CN113197546A - High-permeability friction nano sensor and preparation method thereof - Google Patents
High-permeability friction nano sensor and preparation method thereof Download PDFInfo
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/6802—Sensor mounted on worn items
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- D—TEXTILES; PAPER
- D01—NATURAL OR MAN-MADE THREADS OR FIBRES; SPINNING
- D01F—CHEMICAL FEATURES IN THE MANUFACTURE OF ARTIFICIAL FILAMENTS, THREADS, FIBRES, BRISTLES OR RIBBONS; APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OF CARBON FILAMENTS
- D01F6/00—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof
- D01F6/58—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products
- D01F6/74—Monocomponent artificial filaments or the like of synthetic polymers; Manufacture thereof from homopolycondensation products from polycondensates of cyclic compounds, e.g. polyimides, polybenzimidazoles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/04—Friction generators
Abstract
The invention belongs to the related technical field of flexible wearable electronic devices, and discloses a high-permeability friction nano sensor and a preparation method thereof, wherein the nano sensor comprises a packaging layer, an electrode layer, a friction layer and a microstructure layer which are arranged from top to bottom; the friction layer is made of PI and is prepared by adopting a one-step electrostatic spinning process; the friction nano sensor also comprises an adhesion layer, wherein the adhesion layer is arranged on the microstructure layer and realizes adhesion with a user through wetting. The friction nano sensor is convenient to wear, when the sensor is worn, the stable adhesion of a device can be realized by wetting the adhesion layer with a small amount of water, the wearing is assisted without using a transparent adhesive tape or a double-sided adhesive tape, and the self-adhesion function of the device is realized.
Description
Technical Field
The invention belongs to the technical field of flexible wearable electronic devices, and particularly relates to a high-permeability friction nano sensor and a preparation method thereof.
Background
The traditional electronic device is composed of rigid components such as a silicon-based chip, a hard circuit board, a resistor, a capacitor and the like, and the application range and the function expansion of the electronic device are limited. In recent years, with the development of material science and the progress of manufacturing processes, flexible electronic devices have been gradually developed, and have attracted wide attention of scholars. The flexible wearable electronic device has great application potential in the fields of flexible sensing, intelligent artificial limbs, human health monitoring and the like due to the stretchability, flexibility and intelligence of the flexible wearable electronic device and the easiness in integrated use with various sensing devices and wearable electronic systems.
Flexible wearable electronic devices developed at present can be attached to human skin by means of adhesive objects such as scotch tape or double-sided tape and the like, and are used for real-time touch sensing and biomechanical activity monitoring. However, since the electronic device has a long single-use time, the defects of non-permeability and poor adhesion performance of the electronic device are gradually revealed, and the electronic device becomes a key factor for restricting the subsequent development of the flexible wearable electronic device. Therefore, it is of great importance to develop a self-adhesive, high-permeability flexible wearable electronic device.
Disclosure of Invention
Aiming at the defects or improvement requirements of the prior art, the invention provides a high-permeability friction nano sensor and a preparation method thereof, wherein the sensor faces to the surface signal monitoring of a human body, a high-voltage electrostatic spinning technology and a friction nano power generation technology are combined, the prepared single-electrode self-attaching high-permeability friction nano sensor is used, and the single-electrode friction nano sensor can generate corresponding electric signals by means of contact separation or relative sliding between skin and a friction layer based on the principles of contact electrification and electrostatic induction. When micro friction is generated between the friction layer and the microstructure layer of the friction nano sensor and the human epidermis, the friction layer and the microstructure layer carry corresponding charges due to a contact electrification effect, and the electrode layer generates a corresponding charge transfer phenomenon by an electrostatic induction effect to form an induced current, so that the signal detection of the human epidermis is realized.
In order to achieve the above objects, according to one aspect of the present invention, there is provided a high-permeability friction nanosensor, the friction nanosensor including an encapsulation layer, an electrode layer, a friction layer, and a microstructure layer, which are disposed from top to bottom; the friction layer is made of PI and is prepared by adopting a one-step electrostatic spinning process;
the friction nano sensor also comprises an adhesion layer, wherein the adhesion layer is arranged on the microstructure layer and realizes adhesion with a user through wetting.
