CN113174589A

CN113174589A - Modular rotary space atomic layer deposition system

Info

Publication number: CN113174589A
Application number: CN202110550084.6A
Authority: CN
Inventors: 张雨晴
Original assignee: Beijing State Rui Instrument Technology Co ltd
Current assignee: Beijing State Rui Instrument Technology Co ltd
Priority date: 2021-05-20
Filing date: 2021-05-20
Publication date: 2021-07-27

Abstract

The invention relates to the technical field of space atomic layer deposition, and provides a modular rotary space atomic layer deposition system, which comprises: the first shell is of an annular structure formed by combining a plurality of identical detachably connected unit cavities, and a plurality of partitions are arranged in each unit cavity at intervals to divide the unit cavity into a plurality of functional area cavities; the multi-section transmission guide rail is provided with a plurality of trays for placing wafers, the trays correspond to the unit chambers one by one, each section of transmission guide rail is arranged in each unit chamber in the first shell, and when the unit chambers are combined into the first shell, the multi-section transmission guide rail forms a closed loop so that the trays can circularly move in the unit chambers; through setting up first casing and circularizing the structure, have the space compactness, this system can place system's accessory at annular central authorities, does benefit to and produces the line overall arrangement.

Description

Modular rotary space atomic layer deposition system

Technical Field

The invention relates to the technical field of space atomic layer deposition, in particular to a modular rotary space atomic layer deposition system.

Background

The Atomic Layer Deposition (ALD) technique is a chemical vapor deposition technique based on sequential, surface self-saturation reactions. Compared with the traditional Chemical Vapor Deposition (CVD) technology, ALD has the advantages of compact film layer, high uniformity, high step coverage rate and the like, and is widely concerned in the fields of display, semiconductors, microelectronics, energy sources and the like. With the development of ALD technology adapted to different fields of application, it gradually moves from the basic research stage to the practical application stage. The atomic layer deposition cycle (reaction cycle) consists of A, B two half-reactions (half cycles), one cycle being performed in four steps: 1) the precursor A enters a reaction chamber in a pulse mode, and adsorption reaction is carried out on the surface of the substrate; 2) purging redundant precursor A and reaction byproducts by inert gas; 3) the precursor B enters a reaction chamber in a pulse mode, and adsorption reaction is carried out on the surface of the substrate after the reaction in the step 1; 4) and purging redundant precursor B and reaction byproducts by inert gas, and then sequentially circulating to realize the deposition process of growing the film on the surface of the substrate layer by layer. However, since each deposition of ALD can only realize the growth of a self-limiting monoatomic layer, the deposition rate of a thin film is very slow, so that the ALD is mostly applied to the field of high-end semiconductor chip manufacturing processes at present.

Spatial ALD (SALD) is a new ALD technique that has emerged to increase deposition rates. In contrast to conventional ALD, which performs reaction cycles in a temporal sequence, SALD performs reaction cycles in a spatial position sequence, and different precursors are continuously introduced at different positions isolated from each other, so that A, B two half-reactions are continuously and alternately performed at different positions of the reaction chamber. The deposition time for a SALD depends on the time required for the substrate to pass through the different reaction sites, which is much less than the cumulative time required to complete a conventional ALD reaction cycle. This time-space approach can greatly increase the deposition rate, which is the preferred solution for most industrial applications.

In the field of SALD, there are a number of manufacturers that have developed corresponding industrial grade products, such as roll-to-roll WCS-600SALD equipment from Beneq, finland, which can perform continuous deposition of up to 10 m/s for a film web (e.g., PET). For sheets (e.g., wafers, glass substrates, etc.), the SALD apparatus is largely divided into three types: linear, single-chip rotation, multi-chip rotation. The linear SALD device is currently used in the process flow of PERC solar cells, and a representative product is the HY4000 system of Jiangsu micro-conductance, which has a nominal wafer throughput of 4000 wafers/hour (under 10nm of deposited alumina).

