CN113192976A - Display device and method for manufacturing the same - Google Patents
Display device and method for manufacturing the same Download PDFInfo
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- CN113192976A CN113192976A CN202110384441.6A CN202110384441A CN113192976A CN 113192976 A CN113192976 A CN 113192976A CN 202110384441 A CN202110384441 A CN 202110384441A CN 113192976 A CN113192976 A CN 113192976A
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- 238000000034 method Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000012790 adhesive layer Substances 0.000 claims abstract description 95
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 239000007787 solid Substances 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 68
- 238000005530 etching Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 27
- 229910052760 oxygen Inorganic materials 0.000 abstract description 27
- 239000001301 oxygen Substances 0.000 abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 27
- 239000000428 dust Substances 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 15
- 230000009545 invasion Effects 0.000 abstract description 12
- 239000004568 cement Substances 0.000 abstract description 10
- 238000002360 preparation method Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000004983 Polymer Dispersed Liquid Crystal Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
- H10K59/65—OLEDs integrated with inorganic image sensors
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The application provides a display device and a preparation method thereof, the display device comprises an electronic element setting area and a display area, the display area is arranged around the electronic element setting area, a through hole is formed in the electronic element setting area, an adhesive layer is arranged in the through hole, the adhesive layer is liquid when the electronic element is not arranged in the through hole, and the adhesive layer is solidified into a solid after the electronic element is arranged in the through hole. This application is through adopting the bond line to fill to the via hole in, and make the bond line be liquid before electronic component and bond line contact, when bond line and electronic component contact, the bond line can fully contact postcure with electronic component, thereby avoid dust and water oxygen invasion, improve the effect of making a video recording, and avoid water oxygen to invade optical cement, lead to optical cement edge overflow to glue, and because the bond line becomes solid-state by liquid, the clearance between each rete of filling electronic component and display device that can be better, it still has the clearance to fill behind the via hole to avoid the bond line.
Description
Technical Field
The application relates to the technical field of display, in particular to a display device and a preparation method thereof.
Background
Present display panel realizes the full-face screen in order to improve the screen to account for than, can set up leading camera in the display panel below, and in order to improve the daylighting effect of leading camera, can dig the hole to rete such as display panel, extends to digging downtheholely with leading camera. But there is the clearance between leading camera and apron, can make dust and water oxygen get into the hole of digging between camera and the screen apron after long-time use or use under adverse circumstances, leads to making a video recording the effect relatively poor.
Therefore, the existing display device has the technical problem that the hole digging content between the camera and the cover plate is easy to be invaded by dust and water oxygen, so that the shooting effect is poor.
Disclosure of Invention
The embodiment of the application provides a display device and a preparation method thereof, which are used for relieving the technical problem that the hole digging content between a camera and a cover plate of the existing display device is easy to be invaded by dust and water oxygen.
An embodiment of the present application provides a display device, which includes:
an electronic component setting region;
a display area disposed around the electronic component disposing area;
the electronic element installation area is provided with a through hole, an adhesive layer is arranged in the through hole, the adhesive layer is liquid when the electronic element is not arranged in the through hole, and the adhesive layer is solidified into a solid after the electronic element is arranged in the through hole.
In some embodiments, the display device includes:
a support plate;
the electronic element is arranged in the electronic element arrangement area and is arranged on one side of the supporting plate;
the support plate is in electronic component sets up the district and is formed with first via hole, the via hole includes first via hole, the bond line set up in the first via hole, under the front view perspective, electronic component with the laminating of support plate downside sets up, just electronic component passes through the bond line with the both sides of support plate are connected.
In some embodiments, the display device includes:
the back plate is arranged on one side, away from the electronic element, of the supporting plate, and a second through hole is formed in the electronic element arrangement area of the back plate;
the display panel is arranged on one side, far away from the supporting plate, of the back plate, and a third through hole is formed in the electronic element arrangement area of the display panel;
the polaroid is arranged on one side, far away from the back plate, of the display panel, and a fourth through hole is formed in the electronic element arrangement area of the polaroid;
the cover plate is arranged on one side of the polaroid, which is far away from the display panel;
wherein, the via hole includes the second via hole the third via hole with the fourth via hole, the adhesive layer set up in second via hole, third via hole and fourth via hole, just the adhesive layer with the apron laminating sets up.
