CN113192863B - Control method of wafer transmission system and semiconductor process equipment - Google Patents

Control method of wafer transmission system and semiconductor process equipment Download PDF

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Publication number
CN113192863B
CN113192863B CN202110336964.3A CN202110336964A CN113192863B CN 113192863 B CN113192863 B CN 113192863B CN 202110336964 A CN202110336964 A CN 202110336964A CN 113192863 B CN113192863 B CN 113192863B
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manipulator
determining
bearing structure
speed information
height information
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CN113192863A (en
Inventor
王磊
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Beijing Naura Microelectronics Equipment Co Ltd
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Beijing Naura Microelectronics Equipment Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The embodiment of the invention provides a control method of a wafer transmission system and semiconductor process equipment, wherein the method comprises the following steps: determining actual height information of a currently operated manipulator when the wafer is transmitted; determining target height information and target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure; and controlling the bearing structure to move according to the target height information and the target speed information. According to the embodiment of the invention, the height and speed of the bearing structure in wafer transmission are controlled, the situation that the bearing structure collides with the manipulator is avoided, and the distance between the bearing structure and the manipulator is reduced, so that the chamber volume of the loading chamber is reduced, and the switching efficiency of the vacuum environment and the atmospheric environment is improved.

Description

Control method of wafer transmission system and semiconductor process equipment
Technical Field
The present invention relates to the field of semiconductor processing technology, and in particular, to a control method of a wafer transmission system and a semiconductor processing apparatus.
Background
In a semiconductor manufacturing process, a transfer system is required to transfer a Wafer (Wafer) from an atmospheric environment to a vacuum environment to process the Wafer in the vacuum environment, wherein the transfer system generally comprises a load lock (LoadLock), a robot, a carrying structure, and the like, the robot and the carrying structure are driven by a motor, the Wafer can be transferred between the robot and the carrying structure through a lifting carrying mechanical structure, and the load lock is used for completing switching between the vacuum environment and the atmospheric environment.
However, for the transmission system with the dual independent robots and the carrying structure with the dual carrying positions, since the parameters of the driving motor are preset, if the distance between the dual carrying positions is smaller than the distance between the dual robots, as shown in fig. 1a, the situation that the carrying positions slot1 collide with the robot a easily occurs in the process of transporting the wafer by the slot2 and the robot B, and if the distance between the dual carrying positions is greater than the distance between the dual robots, as shown in fig. 1B, the distance between the robot and the mechanical structure of the bracket is too large in the process of transporting the wafer, resulting in that the volume of the chamber of the loading chamber is correspondingly increased, so that the time for filling the atmosphere of the loading chamber and extracting the vacuum is too long, and the switching efficiency between the vacuum environment and the atmospheric environment is too low.
Disclosure of Invention
In view of the above problems, a control method of a wafer transfer system and a semiconductor process apparatus have been proposed which can overcome or at least partially solve the above problems, comprising:
a method of controlling a wafer transfer system including a transfer structure, a loading chamber, and a load-bearing structure in the loading chamber, the transfer structure including a plurality of independent robots, the method comprising:
determining actual height information of a currently operated manipulator when the wafer is transmitted;
determining target height information and target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure;
and controlling the bearing structure to move according to the target height information and the target speed information.
Optionally, the determining the target height information and the target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure includes:
determining a current operation mode of the bearing structure;
determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
Determining target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode;
and determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure.
Optionally, the determining the safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure includes:
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining the safety threshold of the manipulator in the current operation mode as a first safety threshold;
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the manipulator in the current operation mode as a second safety threshold;
wherein the first safety threshold is greater than the second safety threshold.
Optionally, the determining the safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure includes:
when the current operation mode is a sheet placing operation and the current operation manipulator is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining the safety threshold of the current operation manipulator as a third safety threshold;
when the current operation mode is a sheet placing operation and the current operation manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the current operation manipulator as a fourth safety threshold;
wherein the fourth safety threshold is greater than the third safety threshold.
Optionally, the determining the target speed information of the bearing structure according to the current working mode and the position of the currently operated manipulator in the transmission structure includes:
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining that the target speed information of the bearing structure is first speed information;
When the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is larger than the target height information, determining target speed information of the bearing structure as second speed information;
wherein the first speed information is greater than the second speed information.
Optionally, the determining the target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure further includes:
when the current height information is smaller than the target height information, determining that the target speed information of the bearing structure is third speed information;
wherein the third speed information is greater than the second speed information, and the third speed information is opposite to the second speed information.
Optionally, the determining the target speed information of the bearing structure according to the current working mode and the position of the currently operated manipulator in the transmission structure includes:
When the current operation mode is a sheet placing operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is larger than the target height information, determining target speed information of the bearing structure as fourth speed information;
and when the current operation mode is a sheet placing operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the target speed information of the bearing structure as fifth speed information.
Optionally, the determining the target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure further includes:
when the current height information is smaller than the target height information, determining that the target speed information of the bearing structure is sixth speed information;
wherein the sixth speed information is smaller than the fourth speed information, and the sixth speed information is opposite to the fourth speed information.
A semiconductor processing apparatus comprising a wafer transfer system and a controller, the wafer transfer system comprising a transfer structure, a loading chamber, and a load-bearing structure in the loading chamber, the transfer structure comprising a plurality of independent robots;
the controller is configured to: determining actual height information of a currently operated manipulator when the wafer is transmitted; determining target height information and target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure; and controlling the bearing structure to move according to the target height information and the target speed information.
