CN113180722A - Acoustic probe of electronic stethoscope - Google Patents

Acoustic probe of electronic stethoscope Download PDF

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Publication number
CN113180722A
CN113180722A CN202110423489.3A CN202110423489A CN113180722A CN 113180722 A CN113180722 A CN 113180722A CN 202110423489 A CN202110423489 A CN 202110423489A CN 113180722 A CN113180722 A CN 113180722A
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China
Prior art keywords
electrode
layer
bias voltage
ultrasonic transducer
bottom electrode
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Pending
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CN202110423489.3A
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Chinese (zh)
Inventor
吴国强
石磊
贾利成
刘崇斌
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Wuhan Memsonics Technologies Co Ltd
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Wuhan University WHU
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Priority to CN202110423489.3A priority Critical patent/CN113180722A/en
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B7/00Instruments for auscultation
    • A61B7/02Stethoscopes
    • A61B7/04Electric stethoscopes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B7/00Instruments for auscultation
    • A61B7/003Detecting lung or respiration noise
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/08Detecting organic movements or changes, e.g. tumours, cysts, swellings
    • A61B8/0883Detecting organic movements or changes, e.g. tumours, cysts, swellings for diagnosis of the heart
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Public Health (AREA)
  • Molecular Biology (AREA)
  • Veterinary Medicine (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Animal Behavior & Ethology (AREA)
  • Surgery (AREA)
  • Biophysics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Acoustics & Sound (AREA)
  • Pulmonology (AREA)
  • Cardiology (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)

Abstract

The invention relates to the technology of medical instruments, in particular to an acoustic probe of an electronic stethoscope, which comprises an ultrasonic transducer and a signal receiving circuit, wherein the ultrasonic transducer is connected with the signal receiving circuit; the ultrasonic transducer adopts a differential structure and comprises an inner electrode, an outer electrode and a bottom electrode; the signal receiving circuit comprises a signal input end, a ground end, a bias voltage end, a signal amplification module and a signal output end; the bias voltage is positioned between the positive power supply voltage value and the negative power supply voltage value of the signal amplification module; the connection mode comprises: the inner electrode is connected with the signal input end, the outer electrode is connected with the bias voltage end, the bottom electrode is suspended or the inner electrode is connected with the bias voltage end, the outer electrode is connected with the signal input end, the bottom electrode is suspended or the inner electrode is connected with the signal input end, the outer electrode is suspended, the bottom electrode is connected with the bias voltage end or the inner electrode is suspended, the outer electrode is connected with the signal input end, and the bottom electrode is connected with the bias voltage end. The probe realizes different connection modes of the ultrasonic transducer and the signal receiving circuit by using a differential structure, thereby improving the sensitivity and the resolution of the stethoscope probe.