Another more common rotary SALD is multi-plate rotary, and the construction of such devices is described in detail in several patents each of which is published by american applied materials, willingness to japan, tai power station, etc. For example, U.S. applied materials corporation in chinese patent application CN104054158A proposes a processing chamber consisting of a plurality of gas distribution assemblies, which is equipped with a rotating track capable of carrying a substrate carrier for the substrate to be rotationally moved between the different gas distribution assemblies for spatial atomic layer deposition. For another example, in chinese patent CN106887398B, a semiconductor manufacturing apparatus is disclosed, which comprises a process chamber, a wafer stage, a conveying mechanism for conveying different reaction zones of different chemical substances, and a gas edge mechanism for isolating the different reaction zones. A plurality of semiconductor wafers are fixed on the wafer seat through the vacuum chuck, and when the wafer seat integrally rotates, the wafers rotate among different reaction areas, so that space atomic layer deposition is realized.

Although linear, single-wafer-rotation, multi-wafer-rotation SALDs can greatly increase deposition rate to meet mass production requirements, they have respective problems, such as: the long and narrow layout of the linear equipment occupies large area and is not beneficial to the layout of a production line; the single chip selection equipment has low efficiency and cannot process a plurality of wafer substrates simultaneously; the structure of the multi-piece rotating equipment is complex, the integrated design results in high maintenance cost, the off-line time of the equipment is uncontrollable, and the integrated structural design has poor expansibility and is not beneficial to upgrading and reconstructing the equipment.

Therefore, it is necessary to develop a modular rotary spatial atomic layer deposition system for solving at least one of the above technical problems.

Disclosure of Invention

The invention aims to provide a modular rotary space atomic layer deposition system, and the design of a segmented modular unit chamber is convenient for equipment maintenance, improves the online production time of the equipment and is beneficial to production line layout.

The above object of the present invention can be achieved by the following technical solutions:

the invention provides a modular rotary space atomic layer deposition system, which comprises:

the first shell is of an annular structure formed by combining a plurality of identical detachably connected unit cavities, and a plurality of partitions are arranged in each unit cavity at intervals to divide the unit cavity into a plurality of functional area cavities;

the multi-section transmission guide rail is provided with a plurality of trays for placing wafers, the trays correspond to the unit cavities one by one, the multi-section transmission guide rail is respectively arranged in the unit cavities in the first shell, and when the unit cavities are combined into the first shell, the multi-section transmission guide rail forms a closed loop so that the trays can circularly move in the unit cavities;

the second shell is communicated with one of the unit chambers, and a carrying mechanical arm for placing the wafer on the tray is arranged in the second shell;

and the gas inlet pipeline is respectively communicated with the plurality of unit cavities and is used for feeding corresponding gas into at least part of the functional area cavities.

In some embodiments of the present invention, the transmission guide rail includes a guide rail body and a connecting member, a lower end of the connecting member is slidably disposed in the guide rail body, an upper end of the connecting member is connected to the tray, and the connecting member is provided with a gear interface;

the gear disc is arranged on a motor shaft of the driving motor and meshed with the gear interface.

In some embodiments of the present invention, a plurality of steel balls are connected between the connecting member and the guide rail body in a rolling manner.

In some embodiments of the present invention, the plurality of functional region chambers are sequentially a first reactive gas chamber, a first vacuum chamber, a first inert gas chamber, a second reactive gas chamber, a second vacuum chamber, and a second inert gas chamber.

In some embodiments of the present invention, the second housing includes a storage chamber for storing the wafer, a handling chamber for placing the handling robot, and an operation chamber communicating with the inner chamber of the first housing, and the handling chamber is located between the storage chamber and the operation chamber.

In some embodiments of the invention, the handling chamber, the storage chamber and the handling chamber are detachably connected.

