CN113179591B - Capacitive membrane material, manufacturing method thereof and capacitive screen - Google Patents
Capacitive membrane material, manufacturing method thereof and capacitive screen Download PDFInfo
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- CN113179591B CN113179591B CN202110474741.3A CN202110474741A CN113179591B CN 113179591 B CN113179591 B CN 113179591B CN 202110474741 A CN202110474741 A CN 202110474741A CN 113179591 B CN113179591 B CN 113179591B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/13—Energy storage using capacitors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a capacitive membrane material, a manufacturing method thereof and a capacitive screen. The method comprises the following steps: exposing the copper-plated surface of the copper film to form an emission circuit pattern on the copper-plated surface of the copper film; attaching flexible OCA optical adhesive to the copper plating surface of the treated copper film, and coating nano silver on the other surface of the copper film to form a nano silver conductive film; and carrying out laser engraving treatment on the nano silver conductive film to form a receiving circuit pattern on the nano silver conductive film, and attaching an inflexible OCA optical adhesive on the nano silver conductive film to obtain the capacitor film material. According to the invention, the transmitting circuit pattern and the receiving circuit pattern are formed on the single-layer copper film, so that the copper film is provided with the transmitting circuit and the receiving circuit at the same time, the original double-layer film circuit structure is replaced, the production efficiency is improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of capacitance film materials, in particular to a capacitance film material, a manufacturing method thereof and a capacitance screen.
Background
At present, the conducting layer structure of the large-size capacitive screen market is generally double-layer, and a layer of transmitting circuit (transmitting signals) is transversely arranged; and a layer of receiving circuit (receiving signal) is longitudinally arranged, so that mutual induction is formed into a capacitive screen. However, because the large size is limited by the number of channels and the processing precision, the sensing area of each layer of circuit cannot be made very small, so that the horizontal and vertical line writing effect of the actual large-size capacitive screen can be smoother, but the oblique line writing effect of oblique lines, especially 45 degrees, is more jittery. The major Film materials in the market of the large-size capacitive screen at present are GFF (Glass Film) and GG (Glass), the GFF structure adopts a structure of a piece of toughened Glass and two pieces of Film materials to form a capacitive screen assembly, the two pieces of Film materials are transmitting circuit Film materials, the one piece of Film materials are receiving circuit Film materials, and the two pieces of Film materials cannot be on the same plane. The GG structure adopts two pieces of toughened glass, one piece of toughened glass is used as protection, one surface of the other piece of toughened glass is used as a transmitting circuit, the other surface of the other piece of toughened glass is used as a receiving circuit, and the transmitting circuit and the receiving circuit are not on the same plane. However, the capacitive screen with the GG structure has a large weight, and if the capacitive screen with a large size needs to be manufactured, the weight of the whole capacitive screen is increased, so that a plurality of adverse factors are generated. The capacitor screen with the GFF structure has lighter weight and lighter weight, and can be used for manufacturing capacitor screens with larger sizes, but the GFF structure is arranged between toughened glass and the transmitting circuit film material, and the transmitting circuit film material and the receiving circuit film material are required to be attached with OCA optical cement (Optically Clear Adhesive optical cement) so as to be attached between the toughened glass and the two film materials. Therefore, when a layer of transmitting circuit film materials with different angles and a layer of receiving circuit film materials with different angles are required to be added on the original GFF structure, more processes are required to be carried out again for obtaining, and the cost is increased.
Disclosure of Invention
The embodiment of the invention provides a capacitive membrane material, a manufacturing method thereof and a capacitive screen, and aims to solve the problems of complex manufacturing process and high cost of a double-layer membrane structure circuit in the prior art.
