CN113183214A - Cutting device and cutting method for detecting heat wire shrinkage rate of substrate glass - Google Patents
Cutting device and cutting method for detecting heat wire shrinkage rate of substrate glass Download PDFInfo
- Publication number
- CN113183214A CN113183214A CN202110593856.4A CN202110593856A CN113183214A CN 113183214 A CN113183214 A CN 113183214A CN 202110593856 A CN202110593856 A CN 202110593856A CN 113183214 A CN113183214 A CN 113183214A
- Authority
- CN
- China
- Prior art keywords
- substrate glass
- cutting
- scribing
- mark
- tool mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 90
- 239000000758 substrate Substances 0.000 title claims abstract description 87
- 238000005520 cutting process Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 8
- 239000005357 flat glass Substances 0.000 abstract description 3
- 239000004579 marble Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005464 sample preparation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2873—Cutting or cleaving
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The cutting device comprises a base for bearing the substrate glass, a cutter head movably mounted above the base, and a transverse graduated scale and a longitudinal graduated scale which are fixed on the base, wherein the cutter head is used for scribing cutting marks and marking cutting marks on the substrate glass, the cutting marks are along the transverse central line direction of the substrate glass, and the marking cutting marks are perpendicular to the cutting marks and are symmetrically arranged relative to the longitudinal central line of the substrate glass. Compare with current system appearance mode, the cutting device that this disclosure provided can be even, quick ruling cutting tool mark and mark tool mark through removing the tool bit, at the in-process of ruling cutting tool mark and mark tool mark, need not remove base plate glass, and after the ruling finishes, direct scale through on the base carry out the reading can, can improve system appearance efficiency, in addition, can also reduce the risk that system appearance personnel lacerate the hand, improved the security of system appearance.
Description
Technical Field
The disclosure relates to the technical field of substrate glass detection, in particular to a cutting device and a cutting method for detecting the rate of re-heating wire shrinkage of substrate glass.
Background
The high temperature environment can be involved in the downstream production process of the substrate glass, the substrate glass can shrink to a certain degree under the high temperature environment due to the existence of the self stress of the glass, and the quality and the yield of the substrate glass are directly determined by the shrinkage, so the reheat linear shrinkage of the substrate glass needs to be detected and monitored. In the related art, in the existing method for detecting the rate of heat wire shrinkage of the substrate glass, a ruler is used as a collimation tool, and a glass cutter is held by hand to scribe marked tool marks.
Disclosure of Invention
The first purpose of this disclosure is to provide a base plate glass is cutting device for heat ray shrinkage rate detection again to solve the technical problem that current system appearance mode system appearance is inefficient.
A second object of the present disclosure is to provide a cutting method for detecting a rate of re-heating wire shrinkage of a substrate glass, using the cutting apparatus provided by the present disclosure.
In order to achieve the above object, the present disclosure provides a cutting device for detecting a rate of re-heating wire shrinkage of substrate glass, comprising a base for bearing the substrate glass, a tool bit movably mounted above the base, and a transverse scale and a longitudinal scale fixed on the base, the tool bit being used for scribing a cutting tool mark and a marking tool mark on the substrate glass, wherein the cutting tool mark is along a transverse center line direction of the substrate glass, and the marking tool mark is perpendicular to the cutting tool mark and symmetrically arranged about a longitudinal center line of the substrate glass.
Optionally, the cutting device further comprises two longitudinal slide rails arranged above the base, a transverse slide rail slidably mounted between the longitudinal slide rails, and a slider slidably mounted on the transverse slide rail, the cutter head being mounted on the slider.
Optionally, a first adjusting knob for changing the scribing direction of the tool bit and/or a second adjusting knob for adjusting the scribing pressure of the tool bit are/is mounted on the sliding block.
Optionally, a sleeve is fixed on the sliding block, and the first adjusting knob penetrates through the sleeve to be connected with the cutter head.
Optionally, the switching device further includes an elastic member abutting against between the first adjusting knob and the end surface of the sleeve, and the second adjusting knob abuts against the end surface of the first adjusting knob to drive the first adjusting knob to move up and down.
Optionally, the adjustment range of the second adjustment knob is 0-7.2N.
Optionally, the cutting device further comprises a first locking knob for fixing the transverse sliding rail, a second locking knob for fixing the sliding block, and a third locking knob for fixing the cutter head.
