CN113199141A - Laser bonding method and bonded structure - Google Patents
Laser bonding method and bonded structure Download PDFInfo
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- CN113199141A CN113199141A CN202110149009.9A CN202110149009A CN113199141A CN 113199141 A CN113199141 A CN 113199141A CN 202110149009 A CN202110149009 A CN 202110149009A CN 113199141 A CN113199141 A CN 113199141A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
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Abstract
The present invention provides a laser bonding method and a bonded structure, the laser bonding method is a method for bonding a first bonding material formed by a stainless steel material and a second bonding material formed by a zinc alloy material by using laser, and the laser bonding method comprises the following steps: a first step of disposing a second bonding material on a first surface of a first bonding material; a second step of irradiating the laser from the second bonding material side to the first bonding material side to melt a part of the second bonding material; a third step of heating the first surface of the first bonding material; and a fourth step of bonding a part of the molten second bonding material to the first bonding material having the first surface heated.
Description
Technical Field
The present invention relates to a laser bonding method and a bonded structure.
Background
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2001-252777
Disclosure of Invention
Problems to be solved by the invention
However, the laser joining method of patent document 1 has a problem that, for example, when a zinc alloy material and a stainless steel material having significantly different melting points are melted and joined, the zinc alloy volatilizes when heated to a temperature at which the stainless steel is melted, and therefore the zinc alloy material and the stainless steel material cannot be melted and joined by a laser.
In view of the above, an object of the present invention is to provide a laser bonding method and a bonded structure capable of bonding a zinc alloy material and a stainless material.
Means for solving the problems
According to a first aspect of the present invention, there is provided a laser bonding method for bonding a first bonding material made of a stainless steel material and a second bonding material made of a zinc alloy material by using a laser, the method comprising the steps of: a first step of disposing a second bonding material on a first surface of a first bonding material; a second step of irradiating the laser beam from the second bonding material side to the first bonding material side to melt a part of the second bonding material; a third step of heating the first surface of the first bonding material; and a fourth step of bonding a part of the molten second bonding material to the first bonding material having the heated first surface.
According to a second aspect of the present invention, there is provided a joined structure obtained by joining a first joining material made of a stainless steel material and a second joining material made of a zinc alloy material, wherein the first joining material and the second joining material are joined by the laser joining method according to the first aspect.
Effects of the invention
According to an aspect of the present invention, a laser bonding method and a bonded structure capable of bonding a zinc alloy material and a stainless steel material can be provided.
Drawings
Fig. 1 is a diagram showing a structure of a joining apparatus.
Fig. 2 is a flowchart showing a part of the sequence of the laser bonding method.
Fig. 3 is a diagram showing a part of the sequence of the laser bonding method.
Fig. 4 is a diagram showing a structure of a bonded structure.
Fig. 5 is a view showing a part of the structure of a bonding apparatus according to a modification.
In the figure:
1a, 11 a-first surface, 11-first bonding material, 12-second bonding material, 20-bonded structure, L-laser, S1-arrangement step (first step), S2-melting step (second step), S3-heating step (third step), S4-bonding step (fourth step).
Detailed Description
In the following description, a direction parallel to a Z axis shown in each drawing is referred to as a vertical direction, a direction parallel to an X axis is referred to as a front-rear direction, and a direction parallel to a Y axis is referred to as a left-right direction. The front-back direction and the left-right direction are orthogonal to each other and to the up-down direction. The positive side of the Z axis in the vertical direction is defined as the upper side, and the negative side of the Z axis in the vertical direction is defined as the lower side. The positive side of the X axis in the front-rear direction is referred to as the front side, and the negative side of the X axis in the front-rear direction is referred to as the rear side. The positive side of the Y axis in the left-right direction is set as the right side, and the negative side of the Y axis in the left-right direction is set as the left side.
In the present embodiment, the vertical direction, the front-rear direction, the left-right direction, and the like are only names for explaining the arrangement relationship and the like of the respective portions, and the actual arrangement relationship and the like may be an arrangement relationship other than the arrangement relationship indicated by these names.
Fig. 1 is a diagram showing a structure of a bonding apparatus used in the laser bonding method of the present embodiment.
As shown in fig. 1, the bonding apparatus 100 of the present embodiment includes a chamber 1, a holding unit 2, a laser irradiation unit 3, and a gas supply unit 4. The chamber 1 encloses a working space where laser bonding is performed. The holding unit 2 holds the object 10 to be laser-bonded in the chamber 1.
