assembly; specifically, the second activation mechanism 44 may be a plasma activation device, and the second activation mechanism 44 has an activation head disposed toward the second activation station, and is capable of performing a plasma activation process on the workpiece conveyed to the second activation station, so that the dispensing position to be dispensed on the second component is surface-activated, thereby enhancing the adhesive force of the dispensing surface. The upper cover glue dispensing mechanism 45 is arranged on the second rack 41 corresponding to the upper cover glue dispensing station and used for dispensing glue on the second component; specifically, the upper cover glue dispensing mechanism 45 includes a glue injection device commonly available on the market. The capping mechanism 46 is arranged on the second frame 41 corresponding to the capping station and is used for pressing and mounting the upper cover onto the second component; specifically, the capping mechanism 46 may include an upper cover transferring mechanism, which may be the robot 15, for transferring the upper cover above the second component located on the capping station, and an upper cover pressing mechanism, which may refer to the above-described core pressing mechanism, for pressing the upper cover on the second component, so that the upper cover and the second component are tightly bonded.
In the embodiment, the plurality of stations in the upper cover mounting process are sequentially connected in series through the second conveying structure, so that the workpieces are sequentially transferred among the stations, the upper cover mounting process can be continuously and automatically carried out, and the upper cover mounting efficiency is improved.
In addition, in the embodiment, at least part of the installation stations in the plurality of installation stations are distributed in a ring shape; the second conveying structure comprises a second conveying part 421 which is annularly arranged, the second conveying part 421 is located at the center of at least part of the mounting stations which are annularly distributed, and can be rotatably arranged around the central axis of the second conveying part 421, and the second conveying part 421 is used for conveying the workpieces. Specifically, in this embodiment, the second conveying portion 421 is a rotary table, and the bonding station, the second activation station, the upper cover dispensing station, and the pressing station are arranged along the circumferential direction of the rotary table, so that the workpiece on the rotary table can be sequentially conveyed among a plurality of stations along with the rotation of the rotary table.
Optionally, the conditioning and testing device 6 includes a third frame 61, a third conveying structure, a conditioning mechanism 63, a testing mechanism 64, and a marking mechanism 65. The third frame 61 is provided with a plurality of adjusting and testing stations, and the adjusting and testing stations comprise an adjusting station, a testing station and a marking station which are sequentially arranged along the machining direction; specifically, the third frame 61 may be a long-strip single-line structure, or may be a closed ring-shaped structure, in this embodiment, the third frame 61 is a substantially square frame, and has a simple structure and a small floor area. The third conveying structure is arranged on the third rack 61 and used for conveying the workpieces to the plurality of adjusting and measuring stations in sequence along the machining direction; in particular, the third transport structure is used to transport the workpiece in a sequential machine direction of process steps within a conditioning test process, e.g., passing the workpiece sequentially through a conditioning station, a test station, and a marking station. The conditioning mechanism 63 is arranged on the third frame 61 corresponding to the conditioning station and is used for conditioning the sensor conveyed to the conditioning station; specifically, the conditioning mechanism 63 may be a conditioning machine corresponding to the type of the sensor, for example, for a pressure sensor, the conditioning mechanism 63 is a pressure sensor conditioning machine, and the conventional equipment may be adopted, and the specific structure thereof is not described in detail. The testing mechanism 64 is arranged on the third rack 61 corresponding to the testing station and used for performing functional testing on the sensor conveyed to the testing station; in particular, the testing mechanism 64 is primarily used to test the performance of the sensor, for example, for a pressure sensor, the testing mechanism 64 may be a detection device for testing the sensitivity of the pressure sensor to pressure. The marking mechanism 65 is arranged on the third frame 61 corresponding to the marking station and is used for marking the sensor conveyed to the marking station; in particular, the marking mechanism 65 may be any marking machine commonly available on the market.
In the embodiment, the plurality of stations in the conditioning test procedure are sequentially connected in series through the third conveying structure, so that the workpieces are sequentially transferred among the stations, the conditioning test procedure can be continuously and automatically performed, and the conditioning test efficiency is improved.