According to a second aspect of the present disclosure, there is also provided a cutting method for detecting a rate of re-heating wire shrinkage of a substrate glass, the substrate glass being cut by the above-described cutting apparatus, the cutting method including: placing substrate glass on a base, keeping the long edge of the substrate glass parallel to the transverse graduated scale, and keeping the wide edge parallel to the longitudinal graduated scale; controlling the cutter head to move along the transverse center line of the substrate glass, and scribing cutting tool marks on the substrate glass; and controlling the cutter head to move along the direction vertical to the cutting tool mark, and scribing the marking tool mark at the two ends of the substrate glass.
Optionally, in the step of scribing the marking tool marks at both ends of the substrate glass, the scribing pressure of the tool bit is controlled to be the same.
Optionally, the tool tip is rotated 90 ° between the steps of scoring the cutting tool mark and scoring the marking tool mark.
Through above-mentioned technical scheme, compare with current system appearance mode, the cutting device that this disclosure provided can be even, quick ruling cutting tool mark and mark tool mark through removing the tool bit, at the in-process of ruling cutting tool mark and mark tool mark, need not remove substrate glass, and after the ruling finishes, direct scale through on the base carry out the reading can, can improve system appearance efficiency, in addition, can also reduce the risk that system appearance personnel cut the hand, improved the security of system appearance.
Additional features and advantages of the disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:
fig. 1 is a plan view of a cutting apparatus for detecting a rate of re-heating wire shrinkage of a substrate glass according to an exemplary embodiment of the present disclosure;
fig. 2 is a schematic diagram illustrating cutting of a substrate glass sample for detecting a rate of re-heating wire shrinkage according to an exemplary embodiment of the present disclosure;
fig. 3 is a partially enlarged view of a blade mounting portion in the cutting apparatus for detecting a rate of re-heating wire shrinkage of substrate glass according to an exemplary embodiment of the present disclosure;
fig. 4 and 5 are flowcharts of a cutting method for detecting a rate of re-heat wire shrinkage of a substrate glass according to an exemplary embodiment of the present disclosure.
Description of the reference numerals
1-base, 2-tool bit, 31-transverse scale, 32-longitudinal scale, 41-longitudinal slide, 42-transverse slide, 43-slide, 51-first adjusting knob, 52-second adjusting knob, 53-sleeve, 54-elastic piece, 61-first locking knob, 62-second locking knob, 63-third locking knob, AB-cutting tool mark; CD-marked tool marks.
Detailed Description
The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.
In the present disclosure, unless otherwise stated, the use of the terms of orientation such as "upper" and "lower" generally means that they are defined in the case of normal use of the cutting device provided in the present disclosure, and in particular, with reference to the drawing direction shown in fig. 3, "inner" and "outer" mean inner and outer of the respective component profiles, "transverse" means along the length direction of the substrate glass, "longitudinal" means along the width direction of the substrate glass, and in addition, the terms "first" and "second" and the like used in the present disclosure are for distinguishing one element from another element, and have no order or importance. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated.
As shown in fig. 2, when detecting the reheat line shrinkage rate of the substrate glass, a straight ruler is usually used as a collimation tool, a glass knife is held by hand to scribe a cutting tool mark AB and a marking tool mark CD, the substrate glass is divided into two parts a and b along the cutting tool mark AB, the part a can be placed in a high temperature environment for heating treatment, the part b is not heated, after heating for a predetermined time, the absolute value of the difference between the distances L1 and L2 between the two marking tool marks CD of the part a and the part b is measured by the straight ruler, and the reheat line shrinkage rate ω of the substrate glass is | L1-L2| ÷ L2. In the existing sample preparation method, the marking tool marks CD are manually scribed, so that the marking tool marks CD at two ends are different, especially under the condition that the shrinkage of the substrate glass is small, the accuracy of a detection result is influenced, and in addition, the manual scribing method also has the defects of low sample preparation efficiency, easy scratching and the like.
In view of the above problems, as shown in fig. 1, the present disclosure provides a cutting device for detecting a rate of re-heating wire shrinkage of a substrate glass, the cutting device including a base 1 for carrying the substrate glass, a tool bit 2 movably mounted above the base 1, and a transverse scale 31 and a longitudinal scale 32 fixed on the base 1, the tool bit 2 being used for scribing a cutting tool mark AB and a marking tool mark CD on the substrate glass, wherein the cutting tool mark AB is along a transverse center line direction of the substrate glass, and the marking tool mark CD is perpendicular to the cutting tool mark AB and symmetrically arranged with respect to a longitudinal center line of the substrate glass.