The embodiment of the invention provides a manufacturing method of a capacitor film material, which comprises the following steps:
exposing the copper-plated surface of the copper film to form an emission circuit pattern on the copper-plated surface of the copper film;
attaching flexible OCA optical adhesive to the copper plating surface of the treated copper film, and coating nano silver on the other surface of the copper film to form a nano silver conductive film;
and carrying out laser engraving treatment on the nano silver conductive film to form a receiving circuit pattern on the nano silver conductive film, and attaching an inflexible OCA optical adhesive on the nano silver conductive film to obtain the capacitor film material.
The embodiment of the invention also provides a capacitor film material, which is manufactured by adopting the manufacturing method of the capacitor film material.
The embodiment of the invention also provides a manufacturing method of the capacitive membrane material with the double-layer membrane structure, which comprises the following steps:
and bonding the two capacitance film materials together to obtain the capacitance film material with the double-layer film structure.
The embodiment of the invention also provides a capacitive membrane material with a double-layer membrane structure, which is manufactured by adopting the manufacturing method of the capacitive membrane material with the double-layer membrane structure.
The embodiment of the invention also provides a capacitive screen, which comprises at least one layer of the capacitive film material and toughened glass attached to the capacitive film material.
The embodiment of the invention provides a capacitive membrane material, a manufacturing method thereof and a capacitive screen. The method comprises the following steps: exposing the copper-plated surface of the copper film to form an emission circuit pattern on the copper-plated surface of the copper film; attaching flexible OCA optical adhesive to the copper plating surface of the treated copper film, and coating nano silver on the other surface of the copper film to form a nano silver conductive film; and carrying out laser engraving treatment on the nano silver conductive film to form a receiving circuit pattern on the nano silver conductive film, and attaching an inflexible OCA optical adhesive on the nano silver conductive film to obtain the capacitor film material. According to the embodiment of the invention, the transmitting circuit pattern and the receiving circuit pattern are formed on the single-layer copper film, so that the copper film is provided with the transmitting circuit and the receiving circuit at the same time, the original double-layer film circuit structure is replaced, the production efficiency is improved, and the production cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic flow chart of a method for manufacturing a capacitive membrane material according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a manufacturing process of a manufacturing method of a capacitive membrane material according to an embodiment of the present invention;
FIG. 3 shows an angle of a transmitting circuit pattern and a receiving circuit pattern of a capacitive film material according to an embodiment of the present invention;
FIG. 4 is a schematic view of another angle of a transmitting circuit pattern and a receiving circuit pattern of a capacitive film according to an embodiment of the present invention;
FIG. 5 is a schematic view of another angle of a transmitting circuit pattern and a receiving circuit pattern of a capacitive film according to an embodiment of the present invention;
FIG. 6 is a schematic view of another angle of a transmitting circuit pattern and a receiving circuit pattern of a capacitive film according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a manufacturing process of a capacitive screen according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1, fig. 1 is a flow chart of a method for manufacturing a capacitor film according to an embodiment of the invention, and the method includes steps S101 to S103.
S101, exposing a copper-plated surface of a copper film to form an emission circuit pattern on the copper-plated surface of the copper film;
s102, attaching flexible OCA optical cement to the treated copper plating surface of the copper film, and coating nano silver on the other surface of the copper film to form a nano silver conductive film;
and S103, performing laser engraving treatment on the nano silver conductive film to form a receiving circuit pattern on the nano silver conductive film, and attaching an inflexible OCA optical adhesive on the nano silver conductive film to obtain a capacitance film material.