Optionally, the controller is further configured to: determining a current operation mode of the bearing structure; determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure; determining target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode; determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
The transmission structure further comprises a bracket, the bracket is positioned at the bottom of the transmission structure, the distance between the manipulator closest to the bracket and the bracket is greater than twice the safety threshold, and the distance between any two adjacent manipulators is greater than twice the safety threshold.
The embodiment of the invention has the following advantages:
in the embodiment of the invention, the actual height information of the currently operated manipulator is determined when the wafer is transmitted, the target height information and the target speed information of the bearing structure are determined according to the actual height information and the position of the currently operated manipulator in the transmission structure, and then the bearing structure is controlled to move according to the target height information and the target speed information, so that the height and the speed of the bearing structure in the wafer transmission are controlled, the situation that the bearing structure collides with the manipulator is avoided, the distance between the bearing structure and the manipulator is reduced, the chamber volume of a loading cavity is reduced, and the switching efficiency of a vacuum environment and an atmospheric environment is improved.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the description of the present invention will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.
FIG. 1a is a schematic diagram of a wafer transfer system according to an embodiment of the present invention;
FIG. 1b is a schematic diagram of another wafer transfer system according to one embodiment of the present invention;
FIG. 2a is a schematic diagram of another wafer transfer system according to one embodiment of the present invention;
FIG. 2b is a schematic illustration of a mechanical structure according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating a method for controlling a wafer transfer system according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating another method for controlling a wafer transfer system according to an embodiment of the present invention;
FIG. 5 is a flowchart illustrating another method for controlling a wafer transfer system according to one embodiment of the present invention;
FIG. 6a is a schematic illustration of a machine operation according to an embodiment of the present disclosure;
FIG. 6b is a schematic illustration of another machine operation provided by an embodiment of the present disclosure;
FIG. 6c is a schematic illustration of another machine operation provided by an embodiment of the present disclosure;
FIG. 6d is a schematic illustration of another machine operation provided by an embodiment of the present disclosure;
FIG. 6e is a schematic illustration of another machine operation provided by an embodiment of the present disclosure;
FIG. 7 is a flowchart illustrating another method for controlling a wafer transfer system according to an embodiment of the present invention;
FIG. 8 is a flowchart illustrating another method for controlling a wafer transfer system according to one embodiment of the present invention;
FIG. 9 is a flowchart illustrating another method for controlling a wafer transfer system according to one embodiment of the present invention;
FIG. 10a is a schematic diagram illustrating an example of a wafer handling operation according to a control method of a wafer transport system according to an embodiment of the present invention;
fig. 10b is a schematic diagram illustrating an example of a wafer handling operation according to a control method of a wafer transfer system according to an embodiment of the invention.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description. It will be apparent that the described embodiments are some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 2a, the wafer transfer system may include a transfer structure 101, a loading chamber 102, and a carrying structure 1021 located in the loading chamber, where the transfer structure may include a plurality of independent robots, for example, as shown in fig. 2a, may include two independent robots, and in particular, as shown in fig. 2b, the robot may have two robots, and the carrying structure 1021 may have at least 2 carrying positions (slots) with at least 3 claw structures thereon, where the claw structures correspond to gaps between the two robots.
In the process of transferring the wafer, the wafer to be processed can be placed by a mechanical arm in the transfer structure, a valve of a chamber of the loading cavity 102 is opened, the transfer structure is driven to horizontally move by a motor, so that the wafer placed on the mechanical arm of the transfer structure enters the loading cavity 102, and the bearing structure can be driven to vertically move by the motor, so that the bearing position in the bearing structure is lifted in the loading cavity 102.
In the vertical movement process of the bearing structure, the wafer placed on the mechanical arm of the transmission structure can be obtained through the claw-shaped structure of the bearing position, and the transmission structure is driven to horizontally move through the motor, so that the transmission structure moves out of the loading cavity, a valve of the cavity of the loading cavity 102 can be closed, and the loading cavity is vacuumized, so that the wafer is switched from the atmospheric environment to the vacuum environment.
After the vacuum environment is switched, the wafer can be processed, after the processing is finished, a valve of a chamber of the loading cavity 102 can be opened, the loading cavity 102 is subjected to atmospheric treatment, so that the wafer is switched from the vacuum environment to the atmospheric environment, the transmission structure 101 is driven to horizontally move through a motor, a mechanical arm of the transmission structure 101 enters the loading cavity 102, the bearing structure 1021 can be driven to lift through the motor, the wafer placed on a claw-shaped structure in the bearing structure 1021 falls onto the mechanical arm of the transmission structure 101, the transmission structure 101 is driven to horizontally move through the motor, the transmission structure 101 with the wafer placed thereon is moved out of the loading cavity 102, and the wafer transmission is finished.
Referring to fig. 3, a flowchart illustrating steps of a method for controlling a wafer transfer system according to an embodiment of the present invention may include a transfer structure, a loading chamber, and a carrying structure disposed in the loading chamber, where the transfer structure may include a plurality of independent robots.
Specifically, the method comprises the following steps:
step 301, determining actual height information of a currently operated manipulator when a wafer is transmitted;
the manipulator which is operated at present can be one manipulator in a transmission structure which is operated at present, and the manipulator comprises a manipulator which is closest to the top end of the loading cavity in the transmission structure and a manipulator which is closest to the bottom end of the loading cavity in the transmission structure. Taking a double independent manipulator structure as an example, the manipulator positioned above is the manipulator closest to the top end of the loading cavity, and the manipulator positioned below is the manipulator closest to the bottom end of the loading cavity.