Here, it should be noted that there are various ways of moving the tool bit 2 by moving the tool bit 2 on the substrate glass to respectively scribe the cutting tool mark AB and the marking tool mark CD, for example, fixing the tool bit 2 on a mechanical arm of a robot, or matching a slide rail and a slide block described below, which are within the protection scope of the present disclosure. In other embodiments, the cutting tool mark AB may also be along the longitudinal centerline of the substrate glass, and the marking tool mark CD may be along the transverse centerline of the substrate glass. Base 1 can be rectangular marble base, can select the marble of 0 level, 1 level, three kinds of plane degree of 00 levels, and horizontal scale 31 and vertical scale 32 inlay on marble base's surface, and horizontal scale 31 is parallel with base 1's long limit, and vertical scale 32 is parallel with base 1's broadside.
Through above-mentioned technical scheme, compare with current system appearance mode, the cutting device that this disclosure provided can be even, quick ruling cutting tool mark AB and mark tool mark CD through removing tool bit 2, at the in-process of ruling cutting tool mark AB and mark tool mark CD, need not remove base plate glass, and after the ruling finishes, direct scale through on the base 1 carry out the reading can, can improve system appearance efficiency, in addition, can also reduce the risk that the personnel of making the appearance cut the hand, the security that has improved the system appearance.
As an exemplary embodiment of the present disclosure, as shown in fig. 1, the cutting device provided by the present disclosure further includes two longitudinal slide rails 41 disposed above the base 1, a lateral slide rail 42 slidably mounted between the longitudinal slide rails 41, and a slider 43 slidably mounted on the lateral slide rail 42, the cutter head 2 being mounted on the slider 43. After the direction of the tool bit 2 is adjusted, the sliding block 43 moves relative to the transverse sliding rail 42, and a cutting tool mark AB can be scribed on the substrate glass; the transverse slide rail 42 and the slide block 43 integrally move relative to the longitudinal slide rail 41, so that a marking knife mark CD can be scribed on the substrate glass; after the slider 43 moves a certain distance with respect to the lateral slide rail 42, the entire body moves with respect to the longitudinal slide rail 41, and a plurality of marking tool marks CD can be scribed at both ends of the substrate glass.
Further, in the present disclosure, as shown in fig. 1 and 3, a first adjusting knob 51 for changing the scribing direction of the cutter head 2 and/or a second adjusting knob 52 for adjusting the scribing pressure of the cutter head 2 are mounted on the slider 43. The cutter head 2 can be provided with a cutter wheel with 0-300 teeth and an angle of 70-120 degrees, after the cutting tool mark AB is marked, the cutter head 2 can be rotated by 90 degrees through the first adjusting knob 51, and the marking tool mark CD is marked along the vertical direction. In addition, when marking tool marks CD at two ends are marked, the pressure of the tool bit 2 acting on the surface of the substrate glass can be controlled to be kept unchanged through the second adjusting knob 52 during marking, so that the marked tool marks CD are ensured to be consistent, reading errors caused by inconsistent marked tool marks CD are avoided, and the accuracy of a detection result is improved.
Specifically, in an exemplary embodiment of the present disclosure, as shown in fig. 3, a sleeve 53 is fixed to the slider 43, and the first adjustment knob 51 is connected to the tool bit 2 through the sleeve 53. To prevent the first adjusting knob 51 from falling downward in the vertical direction, a support may be provided between the sleeve 53 and the end of the first adjusting knob 51, and when the first adjusting knob 51 is rotated, the cutter head 2 may be rotated to adjust the scribing direction. In the present embodiment, the outer peripheral wall of the first adjusting knob 51 is formed with a protrusion, the inner peripheral wall of the sleeve is formed with four grooves arranged at equal intervals, and the protrusion can extend into or withdraw from the grooves, so that the cutter head rotates 90 ° every time the first adjusting knob 51 is rotated once, that is, the first adjusting knob 51 has four consecutive gears, and the adjustment of the angle of the cutter head 2 can be realized by rotating the first adjusting knob 51 clockwise or counterclockwise.