In some embodiments of the invention, a first vacuum pumping cavity for placing an electric control cabinet is arranged below the storage cavity, and a second vacuum pumping cavity for placing a driving motor is arranged below the operation cavity.

In some embodiments of the present invention, a lifting rod is disposed in the operation chamber, and the lifting rod is configured to pass through the tray to drive the wafer to move upward.

In some embodiments of the present invention, the first housing includes an upper cover, a bottom plate and two spaced-apart outer wall layers, the upper cover is disposed above the two outer wall layers, and the bottom plate is disposed below the two outer wall layers.

In some embodiments of the present invention, the upper cover is provided with a plurality of strip-shaped air inlets at intervals, the bottom plate is provided with a plurality of vacuum pumping ports communicated with the unit chambers, and the air inlet duct is communicated with the plurality of functional region chambers through the plurality of strip-shaped air inlets.

The modular rotary space atomic layer deposition system has the characteristics and advantages that:

through setting up first casing and circularizing the structure, have the space compactness, this system can place system's accessory (such as vacuum system, gas distribution system, electric control system etc.) at annular central authorities, does benefit to and produces the line overall arrangement.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic view of a deposition system according to an embodiment of the invention;

FIG. 2 is a front view of a deposition system according to an embodiment of the invention;

FIG. 3 is a schematic view of a second housing according to an embodiment of the invention;

FIG. 4 is a schematic view of a drive rail according to an embodiment of the present invention;

FIG. 5 is a cross-sectional view of a first housing according to an embodiment of the invention;

FIG. 6 is a cross-sectional view of a cell chamber according to an embodiment of the present invention;

FIG. 7 is a schematic view of a unit chamber according to an embodiment of the present invention;

FIG. 8 is a schematic view of a drive motor according to an embodiment of the present invention;

fig. 9 is a schematic view of a tray according to an embodiment of the present invention.

The reference numbers illustrate:

1. a first housing; 11. a unit chamber; 111. a first reaction gas chamber; 112. a first vacuum chamber; 113. a first inert gas chamber; 114. a second reaction gas chamber; 115. a second vacuum chamber; 116. a second inert gas chamber; 117. separating; 12. an interlayer; 13. an upper cover; 131. an air inlet; 14. a base plate; 141. a vacuum pumping port; 15. an outer wall layer;

2. a drive rail; 21. a tray; 22. a guide rail body; 23. a connecting member; 231. a gear interface; 24. steel balls;

3. a second housing; 31. carrying the mechanical arm; 32. a storage chamber; 33. a carrying chamber; 34. an operating chamber; 35. a first vacuum pumping cavity; 36. a second vacuum pumping cavity; 37. a lifting rod;

4. gas enters the pipeline;

5. a drive motor; 51. a gear disc.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

as shown in fig. 1 to 9, the present invention provides a modular spin-on spatial atomic layer deposition system, comprising: the first shell 1 is an annular structure formed by combining a plurality of identical detachably connected unit cavities 11, and a plurality of partitions 117 are arranged in each unit cavity 11 at intervals to divide the unit cavity 11 into a plurality of functional area cavities; therefore, each first shell 1 is arranged in a modularized way, is convenient to maintain and replace,

the wafer cleaning device comprises a multi-section transmission guide rail 2, wherein a plurality of trays 21 used for placing wafers are arranged on the multi-section transmission guide rail 2, the plurality of trays 21 correspond to the plurality of unit cavities 11 in a one-to-one correspondence mode, the multi-section transmission guide rail 2 is respectively arranged in the plurality of unit cavities 11 in the first shell 1, and when the unit cavities 11 are combined into the first shell 1, the multi-section transmission guide rail 2 forms a closed loop so that the plurality of trays 21 can move in a circulating mode in the plurality of unit cavities 11;

a second housing 3, wherein the second housing 3 is communicated with one of the unit chambers 11, and a carrying mechanical arm 31 for placing the wafer on the tray 21 is arranged in the second housing 3; and the gas inlet pipeline 4 is respectively communicated with the plurality of unit cavities 11, and the gas inlet pipeline 4 is used for feeding corresponding gas into at least part of the functional area cavities.