In this embodiment, the copper film is first exposed to light to form a transmitting circuit pattern on the copper-plated surface of the copper film, then a nano silver conductive film is formed by coating nano silver on the other surface of the copper film, and a receiving circuit pattern is formed by laser engraving, so that a circuit is formed by simultaneously forming the transmitting circuit pattern and the receiving circuit pattern on one copper film. After the copper plating surface of the copper film forms the emission circuit pattern, the non-copper plating surface of the copper film can be coated with nano silver to form a nano silver conductive film, or can be coated with ITO to form an ITO film (ITO film is indium tin oxide semiconductor transparent conductive film), or can be coated with other transparent conductive materials, and then laser engraving is carried out to form the receiving circuit pattern. Coating is to coat pasty polymer, molten polymer or polymer melt on paper, cloth or plastic film to obtain composite material (film). Because the nano silver has the characteristics of easy processing and low cost, the embodiment adopts the nano silver conductive film formed by coating the nano silver as a receiving circuit. The copper film is used as a transmitting circuit, the nano silver conductive film is used as a receiving circuit, so that energy loss in the signal transmitting process is effectively reduced, the transmitting frequency power is increased, and the smoothness is improved. And the transmitting circuit and the receiving circuit are formed on one film, compared with the method that a plurality of films are laminated to form the transmitting circuit and the receiving circuit in the prior art, the method reduces the multiple lamination process, avoids lamination errors in the lamination process, and improves the production efficiency.
The OCA optical adhesive has the characteristics of no color, transparency, light transmittance of more than 90%, good cementing strength, capability of being cured at room temperature or medium temperature, small curing shrinkage and the like. Compared with the inflexible OCA optical adhesive, the flexible OCA optical adhesive has certain slight fluidity, can fill the tiny gaps by self weight, and can prevent copper from oxidative discoloration, and the inflexible OCA optical adhesive has lower performance.
As shown in fig. 2, the copper-plated surface 11 of the copper film 1 is exposed to light to form an emission circuit pattern 12, then a flexible OCA optical adhesive 2 is attached to the emission circuit pattern 12, then a nano silver conductive film 3 is coated on the other surface of the copper film 1, the nano silver conductive film 3 is subjected to laser engraving treatment to obtain a receiving circuit pattern 31, and finally a non-flexible OCA optical adhesive 4 is attached to the receiving circuit pattern 31, thereby obtaining the capacitive film material.
In one embodiment, the step S101 includes:
carrying out single-sided copper plating treatment on the PET film to obtain a copper film;
and exposing the copper-plated surface of the copper film by using an exposure mold with a specified angle emission circuit pattern, so that the copper-plated surface of the copper film has the emission circuit pattern.
In this embodiment, copper is first plated on a PET film to obtain a copper film, and then the copper film is subjected to an exposure process treatment by using an exposure mold having a specified angle emission circuit pattern, to obtain a copper film having a specified angle emission circuit pattern. And when the exposure process is carried out, presetting the angle of the emission circuit pattern to be obtained, and then obtaining an exposure mold with a corresponding angle to expose the copper film, so as to obtain the emission circuit pattern with the corresponding angle. Because copper has a low resistance and the signal of the transmitting circuit changes rapidly, the adoption of a copper film with a low resistance can have better signal strength.
In one embodiment, the performing a laser engraving process on the nano silver conductive film to form a receiving circuit pattern on the nano silver conductive film includes:
and carrying out laser engraving treatment on the nano silver conductive film by using a laser engraving die with a specified angle for receiving the circuit pattern, so that the receiving circuit pattern is formed on the nano silver conductive film.
In this embodiment, after the emission circuit pattern is displayed on the copper-plated surface of the copper film, the receiving circuit pattern is obtained by performing laser engraving on the coated nano silver conductive film, and the receiving circuit pattern with the specified angle is obtained by performing engraving on the nano silver conductive film by using a laser engraving die with the specified angle receiving circuit pattern. And acquiring the angle of the receiving circuit pattern according to the angle of the transmitting circuit pattern, thereby acquiring the laser engraving die with the corresponding angle.
In an embodiment, the transmitting circuit pattern and the receiving circuit pattern are perpendicular to each other. In this embodiment, the angle of the transmitting circuit pattern and the angle of the receiving circuit pattern are perpendicular to each other. And when the copper film is subjected to an exposure process, the angle of the transmitting circuit pattern is obtained in advance, so that a receiving circuit pattern with a corresponding angle is obtained, and a corresponding exposure mold and a laser engraving mold are selected to process the copper film.