More specifically, the support member may be an elastic member 54 abutting between the first adjusting knob 51 and the end surface of the sleeve 53, the second adjusting knob 52 abuts on the end surface of the first adjusting knob 51, when the second adjusting knob 52 is rotated, the lower end thereof presses the first adjusting knob 51, the elastic member 54 is compressed, the elastic force acts on the cutter head 2 through the sleeve 53, increasing the scoring pressure at the end of the cutter head 2; conversely, when rotating in the opposite direction, releasing the elastic element 54, the force acting on the sleeve 53 is reduced and the scoring pressure of the corresponding cutting head 2 is reduced, allowing the adjustment of the scoring pressure, the adjustment range of the second rotary knob 52 being 0-7.2N, preferably 4.5N, continuously adjustable every 0.45N.
The present disclosure provides that the cutting device further comprises a first locking knob 61 for fixing the lateral sliding rail 42, a second locking knob 62 for fixing the slider 43, and a third locking knob 63 for fixing the cutter head 2. When the cutting tool mark AB is scribed, the first locking knob 61 is loosened, the transverse sliding rail 42 is adjusted to a proper position, the first locking knob 61 is locked to ensure that the transverse sliding rail 42 is fixed, the second locking knob 62 is loosened, the third locking knob 63 is locked, and the sliding block 43 slides relative to the transverse sliding rail 42 to drive the cutter head 2 to move along the transverse central line direction; when marking the marking tool mark CD, the second locking knob 62 is loosened, the sliding block 43 is adjusted to a proper position, the first locking knob 61 is loosened, the second locking knob 62 and the third locking knob 63 are locked, and the transverse sliding rail 42 drives the sliding block 43 and the cutter head 2 to move along the longitudinal direction.
Because the shrinkage of the substrate glass is small in a high-temperature environment, in order to ensure the accuracy of reading, the part a and the part b need to be placed on an objective table of a microscope after being combined together according to the position before being broken off, the position of the substrate glass to be read can be amplified, and the reading is convenient and accurate. The division value of the transverse scale 31 and the longitudinal scale 32 may be 1 mm.
According to a second aspect of the present disclosure, as shown in fig. 4, there is also provided a cutting method for detecting a rate of re-heating wire shrinkage of a substrate glass, which cuts the substrate glass using the above-described cutting apparatus, the cutting method including: step 101, placing substrate glass on a base 1, keeping the long side of the substrate glass parallel to a transverse graduated scale 31, and keeping the wide side parallel to a longitudinal graduated scale 32; 102, controlling the tool bit 2 to move along the transverse center line of the substrate glass, and scribing a cutting tool mark AB on the substrate glass; and a step 103 of controlling the tool bit 2 to move along the direction perpendicular to the cutting tool mark AB and scribing a marking tool mark CD at the two ends of the substrate glass. The sample preparation method can uniformly and quickly scribe the marked tool mark CD through the movement of the cutter head 2, and sequentially scribe the cutting tool mark AB and the marked tool mark CD under the condition that the substrate glass is not moved, so that the sample preparation efficiency is improved, the labor intensity of operators is reduced, the cutting method has all the beneficial effects of the cutting device, and redundant description is not needed here.
In the step of scribing the marking tool marks CD at the two ends of the substrate glass, the scribing pressure of the tool bit 2 is controlled to be the same, so that the marking tool marks CD at the two ends are consistent, the reading accuracy is ensured, and the accuracy of the detection result is improved.
As shown in fig. 5, after the scribing the cutting scribe AB, the cutting method further includes: step 104, the tool bit is rotated by 90 °, and step 103 is performed again, i.e., the marking tool mark CD is scribed again.
Taking the substrate glass with the size of 15cm by 8cm as an example, moving the cutter head 2 to the positions 1.5cm away from the wide edge of the substrate glass and the cutting tool mark AB along the transverse central line direction of the substrate glass, controlling the scribing pressure of the cutter head to be 4.5N, scribing the marking tool mark CD with the length of 3cm, scribing another same marking tool mark CD at the other end of the substrate glass according to the same method, and finishing the preparation of the substrate glass by using the heat wire shrinkage rate sample wafer.
The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
It should be noted that, in the foregoing embodiments, various features described in the above embodiments may be combined in any suitable manner, and in order to avoid unnecessary repetition, various combinations that are possible in the present disclosure are not described again.