According to the modular rotary space atomic layer deposition system provided by the embodiment of the invention, the first shell 1 is arranged into an annular structure, so that the space is compact, system accessories (such as a vacuum system, a gas distribution system, an electric control system and the like) can be placed in an annular center, and the layout of a production line is facilitated.

It should be noted that the system of the present invention is generally circular, and includes a second housing 3 for feeding, a plurality of unit chambers 11 for performing atomic layer deposition, a circular transfer guide, and a tray 21, wherein a wafer is placed on the tray 21 by the second housing 3 through the transfer robot 31, and the transfer guide rotates at a certain speed and drives the tray 21 to move along the circular ring. The wafers are sequentially placed in all the trays 21 in this manner.

The system of the present invention is composed of a second housing 3 for the feed and a plurality of unit chambers 11, shaped like a circular ring. The number of trays 21 is 8, evenly distributed around the ring. The unit chambers 11 are separated by partition layers 12, and the partition layers 12 are provided with gaps through which the trays 21 can pass.

Example 2:

in this embodiment, the system of the present invention may also be a circular ring structure comprising m (m is an integer, and m < 10) second housings 3 for feeding, n (n is an integer, and n < 100) unit chambers 11. The system structure size calculation method of the invention comprises the following steps: taking a 12-inch wafer as an example, if the unit chamber 11 needs to be able to accommodate a tray 21 of 12-inch wafer, the length L of the inner wall of the first housing 1 is at least 30cm of the diameter of the 12-inch wafer. Assuming that the radius of the first housing 1 is r, L ═ 2 pi ×/(+ n) >30cm, it is possible to obtain >30 × m + n)/2 pi cm. The radius R of the outer wall of the first housing 1 is > R +30 cm. For example, a system comprising 2 second housings 3, 10 unit chambers 11, having an inner diameter R of at least 57.4cm and an outer diameter R of at least 87.4 cm.

In some embodiments, the front face of the second housing 3 is rectangular, with the top coinciding with the top of the unit chamber 11. The bottom of the second housing 3 is in contact with the ground as a support. Of course, the top of the second housing 3 may be higher or slightly lower than the top of the unit chamber 11, and the bottom thereof may be in the form of a stand without being completely in contact with the ground. The area of the unit cell 11 may be supported by a holder to compress the volume of the unit cell 11 as much as possible, thereby reducing the time required for pumping vacuum and gas during the thin film deposition process.

In some embodiments of the present invention, the transmission guide rail 2 includes a guide rail body 22 and a connecting member 23, a lower end of the connecting member 23 is slidably disposed in the guide rail body 22, an upper end of the connecting member 23 is connected to the tray 21, and a gear interface 231 is disposed on the connecting member 23; still include driving motor 5, be equipped with toothed disc 51 on driving motor 5's the motor shaft, toothed disc 51 with gear interface 231 meshing cooperation. In some embodiments of the present invention, a plurality of steel balls 24 are connected between the connecting member 23 and the guide rail body 22 in a rolling manner.

It can be understood that the upper part of the connecting piece 23 is a cross-shaped fixing frame which is connected and fixed with the tray 21, the lower part is inserted into the guide rail body 22, and the steel balls 24 play a role in lubrication. The tray 21 has a raised ring around its periphery and four or more beams inside it to form a bottom for receiving the wafer. Wherein two mutually perpendicular crossbeams are connected with the cross-shaped fixing frame at the upper part of the connecting piece 23. This central area is hollowed out to allow a horizontally placed wafer to move in a vertical direction by using a lift rod 37 described below to pass through the tray 21, thereby efficiently placing the wafer in the tray 21 or taking the wafer out of the tray 21.

