CN113198801A - Method for cleaning micro-nano particles by spatially-constrained double-beam laser-induced shock waves - Google Patents
Method for cleaning micro-nano particles by spatially-constrained double-beam laser-induced shock waves Download PDFInfo
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- CN113198801A CN113198801A CN202110482134.1A CN202110482134A CN113198801A CN 113198801 A CN113198801 A CN 113198801A CN 202110482134 A CN202110482134 A CN 202110482134A CN 113198801 A CN113198801 A CN 113198801A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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Abstract
A method for cleaning micro-nano particles by using spatially-constrained double-beam laser induced shock waves comprises the following steps: 1) bonding a substrate to be cleaned on a three-dimensional moving platform, and moving the three-dimensional moving platform to enable the substrate to be cleaned to be positioned at a laser pulse focusing point and a cavity outlet; 2) the first pulse laser beam and the second pulse laser beam are focused in the cavity to induce gas breakdown to generate plasma shock waves, and the intensity of the shock waves is enhanced through reflection of the inner surface of the cavity, so that micro-nano particle pollutants on the surface of the to-be-cleaned substrate fly away from the surface of the to-be-cleaned substrate under the action of shock wave removing force. The invention provides a method for cleaning micro-nano particles by using spatially-constrained double-beam laser-induced shock waves, which can effectively improve the cleaning area of the surface of a substrate and improve the cleaning efficiency.
Description
Technical Field
The invention relates to a surface cleaning technology, in particular to a method for cleaning micro-nano particles by using space-constrained double-beam laser induced shock waves.
Background
With the continuous reduction of the size of the chip unit (the half pitch of DRAM is expected to reach 14nm in 2021), the size of the pollution particles on the surface of the silicon wafer to be cleaned is smaller than 10 nm. Particulate contaminants can degrade the performance of products such as integrated chips, micromachines, precision optical components and the like in the IC industry, and can cause product failure in severe cases. The conventional mechanical cleaning and chemical cleaning methods (mechanical scrubbing, chemical immersion, ultrasonic cleaning, etc.) have the disadvantages of damaging the substrate and secondary contamination, and such methods are inefficient in cleaning particles having a diameter of less than 100 nm.
The laser-induced plasma cleaning is to directly focus in a gas atmosphere, induce gas ionization to generate plasma shock waves, and remove the nano particles on the surface of the polluted substrate by utilizing the action of the erasing force of the shock waves. The technology avoids the direct interaction of laser and a matrix, can effectively remove nano-particles, is convenient to control and high in efficiency, and does not damage a substrate. Recent researches find that the double-pulse induced plasma cleaning technology can effectively inhibit the problem of formation of uncleaned blind areas in single-pulse laser induced plasma shock wave cleaning, but does not solve the problem of small cleaning area. The invention patent 200810165891.0 discloses a method and a device for cleaning a substrate, which provides an inner chamber constrained laser-induced shock wave cleaning method, and has the defects of small cleaning area and low cleaning efficiency.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a method for cleaning micro-nano particles by using space-constrained double-beam laser-induced shock waves, which can effectively improve the cleaning area of the surface of a substrate and improve the cleaning efficiency.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a method for cleaning micro-nano particles by using spatially-constrained double-beam laser induced shock waves comprises the following steps:
1) bonding a substrate to be cleaned on a three-dimensional moving platform, and moving the three-dimensional moving platform to enable the substrate to be cleaned to be positioned at a laser pulse focusing point and a cavity outlet;
2) the first pulse laser beam and the second pulse laser beam are focused in the cavity to induce gas breakdown to generate plasma shock waves, and the intensity of the shock waves is enhanced through reflection of the inner surface of the cavity, so that micro-nano particle pollutants on the surface of the to-be-cleaned substrate fly away from the surface of the to-be-cleaned substrate under the action of shock wave removing force.
Further, the three-dimensional moving platform is controlled by a computer control system, and the moving precision of the three-dimensional moving platform is 5 micrometers.
The back of the substrate to be cleaned is fixed on the three-dimensional moving platform, the substrate is taken down from the platform after an experiment, and the back of the substrate is bonded on the three-dimensional moving platform by using a double-sided adhesive tape.
The surface of the substrate to be cleaned is positioned right above the outlet of the cavity at the focus point of the double-beam pulse laser, the distance between the plasma and the surface of the substrate to be cleaned is ensured, the substrate is not damaged in the experiment, and the cleaning effect is better.
