CN113192917A - Pre-bent pin, patch type protector comprising same and preparation method thereof - Google Patents
Pre-bent pin, patch type protector comprising same and preparation method thereof Download PDFInfo
- Publication number
- CN113192917A CN113192917A CN202110436229.XA CN202110436229A CN113192917A CN 113192917 A CN113192917 A CN 113192917A CN 202110436229 A CN202110436229 A CN 202110436229A CN 113192917 A CN113192917 A CN 113192917A
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- Prior art keywords
- pin
- bent
- chip
- welded
- pins
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- 230000001012 protector Effects 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 238000005452 bending Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 13
- 238000004080 punching Methods 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 238000000465 moulding Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fuses (AREA)
Abstract
The invention discloses a pre-bent pin, a chip mounting type protector comprising the same and a preparation method thereof, and provides the pre-bent pin which is formed by bending a copper material with consistent thickness in advance, so that the material cost is reduced, the chip mounting part of the pin is not required to be bent after packaging, the problems of desoldering and water seepage of the chip mounting type protector are reduced, and burrs in the punching process are avoided. The pins are made of copper materials with consistent thickness, so that the material cost is reduced, and meanwhile, the patch parts of the pins are formed by bending in advance, so that the technical problem caused by bending the pins after packaging in the prior art is solved, and the product quality is improved.
Description
Technical Field
The invention relates to the field of semiconductors, in particular to a pre-bent pin, a patch type protector comprising the pre-bent pin and a preparation method of the patch type protector.
Background
The pin bending part in the prior patch type protector is usually used for bending the exposed part of the pin after the chip is packaged to form a patch part. This approach has the following problems:
1. when the exposed part of the pin is bent, the external force of the pin is easy to damage the packaging body;
2. when the exposed part of the pin is bent, the external force easily causes the welding part between the pin and the chip to be detached, so that the pin and the chip are in poor contact, heat is generated in the using process, and the fault occurs.
3. When the exposed part of the pin is bent, the external force easily makes the pin loose from the contact of the packaging body to form a gap, and water can permeate into the packaging body to influence the service life of the protector.
In addition, chips (i.e., commonly referred to as dies) used for packaging semiconductor devices are cut from wafers and then sent to a packaging factory for packaging. Generally, the glass bumps 2a protruding from the chip surface are present around the chip 2, and if the bonding portions of the leads and the chip are flat, the bonding portions of the leads and the chip are likely to crush the glass bumps 2a during the processing, which causes a short-circuit failure of the chip. Therefore, in order to solve the above technical problems, some packaging factories adopt the groove 1a (as shown in fig. 3) arranged on the welding part of the pin and the chip to avoid the glass bump 2a, so that the placing precision of the chip 2 is improved in the processing process, the production efficiency is reduced, and once the placing position of the chip 2 is not accurate, the glass bump 2a is crushed by the welding part of the pin and the chip. Or welding an additional heat sink capable of forming a boss on the welding part of the pin and the chip, and welding the boss on the heat sink and the welding part of the chip so as to suspend the glass bump 2a (as shown in fig. 1). Or the pins are processed by adopting thick and thin materials, bosses are punched at the thickness parts of the thick and thin materials and are welded with the welding parts of the chip, so that the glass bumps 2a are suspended (as shown in figure 1), the thin parts of the thick and thin materials are used as the parts of the pins extending out of the packaging body, and the thin parts are bent to form the patch parts of the pins; however, the material cost for processing the pins by adopting thick and thin materials is higher than the material cost with consistent thickness, so that the cost of the patch type protector is higher.
In addition, when the pins are processed by adopting thick and thin materials, burrs are easily generated when the thickness part of the pins is punched, and the phenomenon of point discharge is formed, so that the surface-mounted protector has problems in the use process.
Disclosure of Invention
In view of the above technical problems, a first aspect of the present invention is to provide a pre-bent pin that is formed by using copper materials with consistent thickness and is bent in advance, so as to reduce material cost, and to eliminate the need to bend the chip-mounting portion of the pin after packaging, thereby reducing the problems of desoldering and water seepage of the chip-mounting protector, and eliminating the generation of burrs during the punching process.
The second aspect of the invention provides a patch type protector comprising the pre-bent pin.
The second aspect of the invention provides a method for manufacturing the patch type protector.