Under the driving of the driving motor 5, the motor shaft of the driving motor 5 drives the gear disc 51 to rotate, and the connecting member 23 is driven to move forward along the guide rail body 22 through the gear interface 231, so that the wafer is rotated between different unit chambers 11, and a reaction cycle of multiple spatial atomic layer deposition is completed.

In some embodiments of the present invention, the plurality of functional region chambers are a first reaction gas chamber 111, a first vacuum chamber 112, a first inert gas chamber 113, a second reaction gas chamber 114, a second vacuum chamber 115, and a second inert gas chamber 116 in sequence.

It will be appreciated that the unit chamber 11 is divided into six distinct functional areas by a plurality of partitions 117. A first reaction gas cavity 111, a first vacuum cavity 112, a first inert gas cavity 113, a second reaction gas cavity 114, a second vacuum cavity 115 and a second inert gas cavity 116 are respectively arranged from left to right, wherein a gas inlet pipeline 4 conveys reaction gases into the first reaction gas cavity 111 and the second reaction gas cavity 114, the gas inlet pipeline 4 conveys inert gas cavities into the first inert gas cavity 113 and the second inert gas cavity 116, and a gap which can enable the tray 21, the conveying guide rail and the connecting piece 23 to pass through is reserved in the middle of the partition 117. After the wafer passes through the six zones in sequence, a deposition cycle is achieved.

Example 3:

in this embodiment, the second housing 3 includes a storage chamber 32 for storing wafers, a transfer chamber 33 for placing the transfer robot 31, and an operation chamber 34 communicating with the inner cavity of the first housing 1, and the transfer chamber 33 is located between the storage chamber 32 and the operation chamber 34.

In some embodiments of the present invention, the carrying chamber 33, the storage chamber 32 and the operation chamber 34 are detachably connected. In some embodiments of the present invention, a first vacuum pumping chamber 35 for placing an electrical control cabinet is arranged below the storage chamber 32, and a second vacuum pumping chamber 36 for placing the driving motor 5 is arranged below the operation chamber 34.

It can be understood that the pneumatic vacuum gates are used as connecting channels among the chambers, when wafers are not conveyed, the pneumatic vacuum gates are closed, the chambers are mutually independent, and the required vacuum degree state of each chamber is kept. During the transportation process, the pneumatic valve is opened as required so as to facilitate the wafer to enter and exit.

In some embodiments of the present invention, a lift rod 37 is disposed in the operation chamber 34, and the lift rod 37 is used for moving the wafer upward through the tray 21.

In some embodiments of the present invention, the first housing 1 includes an upper cover 13, a bottom plate 14 and two spaced-apart outer wall layers 15, the upper cover 13 is disposed above the two outer wall layers 15, and the bottom plate 14 is disposed below the two outer wall layers 15.

In some embodiments of the present invention, the upper cover 13 is provided with a plurality of elongated gas inlets 131 at intervals, the bottom plate 14 is provided with a plurality of vacuum pumping ports 141 communicated with the unit chambers 11, and the gas inlet pipe 4 is communicated with the plurality of functional region cavities through the plurality of elongated gas inlets 131.

It will be appreciated that the inlets 131 for the different gases are located in the upper lid 13 of the cell chamber 11, the inlets 131 being elongated and located along the radius of the entire ring system. Flow guide holes are disposed in the elongated gas inlet 131 to uniformly inject gas into the cell chamber 11. The vacuum pumping holes are distributed on the bottom plate 14 of the unit chamber 11, but the present invention is not limited to this distribution, and various distributions may be designed according to the general knowledge in the art.

After the gas is injected into the unit chamber 11 from above, the gas is confined in the local gas reaction region by the partition 117, and the gas above is continuously pumped out downwards by the vacuum pumping port 141 below, and reacts with the surface of the wafer in the downward flow process of the gas, thereby completing a half deposition reaction. Due to the pressure difference that exists all the time, most of the gas does not diffuse from the central opening portion to the partition wall region. Even if some of the gas diffuses, it is exhausted from the chamber by the adjacent vacuum or inert purge regions.