The first pulse laser beam and the second pulse laser beam are respectively obtained by a first pulse laser and a second pulse laser; the first pulse laser beam forms a reflected pulse laser beam through the reflecting mirror, the reflected pulse laser beam and the second pulse laser beam are respectively focused at one point in the cavity through the first focusing mirror and the second focusing mirror, and at least one pulse of the reflected pulse laser beam and the second pulse laser beam can independently break down gas to induce and generate plasma shock waves.
The first pulse laser beam and the second pulse laser beam are controlled by a digital delay generator for pulse delay time, and the pulse delay time is adjustable between 0-100 mu s.
The first focusing mirror and the second focusing mirror respectively focus the reflected pulse laser beam and the second pulse laser beam at the same point in the cavity, the reflected pulse laser beam and the second pulse laser beam are focused on the same plane, and the included angle is adjustable between 0 and 180 degrees.
The cavity is a closed container, the shape of the cavity is a sphere or a cuboid, and the cavity is made of glass or polymer.
At least two of the cavities have a first cavity window and a second cavity window that allow laser light to pass through, and the materials include, but are not limited to, glass.
The reflected pulse laser beam and the second pulse laser beam are focused in the cavity to induce gas breakdown, and the breakdown times are between 1 and 100;
the reflected pulsed laser beam and the second pulsed laser beam are focused to induce breakdown in a gas below the surface to be cleaned, the gas comprising air or an inert gas;
the wavelengths of the first pulse laser and the second pulse laser for cleaning are 1064/532nm, the pulse width is between 10fs and 10ns, and the energy of a single beam is 100 and 1000 mJ; the diameter of the micro-nano particle pollutant is 0.01-1000 mu m.
The invention uses two lasers to respectively generate a beam of laser pulse to focus on the same point in the cavity space, the generated plasma and shock wave are reflected and amplified by the inner surface of the cavity, and finally emerge to the surface of the substrate to be cleaned through the outlet of the cavity, and under the action of the wiping force of the shock wave, the particle pollutants on the surface of the substrate to be cleaned fly away.
The invention has the following beneficial effects: the plasma shock wave is generated by double-pulse laser induced gas breakdown, the direct interaction between the laser and the substrate is avoided, the green and environment-friendly advantages of the pulse laser induced plasma shock wave cleaning technology, convenience in control and no damage to the substrate are kept, meanwhile, the formation of an uncleaned blind area in the single-pulse induced shock wave cleaning method can be effectively inhibited, the cleaning area is enlarged, and the cleaning efficiency is improved.
Drawings
FIG. 1 is a diagram of an apparatus for cleaning micro-nano particles by using spatially-constrained dual-beam laser-induced shock waves according to the present invention.
The device comprises a first pulse laser 1, a digital delay generator 2, a second pulse laser 3, a first pulse laser beam 4, a reflector 5, a reflected pulse laser beam 6, a second pulse laser beam 7, a first focusing mirror 8, a second focusing mirror 9, a three-dimensional moving platform 10, a substrate 11, pollution particles 12, a computer control system 13, a cavity 14, shock waves 15, a focusing focus 16, a cavity window 17 and a cavity window 18.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Referring to fig. 1, a method for cleaning micro-nano particles by using spatially-constrained dual-beam laser-induced shock waves includes the following steps:
1) bonding a substrate to be cleaned on the three-dimensional moving platform 10, and moving the three-dimensional moving platform 10 to enable the substrate to be cleaned to be positioned at a laser pulse focusing point and a cavity outlet;
2) the first pulse laser beam and the second pulse laser beam are focused in the cavity to induce gas breakdown to generate plasma shock waves, and the intensity of the shock waves is enhanced through reflection of the inner surface of the cavity, so that micro-nano particle pollutants on the surface of the to-be-cleaned substrate fly away from the surface of the to-be-cleaned substrate under the action of shock wave removing force.
Further, the three-dimensional moving platform 10 is controlled by the computer control system 13, and the moving precision of the three-dimensional moving platform 10 is 5 μm.
The back of the substrate 11 to be cleaned is fixed on the three-dimensional moving platform 10, the substrate is taken down from the platform after the experiment, and the back of the substrate 11 is bonded on the three-dimensional moving platform 10 by using a double-sided adhesive tape.
The surface of the substrate 11 to be cleaned is positioned right above the outlet of the cavity 14 at the focus point 16 of the double-beam pulse laser, the distance between the plasma and the surface of the substrate 11 to be cleaned is ensured to ensure that the substrate is not damaged in the experiment, and a better cleaning effect is achieved.
