CN113199121A - Semiconductor light-emitting plate welding machine - Google Patents
Semiconductor light-emitting plate welding machine Download PDFInfo
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- CN113199121A CN113199121A CN202110564706.0A CN202110564706A CN113199121A CN 113199121 A CN113199121 A CN 113199121A CN 202110564706 A CN202110564706 A CN 202110564706A CN 113199121 A CN113199121 A CN 113199121A
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- plate
- welding
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- groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K9/00—Arc welding or cutting
- B23K9/32—Accessories
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a semiconductor light-emitting plate welding machine which structurally comprises a control box, a stamping device and a case, wherein the control box is fixedly arranged on the right side of the case; stamping equipment is by the hydraulic pressure pipe, the welding pipe, the processing board, the pillar is constituteed, the hydraulic pressure pipe is vertical to be connected in the welding pipe upper end, the welding pipe is located between the pillar, pillar fixed mounting is in processing board upper end left and right sides, when hot solution is extruded from the soldered connection department, can contact the terminal closed angle department of movable plate, can extrude the movable plate to the left and right sides along with the hot melt liquid that melts constantly increases, impel the movable plate to slide in to the sliding tray inboard gradually, then push up in the pump block department, and the movable plate laminating is in the soldered connection outline, the in-process that the movable plate removed its inboard scraping plate can laminate in the soldered connection outside and rub, scrape the residue through the friction of the friction plate in the scraping plate.
Description
Technical Field
The invention belongs to the technical field of semiconductor light emitting, and particularly relates to a semiconductor light emitting plate welding machine.
Background
The welding machine utilizes the high-temperature electric arc generated by the instantaneous short circuit of the positive pole and the negative pole to melt the welding rod for welding, and the hot melt of the welding rod is contacted with electronic elements to be connected in the luminous plate in the semiconductor processing, thereby achieving the welding effect.
Based on the findings of the inventor, the following defects mainly exist in the prior art, such as: when the equipment is used for welding a workpiece, certain electric arc sparks can splash outwards in the welding process, and the splashed sparks have certain residues, so that part of the residues can be in contact with and stay around the welding head when splashed outwards, the welding rod can be mixed with the residues which stay around the welding head when the welding head is melted, and then the welding rod drips on the workpiece to influence the welding effect.
It is therefore desirable to provide a semiconductor light emitting panel bonder.
Disclosure of Invention
To solve the problems of the above-described technology.
The invention relates to a semiconductor light-emitting plate welding machine, which is achieved by the following specific technical means: the structure of the stamping machine comprises a control box, stamping equipment and a case, wherein the control box is fixedly arranged on the right side of the case, and the stamping equipment is fixedly embedded at the upper end of the case; the stamping equipment comprises hydraulic pressure pipe, welding pipe, process board, pillar, the hydraulic pressure pipe is vertical to be connected in welding pipe upper end, the welding pipe is located between the pillar, pillar fixed mounting is in the process board upper end left and right sides.
The welding pipe is composed of a clamping piece, welding rods, a welding head, a scraping device and a wrapping frame, wherein the clamping piece is fixedly installed on the outer side of the welding rods, the welding rods are vertically connected to the upper end of the welding head, the welding head is movably clamped inside the wrapping frame, the scraping device is located on the left side and the right side of the welding head, and the scraping device is symmetrically installed on the left side and the right side of the welding head and is attached to the outline of the welding head.
Wherein, scraping device comprises crooked board, movable plate, sliding tray, aerifys the block, the movable joint of movable plate is inboard in the sliding tray, sliding tray and crooked board structure as an organic whole, aerify the block laminating and connect in the sliding tray inboard, the movable plate diameter is less than the sliding tray, and the front end surface is comparatively crude.
The movable plate comprises a scraping plate, an inner groove, a discharge mechanism and a conveying plate, wherein the scraping plate is fixedly embedded at the upper end of the inner groove, the discharge mechanism is movably clamped at the lower end of the left side of the inner groove, the conveying plate is fixedly arranged at the inner side of the inner groove, and the conveying plate is attached to the inner contour of the inner groove and inclines for a certain angle.