The system of the invention provides a combination mode of the first reaction gas cavity 111, the first vacuum cavity 112, the first inert gas cavity 113, the second reaction gas cavity 114, the second vacuum cavity 115 and the second inert gas cavity 116, which can reduce the density of the functional area, increase the area of different areas, improve the contact time of the wafer and the reaction gas, and avoid the problems of uneven film and the like caused by insufficient exposure of the wafer in the gas.

The operation within the second housing 3 is briefly described here by describing the steps of wafer placement:

a. an operator places the wafer box carrying a plurality of wafers in the storage cavity 32, and at the moment, the pneumatic vacuum gate in the storage cavity 32 is in a closed state, so that the external environment is prevented from polluting the cavity;

b. the pneumatic vacuum gate outside the storage cavity 32 is closed, and the storage cavity 32 is vacuumized to be consistent with the vacuum degrees of the operation cavity 34 and the carrying cavity 33;

c. the internal pneumatic vacuum gate of the storage chamber 32 is opened, the carrying mechanical arm 31 takes out a wafer to the carrying chamber 33 for waiting, and the internal pneumatic vacuum gate of the storage chamber 32 is closed;

d. the pneumatic vacuum gate of the operation chamber 34 is opened, the transfer robot 31 transfers the wafer above the tray 21, the wafer placing lift lever 37 is raised, the wafer is lifted off the transfer robot 31, the transfer robot 31 is returned to the transfer chamber 33, and the pneumatic vacuum gate of the storage chamber 32 is closed;

e. the wafer placing lift rod 37 falls down, the wafer is placed in the tray 21, the motor shaft drives the tray 21 to move for a certain distance along the guide rail body 22, and after the next empty tray 21 is moved into the operation cavity 34, the first step is repeated.

In addition, the wafer is taken out from the second housing 3, the process is reverse to the putting in sequence, and ordinary engineers can understand the steps of taking out from the above description, which is not described herein again.

The carrying cavity 33, the storage cavity 32 and the operation cavity 34 provided by the system of the invention can be independently detached and combined, and the modules are connected by a universal vacuum connection mode, such as an external bolt and sealing ring mode, but the connection mode cannot be realized by other special vacuum connection modes.

Various structures/components of the system can be made of general sectional materials such as stainless steel and aluminum based on a general machining process, but the general structural materials/components cannot be made of other special sectional materials or machining processes, and specific materials of the components of the modular rotary space atomic layer deposition system are not limited by the book of filing.

Comparative example:

comparative example one: conventional ALD deposition rates

For a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. Conventional deposition methods require about 1 minute per cycle. If 100nm alumina is deposited, 625 minutes, i.e. about 10.5 hours, is required. That is, conventional ALD can only complete 100nm of alumina deposited on one wafer in 10.5 hours. The deposition rate V was 10.5h/100 nm/pcs.

Comparative example two: deposition rate for single slice rotational space ALD

For a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. Assuming that 1 cycle is completed by one wafer revolution in the monolithic rotation space ALD, and the rotation speed is 10rpm, 10 cycles are completed per minute, and 1.6nm deposition is achieved. If 100nm alumina is deposited, it takes 62.5 minutes, i.e. about 1 hour. That is, under this condition, the single piece spin space ALD can complete the deposition of 100nm of alumina on one wafer in 1 hour. The deposition rate V was 1h/100 nm/pcs.

Comparative example three: deposition rate for single slice rotational space ALD

For a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. Assuming that 2 cycles are completed by one wafer revolution in the monolithic rotation space ALD with a rotation speed of 10rpm, 20 cycles are completed per minute, achieving a deposition of 3.2 nm. If 100nm alumina is deposited, 31.2 minutes, i.e., about 0.5 hours, is required. That is, under this condition, the single piece spin space ALD can complete the deposition of 100nm of alumina on one wafer in 0.5 hour. The deposition rate V was 0.5h/100 nm/pcs.