The holding unit 2 includes a base unit 2a and a platen 2b that sandwiches the object 10 with the base unit 2a to restrain the object. The base portion 2a and the platen 2b are made of metal having excellent heat dissipation properties, such as copper. The holding portion 2 also functions as a cooling member that cools the object 10 during laser joining.
The laser irradiation unit 3 irradiates a predetermined laser beam L on the object. The laser irradiation section 3 includes a laser emission section 3a that emits YAG laser light and an optical lens 3b that focuses the laser light emitted from the laser emission section 3 a. The laser irradiation unit 3 can change the focal position of the laser light by moving the optical lens 3b by an actuator (not shown).
The gas supply unit 4 supplies an inert gas G such as nitrogen or argon into the chamber 1 to maintain the inside of the chamber 1 in an inert atmosphere. The bonding apparatus 100 according to the present embodiment can improve the reliability of bonding by performing laser bonding on the object 10 in a clean environment while maintaining the inside of the chamber 1 in an inert atmosphere.
The object 10 to be joined by the joining apparatus 100 of the present embodiment is a laminate in which a first joining material 11 made of a stainless steel material and a second joining material 12 made of a zinc alloy material are laminated. As a stainless steel material constituting the first bonding material 11, austenitic stainless steel (SUS304) was used, and as a zinc alloy material constituting the second bonding material 12, zinc die casting material (ZDC2) was used.
In the present embodiment, a case will be described where the first bonding material 11 and the second bonding material 12 constituting the object 10 to be laser-bonded are each plate-shaped. The shapes of the first bonding material 11 and the second bonding material 12 are not particularly limited.
Here, the melting point of SUS304 constituting the first bonding material 11 was about 1370 degrees, and the melting point of ZDC2 constituting the second bonding material 12 was about 470 degrees. That is, the difference between the melting points of the first bonding material 11 and the second bonding material 12 is about 900 degrees.
Conventionally, dissimilar materials having significantly different melting points such as a laser cannot be fused and joined to each other. This is because ZDC2 volatilizes when heated to a temperature at which SUS304 having a high melting point melts, and the two materials cannot be melted separately.
In contrast, the bonding apparatus 100 of the present embodiment can bond the first bonding material 11(SUS304) and the second bonding material 12(ZDC2) which are different materials having significantly different melting points, as described below.
Fig. 2 is a flowchart showing a part of the procedure of a laser bonding method using the bonding apparatus 100 according to the present embodiment. Fig. 3 is a diagram showing a part of the sequence of the laser bonding method. Fig. 3 is an enlarged view of the inside of the chamber 1 of the joining device 100. Fig. 4 is a diagram showing a structure of a joined structure joined by the laser joining method of the present embodiment.
As shown in fig. 2, the laser bonding method using the bonding apparatus 100 of the present embodiment includes a placement step (first step) S1, a melting step (second step) S2, a heating step (third step) S3, and a bonding step (fourth step) S4. The bonding apparatus 100 of the present embodiment performs the disposing step S1, the melting step S2, the heating step S3, and the bonding step S4 in the chamber 1. That is, in the laser bonding method of the present embodiment, the disposing step S1, the melting step S2, the heating step S3, and the bonding step S4 are performed in an inert atmosphere in the chamber 1.
The disposing step S1 is a step of disposing the laser-bonded object 10 in the chamber 1 of the bonding apparatus 100 as shown in fig. 1. The melting step S2 is a step of irradiating the second bonding material 12 with laser light to melt a part of the second bonding material 12. The heating step S3 is a step of heating the first surface 11a of the first bonding material 11. The bonding step S4 is a step of bonding the partially melted second bonding material 12 to the first bonding material 11 having the first surface 11a heated.
Specifically, in the disposing step S1, as shown in fig. 3, the object 10 having the second bonding material 12 disposed on the first surface 11a of the first bonding material 11 is held by the holding portion 2. In the disposing step S1 of the present embodiment, the object 10 is disposed in the chamber 1 in a state where the second bonding material 12 is positioned above the first bonding material 11. The holding portion 2 is held in a pressurized state by sandwiching the object 10 between the base portion 2a and the platen 2 b. That is, the first bonding material 11 and the second bonding material 12 are held in a state of being pressed in the vertical direction.