Further, the third frame 61 further has a picking station located between the testing station and the marking station, and the conditioning testing device 6 may further include a picking mechanism, where the picking mechanism is located in the third mechanism corresponding to the picking station for rejecting the unqualified products in the tested sensor.
In addition, in the embodiment, at least part of the plurality of the adjusting and measuring stations are distributed in a ring shape; the third transmission structure includes the second transmission portion 421 that is the annular setting, third transmission portion 621 is located and is the annular at least part of distribute the center of adjusting and measuring the station, and can wind third transmission portion 621's center pin sets up with rotating, third transmission portion 621 is used for conveying the work piece. Specifically, in this embodiment, third transfer portion 621 is the carousel, takes care of station, test station and beats the mark station and arrange along the circumference of carousel, so, along with the rotation of carousel, can convey the work piece on the carousel in proper order between a plurality of stations, and this kind of mode of setting, simple structure, area occupied is less, and the station is concentrated, practices thrift the manpower, the management of being convenient for.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a sensor rigging equipment for the equipment sensor, its characterized in that includes transport mechanism and follows core packaging hardware, first high temperature curing device, upper cover installation device, second high temperature curing device and the conditioning testing arrangement that the machine direction set gradually, wherein:
the conveying mechanism is used for conveying a workpiece, so that the workpiece sequentially passes through the core body packaging device, the first high-temperature curing device, the upper cover mounting device, the second high-temperature curing device and the conditioning testing device;
the core packaging device is used for bonding a core in the lower shell of the sensor to form a first assembly;
the first high-temperature curing device is used for carrying out high-temperature curing treatment on the first assembly to obtain a second assembly;
the upper cover mounting device is used for bonding a connecting wire on the second assembly, then bonding and mounting the upper cover on the second assembly to obtain a sensor semi-finished product;
the second high-temperature curing device is used for carrying out high-temperature curing treatment on the semi-finished product of the sensor to obtain the sensor;
the conditioning test device is used for conditioning test on the sensor to obtain a sensor product.
2. The sensor assembling apparatus according to claim 1, wherein said first high-temperature curing means comprises a high-temperature tunnel furnace, and said second high-temperature curing means comprises a high-temperature tunnel furnace.
3. The sensor assembling apparatus according to claim 2, wherein said first high-temperature curing device and said second high-temperature curing device are juxtaposed in the front-rear direction and are each extended in the left-right direction;
the upper cover mounting device is positioned at the left ends of the first high-temperature curing device and the second high-temperature curing device, the feeding end of the upper cover mounting device corresponds to the discharging end of the first high-temperature curing device, and the discharging end of the upper cover mounting device corresponds to the feeding end of the second high-temperature curing device;
the core packaging device and the conditioning testing device are both positioned at the right ends of the first high-temperature curing device and the second high-temperature curing device and are arranged in parallel in the front-rear direction, wherein the discharging end of the core packaging device corresponds to the feeding end of the first high-temperature curing device, and the feeding end of the conditioning testing device corresponds to the discharging end of the second high-temperature curing device.
4. The sensor assembling apparatus according to claim 1, wherein said transfer mechanism comprises:
the first lifting platform can be movably arranged along the up-down direction, is positioned between the blanking end of the core packaging device and the feeding end of the first high-temperature curing device, and is used for conveying the first assembly from the blanking end of the core packaging device to the feeding end of the first high-temperature curing device;
the second lifting platform can be movably arranged along the up-down direction, is positioned between the blanking end of the first high-temperature curing device and the feeding end of the upper cover mounting device, and is used for conveying the second assembly from the blanking end of the first high-temperature curing device to the feeding end of the upper cover mounting device;
the third lifting platform can be movably arranged along the up-down direction, is positioned between the blanking end of the upper cover mounting device and the feeding end of the second high-temperature curing device, and is used for conveying the sensor semi-finished product from the blanking end of the upper cover mounting device to the feeding end of the second high-temperature curing device; and the number of the first and second groups,
and the fourth lifting platform can be movably arranged in the vertical direction, is positioned between the blanking end of the second high-temperature curing device and the feeding end of the conditioning testing device, and is used for conveying the sensor from the blanking end of the second high-temperature curing device to the feeding end of the conditioning testing device.