Description

Acoustic probe of electronic stethoscope
Technical Field
The invention belongs to the technical field of medical instruments, and particularly relates to an acoustic probe of an electronic stethoscope.
Background
The stethoscope has been the most commonly used diagnostic tool for medical doctors both in the home and in the foreign world, and is the mark of the medical doctors. The diagnosis of the traditional acoustic stethoscope mainly depends on the abundant clinical experience of doctors, the quantitative analysis of big data cannot be realized, the influence of subjective factors is easily caused, and the reliability improvement of the heart sound auscultation is limited. In addition, the human ear has inherent limitation, and the low-frequency and weak-sound-intensity heart sound signals which play an important role in auscultation cannot be distinguished, so that the electronic stethoscope is produced at the same time. The electronic stethoscope amplifies heart sound signals by applying the operational amplifier and the filter in a hardware circuit, reduces the interference noise of the traditional stethoscope, and enables the heart and lung sound signals to be heard more clearly and clearly, so that auscultation diagnosis is more accurate, convenient and effective. However, the electronic stethoscope in the market at present has the disadvantages of high cost, poor frequency response, low sensitivity and easy interference.
Disclosure of Invention
In view of the problems in the background art, the invention provides an acoustic probe of an electronic stethoscope.
In order to solve the technical problems, the invention adopts the following technical scheme: an electronic stethoscope acoustic probe includes an ultrasonic transducer and a signal receiving circuit; the ultrasonic transducer adopts a differential structure and comprises an inner electrode, an outer electrode and a bottom electrode; the signal receiving circuit comprises a signal input end, a ground end, a bias voltage end, a signal amplification module and a signal output end; the bias voltage is positioned between the positive power supply voltage value and the negative power supply voltage value of the signal amplification module; the connection mode of the ultrasonic transducer and the signal receiving circuit comprises the following steps: the inner electrode is connected with the signal input end, the outer electrode is connected with the bias voltage end, the bottom electrode is suspended or the inner electrode is connected with the bias voltage end, the outer electrode is connected with the signal input end, the bottom electrode is suspended or the inner electrode is connected with the signal input end, the outer electrode is suspended, the bottom electrode is connected with the bias voltage end or the inner electrode is suspended, the outer electrode is connected with the signal input end, and the bottom electrode is connected with the bias voltage end.
In the acoustic probe of the electronic stethoscope, the ultrasonic transducer comprises a plurality of ultrasonic transducer arrays, each ultrasonic transducer array is formed by arranging a plurality of piezoelectric transducer units in a circular, rectangular or regular hexagonal shape, and the piezoelectric transducer units are arranged in a rectangular lattice or a honeycomb shape.
In the acoustic probe of the electronic stethoscope, the piezoelectric transducer unit consists of two parts, namely a substrate silicon wafer and a transducer structure layer, wherein the transducer structure layer is formed by stacking a silicon oxide layer, a silicon structure layer, a dielectric layer, a bottom electrode layer, a piezoelectric material layer, a top electrode layer and a top electrolyte layer from bottom to top in sequence.
In the acoustic probe of the electronic stethoscope, the silicon structure layer adopts monocrystalline silicon, polycrystalline silicon or amorphous silicon; the piezoelectric material layer is aluminum nitride (AlN), zinc oxide (ZnO) or lead zirconate titanate (PZT); the bottom electrode layer and the top electrode layer are made of gold Au, aluminum Al, molybdenum Mo, platinum Pt or chromium Cr; the top electrolyte layer is silicon oxide or silicon nitride.
In the acoustic probe of the electronic stethoscope, the inner electrode and the outer electrode are a pair of electrodes with opposite polarities; the inner electrode and the outer electrode are located on the top electrode layer or the bottom electrode layer.
In the above-mentioned acoustic probe for an electronic stethoscope, the electrodes of the same polarity of all the piezoelectric transducer units are connected to each other.
In the above-described electronic stethoscope acoustic probe, all the ultrasonic transducer arrays are connected in series with each other.
Compared with the prior art, the ultrasonic transducer provided by the invention has the inner electrode and the outer electrode with opposite polarities, and the differential structure of the ultrasonic transducer can reduce the overall noise of the transducer and increase the output signal. The sensitivity and the resolution of the electronic stethoscope can be improved by utilizing different connection modes of the ultrasonic transducer and the signal receiving circuit.
Drawings
FIG. 1 is a schematic diagram of an ultrasound transducer electrode arrangement in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram of a connection mode in which an inner electrode is connected to a signal input terminal, an outer electrode is connected to a bias voltage terminal, and a bottom electrode is suspended according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a connection mode of an inner electrode connected to a bias voltage terminal, an outer electrode connected to a signal input terminal, and a bottom electrode suspended in the air according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the connection mode of the inner electrode connected to the signal input terminal, the outer electrode suspended, and the bottom electrode connected to the bias voltage terminal according to one embodiment of the present invention;
FIG. 5 is a schematic diagram of the connection mode of the inner electrode being suspended, the outer electrode being connected to the signal input terminal, and the bottom electrode being connected to the bias voltage terminal according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of the top electrode layer with the inner and outer electrodes of the ultrasonic transducer;
FIG. 7 is a schematic cross-sectional view of the bottom electrode layer with the inner and outer electrodes of the ultrasonic transducer;