In some embodiments, the material of the adhesive layer comprises a liquid optical glue.
In some embodiments, the adhesive layer has a modulus of elasticity less than or equal to 100 megapascals when the adhesive layer is in a solid state.
In some embodiments, the volume of the adhesion layer is greater than the difference between the volume of the via and the volume of the electronic component disposed within the via when the adhesion layer is in a liquid state.
In some embodiments, the display device further comprises:
the first bonding layer is arranged between the back plate and the supporting plate, and a fifth through hole is formed in the electronic element arrangement area of the first bonding layer;
the second bonding layer is arranged between the back plate and the display panel, and a sixth through hole is formed in the electronic element arrangement area of the second bonding layer;
the third bonding layer is arranged between the display panel and the polaroid, and a seventh through hole is formed in the electronic element arrangement area of the third bonding layer;
the fourth bonding layer is arranged between the polarizer and the cover plate, and an eighth through hole is formed in the electronic element arrangement area of the fourth bonding layer;
when the adhesive layer is solid, the adhesive layer is attached to the first adhesive layer, the second adhesive layer, the third adhesive layer and the fourth adhesive layer which are located around the fifth via hole, the sixth via hole, the seventh via hole and the eighth via hole.
In some embodiments, a projection of the adhesive layer on the cover plate when the display device is in the unfolded state is not coincident with a projection of the adhesive layer on the cover plate when the display device is in the bent state.
In some embodiments, the cover plate includes an ink layer, and a projection of the ink layer on a plane of the display panel is not coincident with a projection of the adhesive layer on the plane of the display panel.
Meanwhile, an embodiment of the present application provides a method for manufacturing a display device, including:
providing a support plate, and etching the support plate to form a first through hole;
sequentially arranging a first bonding layer, a back plate, a second bonding layer, a display panel, a third bonding layer, a polarizer, a fourth bonding layer and a cover plate on the supporting plate, and etching the first bonding layer, the back plate, the second bonding layer, the display panel, the third bonding layer, the polarizer and the fourth bonding layer to form a fifth via hole, a second via hole, a sixth via hole, a third via hole, a seventh via hole, a fourth via hole and an eighth via hole; the via holes comprise the first via hole, the second via hole, the third via hole, the fourth via hole, the fifth via hole, the sixth via hole, the seventh via hole and an eighth via hole;
arranging an adhesive layer in the via hole; the bonding layer is in a liquid state;
disposing an electronic component in the via and in contact with the adhesive layer;
and curing the bonding layer.
Has the advantages that: the application provides a display device and a preparation method thereof, the display device comprises an electronic element setting area and a display area, the display area is arranged around the electronic element setting area, a through hole is formed in the electronic element setting area, an adhesive layer is arranged in the through hole, the adhesive layer is liquid when the electronic element is not arranged in the through hole, and the adhesive layer is solidified into a solid after the electronic element is arranged in the through hole. This application is through adopting the bond line to fill to the via hole in, and make the bond line be liquid before electronic component and bond line contact, when bond line and electronic component contact, the bond line can fully contact postcure with electronic component, thereby avoid dust and water oxygen invasion, improve the effect of making a video recording, and avoid water oxygen to invade optical cement, lead to optical cement edge overflow to glue, and because the bond line becomes solid-state by liquid, the clearance between each rete of filling electronic component and display device that can be better, it still has the clearance to fill behind the via hole to avoid the bond line.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of a conventional display device having an off-screen camera.
Fig. 2 is a partially enlarged schematic view of a conventional display device.
Fig. 3 is a schematic diagram of a display device according to an embodiment of the present disclosure.
Fig. 4 is another schematic diagram of a display device according to an embodiment of the present disclosure.
Fig. 5 is a flowchart of a method for manufacturing a display device according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1, in order to increase the screen ratio of the conventional display device 1, a camera is disposed under the display screen, and holes are cut in the display screen to increase the lighting efficiency of the camera, that is, the display device 1 includes a camera area 11 and a display area 12 under the screen, as shown in (a), (b), and (c) of fig. 1, which are respectively a flat state, a bent state, and a folded state of the display device 1.