The pre-bent pin is processed by copper materials with consistent thickness, and is provided with a welding part welded with a chip and a bending part for forming a patch, wherein a boss is punched on one surface of the welding part, and a pit corresponding to the boss is punched on the other surface of the welding part; the bent portion has a first bent portion bent perpendicularly from the welded portion and a second bent portion bent perpendicularly from the first bent portion, wherein the second bent portion extends substantially parallel to the welded portion and in the same direction as the welded portion.
The patch type protector as the second aspect of the invention comprises a chip, a first pin and a second pin which are welded with two poles of the chip, and a packaging body packaged outside the welding parts of the chip and the first pin, and the second pin and the two poles of the chip, and is characterized in that the first pin or/and the second pin is/are the pre-bent pin, and a boss in the pre-bent pin is welded with one pole or/and two poles of the chip.
In a preferred embodiment of the present invention, a heat sink is welded in the recess of the pre-bent lead.
The method for manufacturing the patch type protector of the second aspect of the present invention includes the steps of:
step 1: selecting flat copper strip base materials with consistent thickness, and manufacturing a first pin blank continuous piece through a stamping process, wherein the first pin continuous piece is formed by connecting a plurality of first pins; selecting copper strip base materials with consistent thickness, and manufacturing a second pin continuous piece through the same process; one surface of the first pin and one surface of the second pin are pressed with bosses after molding, the back surfaces of the bosses are correspondingly provided with welding parts which form a pit shape due to stamping, and one ends of the first pin and the second pin are pressed and bent to form bending parts.
Step 2: punching and separating the single pins on the first pin continuous piece and the second pin continuous piece respectively to form a plurality of independent first pins and second pins; the first pin or/and the second pin is/are the pre-bent pin;
and step 3: respectively welding the bosses of the first pin and the bosses of the second pin with the two poles of the chip;
and 4, step 4: and packaging the chip and the welding parts of the first pin, the second pin and the chip.
In a preferred embodiment of the present invention, in step 3, a heat sink is further soldered in the recess of the first lead or/and the second lead.
The invention has the beneficial effects that:
the pins are made of copper materials with consistent thickness, so that the material cost is reduced, and meanwhile, the patch parts of the pins are formed by bending in advance, so that the technical problem caused by bending the pins after packaging in the prior art is solved, and the product quality is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic view of a conventional conductive sheet-carrying product of the present invention.
Fig. 2 is a schematic diagram of the structure of the product of the invention.
Fig. 3 is a right side view of the product structure of the present invention.
Fig. 4 is a perspective view of the product structure of the present invention.
Fig. 5 is a perspective view of a pre-bent pin of the present invention.
FIG. 6 is a schematic diagram of preparation step 1 of the present invention.
FIG. 7 is a schematic diagram of preparation step 2 of the present invention.
FIG. 8 is a schematic diagram of preparation step 3 of the present invention.
Figure 9 is a top view of the product structure of the present invention.
Detailed Description
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
The first aspect of the technical problem to be solved by the present invention is to provide a pre-bent pin and a patch type protector including the pre-bent pin, so as to simplify a product structure and improve packaging efficiency.
The second aspect of the technical problem to be solved by the present invention is to provide a method for manufacturing a pre-bent pin and a chip type protector including the pre-bent pin, wherein the method solves the process defects existing in the original process by changing the production process of the semiconductor packaging stage, and further improves the product yield.
The detailed structure of the present invention will be further described with reference to the accompanying drawings and the detailed description.
Referring to fig. 2 to 4, the pre-bent pin and the chip type protector including the pre-bent pin include a pre-bent pin 1 welded to one side of a chip 2, and a package body 3 wrapped on an outermost layer.
The pre-bent lead 1 includes a welding part 10 provided at one end thereof and a bent part 20 provided at the other end thereof, the welding part including a boss 11 formed at one side of the welding part 10 by a stamping process and a corresponding recess 12 simultaneously stamped at the other side of the welding part 10. The bumps 11 are directly soldered to the chip 2 for electrical shock. The bent portion 20 includes a first bent portion 21 horizontally drawn from the welding portion 10 and vertically bent, and a second bent portion 22 vertically bent from the first bent portion 22, and the second bent portion 22 is bent so as to extend inward and parallel to the welding portion 10. The material of the pre-bent pin 1 is preferably copper. The heat radiating fins 4 can be welded in the concave pits 12 and used for enhancing the heat radiating performance of the protector.