601-a first substrate silicon wafer with a cavity structure, 701-a second substrate silicon wafer with a cavity structure, 602-a first silicon oxide layer, 702-a second silicon oxide layer, 603-a first silicon structure layer, 703-a second silicon structure layer, 604-a first dielectric layer, 704-a second dielectric layer, 605-a first bottom electrode layer, 705-a second bottom electrode layer, 606-a first piezoelectric material layer, 706-a second piezoelectric material layer, 607-a first top electrolyte layer, 707-a second top electrolyte layer, 608-a top electrode layer of an external electrode, 609-a top electrode layer of an internal electrode, 708-a bottom electrode layer of an external electrode, and 709-a bottom electrode layer of an internal electrode.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the following embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention is further illustrated by the following examples, which are not to be construed as limiting the invention.
The embodiment provides an acoustic probe of an electronic stethoscope, the acoustic probe comprises an ultrasonic transducer and a signal receiving circuit, the ultrasonic transducer is provided with a differential structure, different connection modes of the ultrasonic transducer and the signal receiving circuit are realized by utilizing the differential structure, and the sensitivity and the resolution of the electronic stethoscope can be improved.
The acoustic probe of the electronic stethoscope is implemented by the following technical scheme that the acoustic probe of the electronic stethoscope is composed of an ultrasonic transducer and a signal receiving circuit, wherein the ultrasonic transducer is of a differential structure and comprises an inner electrode, an outer electrode and a bottom electrode, and the signal receiving circuit comprises a signal input end, a ground end, a bias voltage end, a signal amplification module and a signal output end, as shown in fig. 1 and fig. 2.
The connection mode of the ultrasonic transducer and the signal receiving circuit comprises the following steps: as shown in fig. 2, a) the inner electrode is connected with the signal input end, the outer electrode is connected with the bias voltage end, and the bottom electrode is suspended; as shown in fig. 3, b) the inner electrode is connected with a bias voltage end, the outer electrode is connected with a signal input end, and the bottom electrode is suspended; as shown in fig. 4, c) the inner electrode is suspended, the outer electrode is connected with the signal input end, and the bottom electrode is connected with the bias voltage end; as shown in fig. 5, c) the inner electrode is connected to the signal input terminal, the outer electrode is suspended, and the bottom electrode is connected to the bias voltage terminal.
And the ultrasonic transducer is composed of a plurality of ultrasonic transducer arrays, and the ultrasonic transducer array is composed of a plurality of piezoelectric transducer units according to a specific arrangement mode.
Also, the piezoelectric transducer cells may be circular, rectangular, or regular hexagonal. The piezoelectric transducer units may be arranged in a rectangular lattice or in a honeycomb arrangement.
And the piezoelectric transducer unit consists of a substrate silicon wafer and a transducer structure layer.
And the transducer structure layer is formed by stacking a silicon oxide layer, a silicon structure layer, a dielectric layer, a bottom electrode layer, a piezoelectric material layer, a top electrode layer and a top electrolyte layer from bottom to top in sequence. As shown in fig. 6 and 7.
The silicon structure layer can be monocrystalline silicon, polycrystalline silicon or amorphous silicon; the piezoelectric material layer may be aluminum nitride (AlN), zinc oxide (ZnO), or lead zirconate titanate (PZT); the bottom electrode and the top electrode layer can be made of gold (Au), aluminum (Al), molybdenum (Mo), platinum (Pt) and chromium (Cr); the top electrolyte layer may be silicon oxide or silicon nitride.
The inner electrode and the outer electrode are a pair of electrodes with opposite polarities.
The inner electrode and the outer electrode may be located on the top electrode layer or the bottom electrode layer.
As shown in fig. 6, the inner electrode and the outer electrode of the ultrasonic transducer are located in the cross-sectional structure of the top electrode layer: the first silicon substrate with a cavity structure 601, the first silicon oxide layer 602, the first silicon structure layer 603, the first dielectric layer 604, the first bottom electrode layer 605, the first piezoelectric material layer 606, the first top electrolyte layer 607, the top electrode layer 608 of the outer electrode, and the top electrode layer 609 of the inner electrode are arranged in sequence.
As shown in fig. 7, the inner electrode and the outer electrode of the ultrasonic transducer are located in the cross-sectional structure of the bottom electrode layer: the second silicon substrate with the cavity structure 701, the second silicon dioxide layer 702, the second silicon structure layer 703, the second dielectric layer 704, the second bottom electrode layer 705, the second piezoelectric material layer 706, the second top electrolyte layer 707, the bottom electrode layer 708 of the external electrode, and the bottom electrode layer 709 of the internal electrode are arranged in sequence.
And, the electrodes of the same polarity of all the piezoelectric transducer units constituting the ultrasonic transducer array are connected with each other, i.e., all the piezoelectric transducer units are electrically connected in parallel with each other.
Also, the ultrasound transducer may be composed of several ultrasound transducer arrays; the transducer arrays that make up the transducer are electrically connected in series with each other.
And when any one port of a bias voltage end and a ground end of the signal receiving circuit is connected with any one electrode of an inner electrode, an outer electrode and a bottom electrode of the ultrasonic transducer, the other port is in a suspended state.
The working principle of the embodiment is as follows: the piezoelectric film of the ultrasonic transducer deforms under the action of the sound pressure of an external acoustic signal, corresponding charges are generated under the positive piezoelectric effect, accordingly, the sound energy is converted into electric energy, the ultrasonic transducer outputs an electrical signal, and the electrical signal is amplified and filtered through a signal receiving circuit.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.