In the process of wafer transmission, the manipulator of the operation to be performed at present can be determined, and then the actual height information of the manipulator of the operation at present can be determined.
The actual height information may be the height information of the currently operated manipulator relative to a preset basic reference plane (such as a bottom surface of a chamber, the ground, etc.), specifically, the actual height information of the currently operated manipulator may be determined by an infrared sensor, the initial height information of the manipulator may also be recorded, the speed information and the operation time information of the manipulator may be detected in real time during the operation of the manipulator, the movement distance of the manipulator during the operation may be calculated according to the speed information and the operation time information of the manipulator, and then the actual height information of the manipulator may be determined according to the initial height information of the manipulator and the movement distance of the manipulator during the operation.
Step 302, determining target height information and target speed information of a bearing structure according to actual height information and the position of a currently operated manipulator in a transmission structure;
the target height information may be height information required by the bearing structure for the operation to be performed currently, the target height information may be height information of the bearing structure relative to a preset basic reference plane, and the target speed information may be a movement speed required by the bearing structure.
Target height information for the load bearing structure:
after the actual height information is determined, the target relative position relationship between the bearing structure and the currently operated manipulator, that is, the relative position relationship to be achieved, can be further determined according to the actual height information.
For example, when taking a wafer, the carrying structure needs to move upwards from the lower part of the currently operated manipulator, so that the claw-shaped structure in the carrying structure just passes through between the manipulator arms of the currently operated manipulator, and the wafer placed on the manipulator arms is jacked up through the top ends of the claw-shaped structure, so that the wafer taking is completed, that the target relative position relationship between the carrying structure and the currently operated manipulator can be determined to be that the carrying structure is positioned below the currently operated manipulator, and when the carrying structure moves to the lower part of the previously operated manipulator, the wafer taking operation can be started.
When the wafer is placed, the carrying structure needs to move downwards from the upper part of the currently operated manipulator, and the manipulator of the currently operated manipulator just passes through the carrying structure between the top end of the claw-shaped structure and the bottom end of the claw-shaped structure, so that when the carrying structure moves downwards, the wafer placed at the top end of the claw-shaped structure can be lifted by the manipulator of the currently operated manipulator to finish the wafer placing, namely, the target relative position relationship between the carrying structure and the currently operated manipulator can be determined to be that the carrying structure is positioned above the currently operated manipulator, and when the carrying structure moves to the upper part of the previously operated manipulator, the wafer placing operation can be started to be executed.
After determining the target related position relationship between the bearing structure and the currently operated manipulator, the target height information of the bearing structure can be determined according to the target relative position relationship and the actual height information.
Target speed information for the load bearing structure:
after the target height information of the bearing structure is determined, the current height information of the bearing structure can be determined, and according to the actual height information of the currently operated manipulator and the current height information of the bearing structure, the current relative position relationship between the bearing structure and the currently operated manipulator, namely, the real-time relative position relationship can be determined, and further, the target speed information of the bearing structure can be determined according to the target height information and the current relative position relationship between the bearing structure and the currently operated manipulator.
In practical application, when the currently operated manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure and picking up a slice, if the height corresponding to the current height information of the bearing structure is greater than the height corresponding to the actual height information of the currently operated manipulator, the bearing structure needs to be moved downwards to the height corresponding to the target height information, and when the bearing structure moves downwards, because the currently operated manipulator is close to the bottom end of the loading cavity, the bearing structure has the risk of collision with the bottom end of the loading cavity, and the safety of the bearing structure moving to the target height information can be improved by setting a smaller moving speed.
Similarly, when the currently operated manipulator is the manipulator closest to the top end side of the loading cavity in the transmission structure and performs film placement, if the height corresponding to the current height information of the bearing structure is smaller than the height corresponding to the actual height information of the currently operated manipulator, the bearing structure needs to be moved upwards to the height corresponding to the target height information, and when the bearing structure is moved upwards, since the currently operated manipulator is close to the top end of the loading cavity, the bearing structure has the risk of collision with the top end of the loading cavity, the safety of the bearing structure when moving to the target height information can be improved by setting a smaller moving speed.
And 303, controlling the bearing structure to move according to the target height information and the target speed information.
After the target height information and the target speed information are determined, the bearing structure can be controlled to move according to the target speed information by taking the target height information as an end point, and the bearing structure can be controlled to move according to the target height information and the target speed information, so that the movement of the bearing structure can be controlled, the situation that the bearing structure collides with a manipulator is avoided, the distance between the bearing structure is not required to be set to be larger than the distance between two manipulators, the distance between the manipulators and the bearing structure can be effectively reduced, namely the movement stroke of the bearing structure is reduced, the cavity volume of a loading cavity is reduced, the switching efficiency of a vacuum environment and an atmospheric environment is further improved, and the volume of a transmission system is reduced.
In the embodiment of the invention, the actual height information of the currently operated manipulator is determined when the wafer is transmitted, the target height information and the target speed information of the bearing structure are determined according to the actual height information and the position of the currently operated manipulator in the transmission structure, and then the bearing structure is controlled to move according to the target height information and the target speed information, so that the height and the speed of the bearing structure in the wafer transmission are controlled, the situation that the bearing structure collides with the manipulator is avoided, the distance between the bearing structure and the manipulator is reduced, the chamber volume of a loading cavity is reduced, and the switching efficiency of a vacuum environment and an atmospheric environment is improved.