Comparative example four: deposition rate for single slice rotational space ALD

For a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. Assuming that 2 cycles are completed in one wafer revolution in the monolithic rotation space ALD, with a rotation speed of 20rpm, 40 cycles are completed per minute, achieving a deposition of 6.4 nm. If 100nm alumina is deposited, 16 minutes, i.e., about 0.25 hours, is required. That is, under this condition, the single piece spin space ALD can complete the deposition of 100nm of alumina on one wafer in 0.25 hours. The deposition rate V was 0.25h/100 nm/pcs.

Comparative example five: deposition rates for multi-slice rotating space ALD

For a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. According to the published patent information, assuming that 4 wafers are shared in the multi-wafer rotating space ALD, each wafer completes 2 cycles by one rotation, and the rotating speed is 10rpm, 20 cycles are completed per minute, and 3.2nm deposition is realized. If 100nm alumina is deposited, 31.2 minutes, i.e., about 0.5 hours, is required. That is, under these conditions, the multi-piece rotating space ALD can complete the deposition of 100nm of alumina on four wafers in 0.5 hour. The deposition rate V was 0.125h/100 nm/pcs.

Comparative example six: deposition rates for multi-slice rotating space ALD

For a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. According to the published patent information, assuming that 4 wafers are shared in a multi-wafer rotation space ALD, 4 cycles are completed by one rotation of each wafer, and the rotation speed is 5rpm, 20 cycles are completed per minute, and 3.2nm deposition is realized. If 100nm alumina is deposited, 31.2 minutes, i.e., about 0.5 hours, is required. That is, under these conditions, the multi-piece rotating space ALD can complete the deposition of 100nm of alumina on four wafers in 0.5 hour. The deposition rate V was 0.125h/100 nm/pcs.

Comparative example seven: deposition rates for multi-slice rotating space ALD

For a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. According to the published patent information, assuming that 6 wafers are shared in a multi-wafer rotation space ALD, each wafer completes 4 cycles by one rotation, and the rotation speed is 10rpm, 40 cycles per minute are completed, and 6.4nm deposition is realized. If 100nm alumina is deposited, 16 minutes, i.e., about 0.25 hours, is required. That is, under these conditions, the multi-piece rotating space ALD can complete the deposition of 100nm of alumina on six wafers in 0.25 hour. The deposition rate V was 0.042h/100 nm/pcs.

Comparative example eight: the modular rotary space atomic layer deposition system provided by the embodiment of the invention has the following ALD deposition rate:

for a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. According to the published patent information, assuming that a total of 8 wafers are in a multi-wafer rotation space ALD, 7 cycles are completed by one rotation of each wafer, and the rotation speed is 1rpm, 7 cycles are completed per minute, and deposition of 1.12nm is realized. If 100nm alumina is deposited, 89 minutes, i.e., about 1.5 hours, is required. That is, under these conditions, modular multi-piece rotating space ALD can complete 100nm of alumina deposition on eight wafers in 1.5 hours. The deposition rate V was 0.188h/100 nm/pcs.

Comparative example nine: the modular rotary space atomic layer deposition system provided by the embodiment of the invention has the following ALD deposition rate:

for a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. According to the published patent information, assuming that a total of 8 wafers are in a multi-wafer rotation space ALD, 7 cycles are completed by one rotation of each wafer, and the rotation speed is 5rpm, 35 cycles are completed per minute, and 5.6nm deposition is realized. If 100nm alumina is deposited, it takes 18 minutes, i.e. about 0.3 hours. That is, under these conditions, modular multi-plate rotating space ALD can complete 100nm of alumina deposition on eight wafers in 0.3 hour. The deposition rate V was 0.037h/100 nm/pcs.