The scraping plate is composed of a friction plate, a curved frame and a sliding groove, the friction plate is connected to the upper end of the curved frame in a riveting mode, the curved frame is connected above the sliding groove in an embedded mode, the three friction plates are installed at the upper end of the curved frame in a trapezoid mode, and the surface of each friction plate is made of frosted materials.
Wherein, discharge mechanism comprises collection frame, cavity groove, knob, contact block, it is inboard in the cavity groove to collect frame horizontal installation, knob activity joint is in cavity inslot side lower extreme, the contact block riveting is connected in the knob outside, the certain angle of contact block surface slope, and the top is comparatively hard.
Wherein, collect the frame by the swing board, place board, kicking block, slurcam, activity button and constitute, the swing board is located places the board lower extreme, the kicking block with place board structure as an organic whole, the slurcam is embedded to be connected in the swing inboard, activity button activity block is in the swing board outside, the inboard interval of kicking block constantly increases from both sides to middle part, makes it be the triangle-shaped and distributes.
The pushing plate is composed of an annular groove, an embedding and fixing plate and a rubber block, the annular groove is fixedly arranged at the right lower end of the embedding and fixing plate, the rubber block is movably clamped on the inner side of the annular groove, the inner contour of the annular groove is annular, and the annular groove is soft in texture.
Compared with the prior art, the invention has the following beneficial effects:
1. when hot solution is extruded from the welding head, the hot solution can contact the sharp corner at the tail end of the moving plate, the moving plate can be extruded towards the left side and the right side along with the increasing of the molten hot melting liquid, the moving plate is gradually pushed towards the inner side of the sliding groove and then pushed against the inflating block, the moving plate is attached to the outer contour of the welding head, the scraping plate on the inner side of the moving plate can be attached to the outer side of the welding head to rub in the moving process of the moving plate, and residues are scraped through the friction of the friction plate in the scraping plate.
2. Through the clockwise roll of rotatory button contact slip tank bottom inner wall, the block is in ring channel department, then drives the swing board and swings under the injecing of activity button, makes the closed angle position on top push up in kicking block slope arcwall face department, and the swing to the outside constantly draws simultaneously and places the board downward sloping and open, makes it pile up and places the residue of board upper end outside the face of slope is poured downwards the discharge apparatus.
Drawings
Fig. 1 is a schematic structural view of a semiconductor light emitting panel bonding machine according to the present invention.
Fig. 2 is a schematic structural diagram of a stamping device of a semiconductor light-emitting panel welding machine according to the present invention.
FIG. 3 is a schematic structural diagram of a soldering pipe of the semiconductor light emitting panel soldering machine of the present invention.
Fig. 4 is a schematic structural view of a scraping device of a semiconductor light-emitting panel welding machine according to the present invention.
FIG. 5 is a schematic structural view of a moving plate of a semiconductor light-emitting panel welding machine according to the present invention.
Fig. 6 is a schematic structural view of a scraping plate of a semiconductor light emitting panel welding machine according to the present invention.
FIG. 7 is a schematic diagram of the discharge mechanism of a soldering machine for semiconductor light emitting panels according to the present invention.
Fig. 8 is a schematic structural view of a collecting frame of a semiconductor light emitting panel welding machine according to the present invention.
FIG. 9 is a schematic diagram of the structure of a pusher plate of a semiconductor light emitting panel welding machine of the present invention.
In the figure: the device comprises a control box-1, a stamping device-2, a case-3, a hydraulic pipe-21, a welded pipe-22, a processing plate-23, a support column-24, a clamping piece-221, a welding rod-222, a welding head-223, a scraping device-224, a wrapping frame-225, a bending plate-241, a moving plate-242, a sliding groove-243, an air charging block-244, a scraping plate-421, an inner groove-422, a discharging mechanism-423, a conveying plate-424, a friction plate-211, a curved frame-212, a sliding groove-213, a collecting frame-231, a hollow groove-232, a rotating button-233, a contact block-234, a swinging plate-311, a placing plate-312, a top block-313, a pushing plate-314, a movable button-315, an annular groove-141, a fixing plate-142 and a rubber block-143.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example 1:
as shown in figures 1 to 6:
the invention provides a semiconductor light-emitting panel welding machine which structurally comprises a control box 1, a stamping device 2 and a case 3, wherein the control box 1 is fixedly arranged on the right side of the case 3, and the stamping device 2 is fixedly connected to the upper end of the case 3 in an embedded manner; the stamping equipment 2 comprises hydraulic pressure pipe 21, welded pipe 22, process board 23, pillar 24, hydraulic pressure pipe 21 is vertical to be connected in welded pipe 22 upper end, welded pipe 22 is located between pillar 24, pillar 24 fixed mounting is in the left and right sides of process board 23 upper end.