Referring to fig. 4, a flowchart illustrating steps of a method for controlling a wafer transfer system according to an embodiment of the present invention may include a transfer structure, a loading chamber, and a carrying structure disposed in the loading chamber, where the transfer structure may include a plurality of independent robots.
Specifically, the method comprises the following steps:
step 401, determining actual height information of a currently operated manipulator when a wafer is transferred;
step 402, determining a current operation mode of the bearing structure;
the current operation mode may include a wafer taking operation and a wafer placing operation, where the wafer taking operation is an operation that a carrier position in a carrier structure obtains a wafer from a transmission structure, and the wafer placing operation is an operation that the carrier position in the carrier structure places the wafer on the transmission structure.
After the actual height information is determined, the operation to be completed by the current bearing structure can be determined, and then the current operation mode of the bearing structure can be determined.
For example, when it is determined that the operation to be currently completed is a pick-up operation, it may be determined that the current operation mode of the load-bearing structure is a pick-up operation, and when it is determined that the operation to be currently performed is a drop operation, it may be determined that the current operation mode is a drop operation.
Step 403, determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
the safety threshold may be a threshold set to ensure that the bearing structure does not collide with the manipulator, and the safety threshold may be used to adjust the height information of the bearing structure.
After determining the current operation mode of the bearing structure, the safety threshold value of the currently operated manipulator in the current operation mode of the bearing structure can be determined according to the current operation mode and the position of the currently operated manipulator in the transmission structure due to the distance between the safety threshold value and the double manipulators and the height corresponding to the claw-shaped structure in the bearing structure.
Step 404, determining target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode;
after the safety threshold is obtained, the target relative position relationship between the bearing structure and the currently operated manipulator can be determined according to the current operation mode, and then the target height information of the bearing structure can be determined according to the actual height information, the safety threshold and the target relative position relationship.
Step 405, determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
after determining the current operation mode of the bearing structure, the target speed information of the bearing structure can be determined according to the current operation mode and the position of the manipulator currently operated in the transmission structure.
And step 406, controlling the bearing structure to move according to the target height information and the target speed information.
Referring to fig. 5, a flowchart illustrating steps of a method for controlling a wafer transfer system according to an embodiment of the present invention may include a transfer structure, a loading chamber, and a carrying structure disposed in the loading chamber, where the transfer structure may include a plurality of independent robots.
Specifically, the method comprises the following steps:
step 501, determining actual height information of a currently operated manipulator when a wafer is transmitted;
step 502, determining a current operation mode of a bearing structure;
step 503, when the current operation mode is a slice taking operation and the currently operated manipulator is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining the safety threshold of the currently operated manipulator as a first safety threshold;
When the current operation mode is a piece taking operation, and the manipulator in the current operation is the manipulator closest to one side of the top end of the loading cavity in the transmission structure, the risk of collision between the manipulator and the top end of the loading cavity when the bearing structure moves can be determined to be smaller, and then a larger first safety threshold value can be adopted to adjust the height information of the bearing structure.
In an example, the first safety threshold may be a range of values between a height value of the claw structure in the load bearing structure and a distance value between the dual robots.
Step 504, when the current operation mode is a slice taking operation and the currently operated manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the currently operated manipulator as a second safety threshold; wherein the first safety threshold is greater than the second safety threshold;
the first safety threshold may be greater than the second safety threshold, and the range of values of the second safety threshold may be between a height value of the claw-like structure in the carrying structure and a distance value between the double manipulators.
In an example, the second safety threshold value may be a minimum value, i.e. the same value as the height of the claw structure in the carrying structure.
When the current operation mode is a piece taking operation, and the manipulator operated at present is a manipulator close to one side of the bottom end of the loading cavity, the risk of collision between the manipulator and the bottom end of the loading cavity is large when the bearing structure moves can be determined, and then the smaller second safety threshold can be adopted to adjust the height information of the bearing structure.
The following describes the safety threshold in a film taking operation by way of an example:
as shown in fig. 6 a-6 e, slot1 and slot2 may be represented as bearing bits in a bearing structure, and manipulator a and manipulator B may be represented as manipulators in a transmission structure.
Wherein, fig. 6a is a process of taking a slice from the Slot1 and the manipulator B, fig. 6B is a process of taking a slice from the Slot2 and the manipulator B, fig. 6c is a process of taking a slice from the Slot1 and the manipulator a, fig. 6d is a process of taking a slice from the Slot2 and the manipulator a, and fig. 6e is a process of putting a slice from the Slot2 and the manipulator a.
When the current operation mode is a slice taking operation, it can be determined that the target relative position relationship between the carrying structure slot1 and the currently operated manipulator B is that the carrying structure slot1 is located below the currently operated manipulator B, and then it can be determined that height information corresponding to a position where a distance between the carrying structure slot1 and the currently operated manipulator B is a safety threshold is target height information, namely, a low position B, and similarly, a low position a can be obtained.
Specifically, the lower bit B may be determined using the following formula:
P dest ＝H arm –a min
wherein P is dest Can be expressed as a position which is positioned below the currently operated manipulator B and is at a safe threshold distance from the currently operated manipulator B, H arm Can be expressed as actual height information, a min May be represented as a second safety threshold.
In one embodiment of the present invention, the lower bit a may be determined using the following formula:
P dest ＝H arm –a
wherein P is dest Can be expressed as a position which is positioned below the currently operated manipulator A and is at a safe threshold distance from the currently operated manipulator A, H arm May be expressed as actual altitude information, a may be expressed as a first safety threshold, where a is greater than a min 。
Step 505, determining the target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode;
step 506, determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
and 507, controlling the bearing structure to move according to the target height information and the target speed information.