In the bonding apparatus 100 of the present embodiment, in addition to the arrangement step S1, the object 10 is kept pressurized by the holding unit 2 during the melting step S2, the heating step S3, and the bonding step S4. That is, in the laser bonding method of the present embodiment, the first bonding material 11 and the second bonding material 12 are kept in a pressurized state in the disposing step S1, the melting step S2, the heating step S3, and the bonding step S4.
As shown in fig. 3, the bonding apparatus 100 of the present embodiment irradiates the object 10 with the laser light L from the upper side to the lower side in the melting step S2. That is, in the melting step S2, the laser light L is irradiated from the second bonding material 12 side to the first bonding material 11 side.
Here, the focal portion is highest in terms of the energy of the laser light L. In the melting step S2, the laser irradiation unit 3 performs laser irradiation so that the laser light L is focused on the first surface 11a side of the second bonding material 12 with respect to the half thickness.
In the present embodiment, the laser irradiation unit 3 emits the laser light L from the laser emission unit 3a in a pulsed oscillation manner. That is, in the melting step S2, the laser light L is irradiated in a pulse shape. In the present embodiment, the power of the laser light L emitted in pulses from the laser irradiation unit 3 is set to, for example, 0.7kW, and one pulse time is set to 5 μ sec. By thus irradiating the laser light L in a pulse shape, the energy of the laser light L can be easily propagated to the lower side in the thickness direction of the second bonding material 12, that is, the first surface 1a side.
The laser irradiation unit 3 of the present embodiment performs laser irradiation so that the laser light L is focused on the first surface 11a of the first bonding material 11. Thereby, the laser light L forms a focal point La on the first surface 11 a. As described above, the focal point La is highest in terms of the energy of the laser light L, and therefore the vicinity of the first surface 1a where the focal point La of the laser light L is located is highest in terms of the temperature of the second bonding material 12. At this time, the second bonding material 12 is in a state in which the melted portion 13 is formed by melting a part of the lower surface 12a in contact with the first surface 11a of the first bonding material 11. In this way, in the melting step S2, the melting portion 13 is formed by melting a part of the second bonding material 12.
In the present embodiment, the laser irradiation unit 3 sets the power of the laser light L so that the second bonding material 12 can be melted at the focal point La with the highest energy. This allows the portion of the second bonding material 12 near the focal point La, that is, the portion near the first surface 11a to be selectively melted, thereby forming the melted portion 13.
In the present embodiment, the first surface 11a of the first bonding material 11 is efficiently heated by the laser light L that forms the focal point La on the first surface 11 a. That is, in the laser bonding method of the present embodiment, the heating step S3 heats the first surface 11a of the first bonding material 11 by the heat of the laser beam L that melts a part of the second bonding material 12. Further, as described above, the melting point of the first bonding material 11 is much higher than the melting point of the second bonding material 12, and therefore the first surface 11a of the first bonding material 11 is not melted.
As described above, according to the laser bonding method of the present embodiment, the melting step S2 and the heating step S3 can be performed in the same step. This can shorten the joining time of the object 10.
The laser irradiation unit 3 of the present embodiment irradiates the object 10 with the laser light L from the upper side to the lower side. Specifically, the laser irradiation unit 3 irradiates the first surface 11a of the first bonding material 11 with the laser L from the vertical direction (Z-axis direction). With such a configuration, it is possible to make it difficult to reflect the laser light L on the surface of the object 10, that is, the surface 12b of the second bonding material 12. Thus, the laser light L is efficiently incident on the lower side in the thickness direction of the second bonding material 12, and therefore the first surface 11a of the first bonding material 11 is efficiently heated by the laser light L. That is, according to the laser joining method of the present embodiment, the heat of the laser light L can be efficiently used in the melting step S2 and the heating step S3.
According to the laser bonding method of the present embodiment, the melting step S2 and the heating step S3 allow the melted portion 13 to be generated in a part of the lower surface 12a of the second bonding material 12, and the first surface 11a of the first bonding material 11 to be heated.
In the laser bonding method of the present embodiment, the first bonding material 11 and the second bonding material 12 are held in a pressurized state by the holding portion 2 during the melting step S2 and the heating step S3, whereby the first surface 11a of the first bonding material 11 and the lower surface 12a of the second bonding material 12 can be held in a close contact state. This allows the melted portion 13 formed on the lower surface 12a of the second bonding material 12 to be in good contact with the first surface 11a of the first bonding material 11.