As shown in fig. 2 (a), the display device 1 includes a flexible panel 13 and a camera 14, and an area where the camera 14 and the flexible panel 13 are combined is enlarged to obtain (b) in fig. 2, where the flexible panel 13 includes a support plate 111, a first OCA Adhesive (optical Adhesive) 112, a back plate 113, a second OCA Adhesive 114, a display panel 115, a third OCA Adhesive 116, a polarizer 117, a fourth OCA Adhesive 118, and a cover plate 119, and the camera 14 is bonded to the flexible panel 13 through an Adhesive 16, and specifically, as shown in fig. 2 (b), the camera 14 is bonded to the support plate 111 through an Adhesive 16.
In order to improve the lighting effect, as shown in fig. 2 (b), although the cutout hole 17 is provided in the flexible panel 13, the camera 14 does not fill the cutout hole 17, and a gap exists between the camera and each film layer of the flexible panel 13, so that dust or water and oxygen enter the cutout hole 17 during long-term use of the display device 1 or use in a severe environment, and the imaging effect is deteriorated. Therefore, the existing display device has the technical problem that the hole digging content between the camera and the cover plate is easy to be invaded by dust and water oxygen, so that the shooting effect is poor.
The embodiments of the present application provide a display device and a method for manufacturing the same, so as to solve the above technical problems.
As shown in fig. 3, an embodiment of the present application provides a display device, including:
an electronic component mounting area 21;
a display area 22 disposed around the electronic component disposing area 21;
the electronic component arrangement region 21 is formed with a via hole 27, an adhesive layer 26 is arranged in the via hole 27, the adhesive layer 26 is liquid when the electronic component 24 is not arranged in the via hole 27, and is solidified into a solid after the electronic component 24 is arranged in the via hole 27.
The embodiment of the application provides a display device, this display device fills to the via hole through adopting the bond line, and make the bond line be liquid before electronic component and bond line contact, when bond line and electronic component contact, the bonding can be with the abundant postcure of contact of electronic component, thereby avoid dust and water oxygen invasion, improve the effect of making a video recording, and avoid water oxygen invasion optical cement, lead to optical cement edge to overflow to glue, and because the bond line becomes solid-state by the liquid, the clearance between each rete of filling electronic component and display device that can be better, it still has the clearance to avoid the bond line to fill to the via hole after.
In an embodiment, as shown in fig. 3 (a), which is a schematic view of the flexible display 23 contacting the electronic component 24 in a flattened state, the area 25 where the flexible display 23 contacts the electronic component 24 is enlarged to obtain fig. 3 (b), and as shown in fig. 3 (b), the display device includes:
a support plate 211;
an electronic component 24 disposed in the electronic component disposing region 21, the electronic component 24 being disposed on one side of the supporting plate 211;
the supporting plate 211 is formed with a first via hole in the electronic component disposing area 21, the via hole 27 includes the first via hole, the adhesive layer 26 is disposed in the first via hole, the electronic component 24 is attached to the lower side of the supporting plate 211 in a front view, and the electronic component 24 is connected to two sides of the supporting plate 211 through the adhesive layer 26.
To the display device who sets up first via hole in backup pad department, can have the space between backup pad and the camera and get into the problem of dust and water oxygen. This application embodiment is through setting up the bond line in first mistake for the bond line is filled to first mistake downthehole, and the bond line bonds support column and camera, thereby avoids the camera to drop, and because the bond line becomes solid-state by liquid, then can be better fill in the space, avoid dust and water oxygen invasion to first mistake downthehole. And because the bonding layer bonding support column and camera need not to adopt the glue film, have reduced display device's thickness.
In the front view, the electronic component is connected to both sides of the support plate through the adhesive layer, but in the actual process, the connection between the adhesive layer and the support plate is determined according to the shape of the first via hole, for example, when the first via hole is circular, the adhesive layer is disposed in the first via hole except for the circular area where the camera is disposed, and the electronic component is connected to the periphery of the support plate through the adhesive layer.
In one embodiment, a back plate, a display panel and a polarizer are sequentially arranged on one side of the supporting plate away from the electronic component, and the back plate, the display panel and the polarizer are arranged on the whole surface. When only forming first via hole in the backup pad promptly, through set up the bond line in first via hole, through bond line connection support column and camera, avoid in the first via hole by dust and water oxygen invasion.