Claims (7)

1. An acoustic probe of an electronic stethoscope is characterized by comprising an ultrasonic transducer and a signal receiving circuit; the ultrasonic transducer adopts a differential structure and comprises an inner electrode, an outer electrode and a bottom electrode; the signal receiving circuit comprises a signal input end, a ground end, a bias voltage end, a signal amplification module and a signal output end; the bias voltage is positioned between the positive power supply voltage value and the negative power supply voltage value of the signal amplification module; the connection mode of the ultrasonic transducer and the signal receiving circuit comprises the following steps: the inner electrode is connected with the signal input end, the outer electrode is connected with the bias voltage end, the bottom electrode is suspended or the inner electrode is connected with the bias voltage end, the outer electrode is connected with the signal input end, the bottom electrode is suspended or the inner electrode is connected with the signal input end, the outer electrode is suspended, the bottom electrode is connected with the bias voltage end or the inner electrode is suspended, the outer electrode is connected with the signal input end, and the bottom electrode is connected with the bias voltage end.
2. The acoustic probe of the electronic stethoscope according to claim 1, wherein the ultrasonic transducer comprises a plurality of ultrasonic transducer arrays, each ultrasonic transducer array is formed by arranging a plurality of piezoelectric transducer units, each piezoelectric transducer unit is circular, rectangular or regular hexagonal, and the piezoelectric transducer units are arranged in a rectangular lattice manner or a honeycomb manner.
3. The electronic stethoscope acoustic probe of claim 2, wherein the piezoelectric transducer unit is composed of a substrate silicon wafer and a transducer structure layer, and the transducer structure layer is composed of a silicon oxide layer, a silicon structure layer, a dielectric layer, a bottom electrode layer, a piezoelectric material layer, a top electrode layer and a top electrolyte layer which are stacked in sequence from bottom to top.
4. The electronic stethoscope acoustic probe of claim 3, wherein said silicon structure layer is single crystal silicon, polycrystalline silicon or amorphous silicon; the piezoelectric material layer is aluminum nitride (AlN), zinc oxide (ZnO) or lead zirconate titanate (PZT); the bottom electrode layer and the top electrode layer are made of gold Au, aluminum Al, molybdenum Mo, platinum Pt or chromium Cr; the top electrolyte layer is silicon oxide or silicon nitride.
5. The electronic stethoscope acoustic probe of claim 3, wherein said inner and outer electrodes are a pair of electrodes of opposite polarity; the inner electrode and the outer electrode are located on the top electrode layer or the bottom electrode layer.
6. The electronic stethoscope acoustic probe of claim 2, wherein said like polarity electrodes of all of said piezoelectric transducer elements are interconnected.
7. The electronic stethoscope acoustic probe of claim 2, wherein all of the ultrasonic transducer arrays are connected in series with one another.
CN202110423489.3A 2021-04-20 2021-04-20 Acoustic probe of electronic stethoscope Pending CN113180722A (en)

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CN109746177A (en) * 2019-03-12 2019-05-14 重庆大学 Piezoelectric ultrasonic transducer and its working method
CN111182429A (en) * 2020-01-03 2020-05-19 武汉大学 High fill rate MEMS transducer
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CN201403197Y (en) * 2009-03-31 2010-02-10 比亚迪股份有限公司 Capacitance-type microphone
CN102768093A (en) * 2011-05-04 2012-11-07 Nxp股份有限公司 MEMS capacitive pressure sensor, operating method and manufacturing method
US20140352440A1 (en) * 2013-06-03 2014-12-04 Qualcomm Mems Technologies, Inc. Ultrasonic sensor with bonded piezoelectric layer
CN111479179A (en) * 2013-11-06 2020-07-31 英飞凌科技股份有限公司 Micro-electro-mechanical system
WO2016054448A1 (en) * 2014-10-02 2016-04-07 Chirp Microsystems Piezoelectric micromachined ultrasonic transducers having differential transmit and receive circuitry
CN105232080A (en) * 2015-09-17 2016-01-13 中北大学 Visual electronic stethoscope based on MEMS (micro-electro-mechanical system) acoustic sensor
CN109746177A (en) * 2019-03-12 2019-05-14 重庆大学 Piezoelectric ultrasonic transducer and its working method
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US20200413202A1 (en) * 2019-06-27 2020-12-31 Qualcomm Incorporated Ultrasonic sensor array
CN112291694A (en) * 2019-07-25 2021-01-29 英飞凌科技股份有限公司 MEMS transducer and method for operating the same
CN111182429A (en) * 2020-01-03 2020-05-19 武汉大学 High fill rate MEMS transducer

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