The welding pipe 22 comprises a clamping piece 221, a welding rod 222, a welding head 223, a scraping device 224 and a wrapping frame 225, wherein the clamping piece 221 is fixedly installed on the outer side of the welding rod 222, the welding rod 222 is vertically connected to the upper end of the welding head 223, the welding head 223 is movably clamped on the inner side of the wrapping frame 225, the scraping device 224 is located on the left side and the right side of the welding head 223, the scraping device 224 is symmetrically installed on the left side and the right side of the welding head 223 and is attached to the outer contour of the welding head 223, and when the welding rod 222 is extruded from the welding head 223 after being hot melted, the welding rod 222 can contact and extrude the scraping device 224 and slide on the outer side of the welding head 223, so that residues are scraped.
The scraping device 224 is composed of a curved plate 241, a moving plate 242, a sliding groove 243 and an air charging block 244, the moving plate 242 is movably clamped inside the sliding groove 243, the sliding groove 243 and the curved plate 241 are of an integrated structure, the air charging block 244 is attached to the inner side of the sliding groove 243, the diameter of the moving plate 242 is smaller than that of the sliding groove 243, the front end surface of the moving plate 242 is rough, so that residues adhered to the periphery of the butt joint can be scraped by sliding the moving plate 242 in the sliding groove 243, and the residues are scraped by the front end surface of the moving plate 242.
The movable plate 242 comprises a scraping plate 421, an inner groove 422, a discharge mechanism 423 and a conveying plate 424, the scraping plate 421 is fixedly embedded at the upper end of the inner groove 422, the discharge mechanism 423 is movably clamped at the lower end of the left side of the inner groove 422, the conveying plate 424 is fixedly arranged at the inner side of the inner groove 422, the conveying plate 424 is attached to the inner contour of the inner groove 422 and is inclined at a certain angle, and residues falling from the scraping plate 421 are collected to the discharge mechanism 423 along the surface of the conveying plate 424 and then are discharged.
The scraping plate 421 is composed of a friction plate 211, a curved frame 212 and a sliding groove 213, the friction plate 211 is riveted to the upper end of the curved frame 212, the curved frame 212 is fixedly embedded in the sliding groove 213, the friction plate 211 is provided with three trapezoid-shaped parts which are installed on the upper end of the curved frame 212, the surface of the friction plate is made of a frosted material, and therefore friction scraping is performed on residues retained around a welding head conveniently, and the surface of the welding head is kept clean.
The specific use mode and function of the embodiment are as follows:
when the invention is used, a workpiece to be welded is placed on a processing plate 23 in a stamping device 2, then a button in a control box 1 is pressed to cause a welding rod 222 clamped inside a clamping piece 221 in a welding pipe 22 to be melted and extruded at a welding head 223, then the welding pipe 22 is driven to be close to a designated position of the workpiece to be welded through the movement of a support column 24, scraping devices 224 are arranged at the left side and the right side of the lower end of the welding head 223, when hot solution is extruded from the welding head 223, the sharp angle at the tail end of a moving plate 242 in the scraping devices 224 is contacted, the moving plate 242 is pressed towards the left side and the right side along with the increasing of the molten hot melt liquid, the moving plate 242 is caused to gradually slide towards the inner side of a sliding groove 243 and then is propped against an air charging block 244, the moving plate 242 is attached to the outer contour of the welding head 223, the scraping plate 421 at the inner side is attached to the outer side of the welding head 223 to be rubbed in the moving process of the moving plate 242, the residues left around the welding head 223 are scraped by the friction of the friction plate 211 in the scraping plate 421, and the dropped residues enter the curved frame 212 from the left and right sides, slide down along the curved frame 212, and continuously collect at the upper end of the inner side of the discharge mechanism 423 under the partition of the conveying plate 424, so that the residues around the welding head 223 are favorably carried out, the residues are prevented from being mixed with the hot melt liquid, the scraping device 224 is obliquely arranged, and when the hot melt liquid flowing out from the welding head 223 is reduced, the moving plate 242 slides out and is restored to be attached to the outer side of the welding head 223 again.