Further, the adhesion layer is of a PVA annular sheet structure.
Furthermore, the friction layer is composed of a plurality of nano-scale microcones which are arranged at intervals and are arranged in a disordered way, and the diameter of each nano-scale microcone is 20-100 nm.
Further, the electrode layer is silver nanowires disposed on a surface of the friction layer facing the encapsulation layer.
Furthermore, the microstructure layer and the packaging layer are prepared by electrostatic spinning.
Further, the material of the microstructure layer is PTFE; the packaging layer is made of PI.
According to another aspect of the present invention, there is provided a method for manufacturing a high permeability friction nanosensor, the method for manufacturing a high permeability friction nanosensor as described above.
Further, the preparation method comprises the following steps:
(1) preparing a friction layer by using an electrospinning solution as a raw material and adopting an electrostatic spinning process;
(2) preparing an electrode layer on the friction layer by means of an electrode template and a spraying process;
(3) preparing a packaging layer on the electrode layer by adopting an electrostatic spinning process;
(4) preparing a nano-scale micro-cone on the surface of the friction layer far away from the electrode layer by combining vacuum evaporation and an inductive coupling plasma etching process to obtain the microstructure layer;
(5) and directly writing a circle of PVA solution on the edge of the microstructure layer by using a near-field direct writing process by using a near-field direct writing solution as a raw material by adopting an electrostatic spinning process to obtain the adhesion layer, and then obtaining the friction nano sensor.
Further, PVA powder was dissolved in deionized water and ultrasonically dissolved to obtain a near-field direct writing solution.
Further, the PI powder was dissolved in an organic solvent dimethylacetamide (DMAc), followed by sufficient stirring to obtain an electrospinning solution.
Generally, compared with the prior art, the high-permeability friction nano sensor and the preparation method thereof provided by the invention have the following beneficial effects:
1. the friction nano sensor is provided with the PVA adhesion layer, is convenient to wear, can realize stable adhesion of a device by wetting the adhesion layer with a small amount of water when the friction sensor is worn, does not need to use a transparent adhesive tape or a double-sided adhesive tape for auxiliary wearing, and realizes the self-adhesion function of the device.
2. The friction layer is made of PI, is prepared by a one-step high-voltage electrostatic spinning process, and does not need to perform subsequent imidization on polyamic acid compared with a widely used two-step method; and the device prepared by the electrostatic spinning process has good air permeability, and avoids inflammation and allergy symptoms of the device on human skin after long-term use.
3. The lower surface of the friction layer is added with a layer of PTFE nano-scale micro-cone through the processes of vacuum evaporation and reactive ion etching, which is beneficial to enhancing the sensing effect of the friction nano-sensor and improving the output performance of the friction nano-sensor; wherein the diameter of the nano-micro-cone is between 20 and 100nm (specifically, the projection diameter of the top view of the micro-cone); on the one hand, PTFE material more tends to the negative direction than PI material in the triboelectric sequence, obtains electron more easily, and on the other hand compares with patent CN112603286A, the microcone is the nanometer, and the microstructure that obtains than sand paper inverse die is more meticulous far away, and the specific surface area of increase frictional layer that setting up of nanometer microcone can be fine for friction nanosensor has better frictional properties, and then strengthens the sensor and acquire and the transmission ability in the face of the signal of micro-friction, can improve the sensitivity of sensor greatly.
4. The friction nano sensor is based on contact electrification and electrostatic effect, overcomes the large dependence of a flexible electronic device on an external power supply device, and realizes the self-power supply function of the device.
5. The friction nano sensor is of a hierarchical structure, and the adhesion layer, the microstructure layer, the friction layer, the electrode layer and the packaging layer are sequentially stacked from bottom to top.