Set up the via hole to each rete of display device, can have dust and water oxygen to get into in the via hole, influence the effect of making a video recording. In one embodiment, as shown in fig. 3, the display device includes:
the back plate 213 is arranged on one side of the supporting plate 211 far away from the electronic element 24, and the back plate 213 is provided with a second through hole in the electronic element arrangement area 21;
a display panel 215 disposed on a side of the back plate 213 away from the supporting plate 211, wherein the display panel 215 has a third via hole formed in the electronic component disposing area 21;
a polarizer 217 disposed on a side of the display panel 215 away from the back plate 213, wherein the polarizer 217 has a fourth via hole formed in the electronic component disposing region 21;
a cover 219 disposed on a side of the polarizer 217 away from the display panel 215;
the via hole 27 includes the second via hole, the second via hole and the fourth via hole, the adhesive layer 26 is disposed on the second via hole, the third via hole and the fourth via hole, and the adhesive layer 26 is attached to the cover plate 219. Through set up the bond line in the via hole for bond line and apron contact, then the bond line can fill the space between apron and the camera, invade dust and water oxygen in avoiding the space, improve display device's the effect of making a video recording, and improve display panel separation water oxygen's ability.
The above embodiments describe the display device in detail by taking the support plate opening and all the film layer openings except the cover plate as examples. However, the embodiments of the present application are not limited thereto, and in the embodiments of the present application, a display device having an opening between a cover plate and a camera, for example, a display device having an opening on a support plate or a back plate, may be bonded by using an adhesive layer, so as to improve the water and oxygen blocking capability of the display device.
In an embodiment, the material of the bonding layer includes a liquid optical adhesive, and the liquid optical adhesive has good adhesiveness and optical transparency, and is liquid in the use process, and can be cured after being contacted with the camera, so that the liquid optical adhesive is selected as the material of the bonding layer, the liquid optical adhesive can be fully filled into a gap between the camera and the cover plate, the invasion of dust and water oxygen is avoided, and the liquid optical adhesive has good optical transparency, and the lighting of the electronic element is prevented from being influenced.
In one embodiment, when the adhesive layer is in a liquid state, the volume of the adhesive layer is greater than the difference between the volumes of the via hole and the electronic component arranged in the via hole, and considering that the volume of the adhesive layer is reduced from the liquid state to the solid state, the volume of the adhesive layer in the liquid state is greater than the difference between the volumes of the electronic component in the via hole and the electronic component in the via hole, and the adhesive layer is cured while the electronic component is arranged in the via hole, so that the adhesive layer is prevented from overflowing, and the adhesive layer can be filled into each gap, and dust and water oxygen intrusion are prevented.
The problem that OCA glue dislocation can be caused when the flexible display device is bent, and glue overflow can occur after the OCA glue dislocation is carried out for multiple times is solved. In one embodiment, as shown in fig. 3, the display device further includes:
a first adhesive layer 212 disposed between the back plate 213 and the supporting plate 211, wherein a fifth via hole is formed in the electronic component disposing region 21 by the first adhesive layer 212;
a second adhesive layer 214 disposed between the back plate 213 and the display panel 215, wherein the second adhesive layer 214 has a sixth via hole formed in the electronic component disposing area 21;
a third adhesive layer 216 disposed between the display panel 215 and the polarizer 217, wherein a seventh via hole is formed in the electronic component disposing region 21 by the third adhesive layer 216;
a fourth adhesive layer 218 disposed between the polarizer 217 and the cover plate 219, wherein the fourth adhesive layer 218 has an eighth via hole formed in the electronic component disposing area 21;
when the adhesive layer 26 is in a solid state, the adhesive layer 26 is attached to the first adhesive layer 212, the second adhesive layer 214, the third adhesive layer 216 and the fourth adhesive layer 218 located around the fifth via hole, the sixth via hole, the seventh via hole and the eighth via hole. Through setting up the laminating of bond line and first tie coat, second tie coat, third tie coat and fourth tie coat for display device is when crooked, and the tip and the bond line contact of first tie coat, second tie coat, third tie coat and fourth tie coat have then avoided the edge of first tie coat, second tie coat, third tie coat and fourth tie coat to appear ageing, overflow and glue the scheduling problem.