Referring to fig. 7, a flowchart illustrating steps of a method for controlling a wafer transfer system according to an embodiment of the present invention may include a transfer structure, a loading chamber, and a carrying structure disposed in the loading chamber, where the transfer structure may include a plurality of independent robots.
Specifically, the method comprises the following steps:
step 701, determining actual height information of a currently operated manipulator when a wafer is transmitted;
step 702, determining a current operation mode of a bearing structure;
step 703, when the current operation mode is a film-feeding operation and the currently operated manipulator is the manipulator closest to the top end of the loading cavity in the transmission structure, determining the safety threshold of the currently operated manipulator as a third safety threshold;
when the current operation mode is the sheet placing operation, and the manipulator operated at present is the manipulator close to one side of the top end of the loading cavity, the risk of collision between the manipulator and the top end of the loading cavity is larger when the bearing structure moves can be determined, and then the smaller third safety threshold value can be adopted to adjust the height information of the bearing structure.
In an example, the third safety threshold may be a value in a range that is less than the height of the claw-like structures in the load-bearing structure.
Step 704, when the current operation mode is a film feeding operation and the currently operated manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the currently operated manipulator as a fourth safety threshold; wherein the fourth safety threshold is greater than the third safety threshold;
The fourth safety threshold may be greater than the third safety threshold, and the fourth safety threshold may be a value less than a height of the claw structure in the load bearing structure.
When the current operation mode is the sheet placing operation, and the manipulator operated at present is the manipulator close to one side of the bottom end of the loading cavity, the risk of collision between the manipulator and the bottom end of the loading cavity is small when the bearing structure moves can be determined, and then the large fourth safety threshold can be adopted to adjust the height information of the bearing structure.
As shown in fig. 6 a-6 e, slot1 and slot2 may be represented as bearing bits in a bearing structure, and manipulator a and manipulator B may be represented as manipulators in a transmission structure.
Wherein, fig. 6a is a process of taking a slice from the Slot1 and the manipulator B, fig. 6B is a process of taking a slice from the Slot2 and the manipulator B, fig. 6c is a process of taking a slice from the Slot1 and the manipulator a, fig. 6d is a process of taking a slice from the Slot2 and the manipulator a, and fig. 6e is a process of putting a slice from the Slot2 and the manipulator a.
When the current operation mode is a slice placing operation, it can be determined that the target relative position relationship between the carrying structure slot1 and the currently operated manipulator B is that the carrying structure slot1 is located above the currently operated manipulator B, so that it can be determined that the carrying structure slot1 is located above the currently operated manipulator B, and height information corresponding to a position where a distance between the carrying structure slot1 and the currently operated manipulator B is a safety threshold is target height information, namely a slice transferring position B, and similarly, a slice transferring position a can be obtained.
Specifically, the slice transfer bit B may be determined by the following formula:
P dest ＝H arm +a
wherein P is dest Can be expressed as being located above the currently operated manipulator B at a distance of a safety threshold value from the currently operated manipulator B, H arm May be expressed as actual height information and a may be expressed as a fourth safety threshold.
In one embodiment of the present invention, the lower bit a may be determined using the following formula:
P dest ＝H arm +a min
wherein P is dest Can be expressed as being located above the currently operated manipulator a at a distance of a safety threshold value from the currently operated manipulator a, H arm Can be expressed as actual height information, a min May be expressed as a third safety threshold, where a is greater than a min 。
Step 705, determining the target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode;
step 706, determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
and step 707, controlling the bearing structure to move according to the target height information and the target speed information.
Referring to fig. 8, a flowchart illustrating steps of a method for controlling a wafer transfer system according to an embodiment of the present invention may include a transfer structure, a loading chamber, and a carrying structure disposed in the loading chamber, where the transfer structure may include a plurality of independent robots.
Specifically, the method comprises the following steps:
step 801, determining actual height information of a currently operated manipulator when a wafer is transferred;
step 802, determining the current operation mode of the bearing structure;
step 803, determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
step 804, determining the target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode;
step 805, when the current operation mode is a film taking operation and the currently operated manipulator is the manipulator closest to the top end of the loading cavity in the transmission structure, determining the target speed information of the bearing structure as the first speed information;
when the current operation mode is a piece taking operation, and the manipulator in the current operation is the manipulator closest to one side of the top end of the loading cavity in the transmission structure, the risk of collision between the manipulator and the top end of the loading cavity when the bearing structure moves can be determined to be smaller, and larger first speed information can be adopted to control the speed of movement of the bearing structure.
Step 806, when the current operation mode is a film taking operation and the currently operated manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is greater than the target height information, determining target speed information of the bearing structure as second speed information; wherein the first speed information is greater than the second speed information.
When the current operation mode is a sheet taking operation, and the manipulator operated at present is a manipulator close to one side of the bottom end of the loading cavity, the current height information of the bearing structure can be determined, the current height information of the bearing structure is compared with the target height information, when the height corresponding to the current height information of the bearing structure is greater than the height corresponding to the target height information, the bearing structure can be determined to move downwards, the risk of collision with the bottom end of the loading cavity exists, and then smaller second speed information can be adopted to control the moving speed of the bearing structure.
And when the current height information of the bearing structure is smaller than the target height information, determining the target speed information of the bearing structure as third speed information.