Drawings
FIG. 1 is a schematic structural diagram of a high-permeability friction nanosensor provided by the invention;
fig. 2 (a) - (j) are schematic flow charts of the preparation method of the high-permeability friction nanosensor provided by the invention;
FIG. 3 is a scanning electron microscope image of a PTFE nano-scale microcone provided by the present invention.
The same reference numbers will be used throughout the drawings to refer to the same or like elements or structures, wherein: 1-adhesion layer, 2-microstructure layer, 3-friction layer, 4-electrode layer and 5-packaging layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to fig. 1 and 3, the high-permeability friction nano sensor provided by the invention is a hierarchical structure, and includes a packaging layer 5, an electrode layer 4, a friction layer 3, a micro-structure layer 2 and an adhesion layer 1, which are arranged from top to bottom, wherein the micro-structure layer 2 is formed by arranging a plurality of micro cones arranged at intervals, the micro cones are a layer of PTFE nano micro cones prepared by vacuum evaporation and reactive ion etching processes on the surface of the friction layer 3 facing the adhesion layer 1, and the micro cones are helpful for enhancing the sensing effect of the friction nano sensor and improving the output performance of the friction nano sensor. In the present embodiment, the micro-cone is in the nanometer scale, and the diameter size range is 20-100 nm.
The adhesion layer 1 is of an annular sheet structure, the friction layer 3 is a high-transmittance PI film prepared by a high-voltage electrostatic spinning process, and the microstructure layer 2 is a PTFE (polytetrafluoroethylene) nano-scale surface microcone which is positioned on the lower surface of the friction layer 3 and used for improving the output performance of the friction nano-sensor. The electrode layer 4 is a silver nanowire located on the upper surface of the friction layer 3. The packaging layer 5 is a high-permeability PI film which is located on the upper surface of the electrode layer 4 and is prepared through a high-voltage electrostatic spinning process. Of course, in other embodiments, the material of the electrode layer 4 may also be conductive silver paste, silver nanowires, gold nanowires, or carbon nanotubes; the material of the packaging layer 5 can also be TPU, PU, FPU, PAN, PA 6.
The length of the friction nano sensor is preferably 20mm, and the width of the friction nano sensor is preferably 10 mm; the width of the adhesion layer 1 is preferably 1mm, and the thickness of the adhesion layer 1 is preferably 0.1 mm; the thickness of the microstructure layer 2 is preferably 0.1mm, and the thickness of the friction layer 3 is preferably 0.1-0.2 mm; the thickness of the electrode layer 4 is preferably 0.1mm, and the thickness of the packaging layer 5 is preferably 0.1-0.2 mm. The material of the friction layer 3 is preferably PI.
When micro friction is generated between the friction layer 3 and the microstructure layer 2 of the friction nano sensor and the human epidermis, the friction layer 3 and the microstructure layer 2 carry corresponding charges due to a contact electrification effect, and the electrode layer 4 generates a corresponding charge transfer phenomenon by an electrostatic induction effect to form induced current, so that the signal detection of the human epidermis can be realized.
Referring to fig. 2, the present invention further provides a method for preparing a high-permeability nanosensor, the method mainly includes the following steps:
s1, preparing a friction layer electrospinning solution: soluble PI powder was first dissolved in an organic solvent dimethylacetamide (DMAc), followed by magnetic stirring at normal temperature to obtain an electrospinning solution. Wherein, the stirring time is preferably 2-4 h, and the concentration of the prepared PI electrospinning solution is preferably 20-25 wt%.
S2, preparing a rubbing layer film: preparing a layer of PI film on single-side conductive ITO glass by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 8-10 kV, a receiving distance of 5-15 cm, an injection flow range of a spinning solution of 8000-10000 nl/min and a relative humidity of 60 percent and using a 1ml injector and a universal stainless steel dispensing needle head with an inner diameter of 0.51mm and an outer diameter of 0.82 mm; and then taking down the film, and preserving the heat for 4-6 hours at the temperature of 60 ℃ to solidify the PI material layer to obtain the electro-spinning PI film.