5. The sensor assembling apparatus of claim 1, wherein said core packaging device comprises:
the first frame is provided with a plurality of packaging stations, and the packaging stations comprise a first activation station, a core body dispensing station and a core body installation station which are sequentially arranged along the machining direction;
the first conveying structure is arranged on the first machine frame and used for conveying the workpieces to the plurality of packaging stations in sequence along the machining direction;
the first activation mechanism is arranged on the first rack corresponding to the first activation station and used for carrying out surface activation treatment on the dispensing position of the lower shell;
the core body glue dispensing mechanism is arranged on the first rack corresponding to the core body glue dispensing station and is used for dispensing glue at the glue dispensing position; and the number of the first and second groups,
and the core body mounting mechanism is arranged on the first rack corresponding to the core body mounting station and is used for mounting the core body on the dispensing position covered with glue.
6. The sensor assembling apparatus according to claim 5, wherein said dispensing positions are plural, said core dispensing stations are plural, said core dispensing mechanism is plural, each of said core dispensing mechanisms includes a dispensing head movably disposed in an up-down direction, and said core dispensing mechanisms are in one-to-one correspondence with said core dispensing stations to dispense the adhesive at said dispensing positions; and/or the presence of a gas in the gas,
at least some of the plurality of packaging stations are annularly distributed;
the first conveying structure comprises a first conveying part which is annularly arranged, the first conveying part is located at least part of the packaging stations which are annularly distributed, the first conveying part can rotate around the central shaft of the first conveying part, and the first conveying part is used for conveying the workpieces.
7. The sensor assembling apparatus according to claim 1, wherein said upper cover mounting means comprises:
the second machine frame is provided with a plurality of mounting stations, and the mounting stations comprise a bonding station, a second activation station, an upper cover dispensing station and a gland station which are sequentially arranged along the machining direction;
the second conveying structure is arranged on the second rack and used for conveying the workpieces to the plurality of mounting stations in sequence along the machining direction;
the bonding mechanism is arranged on the second rack corresponding to the bonding station and used for bonding the connecting wire of the second assembly positioned at the bonding station;
the second activation mechanism is arranged on the second rack corresponding to the second activation station and used for carrying out surface activation treatment on the second assembly;
the upper cover glue dispensing mechanism is arranged on the second rack corresponding to the upper cover glue dispensing station and used for dispensing glue on the second component; and the number of the first and second groups,
and the gland mechanism is arranged on the second rack corresponding to the gland station and is used for pressing and assembling the upper cover onto the second assembly.
8. The sensor assembling apparatus according to claim 7, wherein at least some of said plurality of said mounting stations are annularly distributed;
the second conveying structure comprises a second conveying part which is annularly arranged, the second conveying part is positioned at the center of at least part of the mounting stations which are annularly distributed and can be rotationally arranged around the central shaft of the second conveying part, and the second conveying part is used for conveying the workpieces.
9. The sensor assembling apparatus of claim 1, wherein said conditioning test device comprises:
the third machine frame is provided with a plurality of adjusting and testing stations, and the adjusting and testing stations comprise an adjusting station, a testing station and a marking station which are sequentially arranged along the machining direction;
the third conveying structure is arranged on the third rack and used for conveying the workpieces to the plurality of adjusting and measuring stations in sequence along the machining direction;
the conditioning mechanism is arranged on the third rack corresponding to the conditioning station and is used for conditioning the sensor;
the testing mechanism is arranged on the third rack corresponding to the testing station and used for performing functional testing on the sensor; and the number of the first and second groups,
and the marking mechanism corresponds to the marking station and is arranged on the third rack and used for marking the sensor.
10. The sensor assembling apparatus according to claim 9, wherein at least some of said plurality of said alignment stations are annularly arranged;
the third conveying structure comprises a second conveying part which is annularly arranged, the third conveying part is positioned at least part of the adjusting and measuring station which is annularly distributed, and can rotate around the central shaft of the third conveying part, and the third conveying part is used for conveying the workpiece.
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| CN202110488772.4A CN113202848B (en) | 2021-04-30 | 2021-04-30 | Sensor assembling equipment |
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| CN104842157A (en) * | 2015-05-21 | 2015-08-19 | 江苏比微曼智能科技有限公司 | Multi-part assembly device |
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