Wherein the third speed information is greater than the second speed information, and the third speed information is opposite to the second speed information. The first speed information and the third speed information may be the same in size.
In practical application, when the current height information is smaller than the target height information, that is, the current height information needs to be moved upwards to reach the target height, the risk of collision with the bottom end of the loading cavity is small, and then the target speed information of the bearing structure can be determined to be third speed information, that is, larger speed is adopted for movement.
And step 807, controlling the bearing structure to move according to the target height information and the target speed information.
Referring to fig. 9, a flowchart illustrating steps of a method for controlling a wafer transfer system according to an embodiment of the present invention may include a transfer structure, a loading chamber, and a carrying structure disposed in the loading chamber, where the transfer structure may include a plurality of independent robots.
Specifically, the method comprises the following steps:
step 901, determining actual height information of a currently operated manipulator when a wafer is transmitted;
step 902, determining a current operation mode of a bearing structure;
step 903, determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
step 904, determining target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode;
step 905, when the current operation mode is a film placing operation and the currently operated manipulator is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is greater than the target height information, determining the target speed information of the bearing structure as fourth speed information;
When the current operation mode is a film placing operation, and the manipulator operated at present is a manipulator close to one side of the top end of the loading cavity, the current height information of the bearing structure can be determined, the current height information of the bearing structure is compared with the target height information, when the height corresponding to the current height information of the bearing structure is greater than the height corresponding to the target height information, the bearing structure can be determined to move downwards, the risk of collision with the top end of the loading cavity is small, and further larger fourth speed information can be adopted to control the moving speed of the bearing structure.
When the current height information of the bearing structure is smaller than the target height information, determining that the target speed information of the bearing structure is sixth speed information;
the sixth speed information is smaller than the fourth speed information, and the sixth speed information is opposite to the fourth speed information.
In practical application, when the actual height information is smaller than the target height information, that is, the load bearing structure needs to move upwards to reach the target height, and there is a risk of collision with the top end of the load bearing cavity, the target speed information of the load bearing structure can be determined to be sixth speed information, that is, the load bearing structure moves at a smaller speed.
Step 906, when the current operation mode is a film feeding operation and the currently operated manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the target speed information of the bearing structure as fifth speed information;
wherein the fifth speed information may be equal to the fourth speed information.
When the current operation mode is a piece taking operation, and the manipulator operated at present is a manipulator close to one side of the bottom end of the loading cavity, the risk of collision between the manipulator and the bottom end of the loading cavity is small when the bearing structure moves can be determined, and further larger fifth speed information can be adopted to control the speed of movement of the bearing structure.
And step 907, controlling the bearing structure to move according to the target height information and the target speed information.
The following is an exemplary description of a dual independent robot picking operation according to an embodiment of the present invention with reference to fig. 10 a:
1. in the process of taking the wafer, whether the manipulator which is currently operated is a manipulator B which is close to one side of the bottom end of the loading cavity or not can be judged;
2. when the currently operated manipulator is the manipulator B near the bottom end side of the loading cavity, the actual height information H of the manipulator B can be acquired arm ；
3. The actual height information H of the manipulator B at the side close to the bottom end of the loading cavity is acquired by the manipulator currently operated arm Later, the current height information P of the bearing bit slot needing to be operated in the current bearing structure can be acquired now ；
4. At the current height information P of the acquisition bearing bit slot now After that, the safety threshold corresponding to the manipulator currently operated can be determined as the first safety threshold a min Further, according to the first safety threshold and the actual height information, a position P located below the currently operated manipulator B and having a first safety threshold distance from the currently operated manipulator B may be determined dest Namely, the target position of the bearing structure is the target height information, and the height information corresponding to the target position of the bearing structure is the target height information;
5. after determining the target position, the current height information of the bearing bit slot can be compared with the target height information, and when the value corresponding to the current height information of the bearing bit slot is greater than the value corresponding to the target height information, the target speed information of the bearing structure is set as second speed information-V min When the value corresponding to the current height information of the bearing bit slot is smaller than the value corresponding to the target height information, setting the target speed information of the bearing structure to be the third speed information +V, and the moving direction of the bearing structure to be the upward movement, and after the target height information and the target speed information are obtained, controlling the bearing structure to move according to the target height information and the target speed information;
6. When the currently operated manipulator is not the manipulator B near the bottom end of the loading cavity, the currently operated manipulator can be determined to be the manipulator A near the top end of the loading cavity, and the actual height information H of the manipulator A is acquired arm ；
7. In the process of collecting the actual height information H of the manipulator A arm Then, the safety threshold corresponding to the currently operated manipulator may be determined as the second safety threshold a, and the position P located below the currently operated manipulator B and having the distance from the currently operated manipulator B as the second safety threshold may be determined according to the second safety threshold and the actual height information dest Namely, the target position of the bearing structure is the target height information, and the height information corresponding to the target position of the bearing structure is the target height information;
8. after determining the target position, the target speed information of the bearing structure may be set as the first speed information V, and then the bearing structure may be controlled to move according to the target height information and the target speed information, where the direction may be upward or downward.