The problem that the display device is aged and failed due to the fact that water and oxygen enter the display device from the end of the hole digging area exists in the display device. In one embodiment, the difference between the elastic modulus of the adhesive layer and the elastic modulus of the first adhesive layer is less than a threshold value. Through making the elastic modulus of bond line and the similar or even equal of elastic modulus of first tie coat, make when display device is crooked, the hole shape that digs that the dislocation of each rete that the bond line can adapt to display device leads to warp, make the bond line fill all the time in the via hole, and the bond line is laminated with the tip of each rete all the time, thereby avoid the invasion of water oxygen to lead to display device's ageing inefficacy in rete edge, and bond line and tie coat tip contact, can avoid the excessive glue that the bond line leads to because of dislocation many times.
The threshold value may be set as required so that the adhesive layer and the adhesive layer can be held in contact with each other by bending the adhesive layer and the adhesive layer accordingly. In one embodiment, the bond layer has a modulus of elasticity at 20 degrees celsius of less than or equal to 100 megapascals when the bond layer is solid.
In one embodiment, a projection of the adhesive layer on the cover plate when the display device is in the unfolded state is not coincident with a projection of the adhesive layer on the cover plate when the display device is in the bent state. Through making the bond line at display device bending process, the bond line can change along with the change of via hole, then the bond line can keep filling in the via hole, avoids dust and water oxygen invasion, and the tip contact of bond line and each rete, avoids display device to appear spilling gluey.
As shown in fig. 3 and 4, fig. 3 is a schematic diagram of the display device in a flattened state, and fig. 4 is a schematic diagram of the display device in a bent state (including a folded state), it can be known from a comparison between fig. 3 and fig. 4 that each film layer in the display device may have dislocation along with the bending of the display device, and after multiple dislocations, the adhesive layer may have glue overflow.
In one embodiment, the first, second, third and fourth adhesive layers are the same material. Specifically, the material of the first bonding layer includes OCA.
For the adhesive layer to change from a liquid state to a solid state, the cover plate is arranged in the area of the adhesive layer to affect the curing effect of the adhesive layer. In one embodiment, the cover plate includes an ink layer, and a projection of the ink layer on a plane of the display panel is not coincident with a projection of the adhesive layer on the plane of the display panel. The projection of the ink layer and the projection of the bonding layer are not overlapped, so that the curing effect is better when the bonding layer is cured.
In one embodiment, the cover plate includes an ink region, and the ink region and the electronic component disposing region have an overlapping portion. When the ink area is arranged, the ink area can be extended to the electronic element arrangement area, so that the interference of the light of the display area to the light of the electronic element arrangement area is avoided, and the edge of the via hole is shielded.
In one embodiment, the display panel includes an OLED (Organic Light-Emitting Diode) display panel and a liquid crystal display panel. For the liquid crystal display panel, a polymer dispersed liquid crystal can be adopted to form a retaining wall at the edge of the via hole, no additional retaining wall is needed, and the area of a non-display area between a display area and an electronic element arrangement area is reduced.
In one embodiment, the electronic component comprises a camera.
Meanwhile, as shown in fig. 5, an embodiment of the present application provides a method for manufacturing a display device, including:
s1, providing a support plate, and etching the support plate to form a first via hole;
s2, sequentially arranging a first bonding layer, a back plate, a second bonding layer, a display panel, a third bonding layer, a polarizer, a fourth bonding layer and a cover plate on the supporting plate, and etching the first bonding layer, the back plate, the second bonding layer, the display panel, the third bonding layer, the polarizer and the fourth bonding layer to form a fifth via hole, a second via hole, a sixth via hole, a third via hole, a seventh via hole, a fourth via hole and an eighth via hole; the via holes comprise the first via hole, the second via hole, the third via hole, the fourth via hole, the fifth via hole, the sixth via hole, the seventh via hole and an eighth via hole;
s3, arranging an adhesive layer in the via hole; the bonding layer is in a liquid state;
s4, arranging an electronic element in the via hole and contacting the adhesive layer;
and S5, curing the adhesive layer.
The embodiment of the application provides a display device preparation method, the display device preparation method is through after each rete etching to display device forms the via hole, set up liquid bond line in the via hole, then make electronic component and liquid bond line fully contact, after electronic component and liquid bond line fully contact, solidify the bond line, make bond line can better bonding camera and flexible screen, and the bond line fills in the via hole, avoid dust and water oxygen invasion, improve the effect of making a video recording, and avoid water oxygen invasion optical cement, lead to the excessive glue in optical cement edge, and because the bond line becomes solid by liquid, can be better fill the clearance between each rete of electronic component and display device, it still has the clearance to avoid the bond line to fill to the via hole after.