The first pre-bent pin 1a and the second pre-bent pin 1b are respectively welded at two stages of the chip 2 through a welding part 10, and the package 3 is wrapped at the outermost layers of the chip 2 and the welding part 10.
Referring to fig. 2 in combination, a method for manufacturing a pre-bent pin and a patch type protector including the pre-bent pin for manufacturing the product is provided.
Step 1: selecting flat copper strip base materials with consistent thickness, and manufacturing a first pin blank continuous piece through a stamping process, wherein the first pin continuous piece is formed by connecting a plurality of first pins; selecting copper strip base materials with consistent thickness, and manufacturing a second pin continuous piece through the same process; one surface of the first pin and one surface of the second pin are pressed with bosses after molding, the back surfaces of the bosses are correspondingly provided with welding parts which form a pit shape due to stamping, and one ends of the first pin and the second pin are pressed and bent to form bending parts.
Step 2: and respectively punching and separating the single pins on the first pin continuous piece and the second pin continuous piece to form a plurality of independent first pins and second pins.
And step 3: respectively welding the bosses of the first pin and the bosses of the second pin with the two poles of the chip;
and 4, step 4: and packaging the chip and the welding parts of the first pin, the second pin and the chip.
The invention is characterized in that the pin is made of a flat substrate instead of a foreign substrate used in the prior art, and the pin is bent in the molding stage. Therefore, the process of bending the pin after glue pouring and packaging is changed, and the problem that the reject ratio of a product is increased due to the fact that the other end of the pin is desoldered with the chip due to bending in the original process is solved. Meanwhile, the purchase cost of the base material can be reduced.
Claims (4)
1. A pre-bent pin and a patch type protector comprising the same comprise a chip, a first pin and a second pin which are welded with two poles of the chip, and a packaging body packaged outside a welding part where the chip and the first pin are welded, and the second pin and the two poles of the chip are welded, and are characterized in that the first pin or/and the second pin are/is the pre-bent pin, and a boss in the pre-bent pin is welded with one pole or/and two poles of the chip; the pre-bent pin is made of copper materials with consistent thickness, and is provided with a welding part welded with the chip and a bending part for forming a patch, wherein a boss is punched on one surface of the welding part, and a pit corresponding to the boss is punched on the other surface of the welding part; the bent portion has a first bent portion bent perpendicularly from the welded portion and a second bent portion bent perpendicularly from the first bent portion, the second bent portion being substantially parallel to the welded portion and extending in the same direction as the welded portion.
2. The pre-bent lead and the chip on protector including the same as claimed in claim 1, wherein a heat sink is soldered in the recess.
3. A pre-bent pin and a method for manufacturing a patch type protector comprising the pre-bent pin are characterized by comprising the following steps:
step 1: selecting flat copper strip base materials with consistent thickness, and manufacturing a first pin blank continuous piece through a stamping process, wherein the first pin continuous piece is formed by connecting a plurality of first pins; selecting copper strip base materials with consistent thickness, and manufacturing a second pin continuous piece through the same process; one surface of the first pin and one surface of the second pin are pressed with bosses after molding, the back surfaces of the bosses are correspondingly provided with welding parts which form a pit shape due to stamping, and one ends of the first pin and the second pin are pressed and bent to form bending parts.
Step 2: punching and separating the single pins on the first pin continuous piece and the second pin continuous piece respectively to form a plurality of independent first pins and second pins; the first pin or/and the second pin is/are the pre-bent pin;
and step 3: respectively welding the bosses of the first pin and the bosses of the second pin with the two poles of the chip;
and 4, step 4: and packaging the chip and the welding parts of the first pin, the second pin and the chip.
4. The method for preparing a pin pre-bending protector as claimed in claim 3, further comprising the step of welding heat sinks in the pits of the first pin or/and the second pin in the step 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110436229.XA CN113192917A (en) | 2021-04-22 | 2021-04-22 | Pre-bent pin, patch type protector comprising same and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110436229.XA CN113192917A (en) | 2021-04-22 | 2021-04-22 | Pre-bent pin, patch type protector comprising same and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113192917A true CN113192917A (en) | 2021-07-30 |
Family
ID=76978657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110436229.XA Pending CN113192917A (en) | 2021-04-22 | 2021-04-22 | Pre-bent pin, patch type protector comprising same and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113192917A (en) |
-
2021
- 2021-04-22 CN CN202110436229.XA patent/CN113192917A/en active Pending
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