In the bonding step S4, the first surface 11a of the first bonding material 11 and the lower surface 12a of the second bonding material 12 are held in close contact with each other, and the laser irradiation from the laser irradiation unit 3 is stopped. Thereby, the melted portion 13 is hardened with a decrease in temperature, and a bonding layer 14 is formed to bond the first surface 11a of the first bonding material 11 and the second bonding material 12.
In the laser bonding method of the present embodiment, the first surface 11a of the first bonding material 11 is heated in the heating step S3, and the temperature of the first surface 1a is increased in advance when the bonding step S4 is performed. Specifically, the temperature of the portion of the first surface 11a that contacts the melting portion 13 is substantially equal to the temperature of the melting portion 13. That is, in the laser bonding method of the present embodiment, the temperature difference between the temperature of the first surface 11a and the melting point of the melting portion 13 can be reduced in the bonding step S4.
The present inventors have obtained the following findings: in the bonding step S4, if the temperature difference between the first surface 11a and the molten portion 13 is large, the adhesion between the bonding layer 14 formed by curing the molten portion 13 and the first surface 11a is reduced. In contrast, in the laser bonding method of the present embodiment, by heating the first surface 11a in the heating step S3, the bonding step S4 can be performed with the temperature difference between the first surface 11a of the first bonding material 11 and the melted portion 13 of the second bonding material 12 reduced. This improves the bonding reliability of the bonding layer 14 that bonds the first bonding material 11 and the second bonding material 12.
As described above, according to the laser bonding method of the present embodiment, as shown in fig. 4, the bonding structure 20 in which the first bonding material 11 and the second bonding material 12 are bonded to each other with the bonding layer 14 can be obtained by the bonding step S4. In the bonded structure 20, the bonding reliability between the first bonding material 11 and the second bonding material 12 is high by the bonding layer 14, and thus a bonded structure having excellent reliability can be provided.
As described above, according to the laser bonding method of the present embodiment, the bonded structure 20 can be formed by bonding the first bonding material 11 and the second bonding material 12 having significantly different melting points by laser bonding. The joined structure 20 of the present embodiment is configured by laser joining the first joining material 11 made of a stainless material and the second joining material 12 made of a zinc alloy material, and therefore, an inexpensive joined structure can be provided.
(modification example)
Next, a laser bonding method according to a modification will be described. Fig. 5 is a diagram showing a part of the structure of a laser bonding apparatus used in the laser bonding method of the modification. As shown in fig. 5, a bonding apparatus 101 of a modification includes a holding portion 102 different from the holding portion 2 of the above embodiment. The holding portion 102 of the present embodiment includes a base portion 102a, a platen 2b, and a heater portion 102c provided on the base portion 102 a.
The holding portion 102 of the present modification heats the base portion 2a by the heater portion 102c, thereby directly heating the object 10 held on the base portion 102 a. In the present modification, the holding portion 102 heats the first surface 11a of the first bonding material 11 by the heater portion 102 c.
According to the laser bonding method of the modified example, the heater portion 102c including the holding portion 102 can perform the melting step S2 of melting only a part of the second bonding material 12 using the laser light L irradiated from the laser irradiation portion 3, and perform the heating step S3 of heating the first surface 11a of the first bonding material 11 using the heater portion 102 c. According to the laser bonding method of the present modification, unlike the above-described embodiment, the melting step S2 and the heating step S3 can be performed in different steps. In the laser bonding method of the present modification, the bonded structure 20 obtained by laser bonding the first bonding material 11 and the second bonding material 12 having significantly different melting points can be formed in the same manner as in the above-described embodiment.
The above-described structures described in the present specification can be appropriately combined within a range not contradictory to each other.
For example, in the above-described embodiment, the case where the laser irradiation unit 3 irradiates the object 10 with the laser light L from the vertical direction is exemplified, but the irradiation direction of the laser light L is not particularly limited. That is, the laser irradiation unit 3 may irradiate the laser light L from obliquely above.
Claims (10)
1. A laser bonding method for bonding a first bonding material made of a stainless steel material and a second bonding material made of a zinc alloy material by using a laser, the laser bonding method comprising:
a first step of disposing a second bonding material on a first surface of a first bonding material;
a second step of irradiating laser light from the second bonding material side to the first bonding material side to melt a part of the second bonding material;
a third step of heating the first surface of the first bonding material; and
a fourth step of bonding a part of the molten second bonding material to the first bonding material having the heated first surface.