S3, preparing a friction layer: and cutting a film with uniform thickness and 20mm multiplied by 10mm in surface area at the center of the insulated electro-spinning PI film by using a blade to serve as a friction layer.
S4, preparing an electrode template: a laser cutter is utilized to cut a piece of acrylic template with the surface area of 20mm multiplied by 10mm, and then acrylic materials in the shape of an electrode layer are removed from the center of the template.
S5, preparing an electrode layer: attaching an acrylic template to the upper surface of the friction layer by using a transparent adhesive tape, and mixing the silver nanowires with an organic solvent ethanol according to the ratio of 1: 20, placing the mixture in a spray gun, uniformly spraying the mixture on the upper surface of the friction layer until an electrode layer is formed, and taking down the template after the electrode layer is formed;
s6, preparing an encapsulation layer: preparing a layer of PI film on an electrode layer by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 8-10 kV, a receiving distance of 5-15 cm, an injection flow range of a spinning solution of 8000-10000 nl/min and a relative humidity of 60 percent and using a 1ml injector and a universal stainless steel dispensing needle with an inner diameter of 0.51mm and an outer diameter of 0.82 mm; and then taking down the sample, and keeping the temperature at 60 ℃ for 4-6 h to solidify the PI material layer.
S7, preparing a microstructure layer: vacuum evaporation process is used, and vacuum condition of 8.3 × 10 is preferred-4Pa, the threshold value of the loading current is 70A, the current is increased by 5A each time, the time interval is 5min, and a layer of PTFE film is evaporated on the lower surface of the friction layer in vacuum; and etching the PTFE film into a nano-scale surface micro-cone structure by adopting an inductive coupling plasma etching process under the conditions of etching power of 400W, plasma accelerating power of 150W and etching time of 5 min.
S8, preparing an adhesion layer near-field direct-writing solution: dissolving PVA powder in deionized water, and then performing ultrasonic dissolution, wherein the ultrasonic dissolution power is preferably 100W, the temperature is preferably 80 ℃, the dissolution time is preferably 6h, and a PVA near-field direct-writing solution with the concentration of 15 wt% is prepared;
s9, preparing an adhesion layer: a high-voltage electrostatic spinning process is utilized, the direct-current voltage is preferably 3.8kV, the receiving distance is 2mm, the injection flow is 5000nl/min, the relative humidity is 60%, a 1ml injector and a general stainless steel dispensing needle with the inner diameter of 0.51mm and the outer diameter of 0.82mm are used, and a circle of PVA solution is directly written along the edge of the microstructure layer through a near-field direct writing process to obtain the adhesion layer.
The invention is described in further detail below with reference to several specific examples.
Example 1
S1, preparing a friction layer electrospinning solution: firstly, dissolving soluble PI powder in an organic solvent dimethylacetamide (DMAc), and then carrying out magnetic stirring at normal temperature, wherein the stirring time is preferably 2h, and the concentration of the prepared PI electrospinning solution is preferably 20 wt%;
s2, preparing a rubbing layer film: preparing a layer of PI film on the single-sided conductive ITO glass by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 8kV, a receiving distance of 10cm, an injection flow of 8000nl/min and a relative humidity of 60 percent, and using a 1ml injector and a universal stainless steel dispensing needle with an inner diameter of 0.51mm and an outer diameter of 0.82 mm; then taking down the film, and keeping the temperature of the film at 60 ℃ for 4h to solidify the PI material layer to obtain a friction layer film with the thickness of 0.1 mm;
s3, preparing a friction layer: cutting a film with uniform thickness and 20mm multiplied by 10mm in surface area at the center of the insulated electro-spinning PI film by using a blade to serve as a friction layer;
s4, preparing an electrode template: cutting an acrylic template with the surface area of 20mm multiplied by 10mm by a laser cutter, and removing acrylic materials in the shape of an electrode layer from the center of the template;