The first pulse laser beam 4 and the second pulse laser beam 7 are obtained by a first pulse laser (1) and a second pulse laser (3) respectively; the first pulse laser beam 4 forms a reflected pulse laser beam 6 through a reflecting mirror, the reflected pulse laser beam 6 and the second pulse laser beam 7 are respectively focused at one point in a cavity 14 through a first focusing mirror 8 and a second focusing mirror 9, and at least one pulse of the reflected pulse laser beam 6 and the second pulse laser beam 7 can independently break down gas to generate plasma shock waves.
The first pulse laser beam 4 and the second pulse laser beam 7 are controlled by the digital delay generator 2 for a pulse delay time that is adjustable between 0-100 mus.
The first focusing mirror 8 and the second focusing mirror 9 respectively focus the reflected pulse laser beam 6 and the second pulse laser beam 7 at the same point in the cavity, the focus points of the reflected pulse laser beam 6 and the second pulse laser beam 7 are in the same plane, and the included angle is adjustable between 0 and 180 degrees.
The cavity 14 is a closed container, and is in the shape of a sphere or a cuboid, and is made of glass or polymer.
At least two of the cavities 14 have a first cavity window 17 and a second cavity window 18 that allow laser light to pass through, and the materials include, but are not limited to, glass.
The reflected laser beam 6 and the second pulse laser beam 7 are focused in the cavity 14 to induce gas breakdown, and the breakdown times are between 1 and 100;
the reflected laser beam 6 and the second pulsed laser beam 7 are focused to induce breakdown in a gas below the surface to be cleaned, the gas comprising air or an inert gas;
the wavelengths of the first pulse laser 1 and the second pulse laser 3 for cleaning are 1064/532nm, the pulse widths are between 10fs and 10ns, and the energy of a single beam is 100 and 1000 mJ; the diameter of the micro-nano particle pollutant is 0.01-1000 mu m.
As shown in fig. 1, under the regulation of the pulse delay time of the digital delay generator 2, the first pulse laser beam 4 and the second pulse laser beam 7 generated by the first pulse laser 1 and the second pulse laser 3 respectively form a reflected pulse laser beam 6 by the first pulse laser beam 4 through a reflector, the reflected pulse laser beam is focused at the same point in the cavity 14 through the first cavity window 17 and the second cavity window 18, and the shock wave 15 generated by laser focusing finally flows out of the outlet of the cavity 14 under the reflection and amplification of the inner surface of the cavity 14. A silicon wafer 11 polished on one side is fixed on a three-dimensional moving platform 10 through a double-sided adhesive tape, the movement of the three-dimensional moving platform 10 is controlled through a computer control system 13, the distance between a laser focusing point and the surface of the silicon wafer is adjusted, and the surface of the silicon wafer 11 to be cleaned is located above a focusing focus 16 and an outlet of a cavity 14. The two laser pulse delay time is controlled by a digital delay generator 2, a first pulse laser beam 4 and a second pulse laser beam 7 are respectively generated by a Nd: YAG pulse laser 1 and a Nd: YAG pulse laser 3, and the process parameters are as follows: the output wavelength is 1064nm, the pulse width is 6ns, the frequency is 10Hz, and the diameter of the light spot is 0.5 mm. The focal length of the focusing mirror is 150 mm. Of polished surfaces of silicon wafers 11The contaminant particles 12 are polystyrene latex nanoparticles with a particle size distribution of 300 nm. The optimal parameters for removing the micro-nano particles on the surface of the silicon wafer 11 by laser-induced plasma shock waves are adjusted by adjusting the shape and the volume of the cavity, the energy of two pulses of laser, the pulse frequency, the delay time between the pulses and the distance between the shock wave core generated by a laser focusing point and the surface of the silicon wafer 11. When the laser energy is too high and the distance between a laser focusing point and the surface of the silicon wafer is too small, the surface of the silicon wafer can be damaged; when the laser energy is too low and the distance between a laser focusing point and the surface of the silicon wafer is too large, the cleaning efficiency is greatly reduced; when the delay time between double pulses is too long, the area of the residual unwashed blind area cannot be effectively inhibited. Through experiments, the cavity is set to be spherical glass, and the volume is 33.5mm3The laser focus is positioned at the right center of the cavity and is 4mm away from the silicon chip in vertical distance, the single pulse laser energy is 200mJ, the pulse number of each time is 3, and the double pulse delay interval is 200 ns.
The embodiments described in this specification are merely illustrative of implementations of the inventive concepts, which are intended for purposes of illustration only. The scope of the present invention should not be construed as being limited to the particular forms set forth in the examples, but rather as being defined by the claims and the equivalents thereof which can occur to those skilled in the art upon consideration of the present inventive concept.