In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.
Claims (10)
1. The cutting device for detecting the rate of re-heating wire shrinkage of the substrate glass is characterized by comprising a base (1) for bearing the substrate glass, a cutter head (2) movably mounted above the base (1), and a transverse graduated scale (31) and a longitudinal graduated scale (32) which are fixed on the base (1), wherein the cutter head (2) is used for scribing a cutting tool mark (AB) and a marking tool mark (CD) on the substrate glass, the cutting tool mark (AB) is along the transverse central line direction of the substrate glass, and the marking tool mark (CD) is perpendicular to the cutting tool mark (AB) and is symmetrically arranged about the longitudinal central line of the substrate glass.
2. The cutting device for substrate glass heat wire shrinkage rate detection according to claim 1, further comprising two longitudinal slide rails (41) arranged above the base (1), a lateral slide rail (42) slidably mounted between the longitudinal slide rails (41), and a slider (43) slidably mounted on the lateral slide rail (42), the tool bit (2) being mounted on the slider (43).
3. The cutting apparatus for detecting rate of heat wire shrinkage of substrate glass according to claim 2, wherein a first adjusting knob (51) for changing a scribing direction of the blade (2) and/or a second adjusting knob (52) for adjusting a scribing pressure of the blade (2) are mounted on the slider (43).
4. The cutting apparatus for detecting the rate of re-heating wire shrinkage of substrate glass according to claim 3, wherein a sleeve (53) is fixed to the slider (43), and the first adjustment knob (51) is connected to the cutter head (2) through the sleeve (53).
5. The cutting device for detecting heat wire shrinkage rate of substrate glass according to claim 4, further comprising an elastic member (54) abutting between the first adjustment knob (51) and the end surface of the sleeve (53), wherein the second adjustment knob (52) abuts on the end surface of the first adjustment knob (51) to drive the first adjustment knob (51) to move up and down.
6. The cutting apparatus for detecting percentage of heat shrinkage of substrate glass according to claim 5, wherein an adjustment range of the second adjustment knob (52) is 0 to 7.2N.
7. The cutting device for substrate glass heat wire shrinkage rate detection according to claim 2, further comprising a first locking knob (61) for fixing the lateral slide rail (42), a second locking knob (62) for fixing the slider (43), and a third locking knob (63) for fixing the cutter head (2).
8. A cutting method for detecting a rate of re-heat wire shrinkage of a substrate glass, characterized in that the substrate glass is cut with the cutting apparatus according to any one of claims 1 to 7, the cutting method comprising:
placing substrate glass on a base, keeping the long edge of the substrate glass parallel to the transverse graduated scale, and keeping the wide edge parallel to the longitudinal graduated scale;
controlling the cutter head to move along the transverse center line of the substrate glass, and scribing cutting tool marks on the substrate glass; and
and controlling the tool bit to move along the direction vertical to the cutting tool mark, and scribing the marking tool mark at the two ends of the substrate glass.
9. The cutting method for detecting the reheat linear shrinkage rate of a substrate glass according to claim 8, wherein in the step of scribing the marking tool marks at both ends of the substrate glass, the scribing pressure of the tool bit is controlled to be the same.
10. The cutting method for reheat line shrinkage detection of substrate glass according to claim 8, wherein the tool tip is rotated by 90 ° between the steps of scribing the cutting tool mark and scribing the marking tool mark.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593856.4A CN113183214A (en) | 2021-05-28 | 2021-05-28 | Cutting device and cutting method for detecting heat wire shrinkage rate of substrate glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593856.4A CN113183214A (en) | 2021-05-28 | 2021-05-28 | Cutting device and cutting method for detecting heat wire shrinkage rate of substrate glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113183214A true CN113183214A (en) | 2021-07-30 |
Family
ID=76986237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110593856.4A Pending CN113183214A (en) | 2021-05-28 | 2021-05-28 | Cutting device and cutting method for detecting heat wire shrinkage rate of substrate glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113183214A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103454302A (en) * | 2013-09-18 | 2013-12-18 | 四川旭虹光电科技有限公司 | Method for measuring shrinkage factor of PDP (Plasma Display Panel) glass |
| KR101677664B1 (en) * | 2016-04-04 | 2016-11-29 | (주)디엠티 | Scribing stage for cutting LCD glass and one-stage LCD glass cutting system having the same |
| CN206725517U (en) * | 2017-04-06 | 2017-12-08 | 阳谷燎原化工有限公司 | A kind of thin-layer chromatography glass trial production board cutter |
| CN207313433U (en) * | 2017-09-27 | 2018-05-04 | 东旭集团有限公司 | Cutting equipment |
| CN108426913A (en) * | 2018-06-19 | 2018-08-21 | 四川旭虹光电科技有限公司 | A kind of test method of also retract rate |
| CN108675633A (en) * | 2018-07-24 | 2018-10-19 | 彩虹显示器件股份有限公司 | A kind of electronic glass and its shrinking percentage test method of low-shrinkage |
| CN109239125A (en) * | 2018-08-07 | 2019-01-18 | 东旭集团有限公司 | Percent thermal shrinkage measuring device and its base station, glass plate and percent thermal shrinkage measurement method |
-
2021
- 2021-05-28 CN CN202110593856.4A patent/CN113183214A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103454302A (en) * | 2013-09-18 | 2013-12-18 | 四川旭虹光电科技有限公司 | Method for measuring shrinkage factor of PDP (Plasma Display Panel) glass |
| KR101677664B1 (en) * | 2016-04-04 | 2016-11-29 | (주)디엠티 | Scribing stage for cutting LCD glass and one-stage LCD glass cutting system having the same |
| CN206725517U (en) * | 2017-04-06 | 2017-12-08 | 阳谷燎原化工有限公司 | A kind of thin-layer chromatography glass trial production board cutter |
| CN207313433U (en) * | 2017-09-27 | 2018-05-04 | 东旭集团有限公司 | Cutting equipment |
| CN108426913A (en) * | 2018-06-19 | 2018-08-21 | 四川旭虹光电科技有限公司 | A kind of test method of also retract rate |
| CN108675633A (en) * | 2018-07-24 | 2018-10-19 | 彩虹显示器件股份有限公司 | A kind of electronic glass and its shrinking percentage test method of low-shrinkage |
| CN109239125A (en) * | 2018-08-07 | 2019-01-18 | 东旭集团有限公司 | Percent thermal shrinkage measuring device and its base station, glass plate and percent thermal shrinkage measurement method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5173885B2 (en) | Scribing apparatus and scribing method | |
| KR102022907B1 (en) | Tube cutting device | |
| JP5450964B2 (en) | Scribing apparatus and scribing method | |
| US7596879B2 (en) | Gapping system for dual-blade trimmer | |
| US10068782B2 (en) | Device and method for scribing a bottom-side of a substrate while viewing the top side | |
| JP5702765B2 (en) | Scribing apparatus and scribing method | |
| TWI439433B (en) | Scribe device | |
| CN113183214A (en) | Cutting device and cutting method for detecting heat wire shrinkage rate of substrate glass | |
| CN218642633U (en) | Cutting device for substrate | |
| CA2494006C (en) | Method and device for calibrating the position of blades of a slitter-winder of a paper or board machine | |
| US3903767A (en) | Method and apparatus for cutting glass | |
| CN102921976B (en) | Floating boring cutter and using method thereof | |
| CN217752163U (en) | Frock is divided to crystal bar effective area before sapphire cuts | |
| JP2016186958A (en) | Dicing device and dicing method by dicing device | |
| JP2006000934A (en) | Cutter holder for sheet cutting machine, and cutter inclination correcting jig | |
| CN111452240B (en) | Directional viscose device of sapphire crystal bar | |
| CN105965709A (en) | Moveable device and machining device | |
| CN207317717U (en) | A kind of multifunction measuring set | |
| CN106808013A (en) | Device for cutting cylindrical component of machine | |
| JP2010054226A (en) | Device for forming notch in rubber specimen | |
| EP2985127B1 (en) | Tile cutter equipped with digital display scales | |
| CN211250918U (en) | Semiconductor cutting device | |
| CN103570233B (en) | Glass cutting knife box setting device | |
| KR101894546B1 (en) | Wheel Cutter Re-Grinding Jig and Wheel Cutter Re-Grinding Method Using The Same | |
| CN211304889U (en) | Correcting device for drill bit of deep hole boring machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210730 |
|
| RJ01 | Rejection of invention patent application after publication |