In a specific application scenario, as shown in fig. 3, the transmitting circuit pattern may be a lateral transmitting circuit pattern 121, and the receiving circuit pattern may be a longitudinal receiving circuit pattern 311; as shown in fig. 4, the transmitting circuit pattern may also be a-45 degree transmitting circuit pattern 122, and the receiving circuit pattern may also be a +45 degree receiving circuit pattern 312; as shown in fig. 5, the transmitting circuit pattern may also be a-60 degree transmitting circuit pattern 123 and the receiving circuit pattern may also be a +30 degree receiving circuit pattern 313; as shown in fig. 6, the transmitting circuit pattern may also be a-50 degree transmitting circuit pattern 124 and the receiving circuit pattern may also be a +40 degree receiving circuit pattern 314; in the application scene, the optimal angle of the transmitting circuit pattern in the capacitive film material is-45 degrees, and the optimal angle of the receiving circuit pattern is +45 degrees.
The embodiment of the invention also provides a capacitor film material, which is manufactured by adopting the manufacturing method of the capacitor film material.
In one embodiment, the copper film is a low resistance copper film. In this embodiment, since the signal of the transmitting circuit changes rapidly, a low-resistance copper film is used to reduce the current loss during the signal change, so that the transmitting circuit has higher signal strength.
The embodiment of the invention also provides a manufacturing method of the capacitive membrane material with the double-layer membrane structure, which comprises the following steps:
and bonding the two capacitance film materials together to obtain the capacitance film material with the double-layer film structure.
In this embodiment, two capacitance film materials are bonded together, specifically, the non-flexible OCA optical adhesive of the first capacitance film material and the flexible OCA optical adhesive of the second capacitance film material are bonded in a vacuum adsorption bonding mode, so as to obtain the capacitance film material with a double-layer film structure.
In one embodiment, the emission circuit pattern of one capacitive film is at a 45 degree angle to the emission circuit pattern of the other Zhang Dianrong film. In this embodiment, the emission circuit patterns of the two attached capacitive film materials form an included angle of 45 degrees, and in an application scene, the emission circuit patterns of the two attached capacitive film materials may be other angles, which only needs to satisfy that the angles of the emission circuit patterns of the two attached capacitive film materials are different.
The embodiment of the invention also provides a capacitive membrane material with a double-layer membrane structure, which is manufactured according to the manufacturing method of the capacitive membrane material with the double-layer membrane structure.
As shown in fig. 3, the embodiment of the invention further provides a capacitive screen, which comprises at least one layer of the capacitive film material and tempered glass 5 attached to the capacitive film material.
The toughened glass 5 is attached to the flexible OCA optical adhesive 2 of the capacitive membrane material to form a capacitive screen with a single-layer membrane structure. The capacitive screen can also be of a double-layer film structure, two capacitive film materials are laminated firstly, and then the laminated capacitive film materials of the double-layer film structure are laminated on toughened glass, and the specific lamination steps are as follows: and bonding the inflexible OCA optical adhesive of one capacitive film material with the flexible OCA optical adhesive of the other Zhang Dianrong film material, and bonding tempered glass on the flexible OCA optical adhesive of the first capacitive film material. The capacitive screen with the double-layer film structure is provided with the two transmitting circuits and the two receiving circuits, compared with the original capacitive screen with the double-layer film structure with only one transmitting circuit and receiving circuit, the capacitive screen with the double-layer film structure with the two transmitting circuits and the two receiving circuits has better smoothness, and the displayed lines are more real and fine.