Claims (10)
1. A method for cleaning micro-nano particles by using spatially-constrained double-beam laser induced shock waves is characterized by comprising the following steps of:
1) bonding a substrate to be cleaned on a three-dimensional moving platform (10), and moving the three-dimensional moving platform (10) to enable the substrate (11) to be cleaned to be positioned at a laser pulse focusing point (16) and an outlet of a cavity (14);
2) the first pulse laser beam (4) and the second pulse laser beam (7) are focused in the cavity (14) to induce gas breakdown to generate plasma shock waves (15), and the intensity of the shock waves (15) is enhanced through reflection of the inner surface of the cavity (14), so that micro-nano particle pollutants (12) on the surface of the to-be-cleaned substrate fly away from the surface of the to-be-cleaned substrate (11) under the action of shock wave removing force.
2. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock waves as claimed in claim 1, wherein the three-dimensional moving platform (10) is controlled by a computer control system (13), and the moving precision of the three-dimensional moving platform (10) is 5 μm.
3. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock waves as claimed in claim 2, wherein the back surface of the substrate (11) to be cleaned is fixed on the three-dimensional moving platform (10), the substrate is taken down from the platform after the experiment, and a double-sided adhesive tape is selected to bond the back surface of the substrate (11) on the three-dimensional moving platform (10).
4. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock wave as claimed in claim 1, wherein the surface of the substrate (11) to be cleaned is located right above the outlet of the cavity (14) where the dual-beam pulse laser focus (16) is located, and the distance between the plasma and the surface of the substrate (11) to be cleaned is determined to ensure that the substrate is not damaged in the experiment and a better cleaning effect is achieved.
5. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock waves as claimed in claim 1, wherein the first pulse laser beam (4) and the second pulse laser beam (7) are respectively obtained by a first pulse laser (1) and a second pulse laser (3); the first pulse laser beam (4) forms a reflected pulse laser beam (6) through a reflecting mirror, the reflected pulse laser beam (6) and the second pulse laser beam (7) are respectively focused at one point in a cavity (14) through a first focusing mirror (8) and a second focusing mirror (9), and at least one pulse of the reflected pulse laser beam (6) and the second pulse laser beam (7) can independently break down gas to generate plasma shock waves.
6. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock waves as claimed in claim 5, wherein the pulse delay time of the first pulse laser beam (4) and the second pulse laser beam (7) is controlled by the digital delay generator (2), and is adjustable between 0 and 100 μ s.
7. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock waves as claimed in claim 5, wherein the first focusing mirror (8) and the second focusing mirror (9) respectively focus the reflected pulse laser beam (6) and the second pulse laser beam (7) at the same point in the cavity, the focus points of the reflected pulse laser beam (6) and the second pulse laser beam (7) are in the same plane, and the included angle is adjustable between 0 and 180 degrees.
8. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock waves as claimed in claim 5, wherein the cavity (14) is a closed container, the shape of the closed container is a sphere or a cuboid, and the material is glass or a polymer.
9. The method for cleaning micro-nano particles by using spatially confined dual-beam laser-induced shock waves as claimed in claim 5, wherein at least two of the cavities (14) have a first cavity window (17) and a second cavity window (18) for allowing laser to pass through, and the materials of the first cavity window and the second cavity window include but are not limited to glass.
10. The method for cleaning micro-nano particles by using the spatially-constrained dual-beam laser-induced shock waves as claimed in claim 1, wherein the reflected pulse laser beam (6) and the second pulse laser beam (7) are focused in the cavity (14) to induce gas breakdown, and the breakdown frequency is 1-100;
the reflected pulsed laser beam (6) and the second pulsed laser beam (7) are focused to induce breakdown in a gas below the surface to be cleaned, the gas comprising air or an inert gas;
the wavelengths of the first pulse laser (1) and the second pulse laser (3) for cleaning are 1064/532nm, the pulse width is between 10fs and 10ns, and the single-beam pulse energy is 100-1000 mJ; the diameter of the micro-nano particle pollutant is 0.01-1000 mu m.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114472373A (en) * | 2022-02-22 | 2022-05-13 | 浙江工业大学 | Multi-angle double-pulse laser cleaning device and cleaning method thereof |
| CN116441244A (en) * | 2023-03-28 | 2023-07-18 | 中建三局第一建设工程有限责任公司 | Laser cleaning robot control method based on machine vision |
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Application publication date: 20210803 |