2. The laser bonding method according to claim 1,
in the third step, the first surface of the first bonding material is heated by heat of the laser light that melts a part of the second bonding material.
3. The laser bonding method according to claim 2,
in the second step, the laser irradiation is performed so that the laser is focused on the first surface side of the second bonding material with respect to a half of the thickness.
4. The laser bonding method according to claim 3,
in the second step, laser irradiation is performed so that the laser is focused on the first surface of the first bonding material.
5. The laser bonding method according to any one of claims 2 to 4,
in the second step, the first surface of the first bonding material is irradiated with laser light from a vertical direction, i.e., a Y-axis direction.
6. The laser bonding method according to any one of claims 1 to 5,
in the second step, the laser light is irradiated in a pulse shape.
7. The laser bonding method according to any one of claims 1 to 6,
in the first to fourth steps, the first bonding material and the second bonding material are held in a pressurized state.
8. The laser bonding method according to any one of claims 1 to 7,
YAG laser is used as the laser.
9. The laser bonding method according to any one of claims 1 to 8,
the first to fourth steps are performed in an inert atmosphere.
10. A joined structure obtained by joining a first joining material made of a stainless steel material and a second joining material made of a zinc alloy material,
the first bonding material and the second bonding material are bonded by the laser bonding method according to any one of claims 1 to 9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-016295 | 2020-02-03 | ||
| JP2020016295A JP2021122831A (en) | 2020-02-03 | 2020-02-03 | Laser joining method and junction structure |
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| Publication Number | Publication Date |
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| CN113199141A true CN113199141A (en) | 2021-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110149009.9A Withdrawn CN113199141A (en) | 2020-02-03 | 2021-02-03 | Laser bonding method and bonded structure |
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| JP (1) | JP2021122831A (en) |
| CN (1) | CN113199141A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992188A (en) * | 1982-11-15 | 1984-05-28 | Matsushita Electric Ind Co Ltd | Joining method of low melting material and high melting material |
| CN102211253A (en) * | 2010-04-09 | 2011-10-12 | 深圳市大族激光科技股份有限公司 | Laser welding method for dissimilar metals |
| JP2012135811A (en) * | 2010-12-28 | 2012-07-19 | Kobe Steel Ltd | Method for joining different material |
| CN103143838A (en) * | 2013-02-22 | 2013-06-12 | 佛山市利迅达机器人系统有限公司 | Seamless hook welding process for front side of water tank |
| CN104289814A (en) * | 2014-06-26 | 2015-01-21 | 佛山晓世科技服务有限公司 | Dissimilar metal pipe welding method and application |
| CN105149778A (en) * | 2015-07-30 | 2015-12-16 | 江苏大学 | Device and method for eliminating aluminum-steel dissimilar metal laser welding cracks and gas holes |
| CN110000470A (en) * | 2017-11-27 | 2019-07-12 | 矢崎总业株式会社 | The welding method of dissimilar metals |
-
2020
- 2020-02-03 JP JP2020016295A patent/JP2021122831A/en active Pending
-
2021
- 2021-02-03 CN CN202110149009.9A patent/CN113199141A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992188A (en) * | 1982-11-15 | 1984-05-28 | Matsushita Electric Ind Co Ltd | Joining method of low melting material and high melting material |
| CN102211253A (en) * | 2010-04-09 | 2011-10-12 | 深圳市大族激光科技股份有限公司 | Laser welding method for dissimilar metals |
| JP2012135811A (en) * | 2010-12-28 | 2012-07-19 | Kobe Steel Ltd | Method for joining different material |
| CN103143838A (en) * | 2013-02-22 | 2013-06-12 | 佛山市利迅达机器人系统有限公司 | Seamless hook welding process for front side of water tank |
| CN104289814A (en) * | 2014-06-26 | 2015-01-21 | 佛山晓世科技服务有限公司 | Dissimilar metal pipe welding method and application |
| CN105149778A (en) * | 2015-07-30 | 2015-12-16 | 江苏大学 | Device and method for eliminating aluminum-steel dissimilar metal laser welding cracks and gas holes |
| CN110000470A (en) * | 2017-11-27 | 2019-07-12 | 矢崎总业株式会社 | The welding method of dissimilar metals |
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| JP2021122831A (en) | 2021-08-30 |
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Application publication date: 20210803 |