The following is an exemplary description of the dual independent robots performing a dicing operation according to an embodiment of the present invention with reference to fig. 10 b:
1. in the process of placing the wafer, whether the currently operated manipulator is the manipulator A close to one side of the top end of the loading cavity or not can be judged
2. The manipulator which is operated at present is a manipulator A which is close to one side of the top end of the loading cavity, and the actual height information H can be acquired arm ；
3. The actual height information H of the manipulator A at the side close to the top end of the loading cavity is acquired by the manipulator which is currently operated arm Later, the current height information P of the bearing bit slot needing to be operated in the current bearing structure can be acquired now ；
4. At the current height information P of the acquisition bearing bit slot now After that, the safety threshold corresponding to the manipulator currently operated can be determined as the third safety threshold a min Further, according to the third safety threshold and the actual height information, a position P located above the currently operated manipulator a and having a distance from the currently operated manipulator a of the third safety threshold may be determined dest Namely, the target position of the bearing structure is the target height information, and the height information corresponding to the target position of the bearing structure is the target height information;
5. after determining the target position, the current height information of the bearing bit slot may be compared with the target height information, when the value corresponding to the current height information of the bearing bit slot is greater than the value corresponding to the target height information, the target speed information of the bearing structure is set as fourth speed information-V, and the moving direction of the bearing structure is downward movement, and when the value corresponding to the current height information of the bearing bit slot is less than the value corresponding to the target height information, the target speed information of the bearing structure is set as sixth speed information +V min The movement direction of the bearing structure is upward movement, and after the target height information and the target speed information are obtained, the bearing structure can be used for carrying out the movement according to the target height information and the target speed informationTarget speed information, controlling the bearing structure to move;
6. when the currently operated manipulator is not the manipulator A near the top end of the loading cavity, the currently operated manipulator can be determined to be the manipulator B near the bottom end of the loading cavity, and the actual height information H of the manipulator B is acquired arm ；
7. In the process of collecting the actual height information H of the manipulator B arm Then, the safety threshold corresponding to the currently operated manipulator may be determined as a fourth safety threshold a, and the position P above the currently operated manipulator B and at a distance from the currently operated manipulator B of the fourth safety threshold may be determined based on the fourth safety threshold and the actual height information dest Namely, the target position of the bearing structure is the target height information, and the height information corresponding to the target position of the bearing structure is the target height information;
8. after determining the target position, the target speed information of the bearing structure may be set as the fifth speed information V, and then the bearing structure may be controlled to move according to the target height information and the target speed information, where the direction may be upward or downward.
Wherein "+" represents upward movement, "-" represents downward movement, and the upward or downward movement speed is correspondingly set according to the relationship between the slot current position and the slot target position without special description.
It should be noted that, for simplicity of description, the method embodiments are shown as a series of acts, but it should be understood by those skilled in the art that the embodiments are not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred embodiments, and that the acts are not necessarily required by the embodiments of the invention.
The invention provides a semiconductor process device, which comprises a wafer transmission system and a controller, wherein the wafer transmission system comprises a transmission structure, a loading cavity and a bearing structure positioned in the loading cavity, and the transmission structure comprises a plurality of independent manipulators;
the controller is configured to: determining actual height information of a currently operated manipulator when the wafer is transmitted; determining target height information and target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure; and controlling the bearing structure to move according to the target height information and the target speed information.
Transport structure bearing structure transport structure in one embodiment of the invention, the controller is further configured to:
determining a current operation mode of the bearing structure; determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure; determining target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode; determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
the transmission structure further comprises a bracket, the bracket is positioned at the bottom of the transmission structure, the distance between the manipulator closest to the bracket and the bracket is greater than twice the safety threshold, and the distance between any two adjacent manipulators is greater than twice the safety threshold.
In an embodiment of the invention, the controller is further configured to:
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining the safety threshold of the manipulator in the current operation mode as a first safety threshold;
When the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the manipulator in the current operation mode as a second safety threshold;
wherein the first safety threshold is greater than the second safety threshold.
In an embodiment of the invention, the controller is further configured to:
when the current operation mode is a sheet placing operation and the current operation manipulator is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining the safety threshold of the current operation manipulator as a third safety threshold;
when the current operation mode is a sheet placing operation and the current operation manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the current operation manipulator as a fourth safety threshold;
wherein the fourth safety threshold is greater than the third safety threshold.
In an embodiment of the invention, the controller is further configured to:
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining that the target speed information of the bearing structure is first speed information;
When the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is larger than the target height information, determining target speed information of the bearing structure as second speed information;
wherein the first speed information is greater than the second speed information.
In an embodiment of the invention, the controller is further configured to:
when the current height information is smaller than the target height information, determining that the target speed information of the bearing structure is third speed information;
wherein the third speed information is greater than the second speed information, and the third speed information is opposite to the second speed information.
In an embodiment of the invention, the controller is further configured to:
when the current operation mode is a sheet placing operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is larger than the target height information, determining target speed information of the bearing structure as fourth speed information;
And when the current operation mode is a sheet placing operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the target speed information of the bearing structure as fifth speed information.
In an embodiment of the invention, the controller is further configured to:
when the current height information is smaller than the target height information, determining that the target speed information of the bearing structure is sixth speed information;
wherein the sixth speed information is smaller than the fourth speed information, and the sixth speed information is opposite to the fourth speed information.
In the embodiment of the invention, the actual height information of the currently operated manipulator is determined when the wafer is transmitted, the target height information and the target speed information of the bearing structure are determined according to the actual height information and the position of the currently operated manipulator in the transmission structure, and then the bearing structure is controlled to move according to the target height information and the target speed information, so that the height and the speed of the bearing structure in the wafer transmission are controlled, the situation that the bearing structure collides with the manipulator is avoided, the distance between the bearing structure and the manipulator is reduced, the chamber volume of a loading cavity is reduced, and the switching efficiency of a vacuum environment and an atmospheric environment is improved.