Example 2:
as shown in fig. 7 to 9: the scraping device 224 is composed of a curved plate 241, a moving plate 242, a sliding groove 243 and an air charging block 244, the moving plate 242 is movably clamped inside the sliding groove 243, the sliding groove 243 and the curved plate 241 are of an integrated structure, the air charging block 244 is attached to the inner side of the sliding groove 243, the diameter of the moving plate 242 is smaller than that of the sliding groove 243, the front end surface of the moving plate is rough, so that residues adhered to the periphery of the butt joint can be scraped by sliding the moving plate 242 in the sliding groove 243 conveniently.
The movable plate 242 comprises a scraping plate 421, an inner groove 422, a discharge mechanism 423 and a conveying plate 424, the scraping plate 421 is fixedly embedded at the upper end of the inner groove 422, the discharge mechanism 423 is movably clamped at the lower end of the left side of the inner groove 422, the conveying plate 424 is fixedly arranged at the inner side of the inner groove 422, the conveying plate 424 is attached to the inner contour of the inner groove 422 and is inclined at a certain angle, and residues falling from the scraping plate 421 are collected to the discharge mechanism 423 along the surface of the conveying plate 424 and then are discharged.
Wherein, discharge mechanism 423 comprises collection frame 231, cavity 232, knob 233, contact piece 234, it is inboard in cavity 232 to collect frame 231 horizontal installation, knob 233 activity block in the inboard lower extreme of cavity 232, contact piece 234 riveting is connected in the knob 233 outside, contact piece 234 surface slope certain angle, and the top is comparatively hard, and then is favorable to rotating certain angle through knob 233 control contact piece 234 and stretching into collection frame 231 department, and the control is inboard opens and shuts, is convenient for discharge the residue when using.
The collecting frame 231 comprises a swinging plate 311, a placing plate 312, a top block 313, a pushing plate 314 and a movable button 315, the swinging plate 311 is positioned at the lower end of the placing plate 312, the top block 313 and the placing plate 312 are of an integrated structure, the pushing plate 314 is fixedly embedded in the swinging plate 311, the movable button 315 is movably clamped outside the swinging plate 311, the distance between the inner sides of the top blocks 313 is continuously increased from two sides to the middle part, the top blocks 313 are enabled to be distributed in a triangular shape, the top blocks 313 can be conveniently contacted with the bending position of the top block 313 when the swinging plate 311 swings, and the placing plate 312 is controlled to be opened and closed.
The pushing plate 314 comprises an annular groove 141, an embedding plate 142 and a rubber block 143, the annular groove 141 is fixedly arranged at the lower right end of the embedding plate 142, the rubber block 143 is movably clamped inside the annular groove 141, the inner contour of the annular groove 141 is annular and soft, and therefore the pushing plate is beneficial to being matched with the rubber block 143 to be effectively clamped when the device moves, and residue is convenient to discharge.
The specific use mode and function of the embodiment are as follows:
the residue discharged from the scraping plate 421 will enter the upper end of the hollow groove 232 in the discharging mechanism 423 under the baffle of the conveying plate 424, and fall on the placing plate 312 in the collecting frame 231, and when the moving plate 242 slides out from the sliding groove 243, the rotating button 233 will contact the inner wall of the bottom end of the sliding groove 243 to roll clockwise, so that the contact block 234 at the upper end will contact the annular groove 141 in the pushing plate 314 while rolling, and press the rubber block 143 to engage inside, and then drive the swinging plate 311 to swing under the limitation of the movable button 315, so that the sharp corner position at the top end will be against the inclined arc surface of the top block 313 to swing continuously outwards, and at the same time, the placing plate 312 is pulled to tilt downwards and open, so that the residue accumulated at the upper end of the placing plate 312 will fall out of the discharging device along the inclined plate surface, thereby facilitating the residue accumulated at the inner side to be discharged during the moving of the moving plate 242, avoiding accumulation on the inner side.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (8)
1. A semiconductor light-emitting plate welding machine structurally comprises a control box (1), a stamping device (2) and a case (3), wherein the control box (1) is fixedly arranged on the right side of the case (3), and the stamping device (2) is fixedly embedded at the upper end of the case (3); the method is characterized in that:
stamping equipment (2) comprise hydraulic pressure pipe (21), welding pipe (22), processing board (23), pillar (24), hydraulic pressure pipe (21) is vertical to be connected in welding pipe (22) upper end, welding pipe (22) are located between pillar (24), pillar (24) fixed mounting is in processing board (23) upper end left and right sides.