Comparative example ten: the modular rotary space atomic layer deposition system provided by the embodiment of the invention has the following ALD deposition rate:

for a 12 "wafer ALD process, the deposition rate of alumina is approximately 0.16 nm/cycle. According to the published patent information, assuming that there are 14 wafers in the multi-wafer rotation space ALD, each wafer completes 7 cycles by one rotation, and the rotation speed is 5rpm, 35 cycles per minute are completed, and 5.6nm deposition is realized. If 100nm alumina is deposited, it takes 18 minutes, i.e. about 0.3 hours. That is, under these conditions, modular multi-plate rotating space ALD can complete 100nm of alumina deposition on fourteen wafers in 0.3 hours. The deposition rate V was 0.021h/100 nm/pcs.

Serial number	Name of the technology	Deposition rate
			Comparative example 1	Conventional ALD	V＝10.5h/100nm/pcs
Comparative example 2	Single slice rotating space ALD	V＝1h/100nm/pcs
			Comparative example three	Single slice rotating space ALD	V＝0.5h/100nm/pcs
Comparative example four	Single slice rotating space ALD	V＝0.25h/100nm/pcs
			Comparative example five	Multi-slice rotating space ALD	V＝0.125h/100nm/pcs
Comparative example six	Multi-slice rotating space ALD	V＝0.125h/100nm/pcs
			Comparative example seven	Multi-slice rotating space ALD	V＝0.042h/100nm/pcs
Comparative example eight	Modular rotary spatial atomic layer deposition system	V＝0.188h/100nm/pcs
			Comparative example nine	Modular rotary spatial atomic layer deposition system	V＝0.037h/100nm/pcs
Comparative example ten	Modular rotary spatial atomic layer deposition system	V＝0.021h/100nm/pcs

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A modular rotary spatial atomic layer deposition system, comprising:

2. The modular rotary spatial atomic layer deposition system according to claim 1, wherein the transmission rail comprises a rail body and a connecting member, a lower end of the connecting member is slidably disposed in the rail body, an upper end of the connecting member is connected to the tray, and a gear interface is disposed on the connecting member;

3. The modular rotary spatial atomic layer deposition system of claim 2, wherein a plurality of steel balls are rotatably connected between the connecting member and the rail body.

4. The modular rotary spatial atomic layer deposition system according to claim 1, wherein the plurality of functional area chambers are sequentially a first reactive gas chamber, a first vacuum chamber, a first inert gas chamber, a second reactive gas chamber, a second vacuum chamber, a second inert gas chamber.

5. The modular rotary spatial atomic layer deposition system according to claim 2, wherein the second housing comprises a storage chamber for storing wafers, a handling chamber for placing the handling robot, and an operating chamber in communication with the inner chamber of the first housing, the handling chamber being located between the storage chamber and the operating chamber.

6. The modular rotary spatial atomic layer deposition system according to claim 5, wherein the handling chamber, the storage chamber and the process chamber are detachably connected.

7. The modular rotary spatial atomic layer deposition system according to claim 6, wherein a first vacuum pumping chamber for placing an electrical control cabinet is arranged below the storage chamber, and a second vacuum pumping chamber for placing a driving motor is arranged below the operation chamber.

8. The system according to claim 5, wherein a lift rod is disposed in the process chamber, and the lift rod is configured to move the wafer upward through the tray.

9. The modular rotary spatial atomic layer deposition system according to claim 1, wherein the first housing comprises a top cover, a bottom plate and two spaced apart outer wall layers, the top cover being disposed over the two outer wall layers and the bottom plate being disposed under the two outer wall layers.

10. The modular rotary spatial atomic layer deposition system according to claim 9, wherein the upper lid has a plurality of elongated gas inlets spaced apart from each other, the bottom plate has a plurality of vacuum pumping ports communicating with the unit chambers, and the gas inlet pipe communicates with the functional region chambers through the plurality of elongated gas inlets.