An embodiment of the present invention further provides a server, which may include a processor, a memory, and a computer program stored in the memory and capable of running on the processor, where the computer program when executed by the processor implements a method for controlling a wafer transfer system as described above.
An embodiment of the present invention further provides a computer readable storage medium, on which a computer program is stored, which when executed by a processor implements a method for controlling a wafer transfer system as described above.
For the device embodiments, since they are substantially similar to the method embodiments, the description is relatively simple, and reference is made to the description of the method embodiments for relevant points.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described by differences from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
It will be apparent to those skilled in the art that embodiments of the present invention may be provided as a method, apparatus, or computer program product. Accordingly, embodiments of the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, embodiments of the invention may take the form of a computer program product on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) having computer-usable program code embodied therein.
Embodiments of the present invention are described with reference to flowchart illustrations and/or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flowchart illustrations and/or block diagrams, and combinations of flows and/or blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article or terminal device comprising the element.
The foregoing has described in detail a method for controlling a wafer transfer system and a semiconductor processing apparatus, and specific examples have been provided herein to illustrate the principles and embodiments of the present invention, the above examples being provided only to assist in understanding the method and core ideas of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present invention, the present description should not be construed as limiting the present invention in view of the above.

Claims (8)

1. A method of controlling a wafer transfer system, the wafer transfer system comprising a transfer structure, a load chamber, and a load-bearing structure positioned in the load chamber, the transfer structure comprising a plurality of independent robots, the method comprising:
determining actual height information of a currently operated manipulator when the wafer is transmitted;
determining target height information and target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure;
controlling the bearing structure to move according to the target height information and the target speed information;
The determining the target height information and the target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure comprises the following steps:
determining a current operation mode of the bearing structure;
determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
determining target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode;
and determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure.
2. The method of claim 1, wherein determining the safety threshold for the currently operated manipulator based on the current job mode and the position of the currently operated manipulator in the transport structure comprises:
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining the safety threshold of the manipulator in the current operation mode as a first safety threshold;
When the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the manipulator in the current operation mode as a second safety threshold;
wherein the first safety threshold is greater than the second safety threshold.
3. The method of claim 1, wherein determining the safety threshold for the currently operated manipulator based on the current job mode and the position of the currently operated manipulator in the transport structure comprises:
when the current operation mode is a sheet placing operation and the current operation manipulator is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining the safety threshold of the current operation manipulator as a third safety threshold;
when the current operation mode is a sheet placing operation and the current operation manipulator is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the safety threshold of the current operation manipulator as a fourth safety threshold;
Wherein the fourth safety threshold is greater than the third safety threshold.
4. The method of claim 1, wherein determining the target speed information for the load bearing structure based on the current work mode and the position of the currently operated manipulator in the transport structure comprises:
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining that the target speed information of the bearing structure is first speed information;
when the current operation mode is a slice taking operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is larger than the target height information, determining target speed information of the bearing structure as second speed information;
wherein the first speed information is greater than the second speed information.
5. The method of claim 4, wherein determining the target speed information for the load bearing structure based on the current manner of operation and the position of the currently operated manipulator in the transport structure further comprises:
When the current height information is smaller than the target height information, determining that the target speed information of the bearing structure is third speed information;
wherein the third speed information is greater than the second speed information, and the third speed information is opposite to the second speed information.
6. The method of claim 1, wherein determining the target speed information for the load bearing structure based on the current work mode and the position of the currently operated manipulator in the transport structure comprises:
when the current operation mode is a sheet placing operation and the manipulator in the current operation mode is the manipulator closest to the top end side of the loading cavity in the transmission structure, determining current height information of the bearing structure, and when the current height information is larger than the target height information, determining target speed information of the bearing structure as fourth speed information;
and when the current operation mode is a sheet placing operation and the manipulator in the current operation mode is the manipulator closest to the bottom end side of the loading cavity in the transmission structure, determining the target speed information of the bearing structure as fifth speed information.
7. The method of claim 6, wherein determining the target speed information for the load bearing structure based on the current work mode and the position of the currently operated manipulator in the transport structure, further comprises:
when the current height information is smaller than the target height information, determining that the target speed information of the bearing structure is sixth speed information;
wherein the sixth speed information is smaller than the fourth speed information, and the sixth speed information is opposite to the fourth speed information.
8. A semiconductor processing apparatus comprising a wafer transfer system and a controller, wherein the wafer transfer system comprises a transfer structure, a loading chamber, and a carrier structure positioned in the loading chamber, the transfer structure comprising a plurality of independent robots;
the controller is configured to: determining actual height information of a currently operated manipulator when the wafer is transmitted; determining target height information and target speed information of the bearing structure according to the actual height information and the position of the currently operated manipulator in the transmission structure; controlling the bearing structure to move according to the target height information and the target speed information;
The controller is further configured to: determining a current operation mode of the bearing structure; determining a safety threshold for the currently operated manipulator according to the current operation mode and the position of the currently operated manipulator in the transmission structure; determining target height information of the bearing structure according to the actual height information, the safety threshold value and the current operation mode; determining target speed information of the bearing structure according to the current operation mode and the position of the currently operated manipulator in the transmission structure;
the transmission structure further comprises a bracket, the bracket is positioned at the bottom of the transmission structure, the distance between the manipulator closest to the bracket and the bracket is greater than twice the safety threshold, and the distance between any two adjacent manipulators is greater than twice the safety threshold.
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