According to the above embodiment:
the embodiment of the application provides a display device and a preparation method thereof, the display device comprises an electronic element arrangement area and a display area, the display area is arranged around the electronic element arrangement area, through holes are formed in the electronic element arrangement area, bonding layers are arranged in the through holes, the bonding layers are liquid when the electronic elements are not arranged in the through holes, and the bonding layers are solidified into solid after the electronic elements are arranged in the through holes. This application is through adopting the bond line to fill to the via hole in, and make the bond line be liquid before electronic component and bond line contact, when bond line and electronic component contact, the bond line can fully contact postcure with electronic component, thereby avoid dust and water oxygen invasion, improve the effect of making a video recording, and avoid water oxygen to invade optical cement, lead to optical cement edge overflow to glue, and because the bond line becomes solid-state by liquid, the clearance between each rete of filling electronic component and display device that can be better, it still has the clearance to fill behind the via hole to avoid the bond line.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display device and the manufacturing method thereof provided by the embodiments of the present application are described in detail above, and the principle and the embodiment of the present application are explained in the present application by applying specific examples, and the description of the embodiments above is only used to help understanding the technical scheme and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display device, comprising:
an electronic component setting region;
a display area disposed around the electronic component disposing area;
the electronic element installation area is provided with a through hole, an adhesive layer is arranged in the through hole, the adhesive layer is liquid when the electronic element is not arranged in the through hole, and the adhesive layer is solidified into a solid after the electronic element is arranged in the through hole.
2. The display device according to claim 1, wherein the display device comprises:
a support plate;
the electronic element is arranged in the electronic element arrangement area and is arranged on one side of the supporting plate;
the support plate is in electronic component sets up the district and is formed with first via hole, the via hole includes first via hole, the bond line set up in the first via hole, under the front view perspective, electronic component with the laminating of support plate downside sets up, just electronic component passes through the bond line with the both sides of support plate are connected.
3. The display device according to claim 2, wherein the display device comprises:
the back plate is arranged on one side, away from the electronic element, of the supporting plate, and a second through hole is formed in the electronic element arrangement area of the back plate;
the display panel is arranged on one side, far away from the supporting plate, of the back plate, and a third through hole is formed in the electronic element arrangement area of the display panel;
the polaroid is arranged on one side, far away from the back plate, of the display panel, and a fourth through hole is formed in the electronic element arrangement area of the polaroid;
the cover plate is arranged on one side of the polaroid, which is far away from the display panel;
wherein, the via hole includes the second via hole the third via hole with the fourth via hole, the adhesive layer set up in second via hole, third via hole and fourth via hole, just the adhesive layer with the apron laminating sets up.
4. The display device of claim 3, wherein the material of the adhesive layer comprises a liquid optical glue.
5. The display device according to claim 4, wherein when the adhesive layer is in a solid state, an elastic modulus of the adhesive layer is less than or equal to 100 mpa.
6. The display device according to claim 3, wherein a volume of the adhesive layer is larger than a difference between a volume of the via hole and a volume of an electronic component disposed in the via hole when the adhesive layer is in a liquid state.
7. The display device of claim 3, further comprising:
the first bonding layer is arranged between the back plate and the supporting plate, and a fifth through hole is formed in the electronic element arrangement area of the first bonding layer;
the second bonding layer is arranged between the back plate and the display panel, and a sixth through hole is formed in the electronic element arrangement area of the second bonding layer;
the third bonding layer is arranged between the display panel and the polaroid, and a seventh through hole is formed in the electronic element arrangement area of the third bonding layer;
the fourth bonding layer is arranged between the polarizer and the cover plate, and an eighth through hole is formed in the electronic element arrangement area of the fourth bonding layer;
when the adhesive layer is solid, the adhesive layer is attached to the first adhesive layer, the second adhesive layer, the third adhesive layer and the fourth adhesive layer which are located around the fifth via hole, the sixth via hole, the seventh via hole and the eighth via hole.