According to the capacitive screen provided in this embodiment, line smoothness measurement is performed on the capacitive screen, and the measurement results are shown in table 1 below. As can be seen from table 1, in the line smoothness measurement of the conventional capacitive screen, the values around the line oblique lines are all above 180db (db is a signal value unit), so that when the capacitive screen senses an external conductive object, the external conductive object is closer to the sensing block sensor on the conductive film of the capacitive screen. When the smoothness of the capacitive screen is calculated by using a touch algorithm, the measured data show that the lines of the capacitive screen shake, and the problem of low induction sensitivity of the conventional capacitive screen is also solved because the lines are required to be closer to the induction block sensor. The capacitive screen in this embodiment is made of the foregoing capacitive film material bonded with tempered glass, and line smoothness measurement is performed on the capacitive screen in this embodiment, as can be obtained from the data in table 2, the values around the line diagonal of the capacitive screen made of the foregoing capacitive film material are greatly reduced compared with the existing capacitive screen, so that the capacitive screen in this embodiment has higher sensitivity, and since the values around the line diagonal are reduced, the capacitive screen in this embodiment has fine line display.
TABLE 1
TABLE 2
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (4)
1. The manufacturing method of the capacitive membrane material with the double-layer membrane structure is characterized by comprising the following steps of:
exposing the copper-plated surface of the copper film to form an emission circuit pattern on the copper-plated surface of the copper film;
attaching flexible OCA optical adhesive to the copper plating surface of the treated copper film, and coating nano silver on the other surface of the copper film to form a nano silver conductive film;
performing laser engraving treatment on the nano silver conductive film to form a receiving circuit pattern on the nano silver conductive film, and attaching inflexible OCA optical cement on the nano silver conductive film to obtain a capacitance film material;
the exposure treatment is performed on the copper-plated surface of the copper film to form an emission circuit pattern on the copper-plated surface of the copper film, including:
carrying out single-sided copper plating treatment on the PET film to obtain a copper film;
exposing the copper-plated surface of the copper film by using an exposure mold with a specified angle emission circuit pattern to enable the copper-plated surface of the copper film to have the emission circuit pattern;
the laser engraving treatment is performed on the nano silver conductive film to form a receiving circuit pattern on the nano silver conductive film, and the laser engraving treatment comprises the following steps:
performing laser engraving treatment on the nano silver conductive film by using a laser engraving die with a specified angle for receiving the circuit pattern, so that the receiving circuit pattern is formed on the nano silver conductive film;
the transmitting circuit pattern and the receiving circuit pattern are mutually perpendicular, wherein the angle of the transmitting circuit pattern in the capacitance film material is-45 degrees, and the angle of the receiving circuit pattern is +45 degrees;
bonding the two manufactured capacitor film materials together to obtain the capacitor film material with the double-layer film structure;
the emitting circuit pattern of one capacitor film material and the emitting circuit pattern of the other Zhang Dianrong film material form an included angle of 45 degrees.
2. A capacitive membrane material with a double-layer membrane structure, which is characterized by being manufactured by the manufacturing method of the capacitive membrane material as claimed in claim 1.
3. The capacitive film material of claim 2, wherein the copper film is a low-resistance copper film.
4. A capacitive screen, characterized in that the capacitive screen comprises the capacitive film material according to claim 2 or 3 and tempered glass attached to the capacitive film material.
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| CN107433817A (en) * | 2016-05-27 | 2017-12-05 | 苏州苏大维格光电科技股份有限公司 | A kind of decorating film and ambetti |
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| US9372579B2 (en) * | 2009-10-27 | 2016-06-21 | Atmel Corporation | Touchscreen electrode arrangement |
| CN103279250A (en) * | 2013-06-18 | 2013-09-04 | 格林精密部件（惠州）有限公司 | Capacity touch panel employing copper-plated conductive substrate |
| KR101496256B1 (en) * | 2013-07-05 | 2015-02-26 | (주)티메이 | Touch Panel and Method for Making the Same |
| CN109213373A (en) * | 2018-08-21 | 2019-01-15 | 意力(广州)电子科技有限公司 | A kind of transducer production method and its sensor applied to display equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107433817A (en) * | 2016-05-27 | 2017-12-05 | 苏州苏大维格光电科技股份有限公司 | A kind of decorating film and ambetti |
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