s5, preparing an electrode layer: attaching an acrylic template to the upper surface of the friction layer by using a transparent adhesive tape, and mixing the silver nanowires with an organic solvent ethanol according to the ratio of 1: 20, placing the mixture in a spray gun, uniformly spraying the mixture on the upper surface of the friction layer until an electrode layer with the thickness of 0.1mm is formed, and taking down the template after the electrode layer is formed;
s6, preparing an encapsulation layer: preparing a PI film on the upper surface of an electrode layer by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 8kV, a receiving distance of 10cm, an injection flow of 8000nl/min and a relative humidity of 60%, using a 1ml injector and a universal stainless steel dispensing needle with an inner diameter of 0.51mm and an outer diameter of 0.82mm to obtain a packaging layer with a thickness of 0.1mm, removing redundant PI along the edge range of a friction layer by using a blade after the preparation is finished, and taking down a sample to keep the temperature for 4 hours at 60 ℃ to solidify a PI material layer;
s7, preparing a microstructure layer: vacuum evaporation process is used, and vacuum condition of 8.3 × 10 is preferred-4Pa, the threshold value of the loading current is 70A, the current is increased by 5A each time, the time interval is 5min, and a layer of PTFE film is evaporated on the lower surface of the friction layer in vacuum; etching the PTFE film into a nano-scale surface micro-cone structure by adopting an inductive coupling plasma etching process under the conditions of etching power of 400W, plasma accelerating power of 150W and etching time of 5 min;
s8, preparing an adhesion layer near-field direct-writing solution: dissolving PVA powder in deionized water, and then performing ultrasonic dissolution, wherein the ultrasonic dissolution power is preferably 100W, the temperature is preferably 80 ℃, the dissolution time is preferably 6h, and a PVA near-field direct-writing solution with the concentration of 15 wt% is prepared;
s9, preparing an adhesion layer: a high-voltage electrostatic spinning process is utilized, the direct-current voltage is preferably 3.8kV, the receiving distance is 2mm, the injection flow is 5000nl/min, the relative humidity is 60%, a 1ml injector and a general stainless steel dispensing needle with the inner diameter of 0.51mm and the outer diameter of 0.82mm are used for directly writing a circle of PVA solution along the edge of the microstructure layer through a near-field direct writing process, and the adhesive layer with the width of 1mm and the thickness of 0.1mm is obtained.
Example 2
S1, preparing a friction layer electrospinning solution: firstly, dissolving soluble PI powder in an organic solvent dimethylacetamide (DMAc), and then carrying out magnetic stirring at normal temperature, wherein the stirring time is preferably 3h, and the concentration of the prepared PI electrospinning solution is preferably 22 wt%;
s2, preparing a rubbing layer film: preparing a layer of PI film on single-sided conductive ITO glass by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 9kV, a receiving distance of 12cm, an injection flow of 9000nl/min and a relative humidity of 60 percent, and using a 1ml injector and a universal stainless steel dispensing needle with an inner diameter of 0.51mm and an outer diameter of 0.82 mm; then taking down the film, and keeping the temperature of the film at 60 ℃ for 5 hours to solidify the PI material layer to obtain a friction layer film with the thickness of 0.15 mm;
s3, preparing a friction layer: cutting a film with uniform thickness and 20mm multiplied by 10mm in surface area at the center of the insulated electro-spinning PI film by using a blade to serve as a friction layer;
s4, preparing an electrode template: cutting an acrylic template with the surface area of 20mm multiplied by 10mm by a laser cutter, and removing acrylic materials in the shape of an electrode layer from the center of the template;
s5, preparing an electrode layer: attaching an acrylic template to the upper surface of the friction layer by using a transparent adhesive tape, and mixing the silver nanowires with an organic solvent ethanol according to the ratio of 1: 20, placing the mixture in a spray gun, uniformly spraying the mixture on the upper surface of the friction layer until an electrode layer with the thickness of 0.1mm is formed, and taking down the template after the electrode layer is formed;
s6, preparing an encapsulation layer: preparing a PI film on the upper surface of an electrode layer by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 9kV, a receiving distance of 12cm, an injection flow of 9000nl/min and a relative humidity of 60%, using a 1ml injector and a universal stainless steel dispensing needle with an inner diameter of 0.51mm and an outer diameter of 0.82mm to obtain a packaging layer with a thickness of 0.15mm, removing redundant PI along the edge range of a friction layer by using a blade after the preparation is finished, taking off a sample, and keeping the temperature for 5 hours at 60 ℃ to solidify a PI material layer;
s7, preparing a microstructure layer: vacuum evaporation process is used, and vacuum condition of 8.3 × 10 is preferred-4Pa, the threshold value of the loading current is 70A, the current is increased by 5A each time, the time interval is 5min, and a layer of PTFE film is evaporated on the lower surface of the friction layer in vacuum; etching the PTFE film into a nano-scale surface micro-cone structure by adopting an inductive coupling plasma etching process under the conditions of etching power of 400W, plasma accelerating power of 150W and etching time of 5 min;
s8, preparing an adhesion layer near-field direct-writing solution: dissolving PVA powder in deionized water, and then performing ultrasonic dissolution, wherein the ultrasonic dissolution power is preferably 100W, the temperature is preferably 80 ℃, the dissolution time is preferably 6h, and a PVA near-field direct-writing solution with the concentration of 15 wt% is prepared;
s9, preparing an adhesion layer: a high-voltage electrostatic spinning process is utilized, the direct-current voltage is preferably 3.8kV, the receiving distance is 2mm, the injection flow is 5000nl/min, the relative humidity is 60%, a 1ml injector and a general stainless steel dispensing needle with the inner diameter of 0.51mm and the outer diameter of 0.82mm are used for directly writing a circle of PVA solution along the edge of the microstructure layer through a near-field direct writing process, and the adhesive layer with the width of 1mm and the thickness of 0.1mm is obtained.
Example 3
S1, preparing a friction layer electrospinning solution: firstly, dissolving soluble PI powder in an organic solvent dimethylacetamide (DMAc), and then carrying out magnetic stirring at normal temperature, wherein the stirring time is preferably 4h, and the concentration of the prepared PI electrospinning solution is preferably 25 wt%;
s2, preparing a rubbing layer film: preparing a layer of PI film on single-side conductive ITO glass by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 10kV, a receiving distance of 15cm, an injection flow of 10000nl/min and a relative humidity of 60 percent, and using a 1ml injector and a universal stainless steel dispensing needle with an inner diameter of 0.51mm and an outer diameter of 0.82 mm; then taking down the film, and keeping the temperature of the film at 60 ℃ for 6h to solidify the PI material layer to obtain a friction layer film with the thickness of 0.2 mm;
s3, preparing a friction layer: cutting a film with uniform thickness and surface area of 20mm multiplied by 10mm at the center of the insulated electro-spinning PI film by using a blade to serve as a friction layer;
s4, preparing an electrode template: cutting an acrylic template with the surface area of 20mm multiplied by 10mm by a laser cutter, and removing acrylic materials in the shape of an electrode layer from the center of the template;
s5, preparing an electrode layer: attaching an acrylic template to the upper surface of the friction layer by using a transparent adhesive tape, and mixing the silver nanowires with an organic solvent ethanol according to the ratio of 1: 20, placing the mixture in a spray gun, uniformly spraying the mixture on the upper surface of the friction layer until an electrode layer with the thickness of 0.1mm is formed, and taking down the template after the electrode layer is formed;
s6, preparing an encapsulation layer: preparing a PI film on the upper surface of an electrode layer by using a high-voltage electrostatic spinning process, preferably selecting a direct-current voltage of 10kV, a receiving distance of 15cm, an injection flow of 10000nl/min and a relative humidity of 60%, using a 1ml injector and a universal stainless steel dispensing needle with an inner diameter of 0.51mm and an outer diameter of 0.82mm to obtain a packaging layer with a thickness of 0.2mm, removing redundant PI along the edge range of a friction layer by using a blade after the preparation is finished, and taking down a sample to keep the temperature for 6 hours at 60 ℃ to solidify a PI material layer;
s7, preparing a microstructure layer: vacuum evaporation process is used, and vacuum condition of 8.3 × 10 is preferred-4Pa, the threshold value of the loading current is 70A, the current is increased by 5A each time, the time interval is 5min, and a layer of PTFE film is evaporated on the lower surface of the friction layer in vacuum; etching the PTFE film into a nano-scale surface micro-cone structure by adopting an inductive coupling plasma etching process under the conditions of etching power of 400W, plasma accelerating power of 150W and etching time of 5 min;
s8, preparing an adhesion layer near-field direct-writing solution: dissolving PVA powder in deionized water, and then performing ultrasonic dissolution, wherein the ultrasonic dissolution power is preferably 100W, the temperature is preferably 80 ℃, the dissolution time is preferably 6h, and a PVA near-field direct-writing solution with the concentration of 15 wt% is prepared;
s9, preparing an adhesion layer: a high-voltage electrostatic spinning process is utilized, the direct-current voltage is preferably 3.8kV, the receiving distance is 2mm, the injection flow is 5000nl/min, the relative humidity is 60%, a 1ml injector and a general stainless steel dispensing needle with the inner diameter of 0.51mm and the outer diameter of 0.82mm are used for directly writing a circle of PVA solution along the edge of the microstructure layer through a near-field direct writing process, and the adhesive layer with the width of 1mm and the thickness of 0.1mm is obtained.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A high permeability friction nanosensor, characterized by:
the friction nano sensor comprises a packaging layer, an electrode layer, a friction layer and a microstructure layer which are arranged from top to bottom; the friction layer is made of PI and is prepared by adopting electrostatic spinning;
the friction nano sensor also comprises an adhesion layer, wherein the adhesion layer is arranged on the microstructure layer and realizes adhesion with a user through wetting.
2. The high permeability friction nanosensor of claim 1, wherein: the adhesion layer is of a PVA annular sheet structure.
3. The high permeability friction nanosensor of claim 1, wherein: the friction layer is composed of a plurality of nano-scale microcones which are arranged at intervals and are arranged in a disordered way, and the diameters of the microcones are between 20nm and 100 nm.
4. The high permeability friction nanosensor of claim 1, wherein: the electrode layer is silver nanowires arranged on the surface of the friction layer facing the packaging layer.
5. The high permeability friction nanosensor of any of claims 1-4, wherein: the microstructure layer and the packaging layer are prepared by electrostatic spinning.
6. The high permeability friction nanosensor of any of claims 1-4, wherein: the material of the microstructure layer is PTFE; the packaging layer is made of PI.
7. A preparation method of a high-permeability friction nano sensor is characterized by comprising the following steps: the preparation method is used for preparing the high-permeability friction nano sensor as defined in any one of claims 1 to 6.
8. The method for preparing a high-permeability friction nanosensor as defined in claim 7, wherein: the preparation method comprises the following steps:
(1) preparing a friction layer by using an electrospinning solution as a raw material and adopting an electrostatic spinning process;
(2) preparing an electrode layer on the friction layer by means of an electrode template and a spraying process;
(3) preparing a packaging layer on the electrode layer by adopting an electrostatic spinning process;
(4) preparing a nano-scale micro-cone on the surface of the friction layer far away from the electrode layer by combining vacuum evaporation and an inductive coupling plasma etching process to obtain the microstructure layer;
(5) and directly writing a circle of PVA solution on the edge of the microstructure layer by using a near-field direct writing process by using a near-field direct writing solution as a raw material by adopting an electrostatic spinning process to obtain the adhesion layer, and then obtaining the friction nano sensor.
9. The method for preparing a high-permeability friction nanosensor as defined in claim 8, wherein: PVA powder was dissolved in deionized water and ultrasonically dissolved to give a near-field direct write solution.
10. The method for preparing a high-permeability friction nanosensor as defined in claim 8, wherein: the soluble PI powder was dissolved in an organic solvent, dimethylacetamide, followed by sufficient stirring to obtain an electrospinning solution.
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