2. The semiconductor light emitting panel bonding machine of claim 1, wherein: the welding pipe (22) is composed of a clamping piece (221), a welding rod (222), a welding head (223), a scraping device (224) and a wrapping frame (225), the clamping piece (221) is fixedly installed on the outer side of the welding rod (222), the welding rod (222) is vertically connected to the upper end of the welding head (223), the welding head (223) is movably clamped on the inner side of the wrapping frame (225), and the scraping device (224) is located on the left side and the right side of the welding head (223).
3. The semiconductor light emitting panel bonding machine of claim 2, wherein: the scraping device (224) is composed of a bent plate (241), a moving plate (242), a sliding groove (243) and an air inflation block (244), the moving plate (242) is movably clamped on the inner side of the sliding groove (243), the sliding groove (243) and the bent plate (241) are of an integrated structure, and the air inflation block (244) is attached to the inner side of the sliding groove (243).
4. The semiconductor light emitting panel bonding machine of claim 3, wherein: the movable plate (242) is composed of a scraping plate (421), an inner groove (422), a discharge mechanism (423) and a conveying plate (424), the scraping plate (421) is fixedly embedded at the upper end of the inner groove (422), the discharge mechanism (423) is movably clamped at the lower end of the left side of the inner groove (422), and the conveying plate (424) is fixedly installed on the inner side of the inner groove (422).
5. The semiconductor light emitting panel bonding machine of claim 4, wherein: the scraping plate (421) is composed of a friction plate (211), a curved frame (212) and a sliding groove (213), the friction plate (211) is connected to the upper end of the curved frame (212) in a riveting mode, and the curved frame (212) is fixedly connected to the upper portion of the sliding groove (213) in an embedding mode.
6. The semiconductor light emitting panel bonding machine of claim 4, wherein: discharge mechanism (423) comprises collection frame (231), cavity groove (232), knob (233), contact piece (234), collection frame (231) horizontal installation is inboard in cavity groove (232), knob (233) activity block is in the inboard lower extreme of cavity groove (232), contact piece (234) riveting is connected in the knob (233) outside.
7. The semiconductor light emitting panel bonding machine of claim 6, wherein: the collecting frame (231) is composed of a swinging plate (311), a placing plate (312), a top block (313), a pushing plate (314) and a movable button (315), the swinging plate (311) is located at the lower end of the placing plate (312), the top block (313) and the placing plate (312) are of an integrated structure, the pushing plate (314) is fixedly connected to the inner side of the swinging plate (311), and the movable button (315) is movably clamped on the outer side of the swinging plate (311).
8. The semiconductor light emitting panel bonding machine of claim 7, wherein: the pushing plate (314) is composed of an annular groove (141), an embedding plate (142) and a rubber block (143), the annular groove (141) is fixedly arranged at the right lower end of the embedding plate (142), and the rubber block (143) is movably clamped on the inner side of the annular groove (141).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110564706.0A CN113199121A (en) | 2021-05-24 | 2021-05-24 | Semiconductor light-emitting plate welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110564706.0A CN113199121A (en) | 2021-05-24 | 2021-05-24 | Semiconductor light-emitting plate welding machine |
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| CN113199121A true CN113199121A (en) | 2021-08-03 |
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| CN202110564706.0A Pending CN113199121A (en) | 2021-05-24 | 2021-05-24 | Semiconductor light-emitting plate welding machine |
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