8. The display device of claim 3, wherein a projection of the adhesive layer on the cover plate when the display device is in an unfolded state is not coincident with a projection of the adhesive layer on the cover plate when the display device is in a bent state.
9. The display device of claim 3, wherein the cover plate comprises an ink layer, and a projection of the ink layer on a plane of the display panel is not coincident with a projection of the adhesive layer on the plane of the display panel.
10. A method for manufacturing a display device, comprising:
providing a support plate, and etching the support plate to form a first through hole;
sequentially arranging a first bonding layer, a back plate, a second bonding layer, a display panel, a third bonding layer, a polarizer, a fourth bonding layer and a cover plate on the supporting plate, and etching the first bonding layer, the back plate, the second bonding layer, the display panel, the third bonding layer, the polarizer and the fourth bonding layer to form a fifth via hole, a second via hole, a sixth via hole, a third via hole, a seventh via hole, a fourth via hole and an eighth via hole; the via holes comprise the first via hole, the second via hole, the third via hole, the fourth via hole, the fifth via hole, the sixth via hole, the seventh via hole and an eighth via hole;
arranging an adhesive layer in the via hole; the bonding layer is in a liquid state;
disposing an electronic component in the via and in contact with the adhesive layer;
and curing the bonding layer.
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| CN202110384441.6A CN113192976B (en) | 2021-04-09 | 2021-04-09 | Display device and method for manufacturing the same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113241363A (en) * | 2021-06-09 | 2021-08-10 | 武汉华星光电半导体显示技术有限公司 | Display device and electronic apparatus |
| CN114627764A (en) * | 2022-03-16 | 2022-06-14 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
| CN116430617A (en) * | 2023-05-04 | 2023-07-14 | 业成科技（成都）有限公司 | Touch display panel, display device and method for manufacturing touch display panel |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203313284U (en) * | 2013-06-03 | 2013-11-27 | 南昌欧菲光电技术有限公司 | Camera module |
| CN108681131A (en) * | 2018-07-27 | 2018-10-19 | 厦门天马微电子有限公司 | Display device |
| CN109782461A (en) * | 2019-02-22 | 2019-05-21 | 信利光电股份有限公司 | A kind of the dispensing filling attaching process shielded comprehensively, comprehensively screen and electronic equipment |
| CN110456543A (en) * | 2019-07-26 | 2019-11-15 | 武汉华星光电技术有限公司 | Cover board and display device |
| CN110908163A (en) * | 2019-11-29 | 2020-03-24 | 武汉华星光电技术有限公司 | Display panel and preparation method thereof |
| CN211238260U (en) * | 2020-03-25 | 2020-08-11 | 京东方科技集团股份有限公司 | Display device |
-
2021
- 2021-04-09 CN CN202110384441.6A patent/CN113192976B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203313284U (en) * | 2013-06-03 | 2013-11-27 | 南昌欧菲光电技术有限公司 | Camera module |
| CN108681131A (en) * | 2018-07-27 | 2018-10-19 | 厦门天马微电子有限公司 | Display device |
| CN109782461A (en) * | 2019-02-22 | 2019-05-21 | 信利光电股份有限公司 | A kind of the dispensing filling attaching process shielded comprehensively, comprehensively screen and electronic equipment |
| CN110456543A (en) * | 2019-07-26 | 2019-11-15 | 武汉华星光电技术有限公司 | Cover board and display device |
| CN110908163A (en) * | 2019-11-29 | 2020-03-24 | 武汉华星光电技术有限公司 | Display panel and preparation method thereof |
| CN211238260U (en) * | 2020-03-25 | 2020-08-11 | 京东方科技集团股份有限公司 | Display device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113241363A (en) * | 2021-06-09 | 2021-08-10 | 武汉华星光电半导体显示技术有限公司 | Display device and electronic apparatus |
| CN114627764A (en) * | 2022-03-16 | 2022-06-14 | 武汉华星光电半导体显示技术有限公司 | Display module and display device |
| WO2023173474A1 (en) * | 2022-03-16 | 2023-09-21 | 武汉华星光电半导体显示技术有限公司 | Display module and display apparatus |
| CN116430617A (en) * | 2023-05-04 | 2023-07-14 | 业成科技（成都）有限公司 | Touch display panel, display device and method for manufacturing touch display panel |
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|---|---|
| CN113192976B (en) | 2022